Wafer puck

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Description

FIG. 1 is a top plan view of the first embodiment of my new design for a wafer puck;

FIG. 2 is a top perspective view thereof;

FIG. 3 is a side elevational view thereof;

FIG. 4 is a top plan view of the second embodiment of my new design for a wafer puck;

FIG. 5 is a top perspective view thereof; and,

FIG. 6 is a side elevational view thereof.

Claims

The ornamental design for a wafer puck, as shown and described.

Referenced Cited
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Foreign Patent Documents
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Patent History
Patent number: D838325
Type: Grant
Filed: Apr 8, 2016
Date of Patent: Jan 15, 2019
Inventor: Robert D. Miller (Ancaster)
Primary Examiner: Catherine A Tuttle
Application Number: 29/560,584
Classifications
Current U.S. Class: Puck Or Curling Stone (D21/710)