Wafer puck
Description
Claims
The ornamental design for a wafer puck, as shown and described.
Referenced Cited
U.S. Patent Documents
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Patent History
Patent number: D838325
Type: Grant
Filed: Apr 8, 2016
Date of Patent: Jan 15, 2019
Inventor: Robert D. Miller (Ancaster)
Primary Examiner: Catherine A Tuttle
Application Number: 29/560,584
Type: Grant
Filed: Apr 8, 2016
Date of Patent: Jan 15, 2019
Inventor: Robert D. Miller (Ancaster)
Primary Examiner: Catherine A Tuttle
Application Number: 29/560,584
Classifications
Current U.S. Class:
Puck Or Curling Stone (D21/710)