Door assembly packaging

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Description

FIG. 1 is a side elevational view of a door assembly packaging of Applicant's design;

FIG. 2 is an opposite side elevational view of FIG. 1;

FIG. 3 is an adjacent side elevational view of FIG. 1;

FIG. 4 is an opposite side elevational view of FIG. 3;

FIG. 5 is a top plan view of FIG. 1;

FIG. 6 is a top sectional plan view taken along line 6-6 in FIG. 1;

FIG. 7 is a bottom plan view of FIG. 1;

FIG. 8 is a side sectional view taken along line 8-8 in FIG. 5;

FIG. 9 is a side elevational view of a second embodiment of a door assembly packaging of Applicant's design;

FIG. 10 is an opposite side elevational view of FIG. 9;

FIG. 11 is an adjacent side elevational view of FIG. 9;

FIG. 12 is an opposite side elevational view of FIG. 11;

FIG. 13 is a top plan view of FIG. 9;

FIG. 14 is a top sectional plan view taken along line 14-14 in FIG. 9;

FIG. 15 is a bottom plan view of FIG. 9;

FIG. 16 is a side sectional view taken along line 16-16 in FIG. 13;

FIG. 17 is a side elevational view of a third embodiment of a door assembly packaging of Applicant's design;

FIG. 18 is an opposite side elevational view of FIG. 17;

FIG. 19 is an adjacent side elevational view of FIG. 17;

FIG. 20 is an opposite side elevational view of FIG. 19;

FIG. 21 is a top plan view of FIG. 17;

FIG. 22 is a top sectional plan view taken along line 22-22 in FIG. 17;

FIG. 23 is a bottom plan view of FIG. 17;

FIG. 24 is a side sectional view taken along line 24-24 in FIG. 21;

FIG. 25 is a side elevational view of a fourth embodiment of a door assembly packaging of Applicant's design;

FIG. 26 is an opposite side elevational view of FIG. 25;

FIG. 27 is an adjacent side elevational view of FIG. 25;

FIG. 28 is an opposite side elevational view of FIG. 27;

FIG. 29 is a top plan view of FIG. 25;

FIG. 30 is a top sectional plan view taken along line 30-30 in FIG. 25;

FIG. 31 is a bottom plan view of FIG. 25; and,

FIG. 32 is a side sectional view taken along line 32-32 in FIG. 29.

Where included, broken lines showing environment or structure are for illustrative purposes only and form no part of the claimed design.

Claims

Applicant claims the ornamental design for a door assembly packaging, as shown and described.

Referenced Cited
U.S. Patent Documents
5642923 July 1, 1997 Meacham
5950836 September 14, 1999 Iwamoto
D506131 June 14, 2005 Izen
D640568 June 28, 2011 Cluett
20040195142 October 7, 2004 Hayashi
20060249416 November 9, 2006 Bradford
20090071381 March 19, 2009 Ponto
20150259098 September 17, 2015 Sanger
20170043922 February 16, 2017 Chubb
20170313501 November 2, 2017 Bradford
20180044057 February 15, 2018 Scott
20180050828 February 22, 2018 Sytema
Patent History
Patent number: D859180
Type: Grant
Filed: Nov 4, 2015
Date of Patent: Sep 10, 2019
Assignee: THERMOSEAL INDUSTRIES, LLC (Gloucester City, NJ)
Inventors: Richard A. Chubb (Voorhees, NJ), Donald B. Cheke (Saskatoon), Daniel H. Nichols (West Deptford, NJ), Charles E. Beck (Sicklerville, NJ)
Primary Examiner: Lauren R Calve
Application Number: 29/544,534
Classifications
Current U.S. Class: D9/721