Electrode cover for a plasma processing apparatus

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Description

This application contains subject matter related to the following co-pending U.S. design patent applications:

Application Ser. No. 29/635,287, filed herewith and entitled “Electrode Plate for a Plasma Processing Apparatus”;

Application Ser. No. 29/635,289, filed herewith and entitled “Gas Ring for a Plasma Processing Apparatus”; and

Application Ser. No. 29/635,296, filed herewith and entitled “Electrode Plate Peripheral Ring for a Plasma Processing Apparatus”.

FIG. 1 is a front, bottom and right side perspective view of an electrode cover for a plasma processing apparatus according to the design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a left side elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a rear elevational view thereof;

FIG. 8 is a cross-sectional view taken along line 8-8 of FIG. 2;

FIG. 9 is an enlarged view of the portion shown in BOX 9 in FIG. 8; and,

FIG. 10 is a front, bottom and right side perspective view of a cross-sectional view taken along line 8-8 of FIG. 2.

The broken lines show the boundary of enlarged portions and form no part of the claimed design.

Claims

The ornamental design for an electrode cover for a plasma processing apparatus, as shown and described.

Referenced Cited
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Foreign Patent Documents
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Other references
  • Appleton STG50—½″ Sealing Gasket For Metal Conduit Connectors. Online, published date unknown. Retrieved on May 14, 2019 from URL: https://www.galesburgelectric.com/appleton-stg50-1-2-sealing-gasket-for-metal-conduit-connectors/.
  • 4″ Storz Pressure Gasket. Online, published date unknown. Retrieved on May 14, 2019 from URL: https://www.firehosedirect.com/4-storz-pressure-gasket.
  • Isozaki et al., Design U.S. Appl. No. 29/635,287, filed Jan. 30, 2018.
  • Okuda et al., Design U.S. Appl. No. 29/635,289, filed Jan. 30, 2018.
  • Isozaki et al., Design U.S. Appl. No. 29/635,296, filed Jan. 30, 2018.
Patent History
Patent number: D870314
Type: Grant
Filed: Jan 30, 2018
Date of Patent: Dec 17, 2019
Assignee: Hitachi High-Technologies Corporation (Tokyo)
Inventors: Masakazu Isozaki (Tokyo), Masahito Mori (Tokyo), Kenetsu Yokogawa (Tokyo), Takao Arase (Tokyo), Yousuke Sakai (Tokyo)
Primary Examiner: Susan Bennett Hattan
Assistant Examiner: Omeed Agilee
Application Number: 29/635,292