Wireless IC tag

- TODA KOGYO CORP.
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Description

FIG. 1 is a front elevational view of a first embodiment of a wireless IC tag according to our new design. A rear elevational view thereof is a mirror-image of the front elevational view.

FIG. 2 is a right side elevational view thereof.

FIG. 3 is a left side elevational view thereof.

FIG. 4 is a top plan view thereof.

FIG. 5 is a cross-sectional view thereof, taken in the direction of line 5-5 in FIG. 4.

FIG. 6 is a bottom plan view thereof.

FIG. 7 is a perspective view thereof.

FIG. 8 is a front elevational view of a second embodiment of a wireless IC tag according to our new design. A rear elevational view thereof is a mirror-image of the front elevational view.

FIG. 9 is a right side elevational view thereof.

FIG. 10 is a left side elevational view thereof.

FIG. 11 is a top plan view thereof.

FIG. 12 is a cross-sectional view thereof, taken in the direction of line 12-12 in FIG. 11.

FIG. 13 is a bottom plan view thereof; and,

FIG. 14 is a perspective view thereof.

The broken lines shown in FIG. 4, and FIG. 11 indicate planes upon which the sectional views in FIG. 5, and FIG. 12, respectively, are taken and form no part of the claimed design.

Claims

The ornamental design for a wireless IC tag, as shown and described.

Referenced Cited
U.S. Patent Documents
D474472 May 13, 2003 Maekawa
D597428 August 4, 2009 Sato
D686931 July 30, 2013 Kaufman
D686932 July 30, 2013 Kaufman
D709397 July 22, 2014 Ennabli
D760230 June 28, 2016 Iizuka
D767571 September 27, 2016 Iizuka
D794034 August 8, 2017 Bang
D794641 August 15, 2017 Bang
D794642 August 15, 2017 Bang
D794643 August 15, 2017 Bang
D794644 August 15, 2017 Bang
D795261 August 22, 2017 Bang
D795262 August 22, 2017 Bang
D806044 December 26, 2017 Iizuka
D838201 January 15, 2019 Laird
D839272 January 29, 2019 Seo
D848296 May 14, 2019 Laird
D855617 August 6, 2019 Williams
Patent History
Patent number: D874463
Type: Grant
Filed: May 7, 2018
Date of Patent: Feb 4, 2020
Assignees: TODA KOGYO CORP. (Hiroshima), SECURITAG ASSEMBLY GROUP CO., LTD. (Taichung)
Inventors: Jun Koujima (Hiroshima), Mark Chang (Taichung), Yoshiteru Kouno (Hiroshima), Peter Yan (Taichung)
Primary Examiner: George D. Kirschbaum
Assistant Examiner: Joseph J Kukella
Application Number: 29/646,730
Classifications
Current U.S. Class: Icu Chip (D14/437)