Electrical connector

- SAMTEC, INC.
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Description

FIG. 1 is a top, front, and right side perspective view of an electrical connector showing our new design;

FIG. 2 is a top, front, and left side perspective view thereof;

FIG. 3 is a top, front, and left side perspective view thereof;

FIG. 4 is bottom, front, and left side perspective view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a front elevation view thereof;

FIG. 8 is a back elevation view thereof;

FIG. 9 is a left side elevation view thereof; and,

FIG. 10 is a right side elevation view thereof.

The broken lines in the drawing views are included to show portions of the electrical connector that form no part of the claimed design.

Claims

The ornamental design for an electrical connector, as shown and described.

Referenced Cited
U.S. Patent Documents
D318852 August 6, 1991 Matsumoto
D451885 December 11, 2001 Hisatomi
D452477 December 25, 2001 Hiramoto
D452478 December 25, 2001 Hiramoto
D452678 January 1, 2002 Hiramoto
6462957 October 8, 2002 Kwong et al.
6652318 November 25, 2003 Winings et al.
D500740 January 11, 2005 Fan
7083459 August 1, 2006 Wu et al.
D575743 August 26, 2008 Shifris
D585832 February 3, 2009 Kudo
8398429 March 19, 2013 Costello
8506323 August 13, 2013 Costello
D705172 May 20, 2014 Nomura
D713356 September 16, 2014 Buck
D725043 March 24, 2015 Urano
8998645 April 7, 2015 Vanaleck et al.
D740757 October 13, 2015 Scholeno
9257778 February 9, 2016 Buck et al.
D766832 September 20, 2016 Harper, Jr.
D767505 September 27, 2016 Buck
9608348 March 28, 2017 Wanha et al.
D823814 July 24, 2018 Buck
10243288 March 26, 2019 Matsuzawa
10326225 June 18, 2019 Ju
20030143886 July 31, 2003 Nemoto
20050101176 May 12, 2005 Kachlic
20050277221 December 15, 2005 Mongold
20080166090 July 10, 2008 Kiani et al.
20090201658 August 13, 2009 Lemke et al.
20090233492 September 17, 2009 Mizukami et al.
20100178779 July 15, 2010 Davis et al.
20120058665 March 8, 2012 Zerebilov et al.
20120108109 May 3, 2012 Zhang
20130059471 March 7, 2013 Mongold
20130164987 June 27, 2013 Mongold
20140220795 August 7, 2014 Bai et al.
20140315415 October 23, 2014 Wu
20150038002 February 5, 2015 Sabo
20150038018 February 5, 2015 Matsuzawa
20160006150 January 7, 2016 Bachmutsky
20160233598 August 11, 2016 Wittig
20170125934 May 4, 2017 Endo
20190165509 May 30, 2019 Sano
20190190207 June 20, 2019 Ju
20190237910 August 1, 2019 Chalas
20190288420 September 19, 2019 Hashiguchi
20190288425 September 19, 2019 Ho
20190288430 September 19, 2019 Ho
Foreign Patent Documents
2009-218119 September 2009 JP
D130799 September 2009 TW
D132453 December 2009 TW
D163315 October 2014 TW
D168325 June 2015 TW
D172197 December 2015 TW
2015/116407 August 2015 WO
Other references
  • Samtec Extreme Performance & Density Arrays, dated Jan. 2018, [online], [site visited May 10, 2019]. Available from Internet, URL: http://suddendocs.samtec.com/ebrochures/novaray_ebrochure.pdf (Year: 2018).
  • Faith, et al.; “Electrical Connector Having Latch”; International Application No. PCT/US2018/043025; filed Jul. 20, 2018.
  • Buck, et al.; “Right-Angle Electrical Connector and Electrical Contacts for a Right Angle Connector”; International Patent Application No. PCT/US2018/057266; filed on Oct. 24, 2018.
  • Musser, et al., “Electrical cable connector,” U.S. Appl. No. 29/632,520, filed Jan. 8, 2018.
  • Buck, et al., “Contact Wafers,” U.S. Appl. No. 29/652,017, filed Dec. 20, 2018.
  • Official Communication issued in Taiwanese Patent Application No. 107304335, dated Oct. 31, 2018.
  • Official Communication issued in Taiwanese Patent Application No. 107304336, dated Oct. 31, 2018.
  • Official Communication issued in Taiwanese Patent Application No. 107304337, dated Oct. 31, 2018.
  • Official Communication issued in Taiwanese Patent Application No. 107304338, dated Oct. 31, 2018.
  • Official Communication issued in Taiwanese Patent Application No. 107304339, dated Oct. 31, 2018.
  • Official Communication issued in Taiwanese Patent Application No. 107304340, dated Oct. 31, 2018.
  • Official Communication issued in Taiwanese Patent Application No. 107304341, dated Oct. 31, 2018.
  • Official Communication issued in Taiwanese Patent Application No. 107304342, dated Oct. 31, 2018.
  • Faith, Chadrick P., “Electrical Connector,” U.S. Appl. No. 29/611,521, filed Jul. 21, 2017.
  • Buck et al., “Electrical Connector”, U.S. Appl. No. 29/611,028, filed Jul. 18, 2017.
  • Buck et al., “Contact Wafer”, U.S. Appl. No. 29/611,655, filed Jul. 24, 2017.
  • Buck et al., “Contact Wafer”, U.S. Appl. No. 29/647,260, filed May 11, 2018.
  • Mongold et al., “Overmolded Lead Frame Providing Contact Support and Impedance Matching Properties ”, U.S. Appl. No. 15/566,504, filed Oct. 13, 2017.
  • Buck et al., “Electrical Connector System”, International Application No. PCT/US2018/037198, filed Jun. 13, 2018.
Patent History
Patent number: D877700
Type: Grant
Filed: Jul 17, 2017
Date of Patent: Mar 10, 2020
Assignee: SAMTEC, INC. (New Albany, IN)
Inventors: Jonathan E. Buck (New Albany, IN), John A. Mongold (New Albany, IN)
Primary Examiner: Angela J Lee
Assistant Examiner: Shawn T Gingrich
Application Number: 29/610,936
Classifications
Current U.S. Class: Connector, Conductor Or Housing Therefor (10) (D13/133)