Semiconductor package
Latest Mitsubishi Electric Corporation Patents:
Description
The parts shown in even dashed broken lines do not form part of the claimed design.
Claims
The ornamental design for a semiconductor package, as shown and described.
Referenced Cited
U.S. Patent Documents
3458779 | July 1969 | Blank |
3562609 | February 1971 | Addamiano |
4267559 | May 12, 1981 | Johnson |
D277955 | March 12, 1985 | Takahashi |
D278048 | March 19, 1985 | Takahashi |
D278049 | March 19, 1985 | Takahashi |
D280812 | October 1, 1985 | Takahashi |
5266817 | November 30, 1993 | Lin |
5459350 | October 17, 1995 | Date |
5512784 | April 30, 1996 | Fried |
5564819 | October 15, 1996 | Yamaguchi |
D420983 | February 22, 2000 | Choi |
6147367 | November 14, 2000 | Yang |
6404065 | June 11, 2002 | Choi |
D476296 | June 24, 2003 | Koizumi |
D482666 | November 25, 2003 | Kamada |
D489695 | May 11, 2004 | Komoto |
D515520 | February 21, 2006 | Komoto |
D623546 | September 14, 2010 | Nishikawa |
D623547 | September 14, 2010 | Nishikawa |
D623548 | September 14, 2010 | Nishikawa |
Patent History
Patent number: D877707
Type: Grant
Filed: Aug 16, 2017
Date of Patent: Mar 10, 2020
Assignee: Mitsubishi Electric Corporation (Tokyo)
Inventors: Hiroshi Itakura (Tokyo), Keitaro Yamagishi (Tokyo), Yoshihiro Akeboshi (Tokyo)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/614,124
Type: Grant
Filed: Aug 16, 2017
Date of Patent: Mar 10, 2020
Assignee: Mitsubishi Electric Corporation (Tokyo)
Inventors: Hiroshi Itakura (Tokyo), Keitaro Yamagishi (Tokyo), Yoshihiro Akeboshi (Tokyo)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/614,124
Classifications
Current U.S. Class:
Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)