Case for a circuit board

- Samsung Electronics
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Description

FIG. 1 is a perspective view of a case for a circuit board showing our new design.

FIG. 2 is a front elevation view thereof.

FIG. 3 is a rear elevation view thereof.

FIG. 4 is a left side elevation view thereof.

FIG. 5 is a right side elevation view thereof.

FIG. 6 is a top plan view thereof.

FIG. 7 is a bottom plan view thereof; and,

FIG. 8 is a perspective view of a case for a circuit board shown in an example environment.

The broken lines are for environmental purposes only and form no part of the claimed design.

Claims

The ornamental design for a case for a circuit board, as shown and described.

Referenced Cited
U.S. Patent Documents
5377080 December 27, 1994 Lin
8174847 May 8, 2012 Ohtsuji
8269116 September 18, 2012 Ambo
8503191 August 6, 2013 Nagata
8981240 March 17, 2015 Chitaka
D760176 June 28, 2016 Greiser
D760186 June 28, 2016 Geiser
9526186 December 20, 2016 Lin
D827594 September 4, 2018 Shim
D828358 September 11, 2018 Lim
D834025 November 20, 2018 Lim
D847813 May 7, 2019 Jun
D848418 May 14, 2019 Jun
D848419 May 14, 2019 Jun
D866558 November 12, 2019 Shim
20080096413 April 24, 2008 Chen
20140256164 September 11, 2014 Lin
Other references
  • Communication dated Nov. 26, 2019, from the Japanese Patent Office in counterpart application No. 2019-004032.
Patent History
Patent number: D888675
Type: Grant
Filed: Feb 26, 2019
Date of Patent: Jun 30, 2020
Assignee: SAMSUNG ELECTRONICS CO., LTD. (Suwon-si)
Inventor: Gwangman Lim (Seoul)
Primary Examiner: Janice Hallmark
Assistant Examiner: Harold E Blackwell, II
Application Number: 29/681,527
Classifications