Electric contact

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Description

FIG. 1 is a front view of a first embodiment of an electric contact according to the present disclosure.

FIG. 2 is a rear view of the electric contact of FIG. 1.

FIG. 3 is a right side view of the electric contact of FIG. 1.

FIG. 4 is a left side view of the electric contact of FIG. 1.

FIG. 5 is a top view of the electric contact of FIG. 1.

FIG. 6 is a bottom view of the electric contact of FIG. 1.

FIG. 7 is a top front-left perspective view of the electric contact of FIG. 1.

FIG. 8 is a front view of a second embodiment of an electric contact according to the present disclosure.

FIG. 9 is a rear view of the electric contact of FIG. 8.

FIG. 10 is a right side view of the electric contact of FIG. 8.

FIG. 11 is a left side view of the electric contact of FIG. 8.

FIG. 12 is a top view of the electric contact of FIG. 8.

FIG. 13 is a bottom view of the electric contact of FIG. 8; and,

FIG. 14 is a top front-left perspective view of the electric contact of FIG. 8.

This article is an electric contact for testing and inspecting the electric characteristics of semiconductor devices such as semiconductor chips, etc.

Claims

The ornamental design for an electric contact, as shown and described.

Referenced Cited
U.S. Patent Documents
D380670 July 8, 1997 Blocker
D385189 October 21, 1997 Weller
D386682 November 25, 1997 Richardson
D447947 September 18, 2001 Nakagawa
D483668 December 16, 2003 Le Roux
D515418 February 21, 2006 Sandler
D520362 May 9, 2006 Powell
D544792 June 19, 2007 Camarella
D595130 June 30, 2009 Bizzell
D852755 July 2, 2019 Wang
D852756 July 2, 2019 Huang
D852757 July 2, 2019 Huang
D853335 July 9, 2019 Huang
D886066 June 2, 2020 Williams Barnett
Foreign Patent Documents
300517445 January 2009 KR
Other references
  • Micronics Japan. Package Probe (Test Socket). No date specified, https://www.mjc.co.jp/en/products/semiconductor/package_probe.html (Year: 0).
Patent History
Patent number: D918150
Type: Grant
Filed: Jul 23, 2019
Date of Patent: May 4, 2021
Assignee: KABUSHIKI KAISHA NIHON MICRONICS (Musashino)
Inventor: Eichi Osato (Musashino)
Primary Examiner: Darcey E Gottschalk
Application Number: 29/699,208
Classifications
Current U.S. Class: Element Or Attachment (D13/154)