Liquid discharge nozzle for semiconductor substrate processing apparatus

- TOKYO ELECTRON LIMITED
Skip to: Description  ·  Claims  ·  References Cited  · Patent History  ·  Patent History
Description

FIG. 1 is a front, top perspective view of a liquid discharge nozzle for semiconductor substrate processing apparatus showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left-side elevational view thereof;

FIG. 5 is a right-side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Claims

The ornamental design for a liquid discharge nozzle for semiconductor substrate processing apparatus, as shown and described.

Referenced Cited
U.S. Patent Documents
D341418 November 16, 1993 Akimoto
D636845 April 26, 2011 Suzuki
D637267 May 3, 2011 Suzuki
D823906 July 24, 2018 Kaminski
D824966 August 7, 2018 Kaminski
D903836 December 1, 2020 Pak
D906485 December 29, 2020 Fowler
D907744 January 12, 2021 Roehl
Other references
  • Liquid Paste Filling Machine Filling Nozzle Head, Dec. 10, 2020, Amazon.com, May 5, 2021.URL: https://www.amazon.com/WINUS-Filling-Nozzle-1000ml-Machine/dp/B08G8KPF43 (Year: 2020).
Patent History
Patent number: D930796
Type: Grant
Filed: Aug 3, 2020
Date of Patent: Sep 14, 2021
Assignee: TOKYO ELECTRON LIMITED (Tokyo)
Inventors: Yoshifumi Amano (Kumamoto), Kazuhiro Aiura (Kumamoto)
Primary Examiner: Jack Reickel
Assistant Examiner: Keith J Wilson
Application Number: 29/744,996
Classifications
Current U.S. Class: Fitting (10) (D23/259)