Thermal conduction metal material
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The design shown is not to be limited to any particular size and may be scaled larger or smaller.
Claims
The ornamental design for a thermal conduction metal material, as shown and described.
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Type: Grant
Filed: Feb 26, 2019
Date of Patent: Jan 11, 2022
Assignee: MITSUBISHI MATERIALS CORPORATION (Tokyo)
Inventors: Toshihiko Saiwai (Kitamoto), Fumio Sakamoto (Kitamoto)
Primary Examiner: Patricia A Palasik
Application Number: 29/681,472