Radio frequency conduit
Latest Applied Materials, Inc. Patents:
- LINEAR ACCELERATOR ASSEMBLY INCLUDING FLEXIBLE HIGH-VOLTAGE CONNECTION
- LOW RESISTIVITY GAPFILL
- Semiconductor processing tool platform configuration with reduced footprint
- Optimized selector and memory element with electron barrier
- Lithography apparatus, patterning system, and method of patterning a layered structure
Description
The broken lines appearing in
Claims
The ornamental design for a radio frequency conduit, as shown and described.
Referenced Cited
U.S. Patent Documents
Other references
D248955 | August 15, 1978 | Kitson |
D278141 | March 26, 1985 | Steidel |
D390656 | February 10, 1998 | Linder |
D747276 | January 12, 2016 | Rodrigue |
9490590 | November 8, 2016 | Pari |
D783786 | April 11, 2017 | Madireddi |
9667018 | May 30, 2017 | Liu |
D848370 | May 14, 2019 | Lee |
D848378 | May 14, 2019 | Gross |
D913962 | March 23, 2021 | Campos |
20130089994 | April 11, 2013 | Smith |
- TW Office Action in related application 109301646 dated Nov. 25, 2020.
Patent History
Patent number: D946534
Type: Grant
Filed: Oct 25, 2019
Date of Patent: Mar 22, 2022
Assignee: Applied Materials, Inc. (Santa Clara, CA)
Inventors: Adam Fischbach (Campbell, CA), Kien N. Chuc (Cupertino, CA), Canfeng Lai (Fremont, CA), Carlaton Wong (Sunnyvale, CA)
Primary Examiner: Jennifer O King
Application Number: 29/710,770
Type: Grant
Filed: Oct 25, 2019
Date of Patent: Mar 22, 2022
Assignee: Applied Materials, Inc. (Santa Clara, CA)
Inventors: Adam Fischbach (Campbell, CA), Kien N. Chuc (Cupertino, CA), Canfeng Lai (Fremont, CA), Carlaton Wong (Sunnyvale, CA)
Primary Examiner: Jennifer O King
Application Number: 29/710,770
Classifications
Current U.S. Class:
Conduit, Duct Or Channel (D13/155)