Expansion filler module
Latest ROHM & HAAS ELECTRONIC MATERIALS SINGAPORE PTE. LTD Patents:
Description
The broken line showing is included for the purpose of illustrating portions of the article and forms no part of the claimed design.
Claims
I claim the ornamental design for an expansion filler module, as shown and described.
Referenced Cited
U.S. Patent Documents
D252524 | July 31, 1979 | Lewis |
D331619 | December 8, 1992 | Biltoft et al. |
D334614 | April 6, 1993 | Biltoft et al. |
D335526 | May 11, 1993 | Biltoft et al. |
D462699 | September 10, 2002 | Johnson et al. |
D478913 | August 26, 2003 | Johnson et al. |
D547823 | July 31, 2007 | Kennedy |
7621570 | November 24, 2009 | Hashem |
D656578 | March 27, 2012 | Sherman |
D712507 | September 2, 2014 | Hammerback |
D716909 | November 4, 2014 | Hammarback |
D717397 | November 11, 2014 | Hammarback |
D720051 | December 23, 2014 | Dole |
D729899 | May 19, 2015 | Biltoft et al. |
D741449 | October 20, 2015 | Washburn |
D755345 | May 3, 2016 | Luthi |
D764017 | August 16, 2016 | McMahon et al. |
D764018 | August 16, 2016 | Biltoft et al. |
D767713 | September 27, 2016 | Biltoft et al. |
D788880 | June 6, 2017 | Zou |
20120204992 | August 16, 2012 | Park |
20130061973 | March 14, 2013 | Zerbes |
Patent History
Patent number: D946696
Type: Grant
Filed: Mar 11, 2019
Date of Patent: Mar 22, 2022
Assignee: ROHM & HAAS ELECTRONIC MATERIALS SINGAPORE PTE. LTD (Singapore)
Inventor: Tomasz Swiatek (Baulkham Hills)
Primary Examiner: Amy C Wierenga
Application Number: 29/683,090
Type: Grant
Filed: Mar 11, 2019
Date of Patent: Mar 22, 2022
Assignee: ROHM & HAAS ELECTRONIC MATERIALS SINGAPORE PTE. LTD (Singapore)
Inventor: Tomasz Swiatek (Baulkham Hills)
Primary Examiner: Amy C Wierenga
Application Number: 29/683,090
Classifications
Current U.S. Class:
Treatment (D23/207)