Headphone stand

Info

Patent number: D947160
Type: Grant
Filed: Sep 16, 2020
Date of Patent: Mar 29, 2022
Assignee: RAZER (ASIA-PACIFIC) PTE. LTD. (Singapore)
Inventor: Boon Sim Chong (Singapore)
Primary Examiner: Katie Jane Stofko
Application Number: 29/750,836

Description

Description

FIG. 1 is a perspective view of a first embodiment of a headphone stand, showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof;

FIG. 8 is a perspective view of a second embodiment of the headphone stand;

FIG. 9 is a front elevational view thereof;

FIG. 10 is a rear elevational view thereof;

FIG. 11 is a left side elevational thereof;

FIG. 12 is a right side elevational view thereof;

FIG. 13 is a top plan view thereof;

FIG. 14 is a bottom plan view thereof;

FIG. 15 is a perspective view of a third embodiment of the headphone stand;

FIG. 16 is a front elevational view thereof;

FIG. 17 is a rear elevational view thereof;

FIG. 18 is a left side elevational view thereof;

FIG. 19 is a right side elevational view thereof;

FIG. 20 is a top plan view thereof;

FIG. 21 is a bottom plan view thereof;

FIG. 22 is a perspective view of a fourth embodiment of the headphone stand;

FIG. 23 is a front elevational view thereof;

FIG. 24 is a rear elevational view thereof;

FIG. 25 is a left side elevational view thereof;

FIG. 26 is a right side elevational view thereof;

FIG. 27 is a top plan view thereof;

FIG. 28 is a bottom plan view thereof;

FIG. 29 is a perspective view of a fifth embodiment of the headphone stand;

FIG. 30 is a front elevational view thereof;

FIG. 31 is a rear elevational view thereof;

FIG. 32 is a left side elevational view thereof;

FIG. 33 is a right side elevational view thereof;

FIG. 34 is a top plan view thereof;

FIG. 35 is a bottom plan view thereof;

FIG. 36 is a perspective view of a sixth embodiment of the headphone stand;

FIG. 37 is a front elevational view thereof;

FIG. 38 is a rear elevational view thereof;

FIG. 39 is a left side elevational view thereof;

FIG. 40 is a right side elevational view thereof;

FIG. 41 is a top plan view thereof; and,

FIG. 42 is a bottom plan view thereof.

The broken lines are for illustrating portions of the headphone stand, which form no part of the claimed design.

The stippling type represents a contrast in appearance as shown.

Claims

I claim the ornamental design for a headphone stand, as shown and described.