Communications headset

- Plantronics, Inc.
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Description

FIG. 1 is a first side perspective view of the communications headset according to a first embodiment.

FIG. 2 is a second side perspective view of the communications headset according to a first embodiment.

FIG. 3 is a third side view of the communications headset according to a first embodiment.

FIG. 4 is a fourth side view of the communications headset according to a first embodiment.

FIG. 5 is a second side view of the communications headset according to a first embodiment.

FIG. 6 is a first side view of the communications headset according to a first embodiment.

FIG. 7 is a top down view of the communications headset according to a first embodiment.

FIG. 8 is a bottom up view of the communications headset according to a first embodiment.

FIG. 9 is a first side perspective view of the communications headset according to a second embodiment.

FIG. 10 is a second side perspective view of the communications headset according to a second embodiment.

FIG. 11 is a third side view of the communications headset according to a second embodiment.

FIG. 12 is a fourth side view of the communications headset according to a second embodiment.

FIG. 13 is a second side view of the communications headset according to a second embodiment.

FIG. 14 is a first side view of the communications headset according to a second embodiment.

FIG. 15 is a top down view of the communications headset according to a second embodiment; and,

FIG. 16 is a bottom up view of the communications headset according to a second embodiment.

The broken lines showing the ear cushions, holes, wires, microphone and microphone boom, headband, first side of communications headset in the first embodiment, and second side in the second embodiment are for the purpose of illustrating portions of the article and form no part of the claimed design.

The thin, black lines show contour of the surfaces or curved edges of the communications headset, and are not shading or actual lines on the communications headset.

Claims

The ornamental design for a communications headset, as shown and described.

Referenced Cited
U.S. Patent Documents
D691579 October 15, 2013 Lee
D765056 August 30, 2016 Yang
D830333 October 9, 2018 Carr
D830334 October 9, 2018 Carr
D875068 February 11, 2020 Nagamine
D885364 May 26, 2020 Paterson
D886759 June 9, 2020 Bailey
D927451 August 10, 2021 Paterson
D927452 August 10, 2021 Paterson
D927455 August 10, 2021 Yang
D940686 January 11, 2022 Yang
D947153 March 29, 2022 He
20160277828 September 22, 2016 Oh
Other references
  • [Plantronics (Poly) Blackwire 8225 Premium Wired UC Headset (USB-A)], available in Amazon.com, date first available Jun. 17, 2020 [online], [site visited date], Available from the internet URL: https://www.amazon.com/Plantronics-Blackwire-Premium-Headset-Advisor/dp/B08BFC8NKB/ref=sr_1_3_mod_primary_new (Year: 2020).
  • [Review—Poly Blackwire 8225 Dual Speakers with ANC!], announced in YouTube on Dec. 2, 2020 [online], [site visited Apr. 15, 2022], Available from the internet URL: https://www.youtube.com/watch?v=JCgkfRfjOlg (Year: 2020).
  • Design U.S. Appl. No. 29/705,717, filed Sep. 13, 2019 (18 pages).
  • Design U.S. Appl. No. 29/710,017, filed Oct. 18, 2019 (20 pages).
  • Poly: Data Sheet, Poly Blackwire Series; Plantronics, Nov. 2019 (2 pages).
  • Poly Newsroom—Poly Introduces the Next Generation of Savi Wireless Headsets, Sep. 18, 2019 (4 pages).
Patent History
Patent number: D961549
Type: Grant
Filed: May 11, 2020
Date of Patent: Aug 23, 2022
Assignee: Plantronics, Inc. (Santa Cruz, CA)
Inventors: Bowman Wang (Ben Lomond, CA), Joseph W. Yang (Santa Cruz, CA), Nicholas W. Paterson (Aptos, CA), John A. Kelley (Santa Cruz, CA)
Primary Examiner: Khawaja Anwar
Assistant Examiner: Megan Tiana Rakos
Application Number: 29/734,291
Classifications
Current U.S. Class: Circular Or Oval (D14/216); Headphone Or Headset (D14/205)