Semiconductor module
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The broken lines illustrate portions of the semiconductor module that form no part of the claimed design. The dash-dotted lines denote the boundary of the claim and form no part of the claimed design.
Claims
The ornamental design for a semiconductor module, as shown and described.
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- Office Action issued for Japanese Patent Application No. 2020-001382, Dispatch Date: Oct. 2, 2020, 2 pages.
Type: Grant
Filed: Jul 21, 2020
Date of Patent: Dec 6, 2022
Assignee: ROHM CO., LTD. (Kyoto)
Inventor: Hideo Hara (Kyoto)
Primary Examiner: Shawn T Gingrich
Application Number: 29/743,425