Blister package

- Henkel AG & Co. KGaA
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Description

FIG. 1 is a front perspective view of a first blister package embodying the new design;

FIG. 2 is a front side elevation view thereof;

FIG. 3 is a rear side elevation view thereof;

FIG. 4 is a right side elevation view thereof;

FIG. 5 is a left side elevation view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Claims

The ornamental design for a blister package, as shown and described.

Referenced Cited
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Patent History
Patent number: D975531
Type: Grant
Filed: Jul 22, 2019
Date of Patent: Jan 17, 2023
Assignee: Henkel AG & Co. KGaA (Duesseldorf)
Inventor: Bodo Warden (Moenchengladbach)
Primary Examiner: Rhea Shields
Application Number: 29/698,925
Classifications
Current U.S. Class: D9/415