Electronics module housing

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Description

FIG. 1 is an isometric view of an electronics module housing showing our new design;

FIG. 2 is a front view of the electronics module housing of FIG. 1 showing our new design;

FIG. 3 is an isometric view of an electronics module housing showing an alternative embodiment of our new design; and,

FIG. 4 is a front view of the electronics module housing of FIG. 3 showing the alternative embodiment our new design.

The broken lines in the drawings illustrate portions of the electronics module housing that form no part of the claimed design. The solid black shading of the claimed design represents a contrast in appearance only and does not represent any particular color, material, texture, or finish.

Claims

The ornamental design for an electronics module housing, as shown and described.

Referenced Cited
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Other references
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Patent History
Patent number: D984379
Type: Grant
Filed: Jul 28, 2020
Date of Patent: Apr 25, 2023
Assignee: Rockwell Automation Technologies, Inc. (Mayfield Heights, OH)
Inventors: Benjamin R. Henderson (Twinsburg, OH), Douglas J. Carpiaux (Milwaukee, WI)
Primary Examiner: Shawn T Gingrich
Assistant Examiner: Bryan N. Melvin
Application Number: 29/744,366