Electronics module housing
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The broken lines in the drawings illustrate portions of the electronics module housing that form no part of the claimed design. The solid black shading of the claimed design represents a contrast in appearance only and does not represent any particular color, material, texture, or finish.
Claims
The ornamental design for an electronics module housing, as shown and described.
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Type: Grant
Filed: Jul 28, 2020
Date of Patent: Apr 25, 2023
Assignee: Rockwell Automation Technologies, Inc. (Mayfield Heights, OH)
Inventors: Benjamin R. Henderson (Twinsburg, OH), Douglas J. Carpiaux (Milwaukee, WI)
Primary Examiner: Shawn T Gingrich
Assistant Examiner: Bryan N. Melvin
Application Number: 29/744,366