Abstract: A continuous roll of screen which may be payed out from said roll by an installer or manufacturer to a required predetermined window size, or alternatively patio door size, said screen comprising a free end which allows the installer to pay the screen off of the roll upon which the screen is accumulated course upon course, one end of said screen being disposed at the end of the courses accumulated on the roll from which the screening is payed off and the other end being a free end, said screen having side edges and preferably being manufactured from preferably vinyl-coated fiberglass, the edges of said screen having affixed thereto a generally preferably T-shaped key manufactured from a flexible material, for example polyvinyl chloride, which is affixed preferably by radio frequency welding (or RF welding) with the edges and preferably each of the edges, and in one embodiment at least one edge of said screen, wherein the vinyl coating provided on the screen melds with the polyvinyl chloride key to form a resi

Abstract: A heat exchanger of the multi-flow type is provided with baffle members which are adapted to impart a zigzagging flow to the heat-exchange fluid in motion inside a flat tube and define, in conjunction with the inner wall of the flat tube, a flow path of a cross-sectional area having an equivalent diameter in the range of 0.4 to 1.5 mm. This heat exchanger excels in heat exchange ability and in facility of manufacture and assemblage.

Abstract: Supplemental heat mechanisms are employed to ensure that refrigerant in evaporative cold plates for electronic modules not only returns to the compressor in a vapor phase but also further operates to maintain electronic circuit junction temperatures at relatively constant temperature levels. Furthermore, the supplemental heating system responds within a time frame which is faster than other methods which may be employed to achieve the same or similar objectives. In particular, in preferred embodiments of the present invention pressure and temperature measurements of refrigerant exiting the evaporative cold plate are employed to control the turning on of supplemental electrical resistive heating elements to make up for thermal dissipation fluctuations occurring in the electronic module. The supplemental heat may be provided either with a single flat element or through the use of in-line heating elements.

Abstract: A hand-held portable lawn and garden tool having implements. A housing encloses a motor and at least two sets of gears arranged in cascade to provide low speed and high torque to the implements. Each set of gears is a sun gear with a plurality of planetary gears. Embodiments energized by battery packs, line power and internal combustion engines are disclosed.

Abstract: This invention relates generally to an impact tool. The present invention provides a vibration isolated impact tool wherein an impact mechanism and a motor assembly are arranged into a cartridge assembly. An elastomeric member resiliently connects the cartridge assembly with a housing. The cartridge assembly is free to move axially and rotationally within the housing. The elastomeric member absorbs axial vibration and torsional vibration, reducing the vibration transmitted to an operator.

Abstract: An improved conduit box assembly for a large electric motor permits placement of busbar units and other such components at various locations therein. The conduit box has a main box in which fixed mounting bases are installed. Preferably, four L-shaped mounting bases are provided, one located in each of the respective corners. The mounting bases are configured to permit attachment of removable terminal support members on which the busbar units or other components are carried. Each terminal support member is mounted in a desired location within the main box across a pair of opposed base elements. Preferably, the support members can be placed in any one of a plurality of rotational and axial positions.

Abstract: An electronic structure, and associated method of formation, in which a plated metallic layer such as a copper layer, of a plated through hole (PTH) is adhesively coupled to holefill material distributed within the PTH. The holefill material includes a resin such as an epoxy and optionally includes a particulate component such as a copper powder. The adhesive coupling is accomplished by forming an adhesion promoter film on the plated metallic layer such that the adhesion promoter film is bonded to the resin. The adhesion promoter film may include a metallic oxide layer such as layer containing cupric oxide and cuprous oxide, which could be formed from bathing the PTH in a solution of sodium chlorite. Application of a reducing solution of dimethylamine borane to the cuprous oxide layer would convert some of the cuprous oxide to cupric oxide in the metallic oxide layer.

Abstract: A rotary drag bit suitable for directional drilling. The bit includes a bit body from which extend radially-oriented blades carrying PDC cutters. The blades extend to primary gage pads, above which secondary gage pads are either longitudinally spaced or rotationally spaced, or both, defining a gap or discontinuity between the primary and secondary gage pads through which drilling fluid from adjacent junk slots may communicate laterally or circumferentially. Longitudinally leading edges of the secondary gage pads carry cutters for smoothing the sidewall of the borehole. The cutters are preferably configured and oriented so as to provide a relatively aggressive cutting edge to the formation in both longitudinal and rotational directions of bit movement, the cutting edges lying adjacent cutting surfaces preferably disposed at negative rake angles to the formation material of the borehole wall for enhanced durability.

Abstract: A vehicle crush detecting device including an electrically conducting tube with an electrically conducting rod positioned within the tube along with insulating means positioned at at least two points between the rod and tube to insulate the rod from the tube. The electrically conducting tube is deformed during a vehicle crash causing the tube to contact the rod in response to crush of the vehicle. A header/connector assembly seals a space between the rod and tube at one end while a space between the rod and tube at the opposite end is closed. The header/connector assembly includes electrical connector pins electrically coupled to the rod and tube and having an exposed portion for connection to a wire harness. The device is used to sense crashes for the deployment of automobile passive restraint systems such as airbags.

Abstract: A vane damper (1) comprises a body (2) with a space for at least one rotatable vane which divides the space into two part spaces (6a, 6b) which are located on either side of the vane and, because of the rotatability of the vane, are variable and which is mounted in the body by means of a bearing member and operates in a working medium (16) which is located in the space and, via a throttle function, can be transferred between the variable part spaces to produce the damping characteristic. The vane with associated bearing member is produced by means of extruding aluminium. The extruded product is cut for production of the respective vane with associated bearing member. The respective vane is provided with sealing members which establish a seal against the relevant surfaces of the space and of the bearing member.

Abstract: In an electronic device, a combination of an electronic visual display on a housing, electronic circuitry in the housing, the housing having at least one human user depressible surface with associated analog pressure-sensitive element for output of a signal of variable value utilized by the circuitry to control or manipulate one or more functions of the device. The at least one analog pressure-sensitive element receives pressure applied by a user's finger or thumb to the depressible surface, varied pressure applied by the user determines varied value of the signal. The resultant control manipulation from the analog variable value is in some manner indicated, displayed or made visually detectable on the display at least at the time of manipulation so that the user receives visual feedback allowing termination, increase or decrease, if needed or desired, of finger pressure on the depressible surface of the analog sensor.

Abstract: Illustrations are provided on applications and usage of electrically activated catalysts. Methods are disclosed for preparing catalysts from nanomaterials. Processes and devices are described that utilize catalysts. The invention can also be applied to improve the performance of existing catalysts, to enhance the performance of substances by inducing or applying charge in nanostructured forms of substances, and to prepare novel devices. Example processes for hydrogen production are discussed. Finally, the invention can be utilized to engineer the thermal, structural, electrical, magnetic, electrochemical, optical, photonic, and other properties of nanoscale substances.

Abstract: A writable optical disc has an information writing track, and a guiding track for introducing a laser beam to the information writing track. The guiding track has prepit information recorded thereon, the prepit information including at least address information of the optical disc. The prepit information is recorded on the guiding track at a position where interference of adjacent guiding tracks with the prepit information is prevented. The information writing track is a groove track, and the guiding track is a land track.

Abstract: The present invention provides a plating apparatus and a method of plating, which improve the uniformity of the plate coat thickness without changing the flow velocity of feeding the plating solution.

Abstract: A single sheet of non-woven material is provided with sufficient strength and durability to store two compact discs without the necessity of laminating or otherwise interconnecting the non-woven sheet to a backing sheet or other materials for strength. The single sheet of non-woven material is positioned between the playing surfaces of the two compact discs to provide a non-scratching, protective surface and to reduce the costs associated with manufacturing the sleeves used to store the CDS.

Abstract: A method of forming a filter package includes disposing a filter and a liquid in a container with the filter immersed in the liquid and sanitizing the liquid and the filter while in the container. After sanitizing, the container may be hermetically sealed to enclose the sanitized liquid and filter. The container may be vented during sanitizing to allow vapor of the liquid to exit from the container and prevent pressure from building up in the container. The container may be either rigid or flexible.

Abstract: A preferred transmission filter (10) includes a first flange (18) transparent to a laser beam (58) and includes a second flange (20) opaque to the laser beam (58) and meltable upon exposure thereto. The flanges (18, 20) are in registered, abutting relationship with a laser weld bead (62) at the juncture (44) between the flanges (18, 20) to provide a fluid seal circumscribing the filter (10). The preferred filter manufacturing apparatus (12) includes a laser (54) coupled to a robot arm (50) controlled by a programmable logic controller (52). The controller (52) operates the robot arm (50) in order to direct the laser beam (58) through the first flange (18) onto the second flange (20) and along the juncture (44) to form the laser weld bead (62).

Abstract: A filtration system for a cross-flow membrane filter which reduces the deleterious effects of concentration polarization and membrane fouling, thereby increasing the average transmembrane flux. The filtration system includes a feed supply for providing a feed solution; a feed pump connected to the feed supply; a cross-flow membrane filter connected downstream of the feed pump for separating the feed into a permeate and a retentate, the cross-flow membrane filter including at least two membrane ports and at least two permeate outlets; a valve manifold assembly located between the feed pump and the cross-flow membrane filter; and a control system for controlling the valve manifold to selectively reverse the flow of the feed through the cross-flow membrane filter.

Abstract: A shelf stand for goods is proposed which has individually rotatable shelves, which are substantially circular and located one above the other. At the periphery of each shelf there is a driving device adapted to cooperate with driving means on the peripheral part of the shelf for turning or rotating the shelf. The shelves are divided into sections provided with impulse generators cooperating with impulse counters for determining the rotational position of the shelf.

Abstract: A method for producing stable atmospheric pressure glow discharge plasmas using RF excitation and the use of said plasmas for modifying the surface layer of materials. The plasma generated by this process and its surface modification capability depend on the type of gases used and their chemical reactivity. These plasmas can be used for a variety of applications, including etching of organic material from the surface layer of inorganic substrates, as an environmentally benign alternative to industrial cleaning operations which currently employ solvents and degreasers, as a method of stripping paint from surfaces, for the surface modification of composites prior to adhesive bonding operations, for use as a localized etcher of electronic boards and assemblies and in microelectronic fabrication, and for the sterilization of tools used in medical applications.

Abstract: The invention is embodied in an antenna for radiating RF power supplied by an RF source into a vacuum chamber, the antenna including plural concentrically spiral conductors, each having a first end located in a first common region and a second end located in a second common region, and each being wound about a common axis passing through both regions, the regions being concentric with the axis, the conductors being substantially the same length, substantially the same shape, and substantially evenly spaced with respect to each other about the common axis.

Abstract: An electric arc welding apparatus comprising at least a first consumable electrode and a second consumable electrode movable in unison along a welding path between the edges of two adjacent, mutually grounded plates, a first power supply for passing a first welding current at a first low frequency between the first electrode and the two plates, a second power supply for passing a second welding current at a second low frequency between the second electrode and the two plates, where each of the power supplies includes a three phase voltage input operated at line frequency, a rectifier to convert the input voltage to a DC voltage link and a high frequency switching type inverter converting the DC voltage link to a high frequency AC current, an output rectifier circuit to provide a positive voltage terminal and a negative voltage terminal, and an output switching network operated at a given low frequency for directing a pulsating welding current at the given low frequency from the two terminals across one of the

Abstract: A solder assembly 10 which is selectively and operably connectable to a controller 12 and which has several “guns” 74, 76 which each allow for the selective creation of a several circuits, thereby allowing for the creation of substantial even solder connections.

Abstract: A document retaining system for retaining documents in a protected manner while allowing easy and convenient access to the documents. The inventive device includes a base having a pair of opposing slots, and a cover having a pair of opposing pins that are slidably positioned within the slots. The cover is formed to removably fit within the interior cavity of the base and for removably covering the interior cavity of the base. Various documents may be stored and utilized within the base and the cover along with various auxiliary devices such as clamps and partition members.

Abstract: A tape formed of a polymeric material and having a thickness and stiffness suitable as a cutting edge on a dispensing carton for convolutely wound foil, film or paper, the tape includes a coating of adhesive and is applied at a laminating station in the carton manufacturing process and is generally cut with the forming of the carton blanks, and the cut in the tape may be formed with a serrated edge.

Abstract: The present invention provides a method and end-to-side surgical anastomosis apparatus for stapling an end of a tubular tissue structure to a side of a luminal structure including an elongated housing defining a central bore extending longitudinally therethrough. The elongated housing further includes an eversion support surface extending circumferentially about the bore opening adjacent the distal end which is configured to retain and support an everted end of the received tissue structure thereon to face an intimal surface of the tissue structure in an outward direction. The anastomosis apparatus further includes an anvil having a fastener engaging surface, and a compression device having a shoulder portion formed for selectively compressing the everted end of the tissue structure and a surface of the luminal structure together against the fastener engaging surface.

Abstract: A work having a number of solder bumps on a substrate is mounted on a work positioning mechanism, and scanned by an optical micro head to measure errors of a mount posture of the work. Each stage is controlled to correct the errors, and thereafter, the apex positions of the bumps are scanned and measured. The measurement results are collected by a personal computer, and the measurement results together with control data of each axis are sent to a main personal computer and displayed on its screen. An error of an apex position of each bump from a regression plane is calculated, and if the error is smaller than a reference value, the work is judged to be good.

Abstract: A method and device for attaching a module having a ball grid array or column grid array of solder material thereon arranged in a given pattern or footprint to a substrate having an array of connector pads arranged in the same pattern is provided. A preformed alignment device has an array of through holes therein aligned in the same pattern or footprint as the ball grid array or column pattern on the module and the pattern of contact pads on the substrate. The through holes in the preform are filled with a solder material which can be either a solder paste or a solid solder or with a curable conductive adhesive. The solder preferably is a lead-tin eutectic, but in any event has a melting point of less than about 240° C. and in the case of the conduction adhesive, will cure below about 240° C. The preform with the filled through holes is interposed between the module and the substrate with the material in the holes in contact with the solder balls or columns and the contact pads.

Abstract: An improved soldering system which reduces the numbers of steps for paste supply and soldering in soldering lead provided parts and surface mounting parts onto a printed circuit board. A printed circuit board has through holes through which a lead of each lead provided part is to be inserted and lands for surface mounting parts. A printing mask is matched with the through holes and lands and a paste receiving plate having holes to which solder paste is to be supplied corresponding to each of the through holes is disposed. A printing roller is swept by forcibly rotating it so as to fill with solder paste, then a printing squeegee is swept following that printing roller so as to further fill with solder paste.

Abstract: Disclosed is a fully automatic bar code symbol reading system having an hand-supportable laser bar code reading device which can be used in either an automatic hands-on mode of operation, or in an automatic hands-free mode of operation. The system includes a scanner support frame for supporting the hand-supportable device in a user-selected mounting position, and permits complete gripping of its handle portion prior to its use in the hands-on mode of operation. In general, the hand-supportable bar code reading device has long-range and short-range modes of object detection, bar code presence detection and bar code symbol reading. In the illustrative embodiment, the long-range mode is automatically selected when the hand-supportable bar code reading device is placed within the scanner support stand during the automatic hands-free mode of operation.

Abstract: An energy absorbing seat belt retractor (20) comprising: a frame (22); a torsion bar (70,70′) having a first and a second side, rotationally supported relative to the frame. The torsion bar of the type which is pre-torqued to create a permanent deformation therein or having an annular cross section to reduce a transition zone between the torsion bar's elastic and plastic deformation regions. The retractor also includes a locking device (200) adapted to be activated during a vehicle accident and operative on the first side (76) of the torsion bar to stop the torsion bar from rotating.

Abstract: The level of a laser beam is controlled to the maximum level detectable by a sensor, and light transmitted through the pattern is normalized with branched light. The laser beam level is made up for variations, and noise at zero and saturation levels are removed. Data thus can be taken out, in which noise in edge portions is always at a constant level. It is thus possible to increase the pattern image accuracy and obtain sharper image.

Abstract: The invention comprises a substantially non-aqueous, flame-extinguishing composition for extinguishing a fire at the sight of a potential flame comprising a fluorocarbon in admixture with a gelled powder additive comprising salts of weak acids which decompose at the temperature of the sight to reduce or eliminate HF released by the composition when used to extinguish flames.

Abstract: Polishing compositions are described that are appropriate for fine polishing to very low tolerances. The polishing compositions include particles with small diameters with very narrow distributions in size and effectively no particles with diameters several times larger than the average diameter. Furthermore, the particles generally have very high uniformity with respect to having a single crystalline phase. Preferred particles have an average diameter less than about 200 nm. Laser pyrolysis processes are described for the production of the appropriate particles including metal oxides, metal carbides, metal sulfides, SiO2 and SiC.

Abstract: Method and apparatus for short-term relining or construction of a blast furnace uses a grounding apparatus for grounding of ring-shaped blast furnace segments having shells and a casting floor present as a blast furnace floor for transferring the ring-shaped blocks or shells onto a foundation of the blast furnace, and capable of safely and precisely mounting the ring-like blocks on the casting floor, wherein the grounding apparatus is integrated with a jack system utilizing rod type lift jacks and a sliding apparatus installed with intermittently movable hydraulic cylinders for safe and precision mounting of the ring-shaped blocks or shells on the casting floor.

Abstract: A semiconductor device and method of fabricating the same. The semiconductor device includes a first insulating film formed on a substrate and having a plurality of holes therein; a cavity formed under the first insulating film; an impurity region formed in the substrate and around the cavity; a second insulating film formed on portions of the first insulating film to fill the holes and a space between the cavity and the impurity region; a plurality of contact holes formed to expose certain portions of the impurity region; and a plurality of wiring layers formed to be in contact with the impurity region through the contact holes.

Abstract: A surface mount area-array integrated circuit package is disclosed. The package consists of a package substrate having conductive vias and internal and external conductive traces, a semiconductor die electrically and mechanically connected to the top surface of package substrate, an area-array of conductive surface mount terminations electrically and mechanically connected to the bottom of the package substrate, and at least one adhesive mass. The at least one adhesive mass is located on the bottom of the package substrate and replaces the conductive terminations in the area(s) where the joint strain energy density is calculated to be the greatest. When mounted on a substrate, the at least one adhesive mass adheres the package to the substrate. Increased mechanical and electrical reliability is thus achieved.

Abstract: A semiconductor photonic device contains a substrate; a ZnO buffer layer provided on the substrate; and a semiconductor compound provided on the ZnO buffer layer and represented by InxGayAlzN wherein x+y+z=1, 0≦x≦1, 0≦y≦1 and 0≦z≦1, wherein the ZnO buffer layer has a lattice constant of about 5.2070 Å or more in the c-axis direction.

Abstract: A method for forming an interconnect wiring structure, such as a fuse structure, comprises forming an opening in an insulating layer using a phase shift mask (the opening having vertical sidewalls sloped sidewalls and horizontal surfaces), depositing a conductive material in the opening and removing the conductive material from the sloped sidewalls and horizontal surfaces, wherein the conductive material remains on the vertical sidewalls as fuse links.

Abstract: A circuit and method for a memory cell with a vertical transistor and a trench capacitor. The cell includes an access transistor that is formed in a pillar of a single crystal semiconductor material. The transistor has vertically aligned first and second source/drain regions and a body region. The transistor also includes a gate that is formed along a side of the pillar. A trench capacitor is also included in the cell. A first plate of the trench capacitor is formed integral with the first source/drain region. A second plate is disposed adjacent to the first plate and separated from the first plate by a gate oxide.

Abstract: A trench MOS-gated device comprises a doped monocrystalline semiconductor substrate that includes an upper layer and is of a first conduction type. An extended trench in the upper layer of the substrate has a bottom portion filled with a dielectric material that forms a thick layer in the bottom of the trench. The upper portion of the trench is lined with a dielectric material and substantially filled with a conductive material, the filled upper portion of the trench forming a gate region. An extended doped zone of a second opposite conduction type extends from the upper surface into the upper layer on one side of the trench, and a doped well region of the second conduction type overlying a drain zone of the first conduction type is disposed in the upper layer on the opposite side of the trench. The drain zone is substantially insulated from the extended zone by the thick dielectric layer in the bottom portion of the trench.

Abstract: A semiconductor structure comprises a silicon substrate of a first conductivity type including wells of a second conductivity type formed on a surface thereof. The wells may be laterally isolated by shallow trench isolation. Transistors are formed in the wells by first forming several chemically distinct layers. Anisotropic etching then forms openings in a top one of the layers. A blanket dielectric layer is formed in the openings and on the layers. Anisotropic etching removes portions of the blanket dielectric layer from planar surfaces of the substrate but not from sidewalls of the openings to form dielectric spacers separated by gaps within the openings. Gate oxides are formed by oxidation of exposed areas of the substrate. Ion implantation forms channels beneath the gate oxides. Polysilicon deposition followed by chemical-mechanical polishing defines gates in the gaps. The chemically distinct layers are then stripped without removing the dielectric spacers.

Abstract: The present invention is an apparatus and method for eliminating parasitic bipolar transistor action in a Silicon on Insulator (SOI) Metal Oxide Semiconductor (MOS) device. In accordance with the invention a SOI electronic device and an active discharging device coupled to said SOI electronic device is provided to deactivate the parasitic bipolar transistor. The parasitic bipolar transistor action is deactivated by controlling the conduction of an active discharging device, said active discharging device being coupled to said SOI device.

Abstract: A semiconductor device has, in one embodiment, two wells of different conductivity types formed in a semiconductor substrate. The two wells are arranged to be adjacent to each other to form a junction therebetween. A field oxide film is formed to cover the junction at a main surface of the semiconductor substrate. Other field oxide films or field-shield isolation structures may be formed to isolate circuit elements from one another in the wells.

Abstract: The present invention provides a storage electrode of a capacitor, which includes a region in contact with a dielectric film of the capacitor, wherein at least the region is made of an amorphous electrically conductive oxide material.

Abstract: A molded plastic package for semiconductor devices incorporating a heat sink, controlled impedance leads and separate power and ground rings is described. The lead frame of the package, separated by a dielectric layer, is attached to a metal heat sink. It has more than one ring for power and ground connections. The die itself is attached directly onto the heat sink through a window on the dielectric and provides high power dissipation. The package is molded using conventional materials and equipment.

Abstract: A method of forming BGA interconnections having improved fatigue life is disclosed. In particular, a combination of mask-defined and pad-defined solder joints are selectively positioned within the BGA package. The mask-defined solder joints possess a high equilibrium height, which forces the pad-defined solder joints to elongate, thereby making the pad-defined solder joints more compliant. Further, the pad-defined solder joints posses a slightly longer fatigue life because the stress concentrations found in the mask-defined solder joints are not present in the pad-defined solder joints. Therefore, the fatigue life of BGA packages is increased by implementing a majority of mask-defined solder joints to maintain a high equilibrium height, and selectively placing pad-defined solder joints in high stress areas of the BGA package.

Abstract: Multilayer metal materials are selected so that the materials will alloy or intermix under rapid thermal annealing conditions. The individual materials of the multilayers are preferably chosen such that at least one of the materials may be selectively etched with respect to the other material by wet chemical or electrochemical etching. For electroplating applications, the alloyed plating base material will assume some of the etch resistance of the original electrodeposit material such that a selective wet etch of the plating base can be performed without substantial undercutting. Furthermore, the graded composition alloy will exhibit other advantageous physical and chemical properties for electrode formation and use. The alloying or intermixing may be accomplished before or after patterning of the materials, for the instance wherein the materials deposited as blanket layers.

Abstract: A semiconductor chip package having a back side connection and method of manufacture. The semiconductor chip package can combine industry standard die having conductive back sides with flip chip bump bonding to provide discrete and integrated devices that require less space on a printed circuit board. The chip packages can include a die connected by front side bond pads to a substrate. The substrate includes terminals opposite the side facing the die that electrically connect to contact pads on the opposite side of the substrate by way of vias. In one embodiment, the vias are buried in the substrate. The substrate contact pads connect to bond pads on the front side of the die. The back side of the die is electrically connected to a bond pad (and thereby to the terminal through the via) using a conductive substance that can cascade from the back side of the die to the bond pad. Solder balls can be attached to the terminals to provide solder connections to a printed circuit board.