Abstract: A coated film product comprises a support base, a stencil-forming layer and an intermediate release layer. The stencil-forming layer is a blend of two grades of polyvinyl alcohol having different degrees of hydrolysis. The stencil-forming layer is imaged by dropwise application (for example using an ink-jet printer or plotter) of a cross-linking agent which hardens the stencil-forming layer to resist washing out with water. The hardened areas remaining after washing out are however sufficiently tacky for the washed-out film to adhere to the screen mesh by application of pressure and, after removal of the support base, form the stencil layer of a screen-printing screen.

Abstract: A stencil making apparatus thermo-sensitively perforates a stencil sheet by a thermal print head. The apparatus includes a controlling device for driving contiguous N pieces of heat generating elements of the thermal print head while shifting respectively heat generating timings at every 1/N of a period of one line of main scanning in perforating inputted image data of the one line of the main scanning.

Abstract: In a method and apparatus for perforating a heat sensitive stencil sheet having a heat shrinkable film, the film is selectively heated with a heating device to form independent dot perforations corresponding to an image, and the heating device is controlled to ensure that the perforations satisfy the following formula (1): p≧d+({square root over (2)})f  (1) where p denotes a scanning pitch in a main scanning direction or a sub scanning direction; d denotes an inner diameter of a perforation in the same direction as p; and f denotes a width of a rim of said perforation at a portion that is not merged with any rims of its adjacent perforations. Irregularity of perforation configuration is decreased, size of perforations is kept adequate, and the heating device does not have to be heated to a high temperature.

Abstract: A perforation pattern is provided with a stencil plate, which is decreased in perforation configuration irregularity and has an adequate size of perforations. The stencil plate is produced from a heat sensitive stencil sheet having a heat shrinkable film by selectively heating the film with a heating device to form independent dot perforations corresponding to an image in the film, and each of the perforations has a through hole and a rim surrounding the through hole and bulging on a heated side of the film, and the rim has a height that satisfies the following formulae (1) and (2): h≦4(&mgr;m)  (1) h≦0.05{square root over ( )}(pxpy) (&mgr;m)  (2) where h denotes the height (&mgr;m) in reference to the surface of the film before heated, px and py respectively denote pitches (&mgr;m) in main and sub scanning directions of the heating device.

Abstract: Preparation time of a multi print head screen printing machine is reduced by in putting the printing parameters into an electronic storage device on the silk screen when carrying out test printing, to avoid rekeying the information at the print head.

Abstract: A method and apparatus for improved stencil/screen print quality is disclosed. The stencil or screen assists in application of a printable material onto a substrate, such as an adhesive to a semiconductor die of a semiconductor wafer during a lead-on-chip (LOC) packaging process. In one embodiment, the stencil includes a coating applied to at least one surface of a pattern of the stencil or screen to retard running of the printable material onto the surface. In another embodiment, the stencil or screen includes a second coating applied to at least one other surface of the pattern to promote spreading of the printable material onto the substrate.

Abstract: A compound recording method and compound recording apparatus are provided for producing a printed product. The apparatus includes a plurality of image forming devices to form images on a plurality of recording sheets based on a plurality of image data arbitrarily obtained. Each of the image forming devices forms a separate image on a separate recording sheet in parallel with other image forming devices, and a sheet finisher is provided to accept the plurality of recording sheets ejected from the plurality of image forming devices and apply a designated finish-processing to the plurality of recording sheets on which the images are already formed by the plurality of image forming devices.

Abstract: A heat-sensitive stencil master making system includes a thermal head having an array of a number of heater elements which extends in a main scanning direction substantially perpendicular to a sub-scanning direction in which the thermal head is moved relatively to heat-sensitive stencil master material when imagewise perforating the heat-sensitive stencil master material. Each of the heater elements is longer in the main scanning direction than in the sub-scanning direction.

Abstract: A regenerable stencil printing plate is provided, which can be repeatedly used in master making and printing. The stencil printing plate comprises a film made of a polymeric material that shrinks in response to a stimulus selected from heat and light, and numerous fine apertures are formed in the film in cross sectional direction thereof. Preferably, the polymeric material is mainly composed of a polymer selected from acrylamide based polymers, vinyl ether based polymers, and oxide based polymers. Stencil printing is performed by providing the film, giving the above stimulus to the film in such a manner that a desired image is traced on the film to expand said apertures selectively at sites to which said stimulus is given, and allowing an image forming material to pass through the thus expanded apertures to transfer the image forming material to a recording medium.

Abstract: A thermal stencil sheet for use in a laser stencil printing system comprising a stencil sheet comprising a base layer, a radiation absorbing layer, and a thermal film overlying the radiation absorbing layer. The base layer comprises a porous fibrous material which is saturatable with liquid.

Abstract: A stencil for use in fabricating semiconductor devices is disclosed that has an aperture having a first portion extending from a first side thereof and a second portion extending from a second side thereof to minimize the shear stress between the material extruded therethrough and the stencil. The stencil allows for material to be extruded through the top of the stencil to the surface of the substrate and not contact the wall of the second portion of the aperture of the stencil. Since the material only contacts a small area of the first portion of the aperture near the top of the stencil, the material remains on the substrate and not in the aperture of the stencil.

Abstract: A simplified screen printing machine includes a base member having a print base with an elastic member for mounting an object to be pressed; a framed stencil sheet assembly including a stencil sheet formed of a porous support and a resin film laminated to the support and a frame member laminated with the stencil sheet; and a pressing device attachably and detachably assembled with the framed stencil sheet assembly for pressing the framed stencil sheet assembly to the base member. The pressing device has an opening for receiving at least a part of the print base therein. When the pressing device with the stencil sheet assembly is disposed on the print base with the object, the print base is at least partly located in the opening to thereby stretch the framed stencil sheet assembly with tension.

Abstract: An image is formed by providing a coating of a crosslinkable polymeric substance on a first substrate, and applying a pattern or image of crosslinker to the coated substrate by ink jet printing to crosslink the polymeric substance. Uncrosslinked polymer is removed by washing the coated substrate, and the crosslinked polymer is then transferred imagewise to a second substrate.

Abstract: A thermosensitive stencil has a thermoplastic resin film and a porous resin layer formed thereon, with the porous resin layer having a surface smoothness of 15 to 250 sec when measured by the method of Ohken-shiki prescribed in Japan Tappi No. 5. A method for producing the above-mentioned thermosensitive stencil, and an apparatus for making a printing master from the thermosensitive stencil and printing images are also provided.

Abstract: Substrates having gel ink receptive surfaces as well as an economical and versatile method for their production is provided. The substrates are comprised of media having a dark gel ink writeable surface that is comprised of dark ink disposed upon lighter substrates, as provided by the methods detailed herein. The teachings of the present invention provide users with methodologies that render various substrates, such as paper, particularly amenable to the deposition and display of indicia comprised of gel ink.

Abstract: A dry-transfer stencil is provided for wall decoration. The stencil has at least three bleed-resistant color pigments, including a bleed-resistant magenta pigment, that will not bleed or show through a coat of paint once the stencil is painted over for redecorating. The stencil has an as-applied thickness of 2.5-5, preferably 2.3-5 mils so that it will not be visible through a coat of paint. A plurality of dry-transfer stencils are also provided having designs corresponding to a common design theme. The stencils can be placed by the consumer to provide a custom design suited to that consumer's personal taste.

Abstract: A method and apparatus for improved stencil/screen print quality is disclosed. The stencil or screen assists in application of a printable material onto a substrate, such as an adhesive to a semiconductor die of a semiconductor wafer during a lead-on-chip (LOC) packaging process. In one embodiment, the stencil includes a coating applied to at least one surface of a pattern of the stencil or screen to retard running of the printable material onto the surface. In another embodiment, the stencil or screen includes a second coating applied to at least one other surface of the pattern to promote spreading of the printable material onto the substrate.

Abstract: A perforation pattern is provided with a stencil plate, which is decreased in perforation configuration irregularity and has an adequate size of perforations.

Abstract: Stencil sheets which are inhibited from extension when printing of a large number of copies and from getting creases so that originals can be faithfully reproduced and sharp prints can be obtained are described. A stencil sheet can include a laminate of a thermoplastic resin film and a porous support mainly compose of synthetic fibers, and have a wet tensile strength in the longitudinal direction of 200 gf/cm or more, preferably 300 gf/cm or more and a breaking strength under shear in the longitudinal direction of 400 gf/cm2 or more, preferably 600 gf/cm2 or more. The thermoplastic resin film can have a thickness of 0.1-10 &mgr;m.

Abstract: Disclosed is a screen mask for screen printing including a positive pattern section and a negative pattern section with a mask material (emulsion film) formed on the negative pattern section, for transferring a printing ink to a substrate via openings of a mesh disposed at the positive pattern section, wherein a plating layer is selectively formed on the mesh of the negative pattern section so that the negative pattern section has a mesh opening ratio which is smaller than an opening ratio of the positive pattern section, and a width of a gap, which is formed on the substrate by the negative pattern section, is made to be not more than 40 &mgr;m.

Abstract: A stencil capable of accurately transferring a picture with a plurality of colors by a person without skill. This stencil includes a plurality of die seal papers from which parts of a picture are die-cut at different positions from each other as cutting die portions which are associated with each other to form a completed picture. The bottom faces of the die seal papers are adhesive faces. The die seal papers are bonded and fixed to each other in the required ranges of the base portions thereof. After the lower die seal paper is put on an object to color the object via the cutting die portion, the lower die seal paper is peeled from the object and cut away from the base portion thereof to form a polychrome picture.

Abstract: A method of treating a print screen in order to retard blockage and to make the screen easier to clean comprises treating the print screen with a compound containing a fluorinated radical and a polar radical.

Abstract: A method and apparatus for improved stencil/screen print quality is disclosed. The stencil or screen assists in application of a printable material onto a substrate, such as an adhesive to a semiconductor die of a semiconductor wafer during a lead-on-chip (LOC) packaging process. In one embodiment, the stencil includes a coating applied to at least one surface of a pattern of the stencil or screen to retard running of the printable material onto the surface. In another embodiment, the stencil or screen includes a second coating applied to at least one other surface of the pattern to promote spreading of the printable material onto the substrate.

Abstract: Disclosed is a screen mask for screen printing including a positive pattern section and a negative pattern section with a mask material (emulsion film) formed on the negative pattern section, for transferring a printing ink to a substrate via openings of a mesh disposed at the positive pattern section, wherein a plating layer is selectively formed on the mesh of the negative pattern section so that the negative pattern section has a mesh opening ratio which is smaller than an opening ratio of the positive pattern section, and a width of a gap, which is formed on the substrate by the negative pattern section, is made to be not more than 40 &mgr;m.

Abstract: A solder paste stencil printing apparatus and method for applying a controlled pattern and volume of solder paste onto a single area array component site on a populated printed circuit board (PCB). The stencil is a disposable, adhesive-backed, flexible, polymer membrane. The stencil has a plurality of holes in a pattern corresponding to a component site pad pattern on a printed circuit board. A periphery area of the stencil can be folded or shaped to fit into the available space to be stenciled. The method of applying the solder paste to the PCB includes shaping the stencil to fit available space, removing protective adhesive backer layer, aligning stencil with mating pad pattern on the PCB, and adhering stencil to PCB surface. The secure stencil insures efficient, accurate alignment and secure gasketing of stencil apertures to PCB pad pattern. Solder paste is then dispensed onto stencil surface, squeegeed across stencil surface until all apertures are filled level with top surface.

Abstract: A heat-sensitive stencil sheet, and a method and a composition for perforating the same are provided, in which photothermal conversion materials transferred to the stencil sheet do not blur or spread but are fixed thereon faithfully to desired images, and clear images are printed. The heat-sensitive stencil sheet has on a side thereof a liquid absorbing layer to which the photothermal conversion material is to be transferred, and the liquid absorbing layer comprises a hydrophilic resin and a water-repellent compound, and optionally organic and/or inorganic particulates. The hydrophilic resin and the water-repellent compound may be mixed at a proportion sufficient to provide a contact angle of 20 to 150 degrees between the liquid absorbing layer and the liquid. The liquid, in which the photothermal conversion material is containd, can comprise water and/or a hydrophilic solvent. The liquid absorbing layer preferably has a softening or melting point of 40 to 120°C. and has a thickness of 0.01 to 20 &mgr;m.

Abstract: In a process for the production of a screen printing form comprising a grid-like screen web with a coating of an emulsion, in particular a photosensitive emulsion, a screen web is partially provided with at least one coating area which is composed of a plurality of separately applied coating regions. Preferably the emulsion is applied in a plurality of mutually parallel adjacent coating strips of defined width by at least one nozzle.

Abstract: A method of preparing a plastic mask for paste printing with a plastic sheet being provided with an area containing a predetermined pattern including one or more through-holes is carried out by the steps of bringing the plastic mask provided with electroconductive material on at least one surface into close contact with a printing material while applying an electrical ground potential to the electroconductive material and then using the mask for paste printing by spreading and pressing a past to cause it to pass through any of the through-holes forming the predetermined pattern for deposit on the printing material and then removing the mask from the printing material to leave the paste printing pattern.