Abstract: A method for preparing silicon substrate having average crystallite size greater than or equal to 20 ?m, including at least the steps of: (i) providing polycrystalline silicon substrate of which average grain size is less than or equal to 10 ?m; (ii) subjecting substrate to overall homogeneous plastic deformation, at temperature of at least 1000° C.; (iii) subjecting substrate to localized plastic deformation in plurality of areas of substrate, called external stress areas, spacing between two consecutive areas being at least 20 ?m, local deformation of substrate being strictly greater than overall deformation carried out in step (ii); step (iii) being able to be carried out subsequent to or simultaneous to step (ii); and (iv) subjecting substrate obtained in step (iii) to recrystallization heat treatment in solid phase, at temperature strictly greater than temperature used in step (ii), in order to obtain desired substrate.

Abstract: Methods, systems, and apparatuses are disclosed for temporal pulse shaping of laser pulses used in laser bond inspection applications.

Abstract: The present invention provides a technique which enables production of single crystal silicon having relatively low resistivity by preventing cell growth during crystal growth from occurring, especially in a case where a relatively large amount of dopant is added to a molten silicon raw material. Specifically, the present invention provides a method of producing single crystal silicon by the Czochralski process, comprising producing single crystal silicon having relatively low resistivity by controlling a height of a solid-liquid interface when the single crystal silicon is pulled up.

Abstract: A method for manufacturing a component of a single crystal or a directionally solidified material is provided that includes: superimposing a powder layer of a first material onto a surface of a substrate out of a second, single crystal or directionally solidified, material; transforming the powder layer into a substrate layer by altering a physical condition of the first material of the powder by applying energy to the powder layer; wherein the second material of the substrate has a grain orientation and the material of the substrate layer has a grain orientation; wherein the material of the substrate layer adopts the same grain orientation as the grain orientation of the substrate during the transforming process and wherein the steps are repeated till the component has grown layer by layer into the predefined shape while a process temperature is maintained below a melting temperature of at least the first material.

Abstract: An apparatus to pump a melt is disclosed. The pump has a chamber that defines a cavity configured to hold the melt. A gas source is in fluid communication with the chamber. A first valve is between the chamber and a first pipe and a second valve is between the chamber and a second pipe. The valves may be check valves in one embodiment.

Abstract: Silicon single crystals are grown from the melt by providing the melt in a crucible; imposing a horizontal magnetic field on the melt; directing a gas between the single crystal and a heat shield to a melt free surface, and controlling the gas to flow over a region of the melt free surface extending in a direction substantially perpendicular to the magnetic induction. A suitable apparatus has a crucible for holding the melt; a heat shield surrounding the silicon single crystal having a lower end which is connected to a bottom cover facing a melt free surface and a non-axisymmetric shape with respect to a crucible axis, such that gas which is directed between the crystal and the heat shield to the melt free surface is forced to flow over a region of the melt which extends substantially perpendicular to the magnetic induction.

Abstract: A method and system is disclosed for making ultra thin wafer(s) or thin film(s) of c-Si on demand. One aspect of certain embodiments includes using a planar seed or crystal template in combination with shaped scanning heat sources to produce an intermediate seed or secondary crystal template, and finally producing an ultra thin wafer or thin film with a single crystal structure over an arbitrary area and film thickness starting from an initial low quality Si coating.

Abstract: A wafer slicing method includes winding a wire around rollers and pressing the wire against an ingot while supplying slurry to the rollers. A previously conducted experiment provides a supply temperature profile of the slurry during the slicing process and the relationship to the axial displacement of the rollers. This relationship is used to implement slurry delivery during the slicing process. The resultant wafers are bowed in a uniform direction. This slicing method provides excellent reproducibility in addition to producing wafers that are bowed in a uniform direction.

Abstract: A method for producing thin silicon rods using a floating zone crystallization process includes supplying high frequency (HF) current to a flat induction coil having a central opening, a plurality of draw openings and a plate with a slot as a current supply of the HF current so as to provide a circumfluent current to the central opening. An upper end of a raw silicon rod is heated by induction using the flat induction coil so as to form a melt pool. A thin silicon rod is drawn upwards through each of the plurality of draw openings in the flat induction coil from the melt pool without drawing a thin silicon rod through the central opening having the circumfluent current.

Abstract: A method of manufacturing a silicon monocrystal by FZ method, wherein a P-type or N-type silicon crystal having been pulled up by CZ method is used as a raw material. While impurities whose conductivity type is the same as that of the raw material are supplied by a gas doping method, the raw material is recrystallized by an induction-heating coil for obtaining a product-monocrystal.

Abstract: A method for producing a single crystal by Czochralski method with pulling a seed crystal from a raw material melt, wherein in which a range of a pulling rate of pulling a single crystal, a temperature gradient at a solid-liquid interface and a highest temperature at an interface between a crucible and a raw material melt are defined. The single crystal is pulled with controlling the pulling rate and/or the temperature gradient at a solid-liquid interface within the determined range. The method produces a single crystal in which a desired defect region and/or a desired defect-free region can be determined more precisely and a single crystal with desired quality can be more surely pulled.

Abstract: The invention provides a method of controlling the spatial distribution, shape and size of films of conjugated organic molecules that can be used to grow single layers of organic molecules on silicon oxide nanostructures. The silicon oxide nanostructures are produced using an anodic oxidation process. The organisation of the molecules on the oxide nanostructures is dependent on the kinetic parameters of the latter (evaporation rate, diffusion coefficient) and on the interactions with the silicon (anodic) oxide regions. The molecules form domains which exactly reproduce the lateral size and the shape of the oxide nanostructures. The invention provides a powerful method of performing a bottom-up construction of wires, electrodes and charge transfer zones in nanoscale devices.

Abstract: The object of this invention is to provide a method and a device for manufacturing semiconductor single crystals by the CZ method in response to the increase in the weight of semiconductor single crystal produced. The necked portion formed beneath the reduced portion can be held and the single crystal under lifting can be re-melted.

Abstract: A method of supplying raw material for fabricating semiconductor single crystal according to the continuously charged method provides an inventive method to overcome the problems of the raw material being charged either insufficiently or excessively, and to charge the raw material steadily. According to the inventive method, the raw material of two polysilicon bars is melted simultaneously and flows to the crucible. By calculating the difference between the weight of the growing single crystal and that of the molten raw material, the insufficiency or excess of the raw material charged is obtained, thereby inducing the equivalent regulation. Further, the coordinates of the tips of the raw material of two polysilicon bars while molten is taken to control the power of the two heaters which melt the polysilicon bars respectively for keeping the coordinates of the two tips in a constant position.