Abstract: A sputtering system includes a vacuum chamber, a power source having a pole coupled to a backing plate for holding a sputtering target within the vacuum chamber, a pedestal for holding a substrate within the vacuum chamber, and a time of flight camera positioned to scan a surface of a target held to the backing plate. The time of flight camera may be used to obtain information relating to the topography of the target while the target is at sub-atmospheric pressure. The target information may be used to manage operation of the sputtering system. Managing operation of the sputtering system may include setting an adjustable parameter of a deposition process or deciding when to replace a sputtering target. Machine learning may be used to apply the time of flight camera data in managing the sputtering system operation.

Abstract: A film forming apparatus includes: a processing chamber; a sputtered particle emitter; a substrate mounting unit; and a sputtered particle shielding plate that is provided between the sputtered particle emitter and the substrate mounting unit and has a passage hole that allows the sputtered particles emitted from the sputtered particle emitter to pass through and allows the sputtered particles to be obliquely incident on a substrate mounted on the substrate mounting unit.

Abstract: A film forming apparatus includes: a processing chamber; a sputtered particle emitter; a substrate mounting unit; and a sputtered particle shielding plate that is provided between the sputtered particle emitter and the substrate mounting unit and has a passage hole that allows the sputtered particles emitted from the sputtered particle emitter to pass through and allows the sputtered particles to be obliquely incident on a substrate mounted on the substrate mounting unit.

Abstract: Embodiments include systems, devices, and methods for monitoring etch or deposition rates, or controlling an operation of a wafer fabrication process. In an embodiment, a processing tool includes a processing chamber having a liner wall around a chamber volume, and a monitoring device having a sensor exposed to the chamber volume through a hole in the liner wall. The sensor is capable of measuring, in real-time, material deposition and removal rates occurring within the chamber volume during the wafer fabrication process. The monitoring device can be moved relative to the hole in the liner wall to selectively expose either the sensor or a blank area to the chamber volume through the hole. Accordingly, the wafer fabrication process being performed in the chamber volume may be monitored by the sensor, and the sensor may be sealed off from the chamber volume during an in-situ chamber cleaning process. Other embodiments are also described and claimed.

Abstract: A semiconductor device includes: a semiconductor chip that has a first connection terminal for wiring connection; a substrate that has a second connection terminal for wiring connection, the second connection terminal being electrically connected to the first connection terminal; and a reflective surface that reflects light from the first connection terminal and the second connection terminal in a thickness direction of the substrate or the semiconductor chip.

Abstract: Embodiments of the present invention disclose a detection device for detecting a thickness of a vacuum-evaporated film and a vacuum evaporation apparatus, thereby solving, for example, a problem that a conventional detection device results in excessively high production cost due to frequent replacement of a crystal plate. The detection device includes: a crystal plate, a detection structure provided with an opening corresponding to the crystal plate such that evaporated molecules or atoms are deposited on the crystal plate through the opening; and a filter disposed between the opening and the crystal plate.

Abstract: The disclosure relates to an application system and to an application method for applying a fluid (e.g., polyvinyl chloride, adhesive, paint, lubricant, preservation wax, sealant, or PUR foam) to a component (e.g., motor vehicle body component), comprising a flow measuring cell for measuring a quantity flow of the fluid and for producing a measurement signal corresponding to the measured quantity flow, and an evaluating unit for determining the quantity flow from the measurement signal of the flow measuring cellin accordance with a measuring specification. The disclosure further provides a calibrating device for automatically calibrating the measuring specification of the evaluating unit.

Abstract: The present invention provides a method for manufacturing a curved liquid crystal display panel, which comprises coating a sealing gum on a first or a second frame sealing region; filing liquid crystals between the two substrates and adhering the two substrates together; performing a first curing on partial sealing gum on a first set or a third set of frame bodies; bending the first set and the third set of frame bodies obtained after the first curing along the extension direction of the first set of frame bodies; performing a second curing on uncured sealing gum on the two bended substrates.

Abstract: The invention is directed to QCM measurements in monitoring ALD processes. Previously, significant barriers remain in the ALD processes and accurate execution. To turn this exclusively dedicated in situ technique into a routine characterization method, an integral QCM fixture was developed. This new design is easily implemented on a variety of ALD tools, allows rapid sample exchange, prevents backside deposition, and minimizes both the footprint and flow disturbance. Unlike previous QCM designs, the fast thermal equilibration enables tasks such as temperature-dependent studies and ex situ sample exchange, further highlighting the feasibility of this QCM design for day-to-day use. Finally, the in situ mapping of thin film growth rates across the ALD reactor was demonstrated in a popular commercial tool operating in both continuous and quasi-static ALD modes.

Abstract: A satellite paint waste recovery system for a painting system which reduces hazardous waste generation, providing instead a plurality of solvent mixes which are reusable by the painting system. The satellite paint waste recovery system employs a method of capturing reusable solvent when changing paint colors in the painting system which includes flushing a discrete color of paint loaded in the painting system with fresh solvent and capturing the discrete color of paint flushed and some of the flushing solvent as a discrete color solvent mix in a discrete container each time the paint color sought to be used in the painting system is changed. The discrete color of solvent mix can subsequently be reused to thin a new container of paint instead of using new solvent.

Abstract: A method of adjusting vapor-phase growth apparatuses in which the individual difference of a heater-set temperature and a surface temperature of substrate-mounted plate among the vapor-phase growth apparatuses is eliminated.

Abstract: A film formation method controls with accuracy the thickness of a thin film formed on a film formation object. The film formation method includes a film formation step of heating a film formation source and forming a film on a film formation object while moving the film formation source and monitoring an amount of released vapors of the film forming material using a quartz oscillator for measurement, a control step of adjusting a heating temperature of the film formation source based on the monitored value of the quartz oscillator for measurement, and a calibration step of calibrating the monitored value of the quartz oscillator for measurement, using a quartz oscillator for calibration and the quartz oscillator for measurement. The calibration step is performed in a middle of the film formation step, after movement of the film formation source is started from a waiting position.

Abstract: Approaches are described for selectively managing imaging elements on a computing device. A portable computing device can include a camera module that can manage the capture and/or processing of image data. The module can include a first imaging element attached to a first surface of a substrate and a second imaging element attached to a second surface of the substrate, the first surface being opposite the second surface. The image module can also include an image signal processor (ISP) or other dedicated imaging processing circuitry attached to or otherwise in connection with the substrate. The circuitry can be shared between the imaging elements, and can be configured to receive a selection of one of the imaging elements and process (e.g., depth pixel correction, etc.) captured image data based on the selected imaging element.

Abstract: The present disclosure relates to a process for manufacturing Organic Light-Emitting Diode (OLED) display panel, and in particular to a device and a method for detecting evaporation source. Through installing a mobile detector above a linear evaporation source, the vapor-deposition rate of the whole linear can be timely and effectively detected. The feedback of uniformity of vapor-deposition can be effectively given, and at the same time the abnormity of the vapor-deposition can be found. Meanwhile, in order to increase the yield and quality of product as well as prevent the evaporation source pollution caused by the dropping of some defects such as organic material or dust, the mobile detector is locked in one side of the evaporation source when it does not work.

Abstract: Apparatus and methods of determining a position of a height sensor in a dispensing system. The dispensing system includes a dispenser, height sensor, camera, and a calibration device configured to receive a signal from the height sensor. The calibration device may include an optical sensor that generates an alignment signal in response to receiving light from the height sensor and/or a fiducial that causes the height sensor to generate the alignment signal in response to a detected height change. The alignment signal is used to automatically determine the position at which the height sensor is aligned with the calibration device. The position of the height sensor relative to a camera is determined by aligning the camera with the calibration device and recording its position. The recorded coordinates of the camera are compared to the coordinates of the height sensor when the height sensor is automatically aligned with the calibration device.

Abstract: Provided are an apparatus and method for depositing a thin film on a substrate. The substrate is supported by a substrate holder. The substrate holder is seated on each of a plurality of holder seating grooves defined in a top surface of the susceptor. An injection hole for injecting a gas is defined in a top surface of each of the holder seating grooves. When a process is performed, the susceptor is rotated with respect to a central axis thereof, and the substrate holder is rotated with respect to a central axis of the substrate holder by the gas injected from the injection hole. A flow rate of the gas supplied onto an under surface of the substrate holder is adjusted according to a state of the substrate.

Abstract: A method of making up the skin or the lips, the method including measuring at least one optical characteristic at least one location of the skin or the lips; and automatically forming on the skin or lips a deposit that has an optical characteristic that varies and that corresponds substantially at said location, to the measured optical characteristic.

Abstract: In a measurement mechanism for continuously measuring a thickness of a coating layer, provided in an apparatus for forming the coating layer on a conductive elongate base material in a coating treatment base station while the base material is fed, a sensing portion for measuring a capacitance value of the coating layer is arranged before and after the base station, and tension applied to the base material at the sensing portion is set to be greater than tension applied to the base material at the base station. Thus, in forming the coating layer on the elongate base material while the base material is continuously fed, variation in a feeding speed is suppressed, influence of sway of a measurement surface in a direction of thickness at the thickness sensing portion during feeding is minimized, and a thickness of the coating layer can be measured with higher accuracy.

Abstract: A process (300) is disclosed to measure predetermined wavelength reflectance spectra of a photo resist coated wafer (305,310,315,320) at a nominal thickness. After coating, the predetermined wavelength reflectance (325,330) is measured and the peak heights and valleys in the vicinity of the predetermined wavelength are tabulated. The relative swing ratio is computed (335) as the average peak height of the spectra at the exposure wavelength. This relative swing ratio is then compared to similar computations on other processes to determine which provides the best critical dimension (CD) control.

Abstract: In one aspect, a method of nanolithography is provided using a driving force to control the movement of a deposition compound from a scanning probe microscope tip to a substrate. Another aspect of the invention provides a tip for use in nanolithography having an internal cavity and an aperture restricting movement of a deposition compound from the tip to the substrate. The rate and extent of movement of the deposition compound through the aperture is controlled by a driving force.

Abstract: A bookbinding apparatus includes a coating device for moving relatively to a sheet bundle in the longitudinal direction thereof and for coating an adhesive on the spine of the sheet bundle, a driving device for the relative movement of the coating device, and a control device for controlling the driving device, and according to the thickness of a booklet, changes the number of times of coating of the coating device for one booklet, thereby controls the amount of coating of adhesive.

Abstract: A method for depositing a material on a substrate includes providing an apparatus with at least one material dispenser. The method further includes positioning the pen tip at a predetermined writing gap where the predetermined writing gap is a distance of more than 75 micrometers above the substrate. The method also provides for controlling velocity of the flow of material through the outlet and dispense speed based on dispensed line height and dispensed line width parameters. An apparatus for depositing a material on a substrate is also provided which may have one or more mechanical vibrators, a pen tip with a hydrophobic surface, or multiple nozzles and pen tips on a single pump.

Abstract: A coating apparatus and an operating method thereof that prevent damage to the nozzle of a spinless coater from impurities on a substrate during resin coating of the substrate, and impurities remaining on a stage at the bottom of the substrate. The coating apparatus comprises a stage, a nozzle, a nozzle cleaner, and a stage cleaner. A substrate is placed upon the stage. The nozzle discharges resin on the substrate to perform coating. The nozzle cleaner cleans the nozzle. The stage cleaner cleans the stage. The operating method includes removing a coated first substrate from atop a stage, cleaning the stage using a stage cleaner, introducing a second substrate to be coated onto the cleaned stage, and discharging resin through a nozzle onto the second substrate and coating the second substrate.

Abstract: A method and an apparatus (10) for making thin layers from particles, wherein the particles are deposited on a carrier fluid flowing by gravity along a ramp (12) leading to a dam (18). The particles are held back at the bottom of the ramp (12), thereby causing the particles to be piled up one against the other in a monolayer configuration.

Abstract: The apparatus and method use an optical feedback system to align a brush assembly with a stent strut. Once alignment is achieved, a coating is dispensed onto the stent strut via the brush assembly and the brush assembly is moved along the stent strut to coat the stent strut.

Abstract: A line marking apparatus includes a chassis (2) provided with wheels (4) and with means (6) for propelling the apparatus. A line marking head (12) is adapted to dispense line marking material so as to mark a line upon a surface over which the apparatus is moved. A support (14) is provided for the line marking head such that the line marking head is movable laterally relative to the chassis. Lateral movement of the line marking head is controlled by a controller which includes a detector (32) for detecting a beam of electromagnetic radiation indicative of the line to be marked and which also includes control means for moving the line marking head in response to detection of the beam by the detector, whereby lateral movement of the line marking head relative to the chassis is controlled such that the line marking head substantially follows the line to be marked irrespective of whether the chassis deviates from the direction of such line.

Abstract: An apparatus and method for processing elongated sheet material through a plurality of processing stations including a cooling station for lowering the temperature of the sheet material. The cooling station includes a plurality of individually controllable cooling zones each for controlling a portion of the transverse width of the sheet material during passage through the cooling zone. The cooling zones each include a plurality of cooling fluid directing spray nozzles and a sensor for sensing the temperature of the portion of the sheet material onto which cooling fluid has been directed by the respective cooling zone. A controller responsive to the temperature sensed at each cooling zone is operable for independently controlling the flow of cooling fluid to the fluid spray nozzles of each cooling zone based upon a preset temperature setting of the controller.

Abstract: The present invention presents an improved upper electrode for a plasma processing system, wherein the design and fabrication of an electrode plate coupled to an upper assembly advantageously provides gas injection of a process gas with substantially minimal erosion of the electrode plate.

Abstract: An apparatus for forming an alignment layer of a liquid crystal display device includes: an alignment material dropping unit with a head having a plurality of holes for dropping an alignment material on the substrate; an alignment material supply unit to supply the alignment material to the alignment material dropping unit; a scan unit to survey alignment material dropping from the head; and a monitor to display an image base upon scan data from the scan unit so that the discharge state of the plurality of holes in the head can be checked.

Abstract: An apparatus for fabricating a flat panel display device includes a substrate on which a picture display section is formed and a stage on which the substrate is loaded. A dispenser applies a sealant along an outer line of the picture display section in the substrate. A light detector emits light toward the sealant and detects the amount of reflected light in real-time. A controller detects broken lines in the sealant in accordance with a signal supplied from the light detector and controls the dispenser so as to re-apply the sealant to spaces in the broken line in which the sealant is not present.

Abstract: A semiconductor device manufacturing apparatus is provided with a drawing pattern printing part having a print head which ejects a conductive solvent, an insulative solvent and an interface treatment solution. The print head is formed in such a way that desired circuit drawing pattern can be printed on a wafer based on information on the drawing pattern from a wafer testing part, information on the wafer from a storage part and coordinate information from a chip coordinate recognition part. In a semiconductor device manufacturing method according to the present invention, a semiconductor device is manufactured by using the semiconductor device manufacturing apparatus in such a manner that desired circuits are formed through printing process. In the semiconductor device, pad electrodes and so on are formed in such a way that trimming process can be conducted by printing circuit drawing patterns.

Abstract: The invention relates to a device and method for controlling the operation of a thermal spray torch (12). The inventive device and method are characterized in that an on-board camera (54) and pyrometer (70) are used to measure the properties of the jet (16) and the temperature of the deposit (24) on the part (22) and in that the correction to be made to supply parameters of the torch (12) is deduced. Furthermore, the invention is characterized in that the corrected parameters are sent to the cabinet (30) that controls the torch (12).

Abstract: The invention relates to a device and a method for control of the operation of a thermal projection torch (12), characterized in that the characteristics of the jet (16) and the temperature of the deposit (24) on the piece (22) are measured by means of a camera (54) and a combined pyrometer (70). The correction to be made to the supply parameters of the torch (12) are deduced therefrom and the corrected parameters are transmitted to the unit (30) controlling the torch (12).

Abstract: The invention relates to a device and a method for control of the operation of a thermal projection torch (12), characterized in that the characteristics of the jet (16) and the temperature of the deposit (24) on the piece (22) are measured by means of a camera (54) and a combined pyrometer (70). The correction to be made to the supply parameters of the torch (12) are deduced therefrom and the corrected parameters are transmitted to the unit (30) controlling the torch (12).

Abstract: The invention relates to a device and method for controlling the operation of a thermal spray torch (12). The inventive device and method are characterised in that an on-board camera (54) and pyrometer (70) are used to measure the properties of the jet (16) and the temperature of the deposit (24) on the part (22) and in that the correction to be made to the supply parameters of the torch (12) is deduced. Furthermore, the invention is characterised in that the corrected parameters are sent to the cabinet (30) that controls the torch (12).

Abstract: The present invention relates to a method for manufacturing a liquid crystal display utilizing the dispense-injection method, and it is an object of the invention to provide a method for manufacturing a liquid crystal display which allows an optimum quantity of liquid crystals to be dispensed on each substrate. At a dispense-injection step, in the case of a two-shot process for fabricating two liquid crystal display panels from a single glass substrate 80, the heights of support posts on two CF substrates 82 (let us call them surfaces A and B) having columnar spacers formed thereon are measured at a plurality of points (e.g., five locations indicated by numerals 1 through 5) on each of the surfaces A and B using a laser displacement gauge and an average value of the height is obtained. The support post height of the columnar spacers is thus measured in advance to control the quantity of dispensed liquid crystals based on the measured value.

Abstract: A liquid crystal material dispensing apparatus includes a spacer height measuring unit for measuring a height of a spacer on a substrate, and a liquid crystal material dispensing system for determining an amount of the liquid crystal material to be dispensed on the substrate based upon the measured spacer height and for dispensing the liquid crystal material onto the substrate.

Abstract: A deposition apparatus supplies a reactive gas obtained by vaporizing a liquid material at a vaporizer 30 into a chamber 10 via a processing-gas pipe 40 and forms a thin film on a semiconductor wafer W due to a thermal decomposition of the reactive gas. The deposition apparatus is provided, in the processing-gas pipe 40, with a crystal gauge 51 detecting a pressure Pq under the influence of mist in the reactive gas and a capacitance manometer 52 detecting a pressure Pg under no influence of the mist. The apparatus further includes a gasification monitor 50 detecting a quantity of mist in the reactive gas on the basis of a difference ?P between the pressure Pq and the pressure Pg measured by the crystal gauge 51 and the capacitance manometer 52 in order to prevent deposition defects due to the mist in the reactive gas.

Abstract: A process for forming a thin film is described that enables automatic formation of thin films having constant optical properties reliably and in large quantities with excellent reproducibility suitable for mass production. An apparatus for performing the process is also described. Generally, a material for vapor deposition is vaporized by an electron gun and an antireflection film forms by vapor deposition on lenses held by a coat dome. The electric power applied to the electron gun is controlled so that the amount of transmitted or reflected light continuously measured by an optical film thickness meter during thin film formation is compared to a reference amount of measured light stored in a means for storing data until the measured and reference amounts of measured light are close to, or the same as, one another.

Abstract: In an ink jet apparatus for manufacturing a color filter 1, ink jet heads 22 having a plurality of nozzle 27 are disposed in a linear manner. Filter element member is ejected to a motherboard 12 from a plurality of nozzles 27 four times so as to form the filter element 3 in a predetermined thickness. By doing this, it is possible to prevent difference in the thickness in a plurality of the filter elements 3 and to equalize light transparency in planar manner. Thus, in an ejecting apparatus, a color filter can be formed in more common way at low cost and more efficiently. Also, it is possible to provide an ejecting apparatus which can equalize factors such as electrooptical characteristics of the electrooptical members, color displaying characteristics by the liquid crystal apparatuses, and illuminating characteristics by an EL surface.

Abstract: An apparatus and method for simultaneously coating and measuring a part. The apparatus includes a part support, a sprayer and a part measurer positioned adjacent to the part support and a display device positioned adjacent to the part support. The sprayer applies a coating to a section of the part while the part measurer continuously measures a dimension of the section of the part being coated. In one embodiment, an initial amount of coating and a final amount of coating are applied to the section of the part based on the dimension measurements and desired dimension of the part. In another embodiment, the amount of coating applied to the part is based on the desired coating thickness. As a result, the apparatus and method of the present invention significantly reduces the margin of error related to the application of coatings to parts.

Abstract: A method and apparatus for coating hams is provided. Sugar is uniformly dispensed on an inclined plate that is heated to melt the sugar. The sugar flows into a reservoir from which it is poured onto hams passing below the reservoir on a conveyor. Spices are poured onto the melted sugar that sticks to the ham to form a glaze. Jets of water can cool the glaze to increase retention on the ham. The process can be repeated.

Abstract: A method of plating bath composition control. The method may include analysis of a plating bath to determine byproduct concentrations and changing the composition of the plating bath as a result thereof. Additionally, plating bath solution may be circulated between reservoirs before, during, or after the analysis and the changing of the composition. Methods may be carried out with use of a system having separate reservoirs, an analyzer, and a dosing controller for the changing of the composition.

Abstract: A method for controlling the deposition of an organic layer in making an organic light-emitting device includes depositing at a deposition zone organic material forming a layer of the organic light-emitting device and providing a movable sensor which, when moved into the deposition zone and is being coated during the depositing step, provides a signal representing the deposition rate and thickness of the organic material forming the layer. The method also includes controlling the deposition of the organic material in response to the signal to control the deposition rate and thickness of the deposited organic material forming the layer, moving the movable sensor from the deposition zone to a cleaning position, and removing organic material from the movable sensor to permit reuse of the movable sensor.

Abstract: A liquid output portion is arranged above and moves relative to a semiconductor substrate with determined film formation and non-film-formation regions. The liquid output portion continuously outputs a liquid in a constant amount to the substrate. Below the liquid output portion is a liquid shut-out-portion. A liquid controlled to spread in a constant amount is continuously output from the liquid output nozzle to the substrate. While the nozzle and the substrate relatively move, the liquid is supplied to a first region, and the liquid is supplied to a second region in such a way that the liquid supplied and spread in the second region is in contact with the liquid supplied and spread in the first region. Where projections and depressions are formed on the surface of the substrate, an amount of the liquid supplied varies depending upon the ratio between the projections and depressions.

Abstract: Methods, compositions, and apparatus for preparing biomimetic scaffolds are provided. The methods, compositions, and apparatus are compatible with both in situ and external scaffold preparation. Also provided are methods for preparing scaffolds having 3-D spatial and/or temporal gradients of therapeutic compounds, such as, growth factors, antibiotics, immunosuppressants, analgesics, etc.

Abstract: When a resist film is formed by discharging a resist solution onto the front face of a wafer housed in a cup, a relation between the film thickness of a resist film and the line width of a circuit pattern when the resist film is exposed into a predetermined pattern and thereafter developed is obtained in advance, from that relation, a line width with less variations corresponding to the changes in film thickness of the resist film is selected from among line widths within a designated region to form a resist film to have the film thickness corresponding to the selected line width. Accordingly, the line width of the circuit pattern after development is not likely to vary regardless of the changes in film thickness of the resist film formed on the wafer.

Abstract: A method for controlling the deposition of an organic layer in making an organic light-emitting device includes depositing at a deposition zone organic material forming a layer of the organic light-emitting device and providing a movable sensor which, when moved into the deposition zone and is being coated during the depositing step, provides a signal representing the deposition rate and thickness of the organic material forming the layer. The method also includes controlling the deposition of the organic material in response to the signal to control the deposition rate and thickness of the deposited organic material forming the layer, moving the movable sensor from the deposition zone to a cleaning position, and removing organic material from the movable sensor to permit reuse of the movable sensor.

Abstract: The present invention provides apparatus and methods to carry out the task of both reducing the surface roughness (smoothing) and improving the thickness uniformity of, preferably, but not limited thereto, the top silicon film of a silicon-on-insulator (SOI) wafer or similar thin-film electronic and photonic materials (workpiece). It also provides a method and apparatus for smoothing the surface of a (preferably) SOI wafer (workpiece) and for making the surface of the silicon film of a (preferably) SOI wafer cleaner and more free from contaminants.

Abstract: A method of adjusting plasma processing of a substrate in a plasma reactor having an electrode assembly. The method includes the steps of positioning the substrate in the plasma reactor, creating a plasma in the plasma reactor, monitoring optical emissions emanating from a plurality of different regions of the plasma in a direction substantially parallel to the surface of the substrate during plasma processing of the substrate, and determining an integrated power spectrum for each of the different plasma regions and comparing each of the integrated power spectra to a predetermined value. One aspect of the method includes utilizing an electrode assembly having a plurality of electrode segments and adjusting RF power delivered to the one or more electrode segments based on differences in the integrated power spectra from the predetermined value.