Abstract: A workpiece processing device includes a workpiece supporting unit configured to support a workpiece so that the workpiece is rotatable around a first axis parallel to a central axis of the workpiece, a cutting unit having a blade configured to cut a surface of the workpiece, a detecting unit configured to calculate a position of a vertex of the surface in a direction along a second axis which is perpendicular to the first axis and parallel to the blade, and a control unit configured to control the workpiece supporting unit so that a cutting position on the surface is located at a vertex in the direction along the second axis, and relatively move the workpiece supporting unit and the cutting unit so that an incision direction of the blade is on a plane defined by the central axis and the cutting position, thereby forming a groove at the cutting position.

Abstract: A device and method for reducing a size of feed material. The device has a knife ring that is stationary within a housing or rotates around an axis. The knife ring has rod-shaped knife carriers that are disposed concentrically around the axis in an axis-parallel position at a mutual circumferential distance from each other and that form an inner circumferential surface of the knife ring with their sides facing the axis. Each knife carrier having a receptacle for fastening a flaking knife. The flaking knife protruding by its edge between two knife carriers into the flaking chamber. A measuring instrument includes at least one distance sensor that measures a distance of the inner circumferential surface and/or the edges of the flaking knives from the at least one distance sensor.

Abstract: A blade mount for a cutting machine, in particular for a food slicing machine, includes a contact surface for a blade, a mount section for the blade projecting axially from the contact surface and at least one torque transmission element which projects axially from the contact surface, which is radially spaced apart from the mount section, which engages into the blade and in which a mount is formed for fastening the blade to the blade mount. Additionally, a blade is matched thereto, to a handling apparatus for assembling the blade at the blade mount, and to a system of blade mount, blade and handling apparatus.

Abstract: An amount of warp of a wafer is not only reduced, but the amount of warp of the wafer is also accurately controlled to a desired amount. The present invention relates to a method for slicing a semiconductor single crystal ingot, by which a cylindrical semiconductor single crystal ingot is bonded to and held by a holder in a state where the ingot is rotated at a predetermined rotation angle around a crystal axis of the ingot different from a center axis of a cylinder of this ingot and the ingot is sliced by a cutting apparatus in this state. The predetermined rotation angle at the time of bonding and holding the ingot with the use of the holder in such a manner that an amount of warp of a wafer sliced out by the cutting apparatus becomes a predetermined amount.

Abstract: An embodiment of a method of manufacturing semiconductor wafers comprises forming a notch or a flat in a semiconductor ingot extending along an axial direction. A plurality of markings are formed in the semiconductor ingot. At least some of the plurality of markings at different positions along the axial direction are distinguishable from each other by a characteristic feature. The semiconductor ingot is then sliced into semiconductor wafers.

Abstract: Cutting and grinding of ceramic-type logs to a desired piece length is disclosed. A method of manufacturing ceramic ware is disclosed which comprises transversely cutting a piece from a ceramic-type log having a longitudinal axis by cutting into the log with a blade at a location along the length of the log to form a cut transverse surface on the piece and grinding the cut transverse surface with a side of the blade. An apparatus for manufacturing ceramic ware is also disclosed comprising means for transversely cutting a piece from a ceramic-type log having a longitudinal axis, including a blade for cutting into the log at a location along the length of the log to form a cut transverse surface on the piece, and means for grinding the cut transverse surface with a side of the blade.

Abstract: The present invention provides a cutting machine for stone materials having a power head part, a bedplate, a frame for supporting the bedplate and a basin disposed under the frame. The present invention may also have an expanded basin disposed outside of the basin and a water-retaining device with an upward slope angle may be arranged on the expanded basin to block splashed muddy water in a multi-directional manner during a cutting operation.

Abstract: A rotary stone cutting tool and method for making countertops and the like includes a shank shaped for detachable connection with a rotary drive. A cup-shaped cutting blade is mounted on the outer end of the shank, and has a frusto-conical sidewall and an outer marginal edge with axially protruding cutting teeth. A plurality of cutting pads are embedded in the sidewall and protrude radially outwardly therefrom. The blade is advanced through a stone slab with the sidewall oriented generally perpendicular to the face of the stone slab to cut an arcuate portion of an inside corner with reduced waste.

Abstract: A machine for cutting blocks of natural or similar types of stone includes a plurality of diamond-wire loops, wound about an assembly for the support and transmission of the cutting motion to said diamond-wire loops and at least one assembly for supporting, tensioning and guiding the diamond-wire loops; said assemblies move vertically in unison on the structure of the machine; and presents said supporting, tensioning and guiding assembly comprising a set of pulleys for the support and return of each diamond-wire loop, which are mounted and registered, for wire tensioning, on a movable tensioning means whose registration movement is actuated by a tensioning control means, independently of the movable tensioning means of contiguous diamond wires.

Abstract: A rotary stone cutting tool and method for making countertops and the like includes a shank shaped for detachable connection with a rotary drive. A cup-shaped cutting blade is mounted on the outer end of the shank, and has a frusto-conical sidewall and an outer marginal edge with axially protruding cutting teeth. A plurality of cutting pads are embedded in the sidewall and protrude radially outwardly therefrom. The blade is advanced through a stone slab with the sidewall oriented generally perpendicular to the face of the stone slab to cut an arcuate portion of an inside corner with reduced waste.

Abstract: Provided is a V-groove processing apparatus for cutting and V-groove processing. The V-groove processing apparatus includes a processing unit for processing V-grooves in an engineered stone raw plate fixed on a table while being transferred by a transfer unit. Here, the processing unit includes a circular saw blade disposed at a front of a cutting panel to cut the engineered stone raw plate, one or more cutters disposed on a front of a cutter housing to form a V-groove inside a cut surface, a first rise and fall unit transferring the circular saw blade to a cutting location during the cutting of the engineered stone raw plate and restoring the circular saw blade to an original place after the cutting of the engineered stone raw plate, and a second rise and fall unit transferring the circular saw blade and the cutters to a V-groove forming location during the formation of the V-groove and restoring the circular saw blade and the cutters to original places after the formation of the V-groove.

Abstract: A machine for cutting holes in concrete slabs comprises a connector adapted to be secured to an adapter of a front-end loader. Secured to the connector is a first frame structure that includes an elongated tube and a support foot for engaging the surface of a concrete slab and supporting the first frame structure. Confined within the elongated tube of the first frame structure is a beam that is slidable back and forth therein. One end portion of the beam extends from the elongated tube. A second foot structure extends downwardly from the one end portion of the beam to where it may engage the surface of the concrete slab. Secured directly or indirectly to the elongated beam is a concrete hole cutting saw unit that includes a drum type concrete saw. Interconnected between the beam and the first frame structure is a hydraulic cylinder that is operative to move the elongated beam and saw cutting unit back and forth between a retracted and extended position.

Abstract: An improved portable stone cutter includes a base which is of a rectangular frame composed of a plurality of longitudinal bars, a pair of transverse bars and a pair sliding bars, a working table slidably secured to the sliding bars, a motor disposed on the front end of the frame and sustained by an arcuate support arm and a supplementary support arm which are releasably and rotatably secured to a pair of outmost longitudinal bars, a guarded circular saw blade connected to the motor and operated by the motor via a belt and a transmission shaft and a tool plate movably disposed to one of the outmost longitudinal bars. The feature is that the arcuate support arm and the supplementary support arm define a large space to permit a large piece of stone passing through the saw blade and both the supplementary support arm and the tool plate are removable to reduce the volume of the stone cutter to conveniently pack for transportation.

Abstract: The present invention provides for an apparatus for forming a V groove in a sheet of natural, synthetic or engineered stone material. The apparatus comprises a table for supporting a work piece of natural, synthetic or engineered stone material to be cut, two or more cutting heads aligned to cut along the same line of the work piece of natural, synthetic or engineered stone material and a mechanism for moving the work piece or the cutting heads relative to one another to cut the V groove in the natural, synthetic or engineered stone work piece. Each of the cutting heads removes material from the natural, synthetic or engineered stone work piece with the final cutting head forming the shape of the desired V groove. Each of the cutting heads is provided with a means for air cooling the cutting surfaces.

Abstract: A cutting machine comprising a chuck means for holding a workpiece to be cut and a cutting means for cutting the workpiece held on the chuck means. The cutting machine further has a first moving means for moving the chuck means relative to the cutting means in the first direction, a second moving means for moving the cutting means relative to the chuck means in the second direction perpendicular to the first direction, and a third moving means for moving the cutting means relative to the chuck means in the third direction perpendicular to the first direction and the second direction. The cutting means comprises a rotary blade which can turn on the center axis of rotation extending in the second direction and is shaped like an annular thin plate perpendicular to the second direction.

Abstract: A device in connection with a hand-operated working machine with a water flow directed to the working tool comprises a first control which is a control (15) for a drive motor (3) for the tool, and a second control which is a control (17) for the water supply to the tool. A water control valve (45) in a water supply conduit (14) can be adjusted to adopt chosen opening positions, and is arranged constantly to be kept open in any chosen opening position when the motor is running the tool under influence of the drive motor control. The chosen opening positions are adjustable, i.e. the through opening of the valve can be increased or decreased by using water supply control (17).

Abstract: A holding strip is used to hold a semiconductor ingot during semiconductor wafer fabrication. The holding strip is formed from a semiconductor material, typically the same material used to form the ingot itself. The holding strip has a holding surface shaped to receive the ingot and at least one surface other than the holding surface, into which at least one notch is formed. The holding strip has a characteristic breaking strength that changes when a cut is formed through the holding surface and into the notch. In some embodiments, the notch has sides that are substantially parallel to each other, and in other embodiments, the notch has tapered sides. In alternative embodiments, the shape of the notch causes an abrupt change or a gradual change in the breaking strength of the holding strip as the cut penetrates into the notch. In either case, the notch can be shaped to cause a gradual change in breaking strength as the cut moves deeper into the notch.

Abstract: A holding unit is provided to support an ingot in a semiconductor wafer sawing machine, which minimizes the instability of a blade during a sawing process. The holding unit is formed from substantially the same material as an ingot resting thereon. The holding unit includes a top surface for receiving an ingot, a bottom surface, a pair of side walls, and a cavity formed in the holding unit. The cavity forms a plurality of break points in the holding unit. When contacted by the blade, the holding unit fractures at the break points to minimize the chipping of the wafer.

Abstract: There is an annular or internal-diameter saw and a method of protecting the clamping edge and of cleaning the saw blade of this annular or internal-diameter saw. The annular or internal-diameter saw has an element which partly screens the clamping edge and is arranged in the vicinity of the clamping edge and the saw blade, and has an outer material layer on the clamping edge. The outer material layer faces the element and is substantially harder than a clamping edge material lying behind it. The method is distinguished by the fact that workpiece residues thrown against the clamping edge are shattered when striking the clamping edge. This is due to the fact that an element partly screening the clamping edge is provided in the vicinity of the clamping edge and the saw blade.

Abstract: A dust and particle control attachment for a saw having a housing and a rotary blade secured for rotation on a shaft extending from the housing comprising a rotary blade guard enclosing a portion of the rotary blade having one side thereof secured to the housing and the other side thereof removably secure to the one side to form a passageway for dust and particles produced during a cutting operation, the passageway having an intake end and a discharge end, a first arrangement is associated with at least one of the side and the other side of the rotary blade guard adjacent the intake end of the passageway to enable cutting inside corners of walls disposed at a predetermined angle with respect to each other both horizontally and vertically, and a second arrangement associated with at least one of the one side and the other side of the rotary blade guard to contain the dust and particles within the passageway and to direct the dust and particles to a collection means connected to the rotary blade guard adjacent

Abstract: A cutting apparatus having a chuck table for holding a workpiece and cutting means for cutting the workpiece held by the chuck table. The cutting means includes a spindle unit, a blade to be attached to a rotating spindle of the spindle unit, a cutting-water supplying nozzle for supplying cutting water to the blade and the workpiece, and an air-blowing nozzle provided adjacent to the blade, for supplying air to a peripheral portion of the blade. The cutting-water supplying nozzle and the air-blowing nozzle are provided on a blade cover for covering the blade. Air-blowing piping for feeding air to the air-blowing nozzle is arranged within the spindle unit. Air forced through the air-blowing piping is fed into the air-blowing nozzle, and is blown against the cutting edge of the blade, eliminating cutting water clinging to the cutting edge to carry out setup for adjusting the blade surely and precisely.