Abstract: A system and method of printing on a strand element with a printer head. The printer head includes a conduit and a cavity formed within the conduit, wherein the cavity is configured to receive the strand element and pass the strand element from a first end of the cavity to a second end of the cavity. The printer head also includes a first set of fluid nozzles formed on the conduit and positioned on a perimeter of the cavity around a first target location within the cavity, wherein each of the fluid nozzles in the first set is positioned to aim at the first target location, and the first target location corresponds to a location of a first segment of the strand element when the strand element is positioned within the cavity.

Abstract: The present disclosure provides a wet etching machine and an etching method. The wet etching machine including an etching chamber in which at least two etching layers are disposed. The etching layers are successively overlapped with each other from up to down, and each etching layer includes a first transfer carrier for receiving and transferring a substrate to be etched and a spraying apparatus disposed right above the first transfer carrier for spraying etching solution. When the total etching time is needed to be longer than the transfer time of the substrate without stopping the substrate, the present disclosure can solve the problems in the prior art of causing the takt time decreased due to the stopping time of the substrate is required to be increased or causing the area of the facility increased due to the number of the etching chambers connected in series is required to be increased.

Abstract: A proximity sensor includes a printed circuit board substrate, a semiconductor die, electrical connectors, a lens, a light emitting assembly, and an encapsulating layer. The semiconductor die is positioned over the printed circuit board substrate with its upper surface facing away from the printed circuit board substrate. Each of the electrical connectors is in electrical communication with a contact pad of the semiconductor die and a respective contact pad of the printed circuit board substrate. The lens is positioned over a sensor area of the semiconductor die. The light emitting assembly includes a light emitting device having a light emitting area, a lens positioned over the light emitting area, and contact pads facing the printed circuit board substrate. The encapsulating layer is positioned on the printed circuit board substrate, at least one of the electrical connectors, the semiconductor die, the lens, and the light emitting assembly.

Abstract: A rack for a domestic dishwasher includes a frame and a base. The base can be swung and folded out in order to increase a loading volume of the rack. The base includes a first portion articulated to a first side of the frame via a first articulation, and a second portion articulated to a second side of the frame opposite the first site via a second articulation, and articulated to the first portion via a third articulation. The second portion is configured to change its length between the second and third articulations.

Abstract: An apparatus and a method for selectively etching an encapsulant forming a package of resinous material around an electronic device includes an electronic device package mountable on the etch head; a conductive electrode in electrical contact with package leads of the electronic device package to apply a first voltage to the package leads of the electronic device; a first pump configured to pump a first quantity of the etchant solution from the source into the etch head where the etchant solution is electrically biased to a second voltage different from the first voltage and is cooled to a temperature below the ambient temperature. An etch cavity is formed on an exterior surface of the electronic device package. When the etchant solution has etched through an exterior surface of the electronic device package, the conductive bond wires of the electronic device is prevented from being etched by the applied first voltage.

Abstract: An improved portable cleaning system for use in cleaning heat exchanger tube bundles, fin-fans, towers and other elongated components. The cleaning system comprises a cleaning unit having a cleaning enclosure that receives and cleans the component and a control unit that controls the operation of the system. The cleaning unit has a cleaning enclosure defining a chamber sized and configured to receive the component through a sealable lid. A roller assembly rotates the component while a spray assembly sprays cleaning fluid over and into the rotating component. The cleaning fluid is heated in the chamber using surface heating elements attached to heat transfer plates along sections of the chamber walls. A vapor recovery system captures and treats toxic vapors. In use, the cleaning system is transported to a facility to clean the components on-site using cleaning fluid supplied by the facility and discharging waste to the facility.

Abstract: An apparatus for cleaning a substrate includes a substrate transferring unit configured to support a substrate at a polar angle from a first direction, and transfer the substrate along a second direction orthogonal to the first direction. A cleaning unit is disposed on the substrate transferring unit. The cleaning unit includes a plurality of two-fluid nozzles. The cleaning unit has an azimuth angle from the first direction. The two-fluid nozzles mix a cleaning solution and compressed gas together and spray the mixture.

Abstract: An apparatus for treating a wafer-shaped article, comprises a spin chuck for holding a wafer-shaped article in a predetermined orientation, at least one upper nozzle for dispensing a treatment fluid onto an upwardly facing surface of a wafer-shaped article when positioned on the spin chuck, and at least one lower nozzle arm comprising a series of lower nozzles extending from a central region of the spin chuck to a peripheral region of the spin chuck. The series of nozzles comprises a smaller nozzle in a central region of the spin chuck and a larger nozzle in a peripheral region of the spin chuck. In the method according to the invention, a heated liquid is supplied through the series of nozzles so as to supply more heat to peripheral regions of a wafer than to central regions.

Abstract: A system includes a plurality of nozzles, a pump configured to pump a fluid through the nozzles, and a manifold configured to arrange the plurality of nozzles to substantially match a shape of a workpiece. Each nozzle of the plurality of nozzles is configured to impinge upon a section of the workpiece with the fluid.

Abstract: A device (1) for removing a coating, particularly a photoresist, from a substrate (10) in at least one area of the substrate (10), comprises a nozzle (11) suitable for applying a jet of a solution medium to the substrate.

Abstract: An apparatus for processing a substrate, comprising: a process chamber having a track; a carrier connected to the track; upper and lower proximity heads in the chamber and positioned along the path, the proximity heads having opposing faces that define a gap in which a meniscus of fluid is formed, the path being defined along the gap between the opposing faces; a first pre-wet dispenser and a second pre-wet dispenser disposed along side of the upper proximity head and directed toward the path; a drive for moving each of the pre-wet dispensers between a center position along the length of the upper proximity head and opposite outer positions near outer ends of the upper proximity head; and a pre-wet controller for causing the drive to move each of the first and second pre-wet dispensers based on a position of the carrier when moved under the first and second pre-wet dispensers.

Abstract: The cleaning method includes a cleaning step of, in a state in which an upper cleaning liquid 3 is spouted downward from an upper nozzle 2 arranged on an upper side of a work 10 and a lower cleaning liquid 5 is spouted upward from a lower nozzle 4 arranged on a lower side of the work 10, cleaning at least an upper surface of the work 10 among the upper surface of the work and an outer peripheral surface 10b of the work 10 with the upper cleaning liquid 3 and cleaning a lower surface 10c of the work 10 with the lower cleaning liquid 5 by relatively moving the work 10 in a horizontal direction with respect to both the upper nozzle 2 and the lower nozzle 4.

Abstract: [Problem] To provide a liquid processing method with which, while alleviating a watermark occurring in the surface of a substrate, it is possible to hydrophobize the surface using a hydrophobing gas. [Solution] A substrate (W), retained in substrate retaining parts (21, 22, 23), is rotated and has a liquid compound supplied to the surface thereof, whereby a liquid process is carried out. Next, a rinse liquid is supplied to the surface of the substrate (W) while the substrate (W) is rotated, and the liquid compound is replaced with the rinse liquid. Next, supplying a hydrophobing gas for hydrophobizing the surface of the substrate (W) and supplying the rinse liquid to the surface of the substrate (W) after supplying the hydrophobing gas are repeated alternately, thus hydrophobizing the substrate (W). Next, the rinse liquid is removed by rotating the substrate (W), drying the substrate (W).

Abstract: A substrate processing apparatus comprises an indexer block, an anti-reflection film processing block, a resist film processing block, a development processing block, a resist cover film processing block, a resist cover film removal block, a cleaning/drying processing block, and an interface block. An exposure device is arranged adjacent to the interface block in the substrate processing apparatus. The exposure device subjects a substrate to exposure processing by means of an immersion method. In the edge cleaning unit in the cleaning/drying processing block, a brush abuts against an end of the rotating substrate, so that the edge of the substrate before the exposure processing is cleaned. At this time, the position where the substrate is cleaned is corrected.

Abstract: A nozzle for discharging droplets of a processing liquid for processing a substrate has a main body including a supply port, a drain port, a processing liquid flow passageway connecting the supply port and the drain port, and a plurality of discharge ports from which the processing liquid is discharged. The processing liquid flow passageway includes a plurality of branch flow channels, which branch out between the supply port and the drain port and collect together between the supply port and the drain port. The plurality of discharge ports form a plurality of columns respectively corresponding to the plurality of branch flow channels; and are aligned along and connected to the corresponding branch flow channels. A piezo element applies vibration to the processing liquid flowing through the plurality of branch flow channels.

Abstract: An embodiment of the present invention provides a water wash system that may mix a cleaning fluid with at least one chemical agent to form a cleaning solution. The cleaning solution may reduce the corrosives on components of a compressor. The cleaning solution may be an mildly acidic solution to reduce corrosion of a caustic nature. Alternatively, the cleaning solution may be a mildly basic solution to reduce corrosion of an acidic nature.

Abstract: An embodiment of the present invention provides a water wash system that may mix a cleaning fluid with at least one chemical agent to form a cleaning solution. The cleaning solution may reduce the corrosives on components of a compressor. The cleaning solution may be a mildly acidic solution to reduce corrosion of a caustic nature. Alternatively, the cleaning solution may be a mildly basic solution to reduce corrosion of an acidic nature.

Abstract: In a processing block, a plurality of back surface cleaning units and a main robot are provided. The main robot is provided between the back surface cleaning units provided on one side of the processing block and the back surface cleaning units provided on the other side of the processing block. A reversing unit used to reverse a substrate and a substrate platform used to transfer and receive substrates between an indexer robot and the main robot are provided adjacent to each other in the vertical direction between the indexer robot and the processing block. The main robot transports substrates among the plurality of back surface cleaning units, the substrate platform, and the reversing unit.

Abstract: A wafer cleaning device comprising a wafer stage for holding a wafer having a surface to be washed, a first nozzle positioned above the wafer, a second nozzle positioned above the wafer. A first height is between the first nozzle and the surface and a second height is between the second nozzle and the surface, wherein the first height is shorter than the second height.

Abstract: A dishwashing system for cleaning soiled kitchenware, dishware and utensils is provided. The dishwashing system uses a combination of compressed air and blasting media to thoroughly remove grease and loose as well as hardened food particles from soiled surfaces, without hand tool scrubbing, manual rinsing, or use of soap, detergent, surfactants or other chemicals, whether in pre-soaking or cleaning. This heavy-duty dishwashing system accomplishes this thorough cleaning using no or a minuscule quantity of water. The overall energy requirements are low compared to existing systems due to elimination of water, reduction of the heating load and possible use of the heat of incineration. The dishwashing system may include a system for reclaiming used blasting media by separation from food residues. The dishwashing system is most appropriate for locations where freshwater is unavailable or costly, such as arid zones and aboard ships, and where disposal of gray water is impermissible.

Abstract: A cleaning chamber is provided. The cleaning chamber includes a base portion housing a chuck and a lid affixed to the base portion. A support assembly is linked to the lid and the support assembly includes a top plate spaced apart from a bottom plate, the top plate has a plurality of openings defined therethrough and the bottom plate has a plurality of openings defined therethrough. The cleaning chamber includes a plurality of cups extending through corresponding pairs of the plurality of openings of the top plate and the bottom plate. The plurality of cups is configured to seal against a surface of a substrate, wherein each cup of the plurality of cups is independently supported by the bottom plate.

Abstract: A machine is presented for the cleaning of jewelry. The machine allows the manual or automatic cleaning of jewelry. Under both modes of operation, the jewelry is secured by a user to a support bracket inside a transparent, water-tight cylindrical wash chamber. When in manual mode, the user can direct the spray of wash fluid onto the jewelry by rotating the jewelry using a trackball. When used in automatic mode, the machine washes the jewelry during a preset washing cycle. For both modes, the washing cycle is followed by the drying cycle where a blower directs air onto the jewelry for a set time period to blow off excess moisture. The drying cycle concludes with a blower venting the cylindrical wash chamber to remove residual moisture from the wash chamber and the jewelry. After the cleaning, the user removes the jewelry from the machine.

Abstract: A cleaning apparatus for a semiconductor wafer includes: a gas jet device including a gas nozzle which jets a first gas onto the surface of a semiconductor wafer to thin the thickness of a stagnant layer on the surface of the semiconductor wafer; and a two-fluid jet device including a two-fluid nozzle which jets droplet mist onto a region where thickness of the stagnant layer of the semiconductor wafer is thinned, the droplet mist being mixed two-fluid of a liquid and a second gas.

Abstract: Apparatuses, and related methods, for processing a workpiece that include a particular barrier structure that can overlie and cover a workpiece. Apparatuses, and related methods, for processing a workpiece that include a particular movable member that can be positioned over and moved relative to a workpiece. Apparatuses, and related methods, for processing a workpiece that include a particular ceiling structure that can overlie a processing chamber. Nozzle devices, and related methods, that include a particular annular body. Nozzle devices, and related methods, that include a particular first, second, and third nozzle structure.

Abstract: A liquid processing apparatus includes a substrate holding unit and an elevating member provided to ascend/descend with respect to the substrate holding unit. The substrate holding unit includes a holding base, and a first engagement member and a second engagement member which are provided to be movable in the holding base, and moved between an engaging position where the member is engaged with the peripheral edge of the substrate and a releasing position where the member releases the substrate. When the first contact unit connected to the first engagement member is in contact with a first portion to be contacted, the first engagement member is located at the engaging position. When the second contact unit connected to the second engagement member is in contact with a second portion to be contacted at a lower position than the first portion, the second engagement member is located at the engaging position.

Abstract: In the case of a device and a method for cleaning substrates on a carrier, to the underside of which the substrates are fastened so as to be parallel to and slightly apart from one another, the carrier has in its interior a plurality of longitudinal channels, which run parallel to one another. As a result of the sawing of the wafers, they merge, via openings, into interstices between the substrates. As a result of a relative movement, an elongate tube, from which cleaning fluid is let out, is introduced into one of the longitudinal channels, the relative movement being achieved substantially through moving of the carrier.

Abstract: A device and method for treating the surface of a semiconductor wafer provides a treatment fluid in the form of a dispersion of gas bubbles in a treatment liquid generated at acoustic pressures less than those required to induce cavitation in the treatment liquid. A resonator supplies ultrasonic or megasonic energy to the treatment fluid and is configured to create an interference pattern in the treatment fluid comprising regions of pressure amplitude minima and maxima at an interface of the treatment fluid and the semiconductor wafer.

Abstract: A liquid processing apparatus includes a substrate holding member configured to rotate along with a substrate held thereon in a horizontal state; an annular rotary cup configured to surround the substrate held on the substrate holding member and to rotate along with the substrate; a rotation mechanism configured to integrally rotate the rotary cup and the substrate holding member; and a liquid supply mechanism configured to supply a process liquid onto the substrate. The apparatus further includes an annular drain cup configured to receive the process liquid discharged from the rotary cup, and provided with a drain port; and a circular flow generation element configured to generate a circular flow within the drain cup when the rotary cup and the substrate holding member are rotated, such that the circular flow serves to lead the process liquid within the drain cup to the drain port.

Abstract: Apparatuses, systems, and methods to clean a paint roller are disclosed. Such apparatuses and systems include a housing with an outlet; a handle connected to housing; an adapter disposed on an end portion of the handle; a nozzle disposed inside the handle; an idler attached to an inside surface of the housing; and a slot disposed on the housing on a location substantially opposite to the location of the inside surface of the housing where the idler is attached, wherein the idler is configured to support a paint roller cover to be cleaned and the slot is configured to receive a first portion of a paint roller frame configured to support the paint roller cover so as to dispose the paint roller cover substantially in front of the cleaning fluid jet.

Abstract: A glass treatment apparatus, in one example, can include a fluid dispensing device configured to dispense a substantially laminar flow of a fluid film. In another example, a shroud substantially circumscribes an outer peripheral surface of a working wheel. The shroud includes a slot configured to receive an edge portion of a glass sheet. Methods of treating glass, in one example, include the step of dispensing a substantially laminar flow of a fluid film along a fluid plane to subsequently land on a first side of a glass sheet. In further examples, a fluid is passed over an inner surface of a shroud to carry away machined particles from a glass sheet. In still further examples, an outer peripheral surface of a working wheel is impacted with a fluid stream to clean the working wheel from glass particles generated when machining an edge of the glass sheet.

Abstract: An apparatus for cleaning and storing painting tools is disclosed. The apparatus comprises a bucket member having a bottom wall and a side wall extending vertically from the bottom wall to an upper periphery wherein the side wall surrounds an open cavity. The apparatus also comprises a manifold nested within the bucket member. The manifold substantially bifurcates the open cavity into a first volume within the manifold and a second volume between the side wall and the manifold. The manifold extends vertically between an upper end disposed closer to the upper periphery than the bottom wall and a lower end disposed closer to the bottom wall than the upper periphery. The apparatus comprises at least one retaining member projecting into the second volume from one of the side wall and the manifold. The apparatus comprises at least one drain extending through one of the bottom wall and the side wall.

Abstract: An exemplary wet processing apparatus includes a conveyor, a spraying system, and a suction system. The conveyor is configured for conveying a substrate. The spraying system includes an upper spraying conduit above the conveyor and an upper spraying nozzle mounted on the upper spraying conduit. The suction system includes a suction conduit and a suction nozzle connected to the suction conduit. The suction nozzle is adjacent to the conveyor and configured for suction the wet processing liquid sprayed on the substrate. The suction conduit is connected to the spraying conduit in such a manner that the flowing of the wet processing liquid in the upper spraying conduit can create a negative pressure in the suction conduit to enable the suction nozzle to suck the wet processing liquid on the substrate.

Abstract: An apparatus is disclosed for handling an artificial turf arranged on a base. In at least one embodiment, the apparatus includes a removing station for lifting from the base a strip of the artificial turf extending in a longitudinal direction, a separating station for separating filling material from the strip and a winding station for winding the strip onto a shaft. A method is disclosed for handling an artificial turf arranged on a base. In at least one embodiment, the method includes lifting a strip of the artificial turf extending in a longitudinal direction from the base, separating infill material from the strip and winding the strip onto a shaft.

Abstract: An apparatus and method for treating a wet solid is provided. The apparatus comprises a porous belt and nozzles for applying on or more liquids to the wet solid. The contact with the liquids is achieved in a treatment chamber which is configured for movement between a first position, separated from the belt, and a second position, where the treatment chamber is in sealing contact with the belt.

Abstract: An apparatus for cleaning cylinders (5) and/or rolls (5), e.g., working rolls (5) in a rolling stand, which are used for producing a rolled stock (1) such as strips or slabs, in which a liquid is sprayed onto the cylinders (5) at high pressure through several nozzles D1-Dn, a number of nozzles (D1-Dn) are stationary arranged in and/or on a nozzle beam (10), at least one on-off valve is associated with each nozzle (D1-Dn), and one or several nozzle(s) (D1-Dn) are sequentially switched on and off one after another starting from one end of the nozzle beam.

Abstract: A system for fluid processing one or more substrate surfaces arrayed in a fluid. The system has a process module with a frame and a plurality of fluid jet elements to inject a fluid at the substrate surfaces without contacting the substrate surfaces. A substrate holder assembly has a holder frame and a number of substrate holders, each of which is coupled to the holder frame and configured to hold a substrate so that a different substrate is held by each substrate holder of the substrate holder assembly for transport therewith as a unit to and from the process module. The substrate holder assembly and each substrate holder of the substrate holder assembly are removably coupled to the process module frame and, when coupled to the process module frame, each substrate holder is independently moveable and positionable relative to the other substrate holders of the substrate holder assembly.

Abstract: Provided are a substrate support unit and a substrate treating apparatus and method using the same. The substrate support unit includes a first support part and a second support part. The first support part is movable in a first direction. The first support part supports a first portion of a substrate in which a processing fluid is supplied in a direction corresponding to the first direction. The second support part is movable in a second direction. The second support part supports a second portion of the substrate. At least one of the first support part and the second support part supports the substrate while the processing fluid is supplied.

Abstract: The invention relates to a method and an apparatus for applying a fluid (32) to items (14) to be cleaned, which items are continuously or intermittently transported in the conveying direction (12) in an automatic cleaning machine, preferably an automatic pass-through dishwasher. At least two, preferably tubular, spray bodies (26.1, 26.2, 26.3, . . . 26.n) which are spaced apart from one another are arranged in at least one spray plane (22, 24) which is oriented parallel to the conveying direction (12) of the items (14) to be cleaned.

Abstract: A dishwasher is disclosed. The dishwasher includes a tub to provide a washing space, a dish rack positioned in the washing space, to receive washing objects therein, a spraying arm to spray washing water toward the washing objects received in the dish rack, a supply path to provide washing water to the spraying arm, and a rack spraying arm provided in the dish rack, in communication with the supply path, to spray the washing water only to predetermined washing objects received in the rack. As a result, the dishwasher may realize an effect of intensive washing performed for washing objects with a high contamination level.

Abstract: A substrate cleaning system including a carrying unit having a plurality of rollers for carrying a substrate, wherein each of the rollers includes a roller shaft and a plurality of division rollers coupled to the roller shaft, and wherein a gap between adjacent ones of the roller shafts is larger than a radius of each of the division rollers; a first rinse unit located along the carrying unit and configured to apply a first cleaning liquid onto the substrate; and a cleaning unit comprising a slit nozzle and configured to apply a second cleaning liquid to the substrate after it encounters the first rinse unit.

Abstract: Devices, including a wash ring assembly, and methods are provided for the removal of excess fluid or solids from the exterior or interior of a probe used to transfer fluids, for instance, in an automated assay device. Typically, a probe is used to aspirate and dispense a sample fluid material such as whole blood or a reagent. The devices and methods provided herein are useful for removing excess fluid from the exterior or interior of the probe so as to prevent dripping and cross-contamination between samples or reagents. It is also contemplated that, utilizing the devices and methods provided herein, washing and/or drying can be performed simultaneously as the probe is in motion, aspirating a sample and/or dispensing a sample.

Abstract: An improved portable cleaning system for use in cleaning heat exchanger tube bundles, fin-fans, towers and other elongated components. The cleaning system comprises a cleaning unit having a cleaning enclosure that receives and cleans the component and a control unit that controls the operation of the system. The cleaning unit has a cleaning enclosure defining a chamber sized and configured to receive the component through a sealable lid. A roller assembly rotates the component while a spray assembly sprays cleaning fluid over and into the rotating component. The cleaning fluid is heated in the chamber using surface heating elements attached to heat transfer plates along sections of the chamber walls. A vapor recovery system captures and treats toxic vapors. In use, the cleaning system is transported to a facility to clean the components on-site using cleaning fluid supplied by the facility and discharging waste to the facility.

Abstract: A method and apparatus for cleaning, drying, coating, baking etching and deposition of surfaces on glass substrate as it transitions thru and between small gaps between hydro-static porous media bearings. Due to the non-contact nature of the device extremely high pressures can be induced upon the work piece through various fluids without damage to the substrate, allowing the system to utilize the viscous nature of fluids to accomplish the desired cleaning, drying, coating, etching or baking. The process also allows for simultaneous and immediately sequential ordering of processes.

Abstract: A substrate holding rotating mechanism is used to hold and rotate a substrate to be processed. The substrate holding rotating mechanism according to the present invention includes at least three spindles, clamp rollers mounted respectively on the spindles for holding a periphery of a substrate, a rotating device for rotating at least one of the clamp rollers, at least one base member on which at least one of the spindles is installed, and a rotational mechanism adapted to allow the base member to be rotatable.

Abstract: There is provided a substrate treatment method for performing treatment by feeding a chemical liquid to a surface of a substrate, in which, before feeding the chemical liquid to a predetermined area of the substrate, a liquid substance having a resistivity lower than that of the chemical liquid is fed to the surface of the substrate so that the liquid substance wets at least the predetermined area, and then, the chemical liquid is fed to the predetermined area so that the treatment is performed on the substrate with the chemical liquid fed to the surface of the substrate.

Abstract: An exemplary apparatus for wet processing a substrate includes a wet processing system and a water supplying system. The wet processing system includes a preliminary rinsing device, a final rinsing device, and a conveyor. The preliminary rinsing device includes a first tank and a first spraying system above the first tank. The final rinsing device includes a second tank and a second spraying system above the second tank. The conveyor is configured for conveying a substrate from the preliminary rinsing device to the final rinsing device. The water supplying system includes a supply pipe configured for supplying water to the second spraying system, a connecting system communicating the second tank and the first spraying system, and a drain pipe communicating with the first tank.

Abstract: A system includes an input configured to connect to a power source providing an input voltage, an output configured to connect to a load and to transfer power from the power source to the load, a battery selectively coupled to the input to receive current from the power source, a detector configured to indicate whether the input voltage drops more than a threshold amount, and a processor configured to regulate the selective coupling of the battery to the input to regulate a charging current supplied to the battery, the processor configured to regulate the selective coupling such that if a first charge current induces a drop in the input voltage beyond the threshold amount, then the processor will change the charging current to a second charge current that is lower than the first charge current.

Abstract: A method of cleaning wafer cleaning includes: first a wafer stage for holding and rotating a wafer is provided. The wafer has a surface to be washed. A nozzle is positioned on the wafer for spraying a cleaning solution. The nozzle moves in non-uniform motion from a first given point to a second given point so as to make the time which the first given point is exposed to the cleaning solution equal to the time which the second given point is exposed to the cleaning solution. Furthermore, the nozzle moves faster when passing the center of the wafer and moves slower when passing the edge of the wafer.

Abstract: A substrate holding rotating mechanism is used to hold and rotate a substrate to be processed. The substrate holding rotating mechanism according to the present invention includes at least three spindles, clamp rollers mounted respectively on the spindles for holding a periphery of a substrate, a rotating device for rotating at least one of the clamp rollers, at least one base member on which at least one of the spindles is installed, and a rotational mechanism adapted to allow the base member to be rotatable.

Abstract: An end effector for a transport robot arm for a wafer wet cleaning system has an arm with a chuck at an end of the arm to support a wafer. The chuck also includes a cavity to spray a bottom surface of the wafer with a cleaning fluid. At least two branches extend from the chuck away from the arm with a roller at the end of each branch to hold the wafer. A spray bar is coupled to the arm. The spray bar is configured to hold and spray a top surface of the wafer with the cleaning fluid.