Abstract: A dishwasher includes a main body having an open front, a washer tub being extracted from and retracted into the main body through the open front, the washer tub having an open top, a lid for closing the open top of the washer tub when the washer tub is fully retracted to be accommodated in the main body, and an extension member extending backward from a top rear portion of the washer tub. When the washer tub is fully extracted from the main body, a rear end of an inner wall of the washer tub is located in front of a front end of the main body and a free end of the extension member is placed under the lid.

Abstract: A dishwasher includes a main body being generally of a box shape with an open front, a washer tub being slidably extracted from and retracted into the main body through the open front, the washer tub having an open top, and a covering member for blocking a gap to be opened between the washer tub and the main body when the washer tub is fully extracted from the main body. Therefore, when the washer tub is fully extracted from the main body, a rear end of an inner wall of the washer tub is located in front of a front end of the main body to open the gap and the opened gap is covered by the covering member.

Abstract: An active rinse shield designed to protect electrofill chemical baths from excessive dilution during rinse sprays on the semiconductor wafer. The shield uses overlapping blades to cover the bath, making a physical barrier between the bath chemistry and the wafer rinse water. The blades are interconnecting ribs that actuate around a common pivot axis. A linear mechanical actuator controls the blade movement, moving the top-most blade, which in turn, moves an adjacent lower blade. Each upper blade is interconnected to an adjacent lower blade by upper and lower ledges, a pivot boss and interlocking cut, and a curved ledge on each blade's body surface. The interconnecting features allow the blades to move one another out for extension or in for retraction. The interlocking blades are inclined above one another, forming grooves to redirect the rinse water away from the chemical bath.

Abstract: A device is suggested which includes a carrier (1) for receiving the disk-shaped object (10), a liquid supply device (17) for applying liquid onto a disk-shaped object (10) located on the carrier (1), and a liquid catch ring (2), which is positioned essentially coaxially around the carrier (1) and is rotatable around the axis of the liquid catch ring (2).

Abstract: An improved wash tube is provided for a dishwasher. The wash tube is mounted on the upper rack and has a first end adapted to be releasably docked with the water manifold in the back of the dishwashing chamber as the rack is moved between the extended loading position and the retracted wash position. The inner end of the wash tube includes a curved cap which increases the docking tolerance and which presents a substantially downwardly oriented water inlet to the wash tube. The cap creates water stagnation adjacent the inlet such that the water velocity is substantially reduced and the pressure increased. The second end of the wash tube is connected to the spray arm which rotates as water is ejected from the spray arm nozzles at increased pressure. The cap allows the wash tube to fully dock into the manifold without obstructing the water inlet.

Abstract: A dish-cleaning appliance comprising a sink having a bowl defining a wash chamber with an open top for providing access to the wash chamber. A liquid recirculation system is provided for spraying liquid onto the dish rack to effect the cleaning of any dishes along the rack. The lid is mounted to the sink and is movable to selectively cover the open top of the bowl. The lid includes a sound absorber and a sound dampener for reducing the transfer of sound from the wash chamber through the lid.

Abstract: A warewash machine includes a multi-position splash guard enabling multiple machine configurations in which undesired overspray is reduced or eliminated. A drip flange may also be provided to increase the amount of water that impinges upon wares.

Abstract: A system and method to clean the pellicle frame and adhesive ring of a photomask reticle are described. One embodiment includes a cover that isolates the photomasks from the pellicle frame. The reticle is secured between a spin chuck and the cover so that the photomasks are isolated and protected from solvents used in a cleaning process. With the reticle secured to the spin chuck, the spin chuck is rotated under a pressurized spray of solvent. The solvent, which is caustic to the photomasks, removes the contaminants from the adhesive ring. After the exposed areas are cleaned, the cover is removed and foreign material from photomasks are removed using less invasive solvents and methods.

Abstract: A high-pressure device has a drill stem (242) with a drill head (244) delivering a high-pressure fluid jet. A shield (246) is movably coupled to the device, wherein the drill head (244) is at least partially enclosed by the shield (246) when the drill head (244) is removed from the container (23).

Abstract: A disc-shaped wheel cover, or shield, with an arm rotatable around the shield center includes a pressurized fluid container at the arm distal end filled with cleaning chemical, extending on the arm radially beyond the shield. A nozzle on the container directed axially disburses chemical toward a tire sidewall. Alternatively, the arm may comprise a grasping member on its distal end adapted to receive a commercially-available pressurized container. A wheel may also be mounted under the container to support the arm distal end a predetermined distance from the tire as the wheel rolls around the tire sidewall. The shield is removably attached to a wheel rim flange by an elastic skirt around the shield circumference at shield closed end with a skirt open end adapted to attach to the wheel. Thus, in operation the elastic skirt is stretched about the flange.

Abstract: A processing apparatus essentially includes a rotatable rotor 21 for carrying semiconductor wafers W, a motor 22 for driving to rotate the rotor 21, a plurality of processing chambers for surrounding the wafers W carried by the rotor 21, for example, an inner chamber 23 and an outer chamber 24, a chemical supplying unit 50, an IPA supplying unit 60, a rinse supplying unit 70 and a drying fluid supplying unit 80. With this constitution of the apparatus, it is possible to prevent the wafers from being contaminated due to the reaction of treatment liquids of different kinds, with the improvement of processing efficiency and miniaturization of the apparatus.

Abstract: A semiconductor wafer cleaning apparatus includes a gas spraying unit, having a gas injection tube and a gas guard extending therearound, for spraying cleaning gas into a water layer formed on a wafer. The gas guard forms a small chamber just above the water layer, so that the partial pressure of gas injected from the gas injection tube is increased in the small chamber, whereupon the cleaning gas readily dissolves in the water layer. As a result, a cleaning solution having a high concentration of cleaning gas is produced, whereby the cleaning efficacy of the solution is high. Subsequently, a drying gas, such as isopropyl alcohol, for drying the wafer can be ejected onto the water layer using the gas spraying unit. Thus, the semiconductor wafer cleaning apparatus has a simple structure.

Abstract: A substrate processing apparatus 10 includes a holding table 20 for rotatably holding a wafer W, a nozzle 40 for supplying chemical solutions L1 and L2 to the wafer W, at least one light irradiation units G1 and G2, and a pot 30 placed in the outer radius of the holding table 20 for collecting the processing solutions L1 and L2 that are scattered from the wafer W. The pot 30 also includes a cover 70 that can be moved in the direction of the axis of the holding table 20 so that a plurality of chemical solution collecting chambers M1 and M2 are formed in the pot by changing the position of the cover 70.

Abstract: The method of the present invention cleans abrasive faces of an upper abrasive plate and a lower abrasive plate of an abrasive machine. The method is executed by a cleaning device including: a nozzle for jetting water; a brush for preventing the jetted water from scattering in the air, the brush enclosing the nozzle; and another brush for closing a gap between the preventing brush and an outer edge of the upper abrasive plate, the method is characterized by the steps of: jetting water from the nozzle toward the abrasive face of the upper abrasive plate; moving the nozzle toward the outer edge of the upper abrasive plate; and closing the gap by the closing brush when the gap is formed between the preventing brush and the outer edge of the upper abrasive plate.

Abstract: A flushing system is used to clean and/or clear clogged sinks, waste pipes, and/or toilets. It consists of the following components: a control nozzle, a drain attachment, a toilet attachment, foot pedal liquid pump, and a water hose for connecting these components to function as a system. Since the flushing system utilizes the application of the liquid pressure principle, it is required to be connected to a pressurized liquid source when the user chooses not to use the foot pedal liquid pump. An example of a pressurized liquid source can be a water main. A water nozzle is used as an option to connect between the pressurized liquid source and the drain or toilet attachments to control the liquid flow. A pulsating jet of pressurized liquid can be delivered from the outlet of either the drain or toilet attachment to effectively clear clogged pipes by the opening and closing motion of the water nozzle.

Abstract: A dishwasher tub is provided with containment structure which prevents liquid from leaking around a door seal. The containment structure includes a bead that extends along side portions of a front flange of the dishwasher tub. At each lower portion of the front flange, the bead includes an inward and downward extending portion which leads to a substantially vertical portion, and finally to another inward and downward extending portion. The final two portions of the bead are arranged along a reduced dimension section of the front flange and define a trough which guides the liquid back into the tub.

Abstract: A cleaning container and method for using the same for chemically cleaning elongated members including quartz thermocouple sleeves including a first body member and a second body member said first body member and second body member respectively forming a first containing space and a second containing space including a first means for reversibly compressively sealing the first body member and the second body member to a form a combined containing space for sealably holding a cleaning solution level; a cap member disposed at a distal end of the first body member said cap member including a second means for reversibly compressively sealing a first opening in communication with the first containing space; and, a second opening centrally disposed in a distal end of the second containing space said second opening including a third means for reversibly compressively sealing around at least one elongated member penetrating through said second opening.

Abstract: The present invention provides an apparatus for removing an edge bead from a substrate. The apparatus includes a substrate support member, a plurality of mounting posts positioned along a perimeter of the substrate support member, and a rigid annular capillary ring mounted to the plurality of mounting posts. The rigid annular capillary ring includes a substantially planar upper capillary surface and is configured to maintain the substantially planar capillary surface when attached to the mounting posts.

Abstract: A high-pressure device has a drill stem (242) with a drill head (244) delivering a high-pressure fluid jet. A shield (246) is movably coupled to the device, wherein the drill head (244) is at least partially enclosed by the shield (246) when the drill head (244) is removed from the container (23).

Abstract: A workpiece holder for processing a workpiece in a chamber of a liquified fluid. In one embodiment, the workpiece holder includes a cylindrically shaped rotator having an exterior wall and at least one fluid guide on the exterior wall. The rotator is adapted to rotate and provide fluid flow across a first end of the rotator, and is adapted to provide fluid flow and mixing perpendicular to a surface of the first end of the rotator. A fixture is coupled to the first end of the rotator for securing the workpiece to the first end of the rotator.

Abstract: A bowl includes a bottom wall having a generally circular shape. A sidewall extends upwardly from the bottom wall to define a cylindrical chamber. The sidewall has a projection that extends into the cylindrical chamber. The projection has a top surface that defines a step in the cylindrical chamber and a sloped surface that extends between the top surface and an inner surface of the sidewall. The top surface of the projection is sloped slightly downwardly. The sloped surface of the projection is oriented relative to the top surface such that extensions of the top surface and the sloped surface define an angle in a range from about 30 degrees to about 45 degrees. A spin, rinse, and dry module including the bowl and a method for loading a semiconductor wafer into a spin, rinse, and dry module also are described.

Abstract: An apparatus for cleaning a semiconductor wafer is disclosed to substantially improve the efficiency of the cleaning process, and reduce the quantity of cleaning solvent used. The apparatus includes a rotating table for supporting the wafer, a rotation device to rotate the rotation table, a movable or stationary curved-slab for scrubbing the surface of the wafer efficiently, a cleaning nozzle for applying a cleaning solvent or stripper on the surface of the wafer, and a resistance wall for preventing the cleaning solvent spun out from the wafer to pollute the cleaning room.

Abstract: A shield or deflector for a dishwashing machine rack is disclosed. The deflector has a bottom wall and a front wall that permits food particles to be caught or deflected away from the floor when the rack extends beyond the door of the dishwashing machine when the door is in an open position. The deflector is removably or permanently mounted on the rack.

Abstract: Apparatus for removal of material in reactions having limited solubility and diffusion. An exemplary system removes unwanted material from the surface of a semiconductor wafer. A flow apparatus is provided for removal of material from a work piece having at least one reaction region containing removable material. The apparatus may include first and second assemblies positionable in spaced-apart relation to form a zone extending between the two assemblies for movement of gaseous material. The first assembly may include a fixture positioned to receive the work piece with the reaction region of the work piece disposed in the zone to allow movement of the gaseous material thereover. A flow assembly is configured to transfer into the zone a gas comprising a condensable material and a reacting species. In another embodiment a system for removal of material from a workpiece includes a chamber, a flow component and a support apparatus.

Abstract: An enclosure 23A that defines a drying chamber 23 is configured of a pair of enclosing elements 23c and 23d and a base element 23b. When wafers enter or leave the drying chamber 23, the enclosing elements 23c and 23d are lifted upward by vertical air cylinders 42 to separate them from the base element 23b. The enclosing elements 23c and 23d are then moved in directions that mutually separate them. To dry wafers within the drying chamber 23, the enclosing elements and the base element 23b are mutually engaged to form a hermetic seal, in the opposite sequence. The present invention reduces the dimensions of the drying chamber without impeding the work of moving wafers into and out of the drying chamber. This makes it possible to reduce the internal volume of the drying chamber, achieving a reduction is the consumption of drying gas, an improvement in the drying efficiency, and a reduction in overall size of the apparatus.

Abstract: A processing apparatus essentially includes a rotatable rotor 21 for carrying semiconductor wafers W, a motor 22 for driving to rotate the rotor 21, a plurality of processing chambers for surrounding the wafers W carried by the rotor 21, for example, an inner chamber 23 and an outer chamber 24, a chemical supplying unit 50, an IPA supplying unit 60, a rinse supplying unit 70 and a drying fluid supplying unit 80. With this constitution of the apparatus, it is possible to prevent the wafers from being contaminated due to the reaction of treatment liquids of different kinds, with the improvement of processing efficiency and miniaturization of the apparatus.

Abstract: An inventive vertical spin-dryer is provided. The inventive spin-dryer may have a shield system positioned to receive fluid displaced from a substrate vertically positioned within the spin-dryer. The shield system may have one or more shields positioned to at least partially reflect fluid therefrom as the fluid impacts the shield. The one or more shields are angled to encourage the flow of fluid therealong, and are preferably hydrophilic to prevent droplets from forming. Preferably the shield system has three shields positioned in a horizontally and vertically staggered manner so that fluid is transferred from a substrate facing surface of a first shield to the top or non-substrate-facing surface of an adjacent shield, etc. A pressure gradient may be applied across the interior of the spin-dryer to create an air flow which encourages fluid to travel along the shield system in a desired direction.

Abstract: A shield useful, in conjunction with an air gun with a medium conduit, in flushing debris from a blind hole. It comprises a case, an exhaust clearance, a hanger, a bottom clearance, and at least one guide with a clearance, and a plug useful for plugging an unused guide clearance. The medium conduit is inserted through a guide clearance which directs a medium, such as compressed air or nitrogen or liquid, towards the blind hole. The medium and debris from the blind hole flow out the exhaust clearance.

Abstract: A washer for washing a fiber suspension includes a porous surface traveling in a running direction and having a width in a direction transverse to the running direction. The porous surface is configured for carrying the fiber suspension thereon. A shower includes a pipe extending parallel to the width of the porous surface. The pipe has a sidewall with a longitudinally extending slot therein. The shower further includes a pair of lips connected to the pipe. The lips are positioned immediately adjacent to and on opposite sides of the slot, thereby defining a slot nozzle with a discharge gap. The lips are movable toward and away from each other to adjust the size of the discharge gap.

Abstract: In order to optimize flow conditions in a device (1) for treating substrates (2) in a treatment basin (3) that is filled with treatment fluid, said device comprising at least one diffusor (12) to introduce the fluid into the treatment basin (3), the distance between the diffusor (12) and the substrates (2) can be regulated. The invention also relates to a method for regulating said distance. According to an additional measure to improve flow conditions in said device, the diffusor (12) has a plate (18) that is curved cylindrically toward the substrates (2) and outlets (20), the cylindrical axes thereof extending perpendicularly in relation to the planes of the substrates.

Abstract: A method and apparatus for rinsing and drying semiconductor wafers. The apparatus includes side walls, end walls and a base. At least a portion of the wall descends relative to the base to facilitate the flow of liquid from the chamber. One embodiment of the apparatus includes a rigid side and end walls. In another embodiment of the apparatus, at least a portion of the side wall is collapsible. In yet another embodiment of the apparatus, at least a portion of the wall has a tambour configuration, facilitating bending or rolling of the wall beneath the base. The apparatus includes an assembly for injecting a rinse liquid into the chamber. The method includes placing a semiconductor wafer into a rinse/dry apparatus, directing rinse liquid over the semiconductor wafer, and lowering a side wall of the rinse/dry apparatus to remove rinse liquid therefrom. The apparatus also includes an assembly for injecting a drying fluid into the chamber.

Abstract: An apparatus for cleaning a semiconductor wafer is disclosed to substantially improve the efficiency of the cleaning process, and reduce the quantity of cleaning solvent used. The apparatus includes a rotating table for supporting the wafer, a rotation device to rotate the rotation table, a movable or stationary curved-slab for scrubbing the surface of the wafer efficiently, a cleaning nozzle for applying a cleaning solvent or stripper on the surface of the wafer, and a resistance wall for preventing the cleaning solvent spun out from the wafer to pollute the cleaning room.

Abstract: A fryer system has a vat having four sides and a bottom. A plurality of heat exchange tubes extending across the vat. A spray unit having at least one nozzle disposed above the plurality of heat exchange tubes is operably connected to a fluid supply. The spray unit is oriented to direct a flow of fluid onto the sides and bottom of the vat and onto the heat exchange tubes.

Abstract: A method for rinsing and drying semiconductor wafers. The method includes placing a semiconductor wafer into a chamber of a rinse/dry apparatus, directing rinse liquid over the semiconductor wafer, and moving a portion of the chamber, such as a portion of a wall of the chamber, substantially vertically relative to the remainder of the chamber to remove rinse liquid therefrom. The method may also include directing a drying fluid onto a surface of the rinse liquid to facilitate drying of the rinsed semiconductor wafers as rinse liquid is being removed from the chamber.

Abstract: To carry out very clean and low-cost fluid processing on both the front and rear surfaces of an object to be processed without generating rubbing particles and without leakage of fluid.

Abstract: A semiconductor processor for spray coating wafers or other semiconductor articles. The processor has a compartment in which are mounted a wafer transfer, coating station and thermal treatment station. The coating station has a spray processing vessel in which a movable spray-head and rotatable wafer holder. The spray station has coating viscosity control features. An ultrasonic resonating spray-head is precisely supplied with coating from a metering pump. The heat treatment station heat cures the coating and then cools the wafer. The system allows coatings to be applied in relatively uniform conformational layers upon irregular surfaces.

Abstract: A method and apparatus for rinsing and drying semiconductor wafers. The apparatus includes side walls, end walls and a base. At least a portion of the wall descends relative to the base to facilitate the flow of liquid from the chamber. One embodiment of the apparatus includes a rigid side and end walls. In another embodiment of the apparatus, at least a portion of the side wall is collapsible. In yet another embodiment of the apparatus, at least a portion of the wall has a tambour configuration, facilitating bending or rolling of the wall beneath the base. The apparatus includes an assembly for injecting a rinse liquid into the chamber The method includes placing a semiconductor wafer into a rinse/dry apparatus, directing rinse liquid over the semiconductor wafer, and lowering a side wall of the rinse/dry apparatus to remove rinse liquid therefrom. The apparatus also includes an assembly for injecting a drying fluid into the chamber.

Abstract: A method and apparatus for rinsing and drying semiconductor wafers. The apparatus includes side walls, end walls and a base. At least a portion of the wall descends relative to the base to facilitate the flow of liquid from the chamber. One embodiment of the apparatus includes a rigid side and end walls. In another embodiment of the apparatus, at least a portion of the side wall is collapsible. In yet another embodiment of the apparatus, at least a portion of the wall has a tambour configuration, facilitating bending or rolling of the wall beneath the base. The apparatus includes an assembly for injecting a rinse liquid into the chamber. The method includes placing a semiconductor wafer into a rinse/dry apparatus, directing rinse liquid over the semiconductor wafer, and lowering a side wall of the rinse/dry apparatus to remove rinse liquid therefrom. The apparatus also includes an assembly for injecting a drying fluid into the chamber.

Abstract: A parts washing system comprises a wash liquid holding tank having a return opening, a rinse liquid holding tank also having a return opening, a wash chamber with drain port situated above both the wash liquid holding tank and the rinse liquid holding tank, a parts carrier movable from a loading position outside the wash chamber to a position inside the wash chamber, a nozzle adapted to direct liquid from one of the holding tanks into the wash chamber, at least one pump for transferring wash liquid and rinse liquid from the wash liquid holding tank and the rinse liquid holding tank to the spray nozzle, and a substantially L-shaped liquid diverter. The L-shaped liquid diverter is rotatably mounted at the drain port of the wash chamber for rotation in a substantially vertical plane. The L-shaped liquid diverter has an outlet end for dispensing liquid from the wash chamber to one of the wash liquid holding tank and the rinse liquid holding tank.

Abstract: A reservoir for re-usable cleaning fluid and filter for filtering fluid draining into the reservoir are positioned below an engine or supported engine component positioned at a cleaning zone. Cleaning fluid is delivered to the cleaning zone from the cleaning fluid held in the reservoir and the delivered cleaning fluid then drains into the reservoir (via the filter) from the cleaning zone above the reservoir. The cleaning fluid is re-circulated and filtered for continuous use.

Abstract: A blocking plate is disposed to face a substrate which is held by substrate holding device. A processing fluid is supplied to a surface of the substrate while supplying inert gas into a space between the substrate and the blocking plate. Since the inert gas flows along the surface of the substrate within the space between the substrate and the blocking plate, no turbulence which whirls upward is created at the surface of the substrate. This prevents the pollutants from adhering to the substrate and improves the quality of the substrate.

Abstract: A vehicle washing system is mounted adjacent the ceiling of a garage or other structure. It includes an upper frame and a mat is located beneath the frame for catching and draining off fluids used during the washing operation. After a vehicle is driven onto the mat beneath the frame, a mechanism is operated to lower a waterproof curtain from the frame down to a point adjacent the mat to completely surround the vehicle. In addition, fluid conduit rings also are lowered from the frame to various positions surrounding the vehicle. Nozzles in these rings are directed toward the vehicle location and washing and rinsing fluid is supplied, under pressure, to the rings in a pre-established sequence to effect the washing of the vehicle. In addition, hot air drying tubes and nozzles are lowered from the frame when the device is in use to permit the application of hot drying air to the vehicle after the washing cycle has been completed.

Abstract: A apparatus and method for in-situ treatment of electrodes in liquid environments in which a solution supply orifice is located near an electrode to be cleaned, and when cleaning is desired, a treatment solution from the solution supply orifice is directed against the electrode or electrodes. A cleaning baffle may be placed over the electrodes to better direct the treatment solution. The electrodes may be cleaned of the treatment solution by directing a flow of gas or a second treatment solution against the electrodes, subsequent use of the first treatment solution.

Abstract: A method for rinsing and drying semiconductor wafers. The method includes placing a semiconductor wafer into a chamber of a rinse/dry apparatus, directing rinse liquid over the semiconductor wafer, and moving a portion of the chamber, such as a portion of a wall of the chamber, substantially vertically relative to the remainder of the chamber to remove rinse liquid therefrom. The method may also include directing a drying fluid onto a surface of the rinse liquid to facilitate drying of the rinsed semiconductor wafers as rinse liquid is being removed from the chamber.

Abstract: An apparatus for the processing of substrates in a fluid tank is provided. The fluid tank has at least one fluid inlet opening and at least one overflow opening in the upper region of at least one side wall of the fluid tank. Optimum adaptation to fluid circulation rates is provided by at least one slide having a variable position relative to the overflow opening for varying the opening area thereof. This opening area is smaller during introduction of gas than during a preceding rinsing process.

Abstract: An apparatus for rinsing and drying semiconductor wafers. The apparatus includes side walls, end walls and a base. One embodiment of the apparatus includes a rigid side and end walls. In another embodiment of the apparatus, at least a portion of the side wall is collapsible. In yet another embodiment of the apparatus, at least a portion of the wall has a tambour configuration, facilitating bending or rolling of the wall beneath the base. The apparatus includes an assembly for injecting a rinse liquid into the chamber. The side walls, end walls, and base form a chamber configured to receive at least one semiconductor wafer. Rinse liquid can be directed into the chamber, over each semiconductor wafer therein to rinse each semiconductor wafer. At least a portion of a side wall can be lowered substantially vertically to permit rinse liquid to flow out of the chamber. The apparatus also includes an assembly for injecting a drying fluid into the chamber.

Abstract: The claimed multi-tank gel developing apparatus and method comprises of two inner tanks within one outer tank to develop multiple electrophoresis gels simultaneously. The two inner tanks have openings along the edges of the walls to allow free circulation of solutions between the inner and outer tanks. The solution maybe exchanged by lifting out the inner tanks which retains the gels inside while the solution drains out. Once the solution in the outer tank has been exchanged, the inner tanks can be re-immersed into the outer tank. Furthermore, the inner tanks have detachable bases to facilitate transfer of the gels after development. This claimed apparatus allows for efficient development of electrophoresis gels by minimizing the direct handling of the gels thereby avoiding unwanted damages often incurred by conventional manually developing methods and apparatuses. The multi-tank apparatus can accommodate various gel compositions and sizes.

Abstract: An apparatus for the sterilization of a medical device includes a multi-chambered compartment having at least a first and a second rigid chamber therein. Each of the first and second chambers is adapted to independently serve as a sterilization chamber and can be operated independently. The apparatus also has a removable interface between the first and second chamber. The interface can have an opening for receiving a lumen device in such a way that the first and second chamber is put in fluid communication through the lumen. A source of sterilant is also included in the apparatus. This source is adapted to provide the sterilant in the first and/or second chamber. Containers sealed with gas-permeable, but microorganism-impermeable membrane can be used in the apparatus so that the sterility of the devices in the container is kept after the completion of a sterilization cycle.

Abstract: A joint for forming a seal between a warewasher and the bottom of a generally rectangular, vertically movable door housed in the warewasher to inhibit release of moisture into the ambient atmosphere. The door has an outer face and is shaped to cover a generally rectangular opening in the warewasher. The joint includes a sill located along the bottom edge of the opening having a downwardly angled surface to retain moisture in the warewasher and an upper assembly located along the lower edge of the outer face including a handle shaped to mate with the sill. The upper assembly further includes a downwardly extending saddle shaped to cover the interface between the handle and the sill to facilitate the retention of moisture in the warewasher.

Abstract: A method for rinsing and drying semiconductor wafers. The method includes placing a semiconductor wafer into a rinse/dry apparatus, directing rinse liquid over the semiconductor wafer, and lowering at least a portion of a side wall of the rinse/dry apparatus to remove rinse liquid therefrom.