Abstract: A cannister deployment apparatus for discharge of gas cannisters within a target building includes a battering ram arranged for being carried on a vehicle for penetrating into the building when impacted on the building by the vehicle. The battering ram has a housing with a plurality of receptacles for receiving the cannisters to be discharged respectively therein. The receptacles include (i) one or more release receptacles arranged to release the respective cannister from the release receptacle upon actuation by a release actuator so that the cannister is discharged from the housing, and (ii) one or more discharge receptacles enabling actuation of the respective cannister into an active state while the cannister remains supported within the discharge receptacle upon actuation by a discharge actuator arranged to trigger a release lever of the cannister in the discharge receptacle into an active state.

Abstract: A method is provided for destructively processing an airbag inflator having an outer housing, a propellant housed within the outer housing, and a membrane disposed between the propellant and an inner surface of the outer housing. The method includes rupturing the membrane, exposing the propellant to a liquid, and permitting the propellant to mix with the liquid to form a liquid-propellant mixture. The method may further include removing at least a portion of the liquid from the liquid-propellant mixture to produce an at least partially solidified material that includes the propellant.

Abstract: An ironing apparatus includes an ironing die and an ironing punch, an injection port for injecting gas or liquid to the metal plate at a high pressure to remove substance adhered to the metal plate therefrom, a suction port for sucking the adhered substance removed from the metal plate, and a protrusion mount portion with a protrusion for preventing dispersion of the gas or the liquid. An ironing method for ironing the metal plate having the single surface or both surfaces coated with the organic resin film includes the steps of injecting the gas or the liquid from the injection port to the metal plate at the high pressure to remove the adhered substance from the metal plate, and sucking and collecting the adhered substance removed from the metal plate from the suction port. The adhered substance such as the hair may be removed by the aforementioned invention.

Abstract: According to one embodiment, a method for cleaning a semiconductor substrate comprises supplying water vapor to a surface of a semiconductor substrate on which a concave-convex pattern is formed while heating the semiconductor substrate at a predetermined temperature, cooling the semiconductor substrate after stopping the heating and the supply of the water vapor and freezing water on the semiconductor substrate, after freezing the water, supplying pure water onto the semiconductor substrate and melting a frozen film, and after melting the frozen film, drying the semiconductor substrate.

Abstract: This invention relates to an apparatus and method for cleaning a photomask. This apparatus, suitable for use in removing an adhesive residue from a photomask, includes a photomask disposed such that a surface thereof on which an adhesive residue is left behind is directed downwards, a metal plate formed adjacent to the adhesive residue, and a laser generator for irradiating a laser onto the metal plate so that the adhesive residue is removed by heat generated from the metal plate.

Abstract: A method for removal of wax deposited on an inner wall in contact with a fluid stream. The method includes the steps of cooling the inner wall and the fluid stream to a temperature of or below the wax appearance temperature, enabling wax to dissolve and precipitate on the inner wall, and heating of the inner wall for a short period of time to release the deposited wax from the surface of the inner wall, mainly in the form of solid parts. The thickness of wax deposits in a pipe section can be determined by computing the temperatures obtained upstream and downstream in the said pipe section, before and after applying heat pulse.

Abstract: A cooling gas discharge nozzle 7 is arranged above an initial position P(Rin) distant from a rotation center P(0) of a substrate W toward the outer edge of the substrate W and supplies a cooling gas to the initial position P(0) of the rotating substrate W to solidify DIW adhering to an initial region including the initial position P(Rin) and the rotation center P(0). Following formation of an initial solidified region FR0, a range to be solidified is spread toward the outer edge of the substrate W and all the DIW (liquid to be solidified) adhering to a substrate surface Wf is solidified to entirely freeze a liquid film LF.

Abstract: A vacuum trap, a plasma etch system using the vacuum trap and a method of cleaning the vacuum trap. The vacuum trap includes a baffle housing; and a removable baffle assembly disposed in the baffle housing, the baffle assembly comprising a set of baffle plates, the baffle plates spaced along a support rod from a first baffle plate to a last baffle plate, the baffle plates alternately disposed above and below the support rod and alternately disposed in an upper region and a lower region of the baffle housing.

Abstract: A process for reducing the content of residual organic substances in mixtures of plastics from durable goods can include separating a feed stream into two or more mixtures of flakes and preforming a cleaning process to remove a portion of one or more of the absorbed organic substances from one or more of the mixtures. Each mixture can contain one or more plastic types and at least one organic substance absorbed into the one or more plastic types. The flakes in the mixtures can have an average particle diameter of less than 10 millimeters.

Abstract: A method of dissolving and/or inhibiting the deposition of scale on a surface of a system comprises the step of bringing the surface of the system into contact with a composition. The composition can comprise from about 3 to about 15 parts by weight of a chelating component. The chelating component is selected from the group of MGDA, NTA, HEDTA, GLDA, EDTA, DTPA, and mixtures thereof. The composition can further comprise from about 3 to about 15 parts by weight of an acidic component, which is different than the chelating component. The composition can further comprise at least about 60 parts by weight of water. Each of the parts by weight ranges above are based on 100 parts by weight of the composition. The composition may further comprise a surfactant component and/or a corrosion inhibitor.

Abstract: After a water film is formed on a wafer front surface in a chamber, the water film is supplied sequentially with an oxidizing component of an oxidation gas, an organic acid component of an organic acid mist, an HF component of an HF gas, the organic acid mist, and the oxidizing component of the oxidation gas. As a result, the HF component and the organic acid component provide cleaning effect on the wafer surface, and a concentration of the cleaning components in the water film within a wafer surface can be even.

Abstract: A substrate having a liquid film formed by pre-processing unit is transported by a substrate transport robot from the pre-processing unit to a freeze processing unit disposed away from the pre-processing unit. In the freeze-processing unit, the liquid film is frozen. This causes the adhesion power of contaminants adhering to the surface of the substrate reduce, and therefore the contaminants is detached from the surface of the substrate. Subsequently, the substrate which was subjected to the freezing process, is transported from the freeze processing unit to a post-processing unit which is disposed away from the pre-processing unit and the freeze processing. In the post-processing unit, a cleaning liquid is supplied to the frozen film on the rotating substrate, thereby easily removing the contaminants adhering to the substrate together with the frozen film.

Abstract: Methods are provided for increasing the temperature of a section of conduit used for the production or transmission of hydrocarbon. According to one aspect, the method includes the steps of: (a) forming a treatment fluid comprising: (i) a carrier fluid; and (ii) a first reactant and a second reactant; and (b) introducing the treatment fluid into a section of conduit used for the production or transmission of hydrocarbon. The first reactant and second reactant are selected for being capable of reacting together in an exothermic chemical reaction; and the first and second reactant are in at least sufficient concentrations in the carrier fluid to generate a theoretical heat of reaction of at least 1,000 kJ/liter of the treatment fluid. At least some of at least one of the first reactant and the second reactant is suspended in the carrier fluid in a solid form that is adapted to help control the release of the reactant into the carrier fluid.

Abstract: An aluminum hard foil is degreased without reducing the hardness to improve the coating performance of coating material. A foil-rolled aluminum foil is subjected to a low-temperature heat treatment for holding the aluminum foil at 80 to 160° C. for 1 hour or more. The low-temperature heat treatment is preferably performed by subjecting the aluminum foil to batch processing with the aluminum foil coiled.

Abstract: Method for the cleaning of spinning devices with a plurality of spinning apertures for the output of molten plastic. With the spinning device in operation, individual dirt-contaminated and/or clogged spinning apertures are closed with plugs, these plugs-consisting of at least in part of at least one oxidizable substance. The spinning device is subjected in the course of its cleaning to a pyrolysis treatment for the breakdown of residual plastic. The spinning device is subjected to an oxidative treatment, so that the oxidizable substance is oxidized.

Abstract: A solid cleaner for heated surfaces is disclosed. The solid cleaner includes a solidifying agent including wax, and a cleaning agent. The solid cleaner is solid at room temperature and liquid at an elevated temperature. Methods of cleaning a heated surface and cleaning articles are also disclosed.

Abstract: The present invention relates to a method and apparatus for the prevention of fouling of process streams by the application of electric charge on process components. The electric charge may be attractive or repulsive to the foulants, they may be constant or variable and may be applied to any section of the process stream where convenient and wherein their preventive effects are optimized.

Abstract: A method for cleaning, method and device for the application of a protective medium to a turbine blade, and a method for placing cooling bores in a turbine blade is disclosed. For this purpose, hot supercritical carbon dioxide is used as a tempering and/or cleaning medium and compressed and decompressed one or more successive times. The cleaning medium is decompressed to a pressure at which the gas assumes a volume that is a multiple of the volume of the compressed cleaning medium in the pressure tank. In so doing, it is possible to remove particulate and other impurities, even from recesses, blind holes, or open hollow spaces.

Abstract: The present invention relates to the use of an optical line detector for regulating the position of the wash front and/or of the build-up front of the crystal bed of a wash column in a melt crystallization process and a corresponding regulation method. The line detector, for example a CCD camera or a linear array of reflection probes, is arranged in such a way that optical properties of the crystal bed can be detected continuously in a region running parallel to the longitudinal axis of the wash column, this region covering the desired setpoint position of the wash front or of the build-up front.

Abstract: The present invention is directed to a cleaning system and methods for cleaning tissue embedding molds. The cleaning system includes a cleaning vessel that holds a cleaning solution. The tissue processing molds are supported by a basket receptacle which is placed inside the cleaning vessel. Cleaning solution is supplied to the cleaning vessel through a supply line. Additional fluids are stored in a reservoir and may be mixed with the cleaning solution in the supply line. Cleaning solution drains from the cleaning vessel through a drain line. A controller controls the opening and closing of valves and the activation or deactivation of a heat source to operate a wash cycle, a rinse cycle, and a dry cycle.

Abstract: There is disclosed a die cleaning method for removing a forming-material from a die used in forming the forming-material containing a binder, comprising the steps of: removing a part or all of the binder contained in the forming-material from the die; and removing the forming-material from the die, whereby the forming-material in the die can be removed without damaging or deforming the die for use in forming the forming-material containing the binder.

Abstract: In one aspect, the invention includes a method of treating a surface of a substrate. A mixture which comprises at least a frozen first material and liquid second material is provided on the surface and moved relative to the substrate. In another aspect, the invention encompasses a method of treating a plurality of substrates. A treating member is provided proximate a first substrate, and an initial layer of frozen material is formed over a surface of the treating member. A surface of the first substrate is treated by moving at least one of the treating member and the first substrate relative to the other of the treating member and the first substrate. After the surface of the first substrate is treated, the initial layer of frozen material is removed from over the surface of the treating member.

Abstract: An apparatus and method are provided for removing contaminate particulate matter from substrate surfaces such as semiconductor wafers. The method and apparatus use a material, preferably a liquid curable polymer, which is applied as a sacrificial coating to the surface of a substrate containing contaminate particulate matter thereon. An energy source is used to dislodge the contaminate particulate matter from the surface of the wafer into the sacrificial coating so that the particles are partially or fully encapsulated and suspended in the sacrificial coating. The sacrificial coating is then removed. The coating is preferably formed into a film to facilitate removal of the coating by pulling (stripping) the film providing a cleaner substrate surface.

Abstract: A method and apparatus are provided for removing solid and/or liquid residues from electronic components such as semiconductor wafers utilizing liquid or supercritical carbon dioxide which is solidified on the surface of the wafer and then vaporized and removed from the system. In a preferred embodiment the solidification and vaporizing steps are repeated (cycled) before removal of the CO2 from the vessel. The residues are carried away with the vaporized carbon dioxide.

Abstract: An apparatus for cleaning an enrober head and a method for using the apparatus, in which the apparatus has a cleaning medium supply vessel having an outlet and an open top, an enrober head mount registered with the open top of the vessel, and a pump, arranged to pump cleaning medium from the vessel to an applicator for application to enrober head elements requiring cleaning. The mount is adapted to attach an enrober head to the vessel, such that, when an enrober head is removed from an enrober and mounted on the apparatus, cleaning medium applied to elements of the enrober head can pass through those elements, through the mount and open top, and back into the vessel, cleaning the enrober head elements, and allowing the cleaning medium to be reapplied.

Abstract: Disclosed is a method for removing sludge in a crude oil storage tank by use of thermal oil discharged from a distillation tower of an oil refinery, such as atmospheric residue, vacuum residue, or vacuum gas oil, and recovering oil having various applications by separating inorganics therefrom. The method is advantageous in terms of minimizing air pollution because of utilizing a closed system, drastically reduced washing time of crude oil storage tank, and continuous removal of the sludge. Additionally, the recovered oil can be provided as fuel oil, marine oil or a feed for secondary treatment processes, such as up-grading processes of heavy oil.

Abstract: A method and device for cleaning an electrical contact. Semiconductor testing device. Process of manufacturing integrated circuits. The electrical contact is used for contacting an integrated circuit and accumulates debris during use. The method comprises directing electromagnetic radiation at the contact. The electromagnetic energy reacts with at least one of the contact and the debris so as to cause at least a portion of the debris on the contact to be removed. The electromagnetic radiation may comprise coherent radiation, such as electromagnetic radiation generated using a laser. The portion of the debris may comprise organic debris, aluminum oxide, polyimide, or other debris. According to one aspect of the invention, the contact comprises a conductive material and the electromagnetic radiation causes removal of the portion of the debris substantially without removal of the conductive material.

Abstract: In one aspect, the invention includes a method of treating a surface of a substrate. A mixture which comprises at least a frozen first material and liquid second material is provided on the surface and moved relative to the substrate. In another aspect, the invention encompasses a method of treating a plurality of substrates. A treating member is provided proximate a first substrate, and an initial layer of frozen material is formed over a surface of the treating member. A surface of the first substrate is treated by moving at least one of the treating member and the first substrate relative to the other of the treating member and the first substrate. After the surface of the first substrate is treated, the initial layer of frozen material is removed from over the surface of the treating member.

Abstract: A system for processing substrates within a chamber and for cleaning accumulated material from chamber components is provided. The system includes a reactive species generator adapted to generate a reactive gas species for chemically etching accumulated material from chamber components, and a processing chamber having at least one fluoropolymer coated component which is exposed to the reactive species. Preferably to have the greatest impact on chamber cleaning efficiency, the fluoropolymer coated component(s) are large components such as a gas distribution plate or a backing plate, and/or a plurality of smaller components (e.g., a shadow frame, chamber wall liners, a susceptor, a gas conductance line) so as to constitute a large percentage of the surface area exposed to the reactive species. Most preferably all surfaces which the reactive species contacts are coated with fluoropolymer.

Abstract: When iron group, especially high nickel, metal alloys that contain substantial amounts of copper are pickled, a displacement coating of copper that is called a “copper kiss” often forms on the pickled surface from the dissolved copper ions in the pickling solution before the pickling solution can be rinsed away. Traditionally this has been removed by treatment with aqueous ammonia, an annoying and potentially hazardous reagent that in many instances requires expensive pollution abatement devices. In this invention, copper kiss is equally effectively removed by treatment with a mixture of sulfuric acid and hydrogen peroxide, optionally also containing hydrofluoric acid.

Abstract: In one aspect, the invention includes a method of treating a surface of a substrate. A mixture which comprises at least a frozen first material and liquid second material is provided on the surface and moved relative to the substrate. In another aspect, the invention encompasses a method of treating a plurality of substrates. A treating member is provided proximate a first substrate, and an initial layer of frozen material is formed over a surface of the treating member. A surface of the first substrate is treated by moving at least one of the treating member and the first substrate relative to the other of the treating member and the first substrate. After the surface of the first substrate is treated, the initial layer of frozen material is removed from over the surface of the treating member.

Abstract: In one aspect, the invention includes a method of treating a surface of a substrate. A mixture which comprises at least a frozen first material and liquid second material is provided on the surface and moved relative to the substrate. In another aspect, the invention encompasses a method of treating a plurality of substrates. A treating member is provided proximate a first substrate, and an initial layer of frozen material is formed over a surface of the treating member. A surface of the first substrate is treated by moving at least one of the treating member and the first substrate relative to the other of the treating member and the first substrate. After the surface of the first substrate is treated, the initial layer of frozen material is removed from over the surface of the treating member.

Abstract: A new method is provided to clean melamine deposits from tools and components that are used to form molds around and to therewith encapsulate BGA devices. The cleaning process applies a dummy BGA substrate as part of and during the cleaning procedure. This dummy BGA substrate replaces the conventionally used copper strips that shield areas of the molding tools during the cleaning cycle. The dummy copper strips require, during and as part of the melamine cleaning process, frequent cleaning, which adds considerable to the time and expense of the melamine cleaning process.

Abstract: A method of cleaning substrates is provided. Prior to, during or prior to and during a cleaning process, fluid is applied to a substrate surface to form a fluid film thereon. Ice crystals are introduced into the fluid film on the substrate surface. The ice crystals have a temperature that is lower than the temperature of the fluid such that the fluid changes the ice crystals into a gaseous state to form a pulse generated in the fluid film. The depth of penetration of the ice crystals into the fluid film is controlled such that the ice crystals do not strike the substrate surface. The substrate surface is cleaned with the pulse.

Abstract: A new method is provided to clean melamine deposits from tools and components that are used to form molds around and to therewith encapsulate BGA devices. The cleaning process applies a dummy BGA substrate as part of and during the cleaning procedure. This dummy BGA substrate replaces the conventionally used copper strips that shield areas of the molding tools during the cleaning cycle. The dummy copper strips require, during and as part of the melamine cleaning process, frequent cleaning, which adds considerable to the time and expense of the melamine cleaning process.

Abstract: In accordance with the invention, the polymeric coating is removed from a coated optical fiber by disposing the fiber within a low pressure environment and applying sufficient heat to volatilize at least a portion of the polymeric coating. The result is that the coating material bursts from the fiber, yielding a clean glass surface virtually free of surface flaws. In a preferred embodiment the heat is provided by a resistive filament heater within a vacuum chamber.

Abstract: A method for the cleaning of SiO2 grain is known whereby SiO2 grain comprising contaminations is heated to a temperature at which the contaminations soften or form melting agglomerates with the SiO2 grain, thus separating the contaminations and the SiO2 grain. On this basis and to specify a method which achieves high grain purity at comparatively little expenditure of time, material and costs, and to provide a simple device suitable for the implementation of the method, it is proposed according to the invention that the SiO2 grain is fed to and heated in a gas stream which is directed towards an impingement plate, the SiO2 grain being accelerated in the direction of the impingement plate such that softened contaminations or melting agglomerates adhere to the impingement plate and cleaned SiO2 grain is removed from the impingement plate.

Abstract: Apparatus including an elongate pipe (1) for use in the transfer of fluids susceptible to form deposits on cooling such as wax deposits in oil, and a container (12) having a reusable heat source including a supercooled solution, e.g., of aqueous sodium acetate. The container (12) is in heat conducting contact with a surface of the pipe (1), preferably on at least one surface of the container. The deposit may be removed from inside the pipe (1) by locating in heat conducting relation to the pipe a reusable heat source including a supercooled solution, and activating crystallization in the solution liberating heat which causes at least some of the deposit to melt and/or dissolve.

Abstract: A method of cleaning a coating apparatus for coating articles with chocolate masses and the like with hot water includes the steps of: filling water into a tub of the coating apparatus, wherein the coating apparatus includes a driven grating conveyer belt for receiving the articles to be coated including an upper portion and a lower portion, and wherein the coating apparatus includes at least one aggregate being arranged in the upper region of the tub; pumping water out of the tub with at least one pump; and directing the substantially unpressurized water onto the grating conveyer belt and onto the at least one aggregate to be cleaned, the water having a temperature being higher than the melting temperature of the mass, the water flowing over the grating conveyer belt and the at least one aggregate and back into the tub in a substantially unpressurized manner.

Abstract: Cleaning a media surface, such as a disc surface, comprises subjecting the surface to a detector for sensing the nature of the surface for an irregularity in the smoothness of the surface. Directing, on detecting an irregularity beyond a predetermined amount, a burnishing pulse laser output to that irregularity, and energizing the laser to thereby impart an energy source to reduce the irregularity to a degree less than a predetermined amount.

Abstract: A micro heater assembly (10) is provided with a micro heater (12) on the distal end (14) of an elongated support wire (16). Micro heater (12) is insertable into a normally water-carrying aperture (141) of an accessible pipe portion (68) under a valved outlet/water collecting appliance such as a sink (40) to reach a frozen section (202) of the branch line pipe (70) upstream of pipe portion (68) whereat to easily and reliably thaw pipe (70) from within safely and cost-effectively.

Abstract: An in-situ method for regenerating a chemical-mechanical polishing pad which includes the steps of: forming the polishing pad by dispensing liquid moldable material, such as wax, polymers or water, on a polishing surface and solidifying the liquid material by reducing the temperature, allowing the moldable material to harden; distributing slurry material on the polishing pad; polishing the surface of a semiconductor wafer with a combination of the slurry material and the polishing pad; and regenerating in-situ the polishing pad. This method quickly, easily and repeatably, resurfaces and refreshes the surface on which the a semiconductor wafer is polished. The polishing pad may also include abrasives embedded therein to enhance its polishing capabilities.

Abstract: An apparatus comprises an elongate pipe (1) for use in the transfer of fluids susceptible to form deposits on cooling such as wax deposits in oil, and a container (12) comprising a reusable heat source comprising a supercooled solution, e.g., of aqueous sodium acetate. The container (12) is in heat conducting contact with a surface of the (1), preferably on at least one surface of the container. The deposit may be removed from inside the pipe (1) by locating in heat conducting relation to the pipe a reusable heat source comprising a supercooled solution, and activating crystallization in the solution liberating heat which causes at least some of the deposit to melt and/or dissolve.

Abstract: An image forming material formed on a paper sheet and containing a color former, a developer and a decolorizer, is decolored by heating of the image forming material, contacting the image forming material with a solvent optionally containing a decolorizer, and removing a residual solvent from the paper sheet.

Abstract: A method for unblocking a vacuum collet channel clogged with solder includes moving a solder-clogged collet into contact with a preform of solder, and melting the solder clog and the preform into a single melted mass, cooling the melted mass to solidify it, and moving the collet away from the cooled mass, leaving the clog behind.

Abstract: A micro heater assembly (10) is provided with a micro heater (12) on the distal end (14) of an elongated support wire (16). Micro heater (12) is insertable into a frozen pipe (60) to reach the frozen area (100) of the pipe (60) whereat to thaw pipe (60) from within safely and cost-effectively.

Abstract: A method for cleaning molding compound tablets while the molding compound tablets are transferred from a tablet container to a molding equipment for encapsulating a microelectronic device. The method includes the steps of loading the molding compound tablets from the tablet container to a tablet parts feeder; transferring the molding compound tablets from the tablet parts feeder to the molding equipment along the transfer line; blowing hot air downwardly on the molded compound tablets as they move along the transfer line; commencing melting of the molded compound tablet, and any contaminants on the molded compound, with the hot air, such that the contaminants are incorporated into a resulting soft tablet dough; and injecting the soft tablet dough into the molding equipment.

Abstract: A process for preparing two connected powder transfer conduits for cleaning without releasing powder from the conduits. The conduits are connected to each other by flexible tube of a water-dissolvable material to enable powder communication between the two conduits. A sealing operation is performed to form a seal in the tube sufficient to prevent the powder communication from one side of the seal to the other. The seal is then severed to produce two tube sections where each tube section is sealed at the point of severance. A cleaning conduit is then place over at least one of the two tube sections and connected to the respective conduit. The cleaning conduit is connected to a liquid cleaning source which is adapted to deliver a cleaning liquid capable of dissolving the tube section thereunder upon contact therewith.

Abstract: A process for removing waxes from silicon wafer polishing plates is provided. The process includes the steps of providing submersion baths of an alkali soap, de-ionized rinse water, sodium hydroxide, and additional de-ionized rinse water, in which polishing plates are exposed. The process eliminates the use of methylene chloride from the process.

Abstract: A method for cleaning molding compound tablets while the molding compound tablets are transferred from a tablet container to a molding equipment for encapsulating a microelectronic device. The method includes the steps of loading the molding compound tablets from the tablet container to a tablet parts feeder; transferring the molding compound tablets from the tablet parts feeder to the molding equipment along the transfer line; blowing hot air downwardly on the molded compound tablets as they move along the transfer line; commencing melting of the molded compound tablet, and any contaminants on the molded compound, with the hot air, such that the contaminants are incorporated into a resulting soft tablet dough; and injecting the soft tablet dough into the molding equipment.