Plural Hot Or Cold Junctions Arranged In A Single Plane Patents (Class 136/212)
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Patent number: 8129882Abstract: A generator device for converting thermal energy to electric energy. A magnetic circuit includes at least a portion made of a magnetic material. A temperature-varying device varied the temperature in the portion made of the magnetic material alternately above and below a phase transition temperature of the magnetic material to thereby vary the reluctance of the magnetic circuit. A coil is arranged around the magnetic circuit, in which electric energy is induced in response to a varying magnetic flux in the magnetic circuit. A magnetic flux generator creates magnetic flux in the magnetic circuit. The temperature-varying device alternately passes hot and cold fluid by, or through holes in, the portion made of the magnetic material of the magnetic circuit in a single direction to thereby vary the temperature in the portion made of the magnetic material alternately above and below the phase transition temperature of the magnetic material.Type: GrantFiled: March 18, 2008Date of Patent: March 6, 2012Assignee: ABB Research Ltd.Inventors: Gunnar Russberg, Mikael Dahlgren, Stefan Thorburn
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Publication number: 20120031450Abstract: A thermoelectric semiconductor component, comprising an electrically insulating substrate surface and a plurality of spaced-apart, alternating p-type (4) and n-type semiconductor structural elements (5) which are disposed on said surface and which are connected to each other in series in an electrically conductive manner alternatingly at two opposite ends of the respective semiconductor structural elements by conductive structures, in such a way that a temperature difference (2?T) between the opposite ends produces an electrical voltage between the conductive structures or that a voltage difference between the conductive structures (7, 9; 13, 15) produces a temperature difference (2?T) between the opposite ends, characterized in that the semiconductor structural elements have a first boundary surface between a first and a second silicon layer, the lattice structures of which are considered ideal and are rotated by an angle of rotation relative to each other about a first axis perpendicular to the substrate suType: ApplicationFiled: January 12, 2010Publication date: February 9, 2012Applicant: IHP GmbH - Innovations for High Performance Micro- electronics / Leibniz-Institut fur Innovative MikInventors: Martin Kittler, Manfred Reiche
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Patent number: 8110736Abstract: The present invention according to one preferred embodiment provides a thermoelectric element device comprising a first electrode including an electrode member, an elastic member that has electrically conductive and is provided on the electrode member, and a heat uniforming member that has electrically conductive and is provided on the elastic member; a thermoelectric element that is made of a thermoelectric material having thermoelectric effect and arranged on the first electrode so as to contact the heat uniforming member; and a second electrode arranged on the thermoelectric element.Type: GrantFiled: August 24, 2006Date of Patent: February 7, 2012Assignee: Kabushiki Kaisha ToshibaInventors: Naokazu Iwanade, Naruhito Kondo, Osamu Tsuneoka, Kazuki Tateyama, Takahiro Sogou
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Publication number: 20120024334Abstract: The present invention pertains to a method for generating electric energy. For several good reasons, it is desired to reduce wastes and renew any wastes from fossil fuel engines. The exhaust heat thermoelectric generator (HETEG) used for this purpose according to the present invention can generate electrical energy from wasted heat emitting from said fossil fuel engine when combined with an array of thermoelectric modules and when said array is mounted on the periphery of a moving vehicle, or when said array is installed in a stationary location for idling trucks and semis to plug their exhaust tails into it. Further, said generated energy can be stored for reuse in any location.Type: ApplicationFiled: July 29, 2010Publication date: February 2, 2012Inventor: CHARLES AMANZE
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Patent number: 8101847Abstract: A thermoelectric module includes a first substrate, a second substrate having a second surface which is apart from and faces a first surface of the first substrate, a plurality of thermoelectric elements arranged on the first and the second surfaces, a plurality of electrodes on the first and second surfaces each electrically connected to at least one of the plurality of thermoelectric elements, and a ground electrode on at least the first surface. The plurality of electrodes on at least the first surface comprises a plurality of columns each of which comprises two or more electrodes aligned in a longitudinal direction, and the ground electrode is between two adjacent columns among the plurality of columns.Type: GrantFiled: January 27, 2009Date of Patent: January 24, 2012Assignee: KYOCERA CorporationInventor: Takeshi Okamura
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Publication number: 20110247670Abstract: According to one embodiment, a thermoelectric module includes a housing and a power generation member. The housing has a first temperature layer and a second temperature layer, the first temperature layer and the second temperature layer being stacked, the housing further having a cylindrical through-hole provided so as to penetrate the first temperature layer and the second temperature layer. The power generation member has thermoelectric materials stacked such that current flows in one direction in the power generation member, the power generation member being provided in the through-hole so that opposite ends of each of the thermoelectric materials are positioned at the first temperature layer and the second temperature layer, respectively.Type: ApplicationFiled: January 19, 2011Publication date: October 13, 2011Inventors: Mio OHMURA, Jun Karasawa, Naruhito Kondo, Osamu Tsuneoka, Yasuhito Saito
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Thermoelectric (TE) Devices/Structures Including Thermoelectric Elements with Exposed Major Surfaces
Publication number: 20110220162Abstract: A thermoelectric structure may include a thermally conductive substrate, and a plurality of thermoelectric elements arranged on a surface of the thermally conductive substrate. Moreover, each thermoelectric element may be non-parallel and non-orthogonal with respect to the surface of the thermally conductive substrate. For example, each of thermoelectric elements may be a planar thermoelectric element, and a plane of each of the thermoelectric elements may be oriented obliquely with respect to the surface of the thermally conductive substrate.Type: ApplicationFiled: March 15, 2011Publication date: September 15, 2011Inventors: Edward P. Siivola, Ramaswamy Mahadevan -
Publication number: 20110192439Abstract: Provided is a thermoelectric array including a plurality of thermoelectric elements arranged in m rows and n columns (each of m and n is an integer equal to or more than 1), each thermoelectric element including a heat absorption layer, a first heat sink layer, a second heat sink layer, a first-conductivity-type leg, and a second-conductivity-type leg formed on the same plane. The heat absorption layers of the thermoelectric elements adjacently disposed in a row or column direction are disposed adjacent to each other, and the first and second heat sink layers of the adjacent thermoelectric elements are disposed adjacent to each other. In this case, thermal interference between adjacent thermoelectric elements may be minimized, thereby obtaining a thermoelectric array having a high figure of merit.Type: ApplicationFiled: February 7, 2011Publication date: August 11, 2011Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Young Sam PARK, Moon Gyu Jang, Myung Sim Jun, Young Hoon Hyun
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Publication number: 20110168224Abstract: Disclosed is a thermoelectric device. The thermoelectric device may include a thermoelectric object disposed as a horizontal structure between a high-temperature region and a low-temperature region. Also, disclosed is a thermoelectric device array where a plurality of thermoelectric objects are disposed between the high-temperature region and the low-temperature region.Type: ApplicationFiled: October 19, 2010Publication date: July 14, 2011Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventor: Jin-woo CHO
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Publication number: 20110155201Abstract: An embodiment of a process for realizing a system for recovering heat is described, the process comprising the steps of: formation on a substrate of a plurality of L-shaped down metal structures; deposition of a dielectric layer on the substrate and the plurality of L-shaped down metal structures by using a screen printing approach; definition and opening in the dielectric layer of upper contacts and lower contacts of the L-shaped down metal structures; formation of a plurality of L-shaped up metal structures being connected to the plurality of L-shaped down metal structure in correspondence of the upper and lower contacts so as to form a plurality of serially connected thermocouples, each comprising at least one L-shaped down metal structure and at least one L-shaped up metal structure, being made of different metal materials and interconnected at a junction, the serially connected thermocouples thus realizing the system for recovering heat.Type: ApplicationFiled: December 21, 2010Publication date: June 30, 2011Applicant: STMICROELECTRONICS S.R.LInventors: Giovanni ABAGNALE, Sebastiano RAVESI
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Publication number: 20110139205Abstract: A thermionic converter for converting thermal energy to electrical energy includes an emitter and a collector. The emitter emits thermionic electrons upon receipt of heat from a heat source. The emitter is made of a first semiconductor material to which a first semiconductor impurity is doped with a first concentration. The collector is spaced and opposite to the emitter to receive the thermionic electrons emitted from the emitter so that the thermal energy is converted to electrical energy. The collector is made of a second semiconductor material to which a second semiconductor impurity is doped with a second concentration less than the first concentration.Type: ApplicationFiled: December 9, 2010Publication date: June 16, 2011Applicant: DENSO CORPORATIONInventors: Yuji KIMURA, Susumu Sobue, Mitsuhiro Kataoka, Eiichi Okuno, Shoichi Kawai
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Publication number: 20110126530Abstract: A vehicle exhaust system includes a thermoelectric generator that uses a plurality of thermoelectric modules to convert thermal energy generated by hot exhaust gases to electric energy. The thermoelectric generator has an inlet associated with an upstream exhaust component and an outlet associated with a downstream exhaust component. The thermoelectric generator diverts exhaust gas flow from a vehicle exhaust system main-flow direction to a cross-flow direction that is non-parallel to the main-flow direction when flowing from the inlet to the outlet of the thermoelectric generator.Type: ApplicationFiled: December 1, 2010Publication date: June 2, 2011Inventors: Joseph Callahan, Christian Paul Vitek, Marco Ranalli, Nilkolaos S. Fortomaris, Robin McCarty, Ralph Irving Larson, JR.
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Publication number: 20110114145Abstract: The invention provides for a nanostructure, or an array of such nanostructures, each comprising a rough surface, and a doped or undoped semiconductor. The nanostructure is an one-dimensional (1-D) nanostructure, such a nanowire, or a two-dimensional (2-D) nanostructure. The nanostructure can be placed between two electrodes and used for thermoelectric power generation or thermoelectric cooling.Type: ApplicationFiled: August 21, 2008Publication date: May 19, 2011Applicant: THE REGENTS OF THE UNIVERSITY OF CALIFORNIAInventors: Peidong Yang, Arunava Majumdar, Allon I. Hochbaum, Renkun Chen, Raul Diaz Delgado
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Patent number: 7939744Abstract: A thermoelectric element formed of a sintered body of a semiconductor comprising at least two kinds of elements selected from the group consisting of Bi, Te, Se and Sb, and having a micro-Vickers' hardness of not smaller than 0.5 GPa. The thermoelectric element has a hardness of not smaller than 0.5 GPa, and exhibits a large resistance against deformation, and is not easily broken by deformation. As a result, breakage due to deformation is prevented and a highly reliable thermoelectric element is realized even when a shape factor which is a ratio of the sectional area of the thermoelectric element to the height thereof, is increased and even when the element density is increased.Type: GrantFiled: August 21, 2002Date of Patent: May 10, 2011Assignee: Kyocera CorporationInventors: Masato Fukudome, Kazuhiro Nishizono, Koichi Tanaka, Kenichi Tajima
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Publication number: 20110100406Abstract: The invention is a Split-Thermo-Electric Structure (STES) and devices and systems that utilize said structure. The STES comprises a first thermo-electric element at an elevated temperature and a second thermo-electric element at a low (cold) temperature. The first thermo-electric element and the second thermo-electric element are connected by either an intermediate connection that conducts both electric current and heat or by a thermo-electric chain comprised of one or more thermo-electric elements. Each pair of the thermo-electric elements in the chain are connected by an intermediate connection that conducts both electric current and heat. Each of the thermo-electric elements and each of the intermediate connections in the STES exhibit a temperature-gradient. The STESs can be utilized in Seebeck or Peltier devices. The STESs can be utilized to construct devices comprised a plurality of n-type and p-type pairs of STESs, wherein each of the STESs in the device are connected at each end to a support layer.Type: ApplicationFiled: July 2, 2009Publication date: May 5, 2011Applicant: LAMOS INC.Inventor: Noam Danenberg
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Patent number: 7932459Abstract: A first conductive member and a second conductive member having different Seebeck coefficients are joined together by a joining member to form a plurality of thermoelectric conversion elements, and these thermoelectric conversion elements are disposed in at least two different temperature environments. The first conductive members of respective thermoelectric conversion elements or the second conductive members thereof are connected to each other by an electric wiring to form a direct energy conversion electric circuit system, and electric potential energy is picked up from an arbitrary portion on this electric wiring. Accordingly, the direct energy conversion electric circuit system from thermal energy to electric energy is formed.Type: GrantFiled: November 16, 2005Date of Patent: April 26, 2011Assignees: Meidensha Corporation, Yoshiomi KondohInventor: Yoshiomi Kondoh
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Publication number: 20110041887Abstract: A thermoelectric generation apparatus, which is provided with a thermoelectric conversion element, can be used even when exposed to a high-temperature environment such as being heated on an open fire, and is inexpensive. Onto the bottom surface or the like of a container (11) which can be used even when heated by heat from an ignition source, the thermoelectric conversion element (12) made from the same material which can be used even when heated by the heat generated from the ignition source is installed fixedly. Thus, a thermoelectric conversion apparatus (10), which can be used even when exposed to the high-temperature environment such as an open fire, and is inexpensive, is provided.Type: ApplicationFiled: April 28, 2009Publication date: February 24, 2011Applicant: Universal Entertainment CorporationInventor: Koh Takahashi
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Publication number: 20110023930Abstract: A method is provided for producing a thermoelectric component having at least one pair of thermoelectric legs, including an n-leg and a p-leg, wherein both legs are welded to an electrically conductive contact material, and wherein the n-leg and the p-leg of the pair of legs are welded in separate welding steps to the contact material. A thermoelectric component produced by the method is also provided.Type: ApplicationFiled: July 23, 2010Publication date: February 3, 2011Applicant: Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung e.V.Inventors: Jan KÖNIG, Uwe VETTER, Carsten MATHEIS
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Publication number: 20110023929Abstract: Thermoelectric generator elements and associated circuit elements are simultaneously formed using a common semiconductor device fabrication process to provide an integrated circuit including a dynamically reconfigurable thermoelectric generator array on a common chip or die substrate. A switch logic circuit formed together with the thermoelectric generator elements is configured to control series and parallel connections of the thermoelectric generator elements is the array in response to changes in circuit demand or changes in the available ambient energy source. In an example implementation, the number of generators connected in series may be varied dynamically to provide a stable voltage source, and the number of generators connected in parallel may be varied dynamically to provide a stable current source.Type: ApplicationFiled: May 28, 2010Publication date: February 3, 2011Applicant: TEXAS INSTRUMENTS INCORPORATEDInventor: Henry Litzmann Edwards
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Patent number: 7875791Abstract: A method for manufacturing thermopile carrier chips comprises forming first type thermocouple legs and second type thermocouple legs on a first surface of a substrate and afterwards removing part of the substrate form a second surface opposite to the first surface, thereby forming a carrier frame from the substrate and at least partially releasing the thermocouple legs from the substrate, wherein the thermocouple legs are attached between parts of the carrier frame. First type thermocouple legs and second type thermocouple legs may be formed on the same substrate or on a separate substrate. In the latter approach both types of thermocouple legs may be optimised independently. The thermocouple legs may be self-supporting or they may be supported by a thin membrane layer. After mounting the thermopile carrier chips in a thermopile unit or in a thermoelectric generator, the sides of the carrier frame to which no thermocouple legs are attached are removed.Type: GrantFiled: March 28, 2008Date of Patent: January 25, 2011Assignee: Stichting IMEC NederlandInventors: Vladimir Leonov, Paolo Fiorini, Chris Van Hoof
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Patent number: 7838759Abstract: A method of forming a thermoelectric device may include forming a pattern of conductive traces, and forming an electrically insulating matrix between the conductive traces of the pattern of conductive traces. In addition, a plurality of thermoelectric elements may be electrically and mechanically coupled to the pattern of conductive traces so that each conductive trace of the pattern of conductive traces has one of the plurality of thermoelectric elements thereon. In addition, the plurality of thermoelectric elements may be free of the electrically insulating matrix. Related methods and structures are also discussed.Type: GrantFiled: June 22, 2006Date of Patent: November 23, 2010Assignee: Nextreme Thermal Solutions, Inc.Inventors: Randall G. Alley, David A. Koester
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Patent number: 7825324Abstract: An apparatus includes a thermoelectric cooler having a first set of one or more metal electrodes, a second set of one or more metal electrodes, and one or more doped semiconductor members. Each member physically joins a corresponding one electrode of the first set to a corresponding one electrode of the second set. Each member has a cross-sectional area that increases along a path from the one metal electrode of the first set to the one metal electrode of the second set.Type: GrantFiled: December 29, 2006Date of Patent: November 2, 2010Assignee: Alcatel-Lucent USA Inc.Inventors: Marc Scott Hodes, Christopher D. W. Jones, Shankar Krishnan, Oana Malis
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Patent number: 7812246Abstract: There is provided a self driving energy direct conversion system capable of restricting global warming by using a recycle-type and open-system thermoelectric effect device which uses a natural heat energy (reusable, non polluting, and omnipresent) and which is capable of obtaining an energy source. With a group of Peltier effect elements separated at a certain distance and a group of Seebeck effect elements separated at a certain distance, a heat energy transfer section, a power generator section, and an electrolysis section are provided. Making artificially a heat energy transfer, an electric potential energy conversion, and a chemical potential energy source (of a hydrogen gas and an oxygen gas) allows use of the heat energy, an electric power and a chemical potential energy. Hereinabove, the chemical potential energy source is made by a water electrolysis circuit using water that is easy to pressurize, compress, store, accumulate and convey.Type: GrantFiled: December 5, 2003Date of Patent: October 12, 2010Assignees: Kabushiki Kaisha MeidenshaInventor: Yoshiomi Kondoh
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Patent number: 7777126Abstract: A thermoelectric device at least includes a ring-shaped insulated substrate and plural sets of thermoelectric thin film material pair (TEP) disposed thereon. The ring-shaped insulated substrate has an inner rim, an outer rim and a first surface. The sets of TEP electrically connected to each other are disposed on the first surface of the ring-shaped insulated substrate. Each set of TEP includes a P-type and an N-type thermoelectric thin film elements (TEE) electrically connected to each other. Also, the N-type TEE of each set is electrically connected to the P-type TEE of the adjacent set of TEP. When a current flows through the sets of TEP along a direction parallel to the surfaces of P-type and N-type thermoelectric thin film elements, a temperature difference is generated between the inner rim and the outer rim of the ring-shaped insulated substrate.Type: GrantFiled: August 4, 2008Date of Patent: August 17, 2010Assignee: Industrial Technology Research InstituteInventor: Hsu-Shen Chu
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Patent number: 7569763Abstract: A solid-state energy converter with a semiconductor or semiconductor-metal implementation is provided for conversion of thermal energy to electric energy, or electric energy to refrigeration. In n-type heat-to-electricity embodiments, a highly doped n* emitter region made of a metal or semiconductor injects carriers into an n-type gap region. A p-type layer is positioned between the emitter region and gap region, allowing for discontinuity of corresponding Fermi-levels and forming a potential barrier to sort electrons by energy. Additional p-type layers can optionally be formed on the collector side of the converter. One type of these layers with higher carrier concentration (p*) serves as a blocking layer at the cold side of the converter, and another layer (p**) with carrier concentration close to the gap reduces a thermoelectric back flow component. Ohmic contacts on both sides of the device close the electrical circuit through an external load to convert heat to electricity.Type: GrantFiled: September 13, 2006Date of Patent: August 4, 2009Assignee: Micropower Global LimitedInventors: Yan R. Kucherov, Peter L. Hagelstein
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Publication number: 20090025773Abstract: A power supply comprises a thermoelectric generator, an initial energy management assembly, an electrostatic converter and a final energy management assembly. The thermoelectric generator is adapted to generate an electrical activation energy with sufficiently high voltage in response to a temperature gradient acting across the thermoelectric generator. The initial energy management assembly is connected to the thermoelectric generator and is adapted to receive and condition the electrical activation energy produced by the thermoelectric generator. The electrostatic converter is connected to the initial energy management assembly and is activatable by the electrical activation energy received therefrom and is configured to generate electrical energy in response to vibrational energy acting thereupon. The final energy management assembly is connected to the electrostatic converter and is adapted to condition the electrical energy produced thereby.Type: ApplicationFiled: September 8, 2006Publication date: January 29, 2009Inventor: Ingo Stark
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Publication number: 20090007953Abstract: An integrated micro-scale power converter converts hydrocarbon fuel into electricity. The integrated micro-scale power converter includes a micromachined combustor adapted to convert hydrocarbon fuel into thermal energy and a micromachined thermoelectric generator adapted to convert the thermal energy into electrical energy. The combustion reaction in the combustor flows in a path in a first plane while the thermal energy flows in a second plane in the generator the second plane being nearly orthogonal or orthogonal to the first plane. The fuel handler in the combustor is adjacent and thermally isolated from the thermoelectric generator. The fuel handler may include a nozzle and gas flow switch, where the frequency of activation of the gas flow switch controls the amount of the fuel ejected from the nozzle.Type: ApplicationFiled: July 7, 2006Publication date: January 8, 2009Inventor: Ying Wen Hsu
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Publication number: 20080251111Abstract: A thermoelectric power generator includes a thermoelectric pile in a chamber. A window admits light and/or heat radiation such as solar radiation into the chamber, which is absorbed in a radiation absorbing body in thermal contact with a first side of the thermoelectric pile, whereby the temperature of the first side is raised. A second side of the thermoelectric pile is in thermal contact with the wall of the chamber, which is a heat sink to maintain the second side at a lower temperature. The temperature difference produces a voltage difference at electrical contacts to the thermoelectric pile, which is capable of powering electrical devices.Type: ApplicationFiled: April 10, 2007Publication date: October 16, 2008Inventor: Woo Sik Yoo
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Patent number: 7273981Abstract: Representative configurations for improved thermoelectric power generation systems to improve and increase thermal efficiency are disclosed.Type: GrantFiled: August 18, 2003Date of Patent: September 25, 2007Assignee: BSST, LLC.Inventor: Lon E. Bell
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Patent number: 7242580Abstract: An efficient exhausting and cooling structure in a disk array apparatus is provided. A HDD module mounted in a HDD box of the disk array apparatus includes, around a HDD, a thermoelectric device which converts heat of HDD into electric power by using temperature difference, a cooling fan automatically operated by power supply of the thermoelectric device, and an air duct which directs air flowing and exhausted from the cooling fan to a rear face side of the HDD module. The entire apparatus is cooled and air therein is exhausted by the operation of exhaust fan operated by main power supply of the apparatus provided in an upper part of the chassis and the automatic operation of the cooling fan of each HDD module.Type: GrantFiled: March 13, 2006Date of Patent: July 10, 2007Assignee: Hitachi, Ltd.Inventor: Shigeaki Tanaka
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Patent number: 7235735Abstract: A thermoelectric device and method of manufacturing the device, where thermoelectric elements of opposite conductivity type are located on respective opposing sides of a heat source member. Heat sinks are disposed on opposite sides of the thermoelectric elements. Peltier metal contacts are positioned between the thermoelectric elements and each of the heat source member and heat sinks. A plurality of devices may be arranged together in a thermally parallel, electrically series arrangement, or in a thermally parallel, electrically parallel arrangement. The arrangement of the elements allow the direction of current flow through the pairs of elements to be substantially the same as the direction of current flow through the metal contacts.Type: GrantFiled: April 15, 2003Date of Patent: June 26, 2007Assignee: Nextreme Thermal Solutions, Inc.Inventors: Rama Venkatasubramanian, Edward P. Siivola
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Patent number: 7109408Abstract: A solid-state energy converter with a semiconductor or semiconductor-metal implementation is provided for conversion of thermal energy to electric energy, or electric energy to refrigeration. In n-type heat-to-electricity embodiments, a highly doped n* emitter region made of a metal or semiconductor injects carriers into an n-type gap region. A p-type layer is positioned between the emitter region and gap region, allowing for discontinuity of corresponding Fermi-levels and forming a potential barrier to sort electrons by energy. Additional p-type layers can optionally be formed on the collector side of the converter. One type of these layers with higher carrier concentration (p*) serves as a blocking layer at the cold side of the converter, and another layer (p**) with carrier concentration close to the gap reduces a thermoelectric back flow component. Ohmic contacts on both sides of the device close the electrical circuit through an external load to convert heat to electricity.Type: GrantFiled: March 15, 2004Date of Patent: September 19, 2006Assignee: Eneco, Inc.Inventors: Yan R. Kucherov, Peter L. Hagelstein
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Patent number: 7100369Abstract: A thermoelectric generating device has a thermoelectric element which utilizes an exhaust gas from an engine as a high temperature heat source and an engine coolant as a low temperature heat source in order to generate electricity. An introducing passage introduces a part of the exhaust gas passed through the thermoelectric element into an intake of the engine. An introducing valve opens and closes the introducing passage. A controller controls an opening degree of the introducing valve according to a load of the engine.Type: GrantFiled: April 29, 2004Date of Patent: September 5, 2006Assignee: DENSO CorporationInventors: Hiroo Yamaguchi, Yasutoshi Yamanaka
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Patent number: 7098393Abstract: A thermoelectric device formed of nanowires on the nm scale. The nanowires are preferably of a size that causes quantum confinement effects within the wires. The wires are connected together into a bundle to increase the power density.Type: GrantFiled: May 17, 2002Date of Patent: August 29, 2006Assignee: California Institute of TechnologyInventors: Jean-Pierre Fleurial, Margaret A. Ryan, Alexander Borshchevsky, Jennifer Herman
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Patent number: 6958443Abstract: Disclosed is a foil segment for a thermoelectric generator comprising a top plate disposed in spaced relation above a bottom plate. An array of the foil segments is perpendicularly disposed in side-by-side arrangement between and in thermal contact with the bottom and top plates. Each foil segment comprises a substrate having a thickness of about 7.5-50 microns, opposing front and back substrate surfaces and a series of spaced alternating n-type and p-type thermoelectric legs disposed in parallel arrangement on the front substrate surface. Each of the n-type and p-type legs is formed of a bismuth telluride-based thermoelectric material having a thickness of about 5-100 microns, a width of about 10-100 microns and a length of about 100-500 microns. The alternating n-type and p-type thermoelectric legs are electrically connected in series and thermally connected in parallel such that a temperature differential between the bottom and top plates results in the generation of power.Type: GrantFiled: May 19, 2003Date of Patent: October 25, 2005Assignee: Applied Digital SolutionsInventors: Ingo Stark, Peter Zhou
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Patent number: 6951456Abstract: A generally toroidal counterflow heat exchanger is the main element of a combustor that operates at a micro scale. The combustor includes a central combustion region with openings to a reactant gas channel and an exhaust gas channel. The reactant channel and exhaust channels are coiled around each other in a spiral configuration that reduces heat loss. An electric current microgenerator is similar and also includes a thermoelectric active wall composed of n-type and p-type thermoelectric elements as part of a channel wall of the microcombustor. The thermoelectric active wall includes fins configured to increase the temperature differential across the thermoelectric elements relative to the temperature difference between the thermoelectric elements and the reactant and exhaust gases. A method of monolithically fabricating such microdevices by electrodepositing multiple layers of material is also provided.Type: GrantFiled: July 29, 2003Date of Patent: October 4, 2005Assignee: University of Southern CaliforniaInventors: Adam L. Cohen, Paul D. Ronney, Uri Frodis, Lars Sitzki, Eckart H. Meiburg, Steffen Wussow
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Patent number: 6894215Abstract: A thermoelectric module with a simple structure with less breakage by thermal stress is provided. For this purpose, the thermoelectric module includes p-type and n-type thermoelectric elements (13, 14) which are alternately placed, and outer electrodes (15) and inner electrodes (16), which are alternately placed between the thermoelectric elements (13, 14), and at least part of at least either one of the outer electrode (15) or the inner electrode (16) has a shape approximately along an object which exchanges heat with the electrodes (15, 16). The inner electrodes (16) surround an object which exchanges heat with the electrodes (15, 16).Type: GrantFiled: January 21, 2003Date of Patent: May 17, 2005Assignee: Komatsu Ltd.Inventor: Hironori Akiba
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Patent number: 6855880Abstract: A thermoelectric semiconductor module (10) includes a plurality of semiconductor pellets (14, 18) having Peltier characteristics are mechanically interconnected and arranged in an electrical series circuit with heat transferring means (12, 16, 20) with all interconnections being directly made. The means (12, 16, 20) can be of platelike construction with an L-shaped cross-section or, alternatively, with a U-shaped cross-section. A large number of modules (10) can be arranged in a two-dimensional or three-dimensional stack (30) with adjacent lines or planes of modules electrically interrelated by end segment connectors (32). In a further version, one side of a modular plane has heat exchanger fins (44-50) while the other side is electrically connected by ceramic segments (58) with deposited conductors (56). In yet another version, the modules are mounted onto rotating discs (94, 96) so as to act as a fluid impeller moving therepast enhancing thermal efficiency.Type: GrantFiled: April 22, 2002Date of Patent: February 15, 2005Inventor: Steve Feher
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Publication number: 20040231714Abstract: Disclosed is a foil segment for a thermoelectric generator comprising a top plate disposed in spaced relation above a bottom plate. An array of the foil segments is perpendicularly disposed in side-by-side arrangement between and in thermal contact with the bottom and top plates. Each foil segment comprises a substrate having a thickness of about 7.5-50 microns, opposing front and back substrate surfaces and a series of spaced alternating n-type and p-type thermoelectric legs disposed in parallel arrangement on the front substrate surface. Each of the n-type and p-type legs is formed of a bismuth telluride-based thermoelectric material having a thickness of about 5-100 microns, a width of about 10-100 microns and a length of about 100-500 microns. The alternating n-type and p-type thermoelectric legs are electrically connected in series and thermally connected in parallel such that a temperature differential between the bottom and top plates results in the generation of power.Type: ApplicationFiled: May 19, 2003Publication date: November 25, 2004Inventors: Ingo Stark, Peter Zhou
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Publication number: 20040177877Abstract: A thermoelectric semiconductor element includes a first section and a second section. A heat path of the first section is greater than a heat path of the second section.Type: ApplicationFiled: September 10, 2003Publication date: September 16, 2004Applicant: ENHANCED ENERGY SYSTEMS, INC.Inventor: Adrian Hightower
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Publication number: 20040177876Abstract: A semiconductor thermoelectric module includes a first semiconductor element formed from a first composition. A second semiconductor element is formed from a second composition. The second semiconductor element is connected electrically in series with the first semiconductor element via an electrical conductor, and the second composition differs from the first composition.Type: ApplicationFiled: March 10, 2003Publication date: September 16, 2004Applicant: ENHANCED ENERGY SYSTEMS, INC.Inventor: Adrian Hightower
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Publication number: 20040134530Abstract: A thermoelectric conversion device for securely fixing a junction of a thermocouple to a top plate while ensuring heat transfer between the junction and the top plate. The thermoelectric conversion device includes a substrate having a main surface, a top plate facing the main surface of the substrate, and a plurality of series-connected thermocouples. Each thermocouple has a first end including a first junction and a second end including a second junction. The first junction of each thermocouple is fixed to the main surface of the substrate and the second junction of each thermocouple is provided with a bump for attaching the second junction to the top plate in such a way that the second junction is separated from the substrate.Type: ApplicationFiled: December 24, 2003Publication date: July 15, 2004Applicants: KABUSHIKI KAISHA TOKAI RIKA DENKI SEISAKUSHO, THE RITSUMEIKAN TRUSTInventors: Kouichi Itoigawa, Hiroshi Ueno, Susumu Sugiyama, Toshiyuki Toriyama
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Patent number: 6759586Abstract: Disclosed is a thermoelectric module, comprising a plurality of p-type thermoelectric elements each comprising a p-type semiconductor having a skutterdite crystal structure, a plurality of n-type thermoelectric elements each comprising a n-type semiconductor having a skutterdite crystal structure, at least one first electrode, at least one second electrode, at least one first alloy layer and at least one second alloy layer, wherein said at least one first alloy layer and said at least one second alloy layer contain Sb and at least one transition metal element selected from the group consisting of Ag, Au and Cu.Type: GrantFiled: March 26, 2002Date of Patent: July 6, 2004Assignee: Kabushiki Kaisha ToshibaInventors: Naoki Shutoh, Hiromitsu Takeda, Naruhito Kondo
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Publication number: 20040089336Abstract: Apparatuses and methods for vaporizing a liquid cryogen and producing electric power, as well as devices and methods for improving the thermal contact between thermoelectric devices and heat transfer surfaces using positive and/or negative pressures. These teachings are applicable to a wide range of thermoelectric applications including thermoelectric vaporizers, thermoelectric generators and thermoelectric heaters/coolers.Type: ApplicationFiled: May 1, 2003Publication date: May 13, 2004Inventor: Robert D. Hunt
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Patent number: 6700052Abstract: A flexible thermoelectric circuit is disclosed. Thermoelectric circuits have traditionally been of the rigid or substantially rigid form. Several different embodiments of thermoelectric circuits are disclosed which permit flexion in one or more directions to permit applications where flexible thermoelectric circuits are advantageous.Type: GrantFiled: November 5, 2001Date of Patent: March 2, 2004Assignee: Amerigon IncorporatedInventor: Lon E. Bell
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Publication number: 20030217766Abstract: An improved torus multi-element semiconductor thermoelectric hybrid utilizes a make-before-break high frequency switching output component to provide nominal alternating current voltage outputs. Overall efficiency of heat conversion is improved by coupling a chiller to the thermoelectric generator where exhaust heat produces chilled liquid or air that is conveyed to the cold side of the thermoelectric device.Type: ApplicationFiled: May 23, 2002Publication date: November 27, 2003Inventors: Jon Murray Schroeder, Gerald Phillip Hirsch
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Patent number: 6625990Abstract: An improved thermoelectric power generation system utilizes rotary thermoelectric configurations to improve and increase thermal power throughput. These systems are further enhanced by the use of hetrostructure thermoelectric materials, very thin plated materials, and deposited thermoelectric materials, which operate at substantially higher power densities than typical of the previous bulk materials. Several configurations are disclosed.Type: GrantFiled: June 6, 2002Date of Patent: September 30, 2003Assignee: BSST LLCInventor: Lon E. Bell
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Patent number: 6613972Abstract: A generally toroidal counterflow heat exchanger is the main element of a combustor that operates at a micro scale. The combustor includes a central combustion region with openings to a reactant gas channel and an exhaust gas channel. The reactant channel and exhaust channels are coiled around each other in a spiral configuration that reduces heat loss. An electric current microgenerator is similar and also includes a thermoelectric active wall composed of n-type and p-type thermoelectric elements as part of a channel wall of the microcombustor. The thermoelectric active wall includes fins configured to increase the temperature differential across the thermoelectric elements relative to the temperature difference between the thermoelectric elements and the reactant and exhaust gases. A method of monolithically fabricating such microdevices by electrodepositing multiple layers of material is also provided.Type: GrantFiled: January 5, 2001Date of Patent: September 2, 2003Assignee: University of Southern CaliforniaInventors: Adam L. Cohen, Paul Ronney, Uri Frodis, Lars Sitzki, Eckart Meiburg, Steffen Wussow
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Publication number: 20030121540Abstract: A thermoelectric module is basically constituted in a double-stage structure for arranging thermoelectric elements between insulating substrates, one of which has at least a pair of recesses and prescribed patterns of conduction layers. Herein, terminal conduction layers are formed inside of recesses, which reliably ensure electrical conduction between conduction layers formed on surfaces of the insulating substrate. In manufacture, cutting areas are defined on an insulating material plate, in which through holes are formed at prescribed positions on boundaries between cutting areas or at corners of cutting areas, wherein conduction layers are formed in prescribed patterns, and terminal conduction layers are formed inside of through holes and are interconnected with conduction layers selectively formed in proximity to through holes.Type: ApplicationFiled: December 27, 2002Publication date: July 3, 2003Inventor: Katsuhiko Onoue
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Patent number: 6548750Abstract: The solid state thermoelectric device includes at least an array of metallic conductor and/or N-type and P-type semiconductor thermoelectric elements assembled on a printed circuit and forming thermoelectric couples electrically connected in series. The structure of the device is formed of at least a pair of laminated elements each formed of a supporting layer made of polymeric material and at least a layer of conductive material, a layer of joining material interposed between the two laminated elements of polymeric material for firmly connecting them one to the other. The printed circuit is made from the layer of conductive material of the laminated elements and electrically connects in series the thermoelectric elements to form thermoelectric couples having the hot or cold sides, respectively, on only one side of the structure. The structure of the thermoelectric device has a spirally or circularly wound configuration.Type: GrantFiled: July 19, 2001Date of Patent: April 15, 2003Assignee: Peltech S.R.L.Inventor: Vincenzo Picone