Abstract: A cemented carbide tool containing tungsten carbide, titanium carbide, niobium carbide, possibly TaC, cobalt, chromium and possibly nickel, iron, molybdenum is disclosed. The composition of the materials provides a lighter material than usual, combined with a good resistance to corrosion as well as high hardness and wear resistance. These properties are particularly interesting for the manufacture of punch tools for cold forming operations. Cold forming tools made with these materials will have much better performance, particularly more steady performance and much longer lifetime. A method of cold forming and drawing, particularly deep drawing and ironing process of aluminum and steel beverage can manufacturing, is also disclosed.

Abstract: There is produced a cable hanger in which a Z-winding spiral and an S-winding spiral are alternately and continuously formed along an axis via a switching part using a hanger wire. A hanger wire is supplied from one end of a housing and sent out from the other end thereof. At least five spiral forming dice are accommodated in a cylindrical space of the housing such that the spiral forming dice are adjacent to each other and can rotate independently from one another.

Abstract: A crimper for spiral-binding coil comprises at least one, and preferably multiple, crimping assemblies including crimping elements that move generally parallel to each other to preferably cut, bend and/or reform an end of the coil for retaining the coil in the book or pamphlet. The movement of the crimping elements may be rotational in parallel planes, or translational in parallel lines. Preferably, multiple sets of crimping elements may be interchanged easily and without tools, for example, by being located on rotating members and are circumferentially spaced apart so that one set is used at a time. For each diameter of coil filament within the range of coil diameters for which a particular crimping set is designed, a member of the crimping assembly is adjusted to change the size/dimension(s) of the space into which the newly-cut end of the coil is forced, preferably adjusting that space to be slightly smaller than the diameter of the coil filament.

Abstract: Disclosed is an apparatus for forming a wire to include coil segments useable in a dynamoelectric machine, the apparatus including a plurality of forming structures simultaneously moveable along an axis into a coil segment forming configuration, with at least a number of the plurality of forming structures being configured to hold a wire, and at least one actuating device associated with at least a number of the plurality of forming structures and configured to simultaneously move the number of the plurality of forming structures into the coil segment forming configuration.

Abstract: The present invention provides microelectronic component assemblies and lead frame structures that may be useful in such assemblies. For example, one such lead frame structure may include a set of leads extending in a first direction and a dam bar. Each of the leads may have an outer length and an outer edge. The dam bar may include a plurality of dam bar elements, with each dam bar element being joined to the outer lengths of two adjacent leads. In this example, each dam bar element has an outer edge that extends farther outwardly than the outer edges of the two adjacent leads. The outer edges of the leads and the outer edges of the dam bar elements together define an irregular outer edge of the dam bar. Other lead frame structures and various microelectronic component assemblies are also shown and described.

Abstract: An apparatus in which wave windings with a defined number of waves are cut from a continuously formed wave winding band. In forming with a wire guide, the wave winding band is laid in alternation around the outer side faces of forming protrusions, offset from one another on the circumference of two disks. The two disks can be driven to rotate. In the angular range in which the wave winding band is driven on the circumference of the disks or roller, the spacing between one forming protrusion of one row and the next forming protrusion in the other row is increased by such an amount that the outer side faces of the forming protrusions form the winding heads of the wave windings. The wave windings cut from the wave winding band are introduced into radially outwardly open slots of a lamination packet or a rotorlike transfer tool.

Abstract: A method for removing from a carrier a carrier part with a housing arranged thereon, wherein prior to performing the separating operation a notched line is arranged in the carrier on at least one side of the carrier along at least a part of the length of a separating edge to be arranged. The invention also relates to a carrier part with a housing arranged thereon, which carrier part contains openings on the side of the carrier remote from the housing which are filled with encapsulating material, manufactured with the present method. The invention moreover relates to an apparatus for performing the method.

Abstract: A device for fabricating a lead frame, by press forming, provided with a die having a flat face, on which a lead frame to be fabricated by press forming is to be placed, and a concavity, which is dented relative to the flat face, the die possessing a fabricating face extending from the bottom of the concavity to the flat face through a slant, which is interposed between the bottom of the concavity and the flat face, the fabricating face contributing the fabrication of a lead frame by press forming, and a punch having punching faces formed so as to be opposite to the fabricating faces of the die for the fabrication of the lead frame by press forming, at least one of the die and the punch being movable so as to hold the lead frame between the fabricating face of the die and the punching face of the punch for the fabrication of the lead frame by press forming, wherein the bottom of the concavity of the die has a bottom concavity formed therein, which is dented relative to the bottom, and the punch has a front en

Abstract: In a lead forming apparatus for a semiconductor device, a holder holds a semiconductor device with leads to be formed, the semiconductor device having leads extending from a package. Two die assemblies (for bending, for cutting, or the like) are set in parallel, each including top and bottom dies matched with each other. A mover changes relative distance between the two die assemblies. The top and bottom dies in the two die assemblies are positioned so the leads of the semiconductor device held on the holder are between the dies.

Abstract: One end of a metallic wire having a rectangular cross-section is widened by upsetting the end of the wire in its axial direction. At the same time, a swollen portion is formed at a position where the widened end portion is to be bent from a straight portion of the wire. Then, the widened end portion is bent at the bending position having the swollen portion. Thus, a metallic wire segment having the widened end portion bent at the bending position is manufactured without wasting any part of wire material, while avoiding formation of cracks on the outer surface of the bending position. Plural wire segments thus manufactured are combined to form a rotor winding of a rotational electric machine, forming a commutator surface by the widened end portions at the same time.

Abstract: This application relates to the field of Dentistry, and in more particular to the use of root canal excavating implements such as files, broaches, reamers, or probes employed for the use of clearing tissue and removing dentin from the nerve canal of teeth. An introduced bent tip of 45 degrees to the angle of the implement, at a distance as close as a half of one millimeter from the leading tip, is cited as an improved means to get the tip of the implement to the desired working length.

Abstract: Apparatus and method for manufacturing multi strand rock bolts having spaced apart bulbs (12), wherein there is a feed means (14, 16, 18 and 19) for supplying a multi strand cable (11) from a rotatable supply wheel (13). Means (30, 32, 35 and 38) is provided for forming the cable (11) with bulbs (12) at spaced intervals and the position of the cable (11) is determined by a sensor means (40).

Abstract: A system for conditioning a plurality of semiconductor leads of a semiconductor device is provided. The system includes an array of comb blades, where each comb blade terminates at a notch that allows the semiconductor leads to be moved laterally through the notch. A controller connected to the comb blades, such as through an intervening motor and comb blade support, causes the comb blades to move relative to the semiconductor device, such as by holding the semiconductor device stationary, so as to perform lateral and vertical conditioning of the semiconductor leads.

Abstract: The application relates to an all-purpose pressing-bending machine having a feeding device (11) for feeding a material to be bent to a plurality of bending tool supporting slides (5), associated with a supporting plate (2). At least one of the bending tool supporting slides (5) can be operated independently from the other slides by a corresponding motor-reducing unit (6), each of the motor-reducing units being coupled to an electronic control device.

Abstract: The invention relates to a machine for stamping, bending and/or mounting of sheet metal parts with at least one upper housing part 14 and at least one lower housing part 16. Preferably, several are arranged in a row. On each housing part 14, 16 the carriage apparatus 20 is engaged by a motor. In order to increase the productivity of the machine, the carriage is driven by a program-controlled synchronous motor. In one embodiment a gear is positioned between motor and carriage which is formed preferably as an eccentric disc, connecting rod or elbow lever. The program-controlled synchronous motor is embodied as a torque motor and coupled by the gear member with the carriage.

Abstract: The invention relates to a device for clamping at least two tool parts movable relative to each other for processing carriers for electronic components in a press. The invention also relates to a press adapted for co-action with the clamping device. The invention also describes a tool part and a tool assembled from tool parts and adapted for co-action with the clamping device. Finally, the invention also relates to a method for mounting a tool in a press.

Abstract: A device for shaping terminal leads is used to bend terminal leads that extend from an electrical component body. The device includes a bearing that is mounted on a shaft. As the shaft is moved in a linear direction relative to the component body, the bearing rolls against the terminal lead to bend the terminal lead toward the component body. Since the bearing does not slide along the terminal lead, damage to the terminal lead is minimized.

Abstract: A method and apparatus for manufacturing electronic parts in which leads can be accurately bent and maintenance operations are easy. Each electronic part so manufactured includes a resin mold section 2 with a built-in electronic device and leads projecting therefrom, and the manufacturing method comprises bending a first portion of each of leads 3 to form a first bent portion 3d, bending a second portion of the lead 3 to form a second bent portion, and pressing the lead from obliquely above to bend the lead in such a manner that a tip portion of the lead 3 is located at a bottom portion of a resin mold. In the first bending step, a V-shaped groove 3c is formed near a root of the lead 3, and in the second bending step, the V-shaped groove 3c is bent to form a second bent portion 3e.

Abstract: A bending die includes a base member (1, 11) and a roller (3, 14). The base member (1, 11) is provided with a first portion (1a, 11a), the root of a lead (5, 16) is in contact with, and a second portion (1b, 11b), the end (5A, 16A) of the lead (5, 16) is in contact with. The roller (3, 14) is arranged around the second portion (1b, 11b) of the base member (1, 11) to make rolling contact with the lead (5, 16) in bending operation.

Abstract: Robust homofilament fibers are meltspun from a differently shaped dual capillary spinneret design to induce differential fiber morphology to produce crimping. Crimping may further be aided by quenching and drawing of the fibers.

Abstract: A modular tool for forming features in an exposed pad having a pad surface between a bleed groove and an edge of the pad surface in a lead frame including a first tool for forming a bottom of the exposed pad under the pad surface, a second tool coupled to the first tool for forming a side of the exposed pad, and a third tool coupled to the first tool for forming another side of the exposed pad.

Abstract: The invention relates to a device for clamping at least two tool parts movable relative to each other for processing carriers for electronic components in a press. The invention also relates to a press adapted for co-action with the clamping device. The invention also describes a tool part and a tool assembled from tool parts and adapted for co-action with the clamping device. Finally, the invention also relates to a method for mounting a tool in a press.

Abstract: A semiconductor manufacturing apparatus and a method of manufacturing a semiconductor device are provided. A horizontal driver (111) and a vertical driver (112) are controlled to move a punch holder (110), or an end portion (101T1) of a punch (101), within a plane defined by first and second directions (D1, D2). A tip (101A) of the punch (101) is brought into contact with leads (11), with a punch-side forming surface (101S) and a die-side forming surface (151S) maintained in parallel relationship. A pressurizer (131) is controlled to move the end portion (101T1) in a fourth direction (D4) toward the die-side forming surface (151S), and the punch-side forming surface (101S) and the die-side forming surface (151S) hold the leads (11) therebetween. A pressure detector (121) detects a load placed upon the punch (101).

Abstract: A lead forming apparatus and a method for removing tin dust from the surface of the outer leads of semiconductor package are disclosed. The apparatus, in which a brushing operation removes tin dust from the outer leads, includes a supplier part; a lead forming part; a collection part; an intermediate post; a package transportation part; a brush block; and a brush transportation part. The method includes steps of providing a leadframe, forming the package leads, removing tin dust from the leads, and collecting the packages in a container.

Abstract: A method of deforming a pin for use in an electrical connection, and a method of making an electrical connection using a deformed pin. A normally straight pin is provided and positioned adjacent to a frame supporting a die and an operating member. The operating member is coupled to the frame and the die, whereby moving the operating member moves the die sufficiently to bend a part of the pin. The method encompasses an apparatus for accomplishing the method, as well a secure electrical connection formed by joining a female fitting with a male fitting carrying a pin modified by the method.

Abstract: An integrated circuit package with a two dimensional array of leads that each have a foot portion which is bent at an angle relative to a vertical column portion of the leads. The foot portion of the leads are typically soldered to the surface pads of a printed circuit board. The leads are formed by a tooling apparatus which has a bending device that bends the foot portions of the leads onto a bending die. The tooling apparatus insures that the foot portions of the leads are all coplanar with the printed circuit board.

Abstract: A method and apparatus for bending a plurality of leads of a component, in order to straighten and/or repair damaged or misaligned leads, is disclosed. The apparatus includes: a securing structure for receiving and holding the component; a first member for engaging the plurality of leads of the component; and a second member for engaging the plurality of leads of the component, wherein the first and second dowels cooperate with one another so as to form the plurality of leads into a desired configuration.

Abstract: A pivot punch that has no explicit pivot point. In one embodiment, the tool includes a die, a punch holder pressable along a path toward the die and a punch supported by the punch holder. The punch extends through and is pivotable in an opening in the holder to move the lower part of the punch laterally toward the center of the die. In another embodiment, the upper part of the punch is held tightly in the holder. The lower part of the punch is flexible to move laterally toward the center of the die. A pivot punch that has no explicit pivot point. The punch is flexible and the punch pivot is permitted by the flexibility of the punch.

Abstract: Four lead bending devices (40) are so disposed as to surround the forming die (31). In each of the lead bending devices (40), a rotary lever (41) extends from a rotary strut (43) and a lever guide (42) disposed therebelow holds the rotary lever (41) to prevent deflection of the rotary lever (41). The rotary strut (43) is connected to a driving unit (44). Thus, a lead forming apparatus and a lead forming method are provided to achieve improvement in flatness of end portions of leads, reduction of generation of solder-plating residues by preventing a removal of solder-plate from surfaces of the leads, and easy change of an angle of the end portions of the leads to be formed.

Abstract: The present invention relates to a press for trimming and forming lead frames of semiconductor packages which have been molded in order to form individual semiconductor chips. The press machine for forming semiconductor packages according to the present invention is able to perform punching operation at low noise and high speed by vertically moving the upper mold mounted on an movable plate through a crank mechanism which is operated by a servomotor and has a characteristic of performing accelerated and decelerated motion with rotation, and also able to drive a feeding device by using the power of the servomotor which drives the press device, without using other driving source. And when there is caused such a trouble that a lead frame gets off the correct position, punching operation is interrupted to prevent any damage on semiconductor packages and a mold by lifting the movable plate provided with an upper mold.

Abstract: A clinching assembly for use with an insertion machine of the type used to form and insert the lead-wires of an electronic component into openings of a printed circuit board insertion machine. The clinching assembly includes two clinch heads that are selectively movable along a U-axis, parallel to the circuit board. Each clinching assembly is further selectively movable along a Z-axis, perpendicular to the circuit board. A single pneumatic actuator is used to raise and lower both clinch heads simultaneously. A T-shaped linkage attaches each clinch head with the single pneumatic actuator. Vertical movement of the pneumatic actuator is translated through the T-shaped linkage to vertically displace both clinch heads, and simultaneously, allow horizontal displacement of each clinch head, independent of the vertical location of the T-shaped linkage.

Abstract: A system for conditioning the leads of a semiconductor device. The system includes a base having at least one anvil surface configured to form the leads to a predetermined shape, and at least one forming arm mounted to the base. An actuator is movable relative to the base to move the forming arm from a first position, with the forming arm spaced from the leads, to a second position, with the forming arm urging the leads against the anvil surface to form the leads to a predetermined configuration.

Abstract: A general-purpose lead bending machine for electronic components that is capable of bending leads of various types of electronic components without a need of a great variety of benders. The machine includes a lead holding device for holding the distal end of a lead of an electronic component. A first driving mechanism causes the lead holding device to move along a first axis of travel. A second driving mechanism causes the lead holding device to move along a second axis of travel perpendicularly intersecting the first axis of travel. A control device controls the first driving mechanism and the second driving mechanism such that the lead holding device holding the lead of the electronic component moves along an approximately circular arc-shaped locus, thereby bending the lead of the electronic component.

Abstract: A shaftless roller for lead forming apparatus for scratch-free, precision forming of leads on a semiconductor device. The shaftless roller includes a semi-cylindrical cavity disposed in the lead forming apparatus. A cylindrical rod is rotatably fitted into the cavity such that more than fifty percent but less than one hundred percent of the rod is inside the cavity. The roller further includes a plurality of slots leading into the cavity for facilitating self-cleaning action, and an air passage adapted for delivering pressured air into the cavity to serve as air bearing for the cylindrical rod.

Abstract: An improved forming tool for forming at least one lead of a semiconductor package includes a member having at least one surface. The at least one surface of the member has a first shape for forming the at least one lead of the semiconductor package to a shape corresponding to the first shape. The at least one surface includes a diamond-like carbon coating thereon. The semiconductor package lead forming method in accordance with the present invention includes providing a semiconductor package having at least one lead in a first shape. A diamond-like carbon coated surface is applied to the at least one lead in the first shape to form the at least one lead into a second shape.

Abstract: An apparatus and method is provided for forming the external leads of an IC, wherein the coplanarity of the tips of the plurality of external leads after external lead formation can be improved even with an IC in which the resin portion is curved. The apparatus comprises a plurality of resin support projections which each support part of a resin portion from underneath, and a plurality of support pins respectively opposing the resin support projections, which each press on part of the resin portion from above.

Abstract: A lead conditioning system (10) conditions leads (74) of electronic component package (30) and includes a rotary table (16) for holding electronic component package (30) and making accessible the leads (74). A conditioning tool (20) includes conditioner arm (34) and conditioner blade (70) that selectively contacts a predetermined number of the leads (74). A manipulator (22) moves conditioning tool (20) to positions that contact a predetermined number of leads (74) to condition leads (74). A control system (24) controls the operation of manipulator (22).

Abstract: Surgical crimping pliers have operating handles and connected, opposed jaws. The jaws define opposed recesses for carrying and crimping a tubular crimp member, which is preferably of oval configuration for carrying a plurality of multistrand cable sections so that, upon crimping, the cable sections are secured together. A capstan is carried on one of the handles for winding a plurality of cable portions so that tension may be placed on both ends of a cable loop array wound about a bone structure, to provide a predetermined, quantitative tension. Then the cable sections within the crimp are secured together by collapse of the crimp. A multistrand cable is preferably used, which exhibits great advantage over single strand wire, and which carries surgical needles of differing type secured to each end thereof.

Abstract: An apparatus and method for tightening and crimping a surgical wire used for orthopedic purposes. The apparatus of this invention includes a pair of operating handles which are biased apart and which operate a pair of opposed jaws to which they are connected. Disposed on opposite sides of the operating handles are a pair of capstans. The jaws are adapted to hold a crimp member therein without deforming it while opposite ends of a length of wire are passed through the crimping member in opposite directions. Each end of the wire is wrapped about an associated capstan. A ratchet handle simultaneously rotates both capstans to wrap the opposite ends of the wire. Once the desired traction force has been achieved, the jaws are further activated to crimp the crimp member. A ring-shaped crimp member is also disclosed which has a central opening extending along the axis thereof and two parallel channels, one channel being disposed on either side of the central opening.

Abstract: Method and apparatus for forming the lead-outs (14) of integrated circuits from which lead-outs (14) which are positioned in a common plane (21) are protruding, are bent in that they are gripped close to their free tips and then are positively moved along a curved path which is situated in a plane extending perpendicular to said common plane (21) and comprising the respective ones of the lead-outs (14) while the lead-outs (14) maintain to be clamped.

Abstract: Apparatus for shaping conductors critically spaced on a carrier that are bonded to contact locations on a substrate surface. The conductors are cantilevered with each adjacent conductor bonded to a contact location that is a different distance from the carrier. Each conductor remains in the plane of the support of the carrier to the vicinity of its respective contact location where it is shaped to extend nearly vertically toward the substrate then horizontally across the contact location exerting pressure on the contact location.

Abstract: An improved forming tool for forming at least one lead of a semiconductor package includes a member having at least one surface. The at least one surface of the member has a first shape for forming the at least one lead of the semiconductor package to a shape corresponding to the first shape. The at least one surface includes a diamond-like carbon coating thereon. The semiconductor package lead forming method in accordance with the present invention includes providing a semiconductor package having at least one lead in a first shape. A diamond-like carbon coated surface is applied to the at least one lead in the first shape to form the at least one lead into a second shape.

Abstract: The leads of a lead frame on which an encapsulated chip is placed are bent by placing them in a mould and subsequently bending them with a bending tool in the form of a cylinder-like roller rotatable round a rotating shaft. Because the roller rolls off over the leads, scraping off of solder onto the leads is prevented during bending. In view of its length the mounting of such a roller causes problems, such as sagging. This is resolved according to the invention by providing the roller on the periphery with slot-like recesses for passage of a bearing for the rotating shaft.

Abstract: A device for cambering conductive fingers, including a cambering plate (14) having a mold (16) which corresponds to the camber to be produced, a device for positioning (8) the intermediate substrate relative to the cambering plate (14), a cambering tool (22) disposed opposite the mold (16) for acting on a conductive finger (4), and a control device (24, 7) for ensuring or controlling the relative displacement of the cambering plate and the cambering tool in a first direction perpendicular to the plane containing the conductive fingers (4) and in a second direction parallel to the longitudinal direction of the conductive fingers (4).

Abstract: A ceramic die for cutting and shaping lead frames, in which at least a working section thereof is made of a specific ceramic material having an iron and cobalt content of less than 100 ppm in total. The ceramic die can be formed in a complex shape with a high precision and has a prolonged lifetime because of its superior mechanical properties, such as high wear resistance and high strength, and less probability of adhesion of foreign matter such as solder or the lead frame material thereto. Even if the solder or lead frame material is adhered onto the die, the adhered matter can be removed through a simple procedure in a shortened time. The die is further improved by depositing a hard carbon film onto the surface of the working section.

Abstract: In a system, method and apparatus for reforming leads of a device having a plurality of generally straight sides and rows of leads of J-shaped configuration extending from the sides of the body portion reforming the leads of a pair of first opposing rows of leads at a first reforming station by moving combs of a lead straightening mechanism through the leads to space the leads a predetermined distance relative to one another. The leads of one row engage against reforming surfaces with the combs engaging between the J-shaped terminal ends. The device is then relocated to present a second pair of opposing rows of leads to a lead straightening mechanism. The second opposing parallel rows of leads are reformed by moving combs through the leads to space the leads a predetermined distance relative to one another by engaging the leads of one row against reforming surfaces with the combs engaging between the J-shaped terminal ends.

Abstract: First and second dies are movably opposed to each other. The second die is for pinching a package and a lead wire of the package in cooperation with the first die with a portion of the lead wire that protrudes from the first and the second dies. A slidable base is slidably supported on a die surface of the first die and has an inclined surface. A base pushing rod is movable in a direction which is substantially perpendicular to a base surface of the slidable base. The base pushing rod has an inclined rod surface which is opposed to the inclined surface. A spring urges the slidable base to make the inclined base surface be brought into contact with the inclined rod surface. The base pushing rod moves the slidable base towards the package together with one end portion of the lead wire that is supported on the slidable base when the protruded portion of the lead wire is pushed by the wire pushing member. The slidable base may have a cam follower internal surface which defines a cam hole.

Abstract: An apparatus and method for conditioning the leads of a semiconductor device having parallel leads formed to a predetermined configuration. The apparatus includes a device for engaging and massaging the leads to reintroduce a predetermined spacing between the leads, bringing the leads into parallelism. The apparatus also includes a device for forming the leads to a partially unbent condition having at least one clamping arm pivotal between a first position spaced from the leads and a second position compressing a portion of the leads between the clamping arm and the support. The apparatus further includes a device for reforming the leads to a predetermined configuration.

Abstract: An outer lead bending apparatus comprises a fixed unit, a movable unit movable toward and away from the fixed unit, a first die detachably mounted on one of the fixed unit and movable unit and holding a semiconductor package devise in place, and a second die detachably mounted on the other unit and, when the movable unit is driven toward the fixed unit, bending, together with the first die, the outer leads of the semiconductor package devise into a given configuration.

Abstract: A lead cutting apparatus for cutting the leads or pins of electric and electronic devices into a predetermined length in the manufacturing process including inclined pressing surface(s) and cutting edge(s) for cutting the leads, which are covered with an anticorrosive coat, at a cutting position. The inclined pressing surface(s) is at an appropriate angle relative to the length of the leads and presses, between the pressing surface and an opposite inclined or non-inclined pressing surface, the leads near the cutting positions, thus cutting the leads into a shape that becomes gradually thinner to a very small thickness. The cut ends of the leads are covered with the anticorrosive coat and thus prevented from rusting without requiring any anticorrosive treatment. Accordingly, the manufacturing cost of the electric and electrical devices can be reduced greatly.