Abstract: A base-coupled logic gate is characterized by input Schottky diodes that are directly formed on the base region of the switching transistor for the gate. A logic of this type provides flexible circuit arrangements and savings in required area, while achieving very high speeds. As a result of the savings in area, the buried layer capacitance of the gate is also reduced, which facilitates the high-speed operation of the circuit.

Abstract: The present invention provides a semiconductor device, in particular, a semiconductor device comprising a vertical npn transistor, a vertical pnp transistor and an IIL which are integrated on the same one-conductivity type semiconductor substrate (1). The IIL comprises an emitter, a base and a collector which are respectively comprised of a high-density n.sup.+ -type first buried layer (5), a p.sup.+ -type second buried layer (8) having a lower impurity density than the n.sup.+ -type first buried layer (5), and at least one of n.sup.+ -type diffused layer (31).The semiconductor device thus constituted makes it possible to increase the emitter injection efficiency while the base impurity density is kept high, and also to decrease the base width, so that the collector-emitter breakdown voltage and current gain of the IIL can be more improved and also the operation speed of the IIL can be made higher.

Abstract: A compact complementary transistor switch (CTS) memory cell structure utilizing both vertical PNP and vertical NPN transistors in gallium arsenide technology is described. The base region of the vertical PNP transistor merges with the collector region of the vertical NPN transistor. The collector region of the vertical PNP transistor merges with the base region of the vertical NPN transistor. The emitter of the vertical PNP transistor is at the top, and the emitter of the vertical NPN transistor is at the bottom in relation to the emitter of the vertical PNP transistor. This structure leads to improvements in memory density, performance and wireability of a memory array comprising many such cells. A novel yet simple process for making such compact CTS memory cells is also disclosed.

Abstract: A lateral bipolar transistor is described incorporating at least two grooves extending from the upper surface and spaced apart by a predetermined amount from which impurities are introduced to form an emitter region extending from the sidewall of one groove and a collector region extending from the sidewall of an adjacent groove with the base being the substrate material between the two regions. A plurality of grooves may be utilized to form a plurality of transistors with the grooves staggered to facilitate access to the ends of the grooves functioning as emitters and those functioning as collectors. The large vertical junction area formed by the side walls relative to the horizontal junction area at the bottom of the grooves and the uniform base width result in a high current gain lateral transistor.

Abstract: An integrated injection logic (I.sup.2 L) semiconductor structure is disclosed which may be advantageously implemented in a group III-V compound semiconductor such as gallium arsenide. The base region of the lateral transistor is made extremely thin (less than one-tenth micron) by use of "regrowth" techniques. The structure of the vertical transistor is simplified by using a Schottky collector.

Abstract: Disclosed is a structure of a semiconductor integrated circuit device including circuit elements such as a bipolar transistor and I.sup.2 L. The structure comprises a buried layer formed by the ion implantation method using an insulating layer, having a window with tapered edges at the surface of semiconductor substrate, as a mask. A part of the buried layer appears at the surface of the semiconductor substrate, thus establishing the connection of electrodes. The circuit element is formed in the region bounded by the buried layer and the window.

Abstract: An integrated circuit wherein the base and surface collector regions of the I.sup.2 L vertical transistor are formed by the same steps used to form the collector and base, respectively, of complementary bipolar transistors. Thus, a high voltage bipolar transistor of the same type as the vertical I.sup.2 L transistor may be formed using separate process steps, thereby optimizing the design of both devices.