Abstract: The operation of tow cutters in an automatic fiber placement machine are monitored to determine if inconsistencies in fiber placement are related to cutter operation. A machine vision system detects inconsistencies in tow placement, and timing signals are generated that represent the actuation of the cutters. The timing signals are correlated with recorded images of the placed tows to determine if the inconsistency in tow placement are related to cutter operation.

Abstract: A gluing group of a final edge of a log including in succession an introducing group into the gluing group of the logs one after the other, an unwinding group of the log associated with means for identifying the final edge, an opening group of the final edge from the log and a glue transfer group on the log, in which the opening group of the final edge and the glue transfer group are housed in a slide structure that is mobile with respect to the unwinding group by a predetermined amount dependent upon the diameter of the log, with rolling transfer means of the log from the unwinding group to the slide structure being foreseen.

Abstract: A method is provided for producing a hybrid multi junction photovoltaic device. The method begins by providing a plurality of planar photovoltaic semi-transparent modules. Each of the modules is a fully functional, thin-film, photovoltaic device and includes first and second conductive layers and at least first and second semiconductor layers disposed between the conductive layers. The first and second semiconductor layers define a junction at an interface therebetween. The method continues by disposing the modules one on top of another and hybridly adhering them to each other. At least one of the modules is configured to convert a first spectral portion of optical energy into an electrical voltage and transmit a second spectral portion of optical energy to another of the junctions that is configured to convert at least part of the second spectral portion of optical energy into an electrical voltage.

Abstract: A machine for making two-color expandable salts includes a feeding unit to feed two strips of different colors to a combining unit which includes a cutting blade and a ultra-wave generator, the cutting blade cuts surplus from two sides of each of the two strips and the two strips are securely connected to each other along two respective sides thereof so as to form the expandable slat. A scrolling unit includes a scrolling wheel which to scroll the expandable slat from the combining unit. A control unit includes a programmable controller and multiple tension detection members which detect tension of the strips and the expandable slat, the tension is sent to the programmable controller which adjusts speed of the feeding wheels and scrolling wheel.

Abstract: An arrangement (1) for the treatment of a material (7, 8; 7?, 8?; 7?, 8?; 18) having at least two layers of material by an ultrasonic device (2) having an ultrasonic horn (3) arranged in conjunction with an abutment (5), in conjunction with which the material (7, 8; 7?, 8?; 7?, 8?; 18) is positioned in a gap (6) that is defined between the ultrasonic horn (3) and the abutment (5), and the ultrasonic horn (3) and/or the abutment (5) is/are so arranged as to be capable of displacement to permit adjustment of the size of the gap (6), for which purpose the arrangement (1) also includes a control unit (13) for the regulation of the size of the gap (6) dependent on the energy supplied to the material in the course of the treatment.

Abstract: In order to seal the corner joint of an elastoplastic tape placed as a spacer on a glass pane, a film strip is pressed with a first portion of its length against the first leg section of the spacer and the protruding portion of the film strip is wrapped around the corner and pressed against the second leg section. For the purpose of automating this process, the film strip is severed mechanically from an automatically supplied film tape and held via a transfer apparatus which thereafter presses the film strip with the first portion of its length against the first leg section. The portion of the film strip protruding freely over the corner is wrapped around the corner via a pressure carriage and pressed by tautening against the second leg section of the spacer.

Abstract: A system and method are provided which enable the joining of two materials via ultrasonic welding, including materials normally considered incompatible in traditional ultrasonic welding techniques. The system permits ultrasonic welding of a first material to a second material, the second material including material types normally considered incompatible with the first material and includes an abrader for altering the surface of the material/s to be joined. A first pressure device is operative to vary the position of the abrader and thereby vary the abrasion applied to the materials. An ultrasonic source provides acoustic energy to a weld interface between the materials. A second pressure device is operative to vary the force applied to the interface between the materials while a sensor senses the weld interface temperature.

Abstract: The cover film sticking device is capable of securely sticking cover film pieces on specimen samples on all slide glasses stored in a basket, which starts to stick the cover film pieces formed, by cutting off long cover film unwound from a film roll to a specified length on the specimen samples on the plurality of slide glasses stored in the basket 26 taken out from a load tank 12 filled with a volatile protective solution. The sticking device is characterized by cover film length securing means for unwinding the long cover film from the film roll and extending the same until reaching cutting means so as to secure the cover film of such a length that can form the cover film pieces to be stuck onto the specimen samples on the maximum number of the slide glasses storable in the basket 26 taken out from the load tank 12.

Abstract: The invention relates to a method and device for heat-sealing windows into folding carton blanks for producing liquid-proof folding cartons having film windows. Pieces of film that are cut to measure are placed on the window openings of the folding carton blanks and the edges of the pieces of film are heat-sealed with the folding carton blanks so as to be liquid-proof using heated pressure segments or heat-sealing dies. The folding carton blanks, together with the pieces of film, are fed to a tail pulley for a transport belt by means of the transport belt and are inserted in the gap between the tail pulley and the transport belt resting thereon. In this gap, the blanks and pieces of film are continuously heat-sealed together by means of at least two heated pressure segments that are disposed on the outer periphery of the tail pulley and push radially from inwards against the transport belt in the area of deflection of the transport belt and thus onto the edges of the pieces of film.

Abstract: An inspection system (9) includes an idler wheel (61) that is coupled to a fabrication system (8) and is in contact with a backing layer (65) of an applied material (64), A rotation sensor (63) monitors the idler wheel (61) and generates a rotational signal. A controller (24) is coupled to the rotation sensor (63) and determines a characteristic of one or more flaws and FOD (19) on a composite structure (12) in response to the rotation signal.

Abstract: An apparatus for high speed labeling of produce including a turret which carries label depositor arms and continuously rotates so that its fully extended tangential speed matches the produce conveyor speed. The label depositor arms are reciprocated along a predetermined path by a mechanical linkage. A supply of pressurized air and vacuum are selectively delivered to the label depositor arms to pick-up a print-on-demand label and adhere it to the produce. One or more rotating turrets are included within a system for high speed labeling. The system monitors a common shaft which drives a conveyor that moves multiple lanes of produce under corresponding turrets. A conveyor offset signal in combination with a printer offset control, allows the system to independently synchronize the high-speed labeling operation at each lane.

Abstract: A system for fabricating a corrugated board sheet fabricated includes warp status information obtaining means (6, 6A-6H, 7, 7A, 7B, 8, 8A-8H, 240a, 240b, 241a, 241b) for obtaining warp status information concerning status of the warp of the corrugated board sheet fabricated by a corrugated-board fabrication machine (1); running-state information obtaining means (5, 5A-5H) for obtaining running state information concerning a running state of the corrugated-board fabrication machine (1); control variable calculating means (4, 4A-4H) for calculating a control variable of a particular control factor that affects the warp of the corrugated board sheet and that is one among control factors used to control the corrugated-board fabrication machine (1) based on the warp status information of the corrugated board sheet and the running state information of the corrugated-board fabrication machine (1); and control means (5, 5A-5H) for controlling the particular control factor using the control variable calculated by the

Abstract: An inspection system (9) includes an idler wheel (61) that is coupled to a fabrication system (8) and is in contact with a backing layer (65) of an applied material (64), A rotation sensor (63) monitors the idler wheel (61) and generates a rotational signal. A controller (24) is coupled to the rotation sensor (63) and determines a characteristic of one or more flaws and FOD (19) on a composite structure (12) in response to the rotation signal.

Abstract: A method of labeling bottles and containers in a bottle or container filling plant, and a bottle or container labeling arrangement therefor. The abstract of the disclosure is submitted herewith as required by 37 C.F.R. §1.72(b). As stated in 37 C.F.R. §1.72(b): A brief abstract of the technical disclosure in the specification must commence on a separate sheet, preferably following the claims, under the heading “Abstract of the Disclosure.” The purpose of the abstract is to enable the Patent and Trademark Office and the public generally to determine quickly from a cursory inspection the nature and gist of the technical disclosure. The abstract shall not be used for interpreting the scope of the claims. Therefore, any statements made relating to the abstract are not intended to limit the claims in any manner and should not be interpreted as limiting the claims in any manner.

Abstract: A wafer taping and detaping machine implements a taping roller set and a detaping roller set to conduct an automatic taping and detaping process on a surface of a wafer that is positioned on a wafer mount so as to remove processing particles from the surface of the wafer.

Abstract: A system for fabricating a corrugated board sheet fabricated includes warp status information obtaining means (6, 6A-6H, 7, 7A, 7B, 8, 8A-8H, 240a, 240b, 241a, 241b) for obtaining warp status information concerning status of the warp of the corrugated board sheet fabricated by a corrugated-board fabrication machine (1); running-state information obtaining means (5, 5A-5H) for obtaining running state information concerning a running state of the corrugated-board fabrication machine (1); control variable calculating means (4, 4A-4H) for calculating a control variable of a particular control factor that affects the warp of the corrugated board sheet and that is one among control factors used to control the corrugated-board fabrication machine (1) based on the warp status information of the corrugated board sheet and the running state information of the corrugated-board fabrication machine (1); and control means (5, 5A-5H) for controlling the particular control factor using the control variable calculated by the

Abstract: The invention relates to a laminating apparatus for laminating a printhead integrated circuit (IC) carrier sub-assembly and a lamination film. The apparatus includes a lamination support for receiving the carrier, a lamina supply for supplying a lamina defining said lamination film, and an alignment mechanism configured to align the lamination film with the IC carrier sub-assembly. Also included is a bonding apparatus configured to bond the lamination film to the IC carrier sub-assembly, and a control system to control operation of the lamina supply, alignment mechanism and bonding apparatus to facilitate automatic bonding of the lamination film to the surface of the carrier.

Abstract: The invention provides a tape monitoring system for use with a taping machine that is mounted independent of a taping head. The tape monitoring system includes a tape dispensing sensor for determining whether tape is being dispensed from the tape supply and capable of providing a signal relating to a tape dispensing velocity, an object presence sensor for determining whether an object is present for taping and capable of providing a response when the object is present, and a control system operatively connected to the tape dispensing sensor and the object presence sensor for determining a potential error condition.

Abstract: A labeling apparatus is for applying labels to articles advanced along an article conveyor. The labeling apparatus may include a frame to be positioned adjacent the article conveyor, and a labeler carried by the frame. The labeler may include a housing, a rotary bellows wheel carried by the housing, bellows carried by the rotary bellows wheel and a fluid pump within the housing and connected in fluid communication with the rotary bellows wheel to provide a fluid flow for the bellows so that each bellows is movable between a retracted position and an extended label-applying position.

Abstract: The substrate is placed over a pressure detection film, the element group is placed selectively over the substrate so that a conductive film functioning as an antenna formed over the substrate and a conductive film functioning as a bump formed over the element group overlap each other, the substrate and the element group are pressure-bonded to each other by applying pressure to the substrate and the element group so that the conductive film formed over the substrate and the conductive film functioning as a bump formed over the element group are electrically connected to each other, a value and distribution of pressure applied to the element group at the time of the pressure bonding are detected by the pressure detection film, and the pressure applied at the time of the pressure bonding is controlled, based on the detected pressure value and pressure distribution.

Abstract: A tyre building machine (1) comprises a rotatable drum (2), to which strips of material (7) can be applied. Strips of material (7) are transported to the drum (2) by means of conveyors (3). The run of the pieces of material (7) transversely in relation to the running direction is sensed by means of a first sensor (9) and fed to a position controlling device (12). To compensate for machine- or transfer-induced errors, at least one second sensor (16), which senses the position of the strip of material (7) transversely in relation to the running direction, is provided in the region of the drum (2). An output signal of this second sensor (16) is in operative connection with the position controlling device (12) to correct the setpoint value correspondingly (FIG. 1).

Abstract: A press is described having an upper platen. The press includes a support arm adapted to selectively move the upper platen between an open position, a partially open position and a closed position with respect to a lower platen. An electromagnet is disposed proximate the support arm and configured to selectively secure the upper platen in the closed position. Another electromagnet, which may be disposed proximate a base member, is configured selectively to secure the upper platen in a partially open position.

Abstract: A device and method for bonding objects to be bonded each having a metal bonding portion on a substrate, comprising cleaning means for exposing the metal bonding portions to a plasma having an energy enough to etch the surfaces of the metal bonding portions at a depth of 1.6 nm or more over the entire surfaces of the metal bonding portions under a reduced pressure and bonding means for bonding the metal bonding portions of the objects taken out of the cleaning means in an atmospheric air. By using a specific scheme, metal bonding portions after the plasma cleaning can be bonded in the atmospheric air, thereby significantly simplifying the bonding process and the whole device and lowering the cost.

Abstract: A substrate bonding system has a first and a second substrate table for holding a first substrate and a second substrate, respectively, and a controller. The first substrate includes a first device having first contact pads and the second substrate a second device having second contact pads. The wafer bonding system is arranged to bond the first and second device in such a way that a circuit may be formed by the first and second device. The first and second substrate tables each include a position sensor arranged to measure an optical signal generated on an alignment marker of the first and second substrate, respectively. The first and second substrate tables include a first and second actuator respectively that is arranged to alter a position and orientation of the respective substrate table.

Abstract: A device for the dimensionally accurate application of an elastoplastic spacer strip onto a glass pane is disclosed. The device includes a compensating or tailback section between a first adjustably driven pair of rollers and a second adjustably driven pair of rollers, as well as a sensor for recognizing the position of the strip in the compensating section. The device is designed such that the spacer strip is not withdrawn from the storage drum but, instead, is unwound in a manner free from any tensile stress. The spacer strip, furthermore, is kept free from tensile and shearing stresses on the route up to being pressed onto a glass pane, despite the fact that the application speed will inevitably fluctuate several times between zero and a maximum value while edges of the glass pane are covered mechanically.

Abstract: A system for fabricating a corrugated board sheet fabricated includes warp status information obtaining means (6, 6A-6H, 7, 7A, 7B, 8, 8A-8H, 240a, 240b, 241a, 241b) for obtaining warp status information concerning status of the warp of the corrugated board sheet fabricated by a corrugated-board fabrication machine (1); running-state information obtaining means (5, 5A-5H) for obtaining running state information concerning a running state of the corrugated-board fabrication machine (1); control variable calculating means (4, 4A-4H) for calculating a control variable of a particular control factor that affects the warp of the corrugated board sheet and that is one among control factors used to control the corrugated-board fabrication machine (1) based on the warp status information of the corrugated board sheet and the running state information of the corrugated-board fabrication machine (1); and control means (5, 5A-5H) for controlling the particular control factor using the control variable calculated by the

Abstract: An inspection system (9) includes an idler wheel (61) that is coupled to a fabrication system (8) and is in contact with a backing layer (65) of an applied material (64). A rotation sensor (63) monitors the idler wheel (61) and generates a rotational signal. A controller (24) is coupled to the rotation sensor (63) and determines a characteristic of one or more flaws and FOD (19) on a composite structure (12) in response to the rotation signal.

Abstract: A system for fabricating a corrugated board sheet fabricated includes warp status information obtaining means (6, 6A-6H, 7, 7A, 7B, 8, 8A-8H, 240a, 240b, 241a, 241b) for obtaining warp status information concerning status of the warp of the corrugated board sheet fabricated by a corrugated-board fabrication machine (1); running-state information obtaining means (5, 5A-5H) for obtaining running state information concerning a running state of the corrugated-board fabrication machine (1); control variable calculating means (4, 4A-4H) for calculating a control variable of a particular control factor that affects the warp of the corrugated board sheet and that is one among control factors used to control the corrugated-board fabrication machine (1) based on the warp status information of the corrugated board sheet and the running state information of the corrugated-board fabrication machine (1); and control means (5, 5A-5H) for controlling the particular control factor using the control variable calculated by the

Abstract: In a thermal activation method for a heat-sensitive adhesive sheet 2 which has a heat-sensitive adhesive layer 2a on one surface thereof and is to be stuck to an adherend 1, when a surface roughness of the adherend 1 is large, by heating the heat-sensitive adhesive layer 2a with large thermal energy, an adhesive is allowed to easily enter recesses 1a of the adherend. When the surface roughness of the adherend 1 is small, by heating the heat-sensitive adhesive layer 2a with small thermal energy, a viscosity of the adhesive is increased to thereby prevent the heat-sensitive adhesive sheet 2 from sliding and being peeled. The surface roughnesses of the adherends 1 may be classified for each material of the adherends 1, and the classified surface roughnesses may be judged according to each material of the adherends 1 to thereby determine the thermal energy.

Abstract: A method for the production of reinforced tube-shaped structures (1) of rubber layers and reinforcement layers (2, 3) has the steps of: a) applying a first rubber layer (2a) with a first extrusion unit (4a) onto a series of sequential rigid cylindrical mandrels (5) which are coupled to each other and which are driven at an advancement speed (v) in the direction of an advancement axis (x); b) applying a first filament layer at defined desired filament angles (?1) referred to the advancement axis (x) with a bobbin creel unit (10a) having means which rotate about the advancing mandrels (5); c) applying atleast one further rubber layer (2b) to the first filament layer utilizing at least one additional extrusion unit (4b); d) continuously measuring the advancement speed (v) of the mandrels (5); controlling the quantity, which is applied via the first extrusion unit (4a), in dependence upon the measured advancement speed (v) in order to obtain a defined desired thickness of the first rubber layer (2a); f) controlli

Abstract: A machine for labeling containers, especially bottles or the like, with a stationary machine rack on which a rotary table for conveying containers is supported, and at least one labeling module, arranged to be interchangeable at or on a machine rack, for labeling the containers being guided past the labeling module by the rotary table wherein its own motor is assigned respectively to the rotary table and at least one labeling module. In order to simplify a change or replacement of a labeling module, the motor is located on the machine rack and remains there.

Abstract: A substrate bonding apparatus for fabricating an LCD device aligns upper and lower stages to accurately bond first and second substrates. The distance to which the upper and lower substrates are spaced apart from each other during bonding is adjustable depending on the determined thickness of the first and second substrates. Further, sealant material disposed on a substrate may be prevented from becoming contaminated by foreign material.

Abstract: A covering apparatus (10) includes a cutter (12), an applicator (14) and a continuous length of removable cover material (16). The cutter (12) is adapted to cut off a discrete section (50) of cover material, and the applicator (14) applies the discrete section (50) to a printed media/ticket substrate (52). The covering apparatus (10) may be mounted adjacent to a printer (108) and creates a complete, covered ticket in response to a ticket substrate (52) being ejected from the printer (108) into the covering apparatus.

Abstract: The invention concerns an installation comprising a feeding device (100, 101, 103, 104, 1, 11, 12) unwinding the support (G) and a treating device (105, 4) for operating on the parts (P). A reading unit (102) positioned on the passage (Z) of the bar codes (CB) of the parts (P), supplies signals (SL). A data source (107) contains data concerning the bar codes (CB). A control circuit (106, 5) receives the sense signals (SL) and the data signals (SD) so as to compare them and transmit control signals (SC) for the treating device (105, 4).

Abstract: The present system enables the monitoring and automatic control of the tolerance in splice overlap of textile play , though the identification of the overlap area, identification and counting of textile cords in the overlap area, and the generation of a control signal for the manufacturing equipment based on parameters and criteria defined by a user. The system includes an image acquisition sub-assembly that contains a lighting module, artificial vision module, and respective elements of support, fixation, conditioning and adjustment. The system also includes a quality control computer program that has a module of morphologic image analysis for detection and recognition of the overlap of the ply, detecting and counting of cords in the overlap area, a module of support to the decision of acceptance/rejection of the ply based on parameters defined by the user and a module of an interface with production equipment.

Abstract: After photographing a surface on which an ABS is formed, and the outer shape of a slider, the ABS and an engraved region formed within the ABS are identified from a photographed image. A reference that becomes a guide for attaching to a suspension is then computed, and a positional relationship between the reference and the outer shape of the slider is stored as association information. Next, the outer shape of the slider is measured, and measured values are compared to the association information and a reference is read out when attaching the slider to the suspension. An adhesive is discharged, from below, onto a suspension attachment surface of the slider based on the reference. The slider may then be attached to the suspension while holding the slider in a state where the ABS is positioned on an upper side of the slider.

Abstract: With an assumption that the three data of the position (X1, Y1) of the first positioning pattern 202 and position (X2, Y2) of the second positioning pattern 212 of the reference chip 200, and the position (X3, Y3) of the first positioning pattern 232 of the bonding object chip 230, as well as the length L of a line segment connecting (X1, Y1) and (X2, Y2), and the angle ?2 of this line segment with respect to the X axis, are known, the coordinates (X4, Y4) of the center position of the imaging range 250 that is to be imaged next is determined by detecting the inclination-angle ?? of the first positioning pattern 232 of the bonding object chip 230. Furthermore, the imaging range can be narrowed and the second positioning pattern 252 can be captured by increasing the precision of ??.

Abstract: Determination of inclination of positioning patterns used in bonding being made by: imaging a positioning pattern of reference chip and taking such image as reference-image; specifying a polar coordinate conversion origin for the reference-image; imaging an object (chip) of bonding to use it as an object-image, thus obtaining a relative positional-relationship with the reference-image; specifying the polar coordinate conversion origin of the object-image, so that the object-image is subjected to a polar coordinate conversion; and calculating inclination-angle from both images that have been subjected to a polar coordinate conversion; thus using a point, in which an error in position of the object of comparison detected by pattern matching between an image, which is the object of comparison obtained by imaging the object of comparison disposed in an attitude that includes positional deviation, and the reference-image, shows a minimal value, as an origin of the polar coordinate conversion.

Abstract: With an assumption that the three data of the position (X1, Y1) of the first positioning pattern 202 and position (X2, Y2) of the second positioning pattern 212 of the reference chip 200, and the position (X3, Y3) of the first positioning pattern 232 of the bonding object chip 230, as well as the length L of a line segment connecting (X1, Y1) and (X2, Y2), and the angle ?2 of this line segment with respect to the X axis, are known, the coordinates (X4, Y4) of the center position of the imaging range 250 that is to be imaged next is determined by detecting the inclination-angle ?? of the first positioning pattern 232 of the bonding object chip 230. Furthermore, the imaging range can be narrowed and the second positioning pattern 252 can be captured by increasing the precision of ??.

Abstract: Determination of inclination of positioning patterns used in bonding being made by: imaging a positioning pattern of reference chip and taking such image as reference-image; specifying a polar coordinate conversion origin for the reference-image; imaging an object (chip) of bonding to use it as an object-image, thus obtaining a relative positional-relationship with the reference-image; specifying the polar coordinate conversion origin of the object-image, so that the object-image is subjected to a polar coordinate conversion; and calculating inclination-angle from both images that have been subjected to a polar coordinate conversion; thus using a point, in which an error in position of the object of comparison detected by pattern matching between an image, which is the object of comparison obtained by imaging the object of comparison disposed in an attitude that includes positional deviation, and the reference-image, shows a minimal value, as an origin of the polar coordinate conversion.

Abstract: A substrate bonding device for fabricating a liquid crystal display (LCD) device accurately aligns substrates of the LCD device while preventing the introduction of foreign material into the substrate bonding device, thereby substantially preventing the generation of defects within liquid crystal material of the LCD device.

Abstract: The invention provides an apparatus and method for aligning a bonding tool. A force sensor having a plurality of force sensing sections is configured to measure a force generated by the bonding tool on the force sensor. Each sensing section is adapted to individually detect an amount of force from a part of the bonding tool acting on that sensing section, so that an alignment of the bonding tool may be determined.

Abstract: This invention relates to an improvement in an apparatus for dispensing a ribbon between layers of web material and more particularly, to an automated and remote positioning system of ribbon dispensers which are precisely positioned with respect to the web material by a controlling and monitoring system and are physically easily accessible for maintenance by an operator. The automated and remote positioning system of ribbon dispensers includes locking means interacting with either the apparatus or with a traversing mechanism such as a lead screw to move the ribbon dispensers.

Abstract: Determination of inclination of positioning patterns used in bonding being made by: imaging a positioning pattern of reference chip and taking such image as reference-image; specifying a polar coordinate conversion origin for the reference-image; imaging an object (chip) of bonding to use it as an object-image, thus obtaining a relative positional-relationship with the reference-image; specifying the polar coordinate conversion origin of the object-image, so that the object-image is subjected to a polar coordinate conversion; and calculating inclination-angle from both images that have been subjected to a polar coordinate conversion; thus using a point, in which an error in position of the object of comparison detected by pattern matching between an image, which is the object of comparison obtained by imaging the object of comparison disposed in an attitude that includes positional deviation, and the reference-image, shows a minimal value, as an origin of the polar coordinate conversion.

Abstract: With an assumption that the three data of the position (X1, Y1) of the first positioning pattern 202 and position (X2, Y2) of the second positioning pattern 212 of the reference chip 200, and the position (X3, Y3) of the first positioning pattern 232 of the bonding object chip 230, as well as the length L of a line segment connecting (X1, Y1) and (X2, Y2), and the angle ?2 of this line segment with respect to the X axis, are known, the coordinates (X4, Y4) of the center position of the imaging range 250 that is to be imaged next is determined by detecting the inclination-angle ?? of the first positioning pattern 232 of the bonding object chip 230. Furthermore, the imaging range can be narrowed and the second positioning pattern 252 can be captured by increasing the precision of ??.

Abstract: An apparatus is provided for transferring components from a pick-up position amongst a supply of components to a placement position on a receptor, such as a die pad, during semiconductor processing. It includes a first delivery device and a second delivery device operative to alternatively transfer the components from the pick-up position to the placement position. The second delivery device is arranged opposite the first delivery device about a line passing through the pick-up position and the placement position.

Abstract: By applying heat and pressure to a backing film with an adhesive layer while mounting it to a polish head used for chemical mechanical polishing, inhomogeneities inside the adhesive layer, e.g. thickness and compressibility variations or air bubbles can easily be removed. A corresponding configuration includes a device for exerting a uniform pressure force, which can be a roller made of silicone or rubber, or a plate. The configuration also includes a device for heating and a control unit for controlling the heat and the pressure force. After the backing film is installed using this configuration and method, the polish head can be used to uniformly remove material from a semiconductor wafer surface and therefore the wafer yield is advantageously increased.

Abstract: A system and method to control the head suspension assembly static attitude during the manufacturing process are disclosed. A loading fixture loads and supports a head suspension while a slider is attached. A pitch static attitude and roll static attitude (PSA/RSA) monitor takes a first measurement of the pitch static attitude and roll static attitude of the head suspension. A rotatable positioning tool holds the slider in a position relative to the head suspension for attachment and to adjust the position of the slider in response to the first measurement.

Abstract: An apparatus for monitoring the operation of a heating element moving periodically along a predefined path includes first and second sensors positioned adjacent the path of the heating element. The first sensor is configured to sense the presence of the heating element proximate to the second sensor, and the second sensor is configured to sense a temperature associated with the heating element as is passes by the second sensor. A controller receives signals from the first and second sensors and performs a control function such as indicating when the temperature sensed by the second sensor fall outside a predetermined range.

Abstract: An offset measuring mechanism and method used in a bonding apparatus, in which the object plane of a position detection camera is set on a hypothetical bonding working plane, and the image of imaging elements within the imaging plane is projected onto a bonding working plane. Furthermore, the tip end of a bonding tool is aligned with the bonding working plane. The object plane of the offset measuring camera is set on the bonding working plane, and the image on the bonding working plane is projected onto the imaging elements of the imaging plane of the offset measuring camera. The imaging elements detect the projected image of the imaging elements of the position detection camera or the image of the tip end of the bonding tool and output this data to the image position measuring part or tool position measuring section of the control block.