With Radiant Heater Not Touching Work Patents (Class 156/380.9)
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Publication number: 20080156430Abstract: The present invention relates to apparatus and method for a silicon ingot to a mounter, the apparatus including a frame; a mounter placed on the frame for mounting a silicon ingot; a press member installed movably to the frame for pressing the silicon ingot toward the mounter; and a heat or light emitting member arranged to emit heat or light to an adhesive member interposed between the silicon ingot and the mounter.Type: ApplicationFiled: December 11, 2007Publication date: July 3, 2008Inventor: Yong-Joon Jo
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Publication number: 20080110560Abstract: The present invention refers to a method for sealing a first packaging material laminate (10) to a second packaging laminate (12), at least the first laminate (10) comprising at least one layer of magnetizable particles and a sealable layer (34). The method is characterized in facing the sealable layer (34) towards the second laminate (12), providing an alternating magnetic field to the laminates in a sealing zone, thereby generating magnetic hysteresis losses in the laminate (10) comprising the magnetizable particles, which losses create heat substantially melting the sealable layer (34) in the sealing zone, and applying a sealing pressure to the first and second laminate (10, 12), which pressure causes the first and second laminate (10, 12) to be pressed together in the sealing zone, thereby sealing the laminates (10, 12) to each other. The invention also relates to a device for carrying out the method.Type: ApplicationFiled: December 13, 2005Publication date: May 15, 2008Applicant: Tetra Laval Holdings & Finance S.A.Inventors: Magnus Wijk, Magnus Rabe, Gert Holmstrom, Mats Qvarford
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Patent number: 7318878Abstract: A method and apparatus for producing continuous belts is disclosed. The belts are formed from plastic films and are used as transfer belts in electrographic printers and copiers. The ends of the film are welded together by abutting their front faces and the ends are held together under pressure while being heated by radiation to a temperature to cause welding of the ends.Type: GrantFiled: September 24, 2001Date of Patent: January 15, 2008Assignee: Oce Printing Systems GmbHInventor: Robert Link
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Patent number: 7279069Abstract: The object of the present invention is to considerably reduce the amount of heat generated in comparison with a conventional lamp to decrease the thermal effects on an optical disc in an adhesive curing method suitable for curing adhesive supplied between the substrates of a DVD or other optical disc in particular. In the adhesive curing method as claimed in the present invention, an adhesive is cured by irradiating with ultraviolet rays using semiconductor elements that emit ultraviolet rays instead of a lamp. In this case, light-emitting semiconductor elements are used that emit ultraviolet rays having a wavelength within a range in which the transmittance relative to the adhesive before curing is lower than the transmittance relative to the adhesive after curing.Type: GrantFiled: August 12, 2002Date of Patent: October 9, 2007Assignee: Origin Electric Company LimitedInventors: Hideo Kobayashi, Shinichi Shinohara, Hironobu Nishimura
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Patent number: 7229519Abstract: An apparatus for burning green sheets of a plasma display panel comprises a feeding part that feeds a green sheet to a plasma display panel substrate, a heat and pressure roller that heats and compresses the green sheet and the plasma display panel substrate from above the plasma display panel substrate, and a heating module that applies heat to a contact portion between the green sheet and the plasma display panel substrate. The heat and pressure roller applies heat and pressure to the green sheet to bring the green sheet into intimate contact with the plasma display panel substrate and to remove residual solvent from the green sheet.Type: GrantFiled: January 27, 2005Date of Patent: June 12, 2007Assignee: LG Electronics, Inc.Inventors: Sang Jin Kong, Jin Ho Choi
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Patent number: 7172676Abstract: A system and a method by which workpieces are bonded to and debond from a manufacturing fixture using a radiation responsive adhesive as a bonding agent. The system includes curing the adhesive agent during loading within seconds, and structurally weakens the adhesive bond during unloading within seconds. During the workpiece loading cycle, an adhesive dispenser deposits radiation responsive adhesive on to a load bearing, light transmittive surface, known as gripper pins. The workpiece is subsequently pushed against the locators, and towards the gripper pins causing the adhesive to interpose between workpiece and gripper pins, curing radiant energy is transmitted through the gripper pins and on to the adhesive to cure adhesive and bond the workpiece to the fixture. Therefore, the bond is structurally weakened or debonded in order to remove the workpiece from the fixture after manufacturing.Type: GrantFiled: August 6, 2003Date of Patent: February 6, 2007Assignee: The Penn State Research CorporationInventor: Edward C. DeMeter
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Patent number: 7150806Abstract: A spiral-shaped lamp (10) is used for disk manufacturing processes, such as curing of coating or bonding, to provide uniform intensity of UV energy to the circular disk without requiring relative motion between the disk and the lamp during the curing process.Type: GrantFiled: January 11, 2002Date of Patent: December 19, 2006Assignee: Xenon CorporationInventors: C. Richard Panico, Louis R. Panico
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Patent number: 7070676Abstract: The present invention is a microwave preheat press. The microwave preheat press includes a first and a second press section which define a press passage therebetween. A compression belt movable along the press passage is contiguous with one of the press sections. The press passage is configured such that it has an initial press section leading into a final press section. A microwave generator is in communication with a microwave waveguide applicator structure assembly such that microwave energy is created and transmitted through the microwave waveguide assembly into the initial compression section.Type: GrantFiled: March 7, 2005Date of Patent: July 4, 2006Assignee: Weyerhaeuser CompanyInventors: Mark T. Churchland, Robert L. Pike
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Patent number: 7048825Abstract: The present invention is a microwave preheat press. The microwave preheat press includes a first and a second press section which define a press passage therebetween. A compression belt movable along the press passage is contiguous with one of the press sections. The press passage is configured such that it has an initial press section leading into a final press section. A microwave generator is in communication with a microwave waveguide applicator structure assembly such that microwave energy is created and transmitted through the microwave waveguide assembly into the initial compression section.Type: GrantFiled: October 3, 2002Date of Patent: May 23, 2006Assignee: Weyerhaeuser CompanyInventors: Mark T. Churchland, Robert L. Pike
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Patent number: 7005033Abstract: The present invention relates to an apparatus and method for laminating a dry film using a microwave which are capable of quickly transforming a photosensitive substance of a dry film to a semi-liquid state by vibrating a water or acryl group copolymer molecular in a dry film for thereby implementing a laminating operation. The apparatus for laminating a dry film includes a microwave oscillating apparatus which includes an interior surrounded by a reflection film, for thereby heat-oscillating a water and acryl group copolymer molecular in a dry film, a caterpillar belt clean apparatus for removing foreign substances formed after pressurizing the film heated by the oscillating apparatus, a frame for performing a laminating work with respect to the substrate fed by the feeding apparatus, and a discharging apparatus for discharging the PCB photosensitive-processed by the microwave oscillating apparatus.Type: GrantFiled: May 22, 2002Date of Patent: February 28, 2006Inventor: Kang Lee
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Patent number: 6996957Abstract: An induction device for heat-shrinking a heat-shrinking film onto a product comprising induction means for causing the heat-shrinking plastic layer of the heat-shrinking film to heat-shrink onto the product, and supply and control means for the induction means connected to the induction means, where the induction means comprises at least one induction ring within which the product passes while the heat-shrinking film heat-shrinks onto the product.Type: GrantFiled: October 3, 2001Date of Patent: February 14, 2006Assignee: Minipack-Torre S.p.A.Inventor: Torre Francesco
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Patent number: 6977018Abstract: An optical information recording medium is manufactured by bonding a first substrate having a first central bore and a second substrate having a second central bore to each other with radiation cure resin. The radiation cure resin is coated on the first substrate. The first and second substrates are brought into close contact with each other so as to form the first and second substrates integrally with the radiation cure resin. A neighborhood of the first and second central bores is radiated. A whole of at least one of opposite outer faces of the integral first and second substrates is irradiated with radiation so as to wholly cure the radiation cure resin.Type: GrantFiled: May 28, 2003Date of Patent: December 20, 2005Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Eiji Ohno, Hidemi Isomura, Hideo Matsumoto, Kazuhiro Hayashi, Kazuya Hisada, Kazuo Inoue
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Patent number: 6966968Abstract: Process and apparatus for joining endless polymer materials by means of the transillumination technique. According to the invention, in order to be joined, the endless materials are guided through two contrarotating rollers that press against each other. The first roller consists of a material that is transparent to laser beams and is tubular. The second roller is formed from a material that can be deformed easily at the surface, so that its surface can adapt to the shape of the first roller. Devices for producing a laser beam at the contact surface between the materials to be joined are arranged in the first roller. In this case, the beam is formed as a linear laser beam longitudinally with respect to the direction of movement of the materials so that during the passage, continuous heating of the material up to the melting point is achieved, without an excessively high laser output having to be provided. By means of the process and the apparatus, continuous joining is possible at high speed.Type: GrantFiled: June 13, 2002Date of Patent: November 22, 2005Assignee: Leister Process TechnologiesInventors: Jie-Wei Chen, Adolf Niederberger
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Patent number: 6913056Abstract: A laser strikes and aseptically heats or sterilizes the end of two flexible tube ends for connection. Tube holders are pushed toward each other to bring the tube ends into contact. A weld detector checks the characteristics of the weld. A laser optics assembly may be used to change the direction of the laser and focus the laser at the tube ends. In addition, a crimping device is used to compress a single flexible tube for disconnection. The laser strikes the compressed area. The crimping device continues to pinch the area and forms a seal in the tube. The tube is separated into two tube segments, each segment has a sealed end.Type: GrantFiled: January 31, 2002Date of Patent: July 5, 2005Assignees: Baxter International Inc., Baxter Healthcare S.A.Inventors: Frank J. Landherr, John A. Biewer, Shahid Din, David Do, Rick Gilbert, James J. Alberti, David W. Pennington, Joe Romack
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Patent number: 6881296Abstract: A method and system of manufacturing an air bag cover assembly utilizing infrared radiation is disclosed. The assembly includes a front panel, a back plate, a switch and infrared-absorbing material. Initially, the front panel and the back plate are positioned so that inner surfaces of the front panel and the back plate define a switch pocket therebetween. Then the switch is positioned in the switch pocket. Thereafter, infrared radiation is directed at the infrared-absorbing material for a time sufficient to heat the infrared-absorbing material to a desired temperature. The amount of heat applied to the infrared-absorbing material by the infrared radiation is controlled by a controller. Finally, the heated material cools to fixedly secures the back plate to the front panel. The heated material may be forced to flow prior to cooling.Type: GrantFiled: November 20, 2001Date of Patent: April 19, 2005Assignee: Patent Holding CompanyInventors: Jason T. Murar, John F. Murphy
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Patent number: 6864034Abstract: A transfer device in which a material which transmits a laser beam LB is employed as an upper mold, and a photothermal conversion layer is formed thereon. A transfer film, at which a transfer material layer is formed, and a workpiece are superposed and pressured between the upper mold and a lower mold. During this pressuring, the laser beam is irradiated in accordance with a pattern of an organic electroluminescent light-emitting layer that is to be formed on the workpiece. Thus, the photothermal conversion layer is heated and the transfer material layer is softened. As a result, the transfer material layer is cleaved and detached from a temporary support, and a component in the transfer material layer that is to form the organic electroluminescent light-emitting layer is transferred to the workpiece. Accordingly, efficient transfer processing is enabled when a transfer material is transferred to a transfer object by a thermal imaging process.Type: GrantFiled: November 7, 2003Date of Patent: March 8, 2005Assignee: Fuji Photo Film Co., Ltd.Inventors: Hiroyuki Nishida, Keisuke Endo
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Patent number: 6855226Abstract: This invention relates to a labeling system for continuously applying a layer of a UV curable adhesive to plastic, sheet fed, cut and stack, labels, irradiating the adhesive on the labels to render the adhesive sufficiently tacky to effectively adhere the labels to containers in a commercial labeling machine and thereafter applying the labels to discrete containers through the sufficiently tacky adhesive layer. The plastic labels can be clear, opaque (including metallized) plastic films and can be retained in a dispensing magazine prior to the application of the UV curable adhesive to the labels.Type: GrantFiled: January 17, 2003Date of Patent: February 15, 2005Assignee: Applied Extrusion Technologies, Inc.Inventors: William J. Hill, IV, Thomas C. McNutt, Bryan Bellafore, Paul D. Fussey, Kenneth J. Longmoore
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Patent number: 6841034Abstract: A device for welding a plurality of thermoplastic plastic parts (parts to be joined) forming a hollow body with an opening by a laser, comprising a vacuum holder having a vacuum chamber which communicates with a vacuum pump, is open on one side and, together with the hollow body, forms a closed chamber that can be evacuated. When a vacuum is applied, the vacuum holder holds the hollow body stationary, holds the joined parts together and enables testing of the tightness of the weld.Type: GrantFiled: April 17, 2002Date of Patent: January 11, 2005Assignee: JENOPTIK Automatisierungstechnik GmbHInventors: Hans-Ulrich Zuehlke, Gabriele Eberhardt, Norbert Preuss, Martin Griebel, Juergen Weisser
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Patent number: 6828017Abstract: A heat-sensitive adhesive material including a substrate and a heat-sensitive adhesive layer provided thereon. The adhesive layer has one of the following properties (a) and (b): (a) the heat-sensitive adhesive layer, when thermally activated, exhibits an adhesive strength in the range of 1800-3500 gf/40 mm at 0-10° C.; (b) the heat-sensitive adhesive layer, when thermally activated, exhibits a scratch resistance in the range of 150-500 gf at 0° C.Type: GrantFiled: September 25, 2001Date of Patent: December 7, 2004Assignee: Ricoh Company, Ltd.Inventors: Tomoyuki Kugo, Toshiaki Ikeda
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Patent number: 6799619Abstract: A composite material collation machine and associated method for fiber tape placement and consolidation at a relatively high rate are provided. The composite material collation machine includes a laser diode array for heating at least one fiber tape, a compaction device for pressing the fiber tape against a workpiece, an inspection system for monitoring the fiber tape, and a controller. The inspection system produces an output representative of at least one characteristic of the fiber tape, and the controller is capable of receiving the output and, based on the output, automatically altering at least one system parameter defining an operational characteristic of the composite material collation machine.Type: GrantFiled: February 6, 2002Date of Patent: October 5, 2004Assignee: The Boeing CompanyInventors: Scott T. Holmes, Bruce E. McIlroy, Roger W. Engelbart, Stanley A. Lawton
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Patent number: 6793748Abstract: It is an object to provide an optical recording medium (disk) bonding apparatus which eliminates the warpage of a disk during bonding and has high precision in the bonding. There are provided means for bonding two substrates and then irradiating radioactive rays from both sides of the substrates when carrying out radiation curing, and a mechanism for shifting the irradiation starts of both radioactive rays to control an amount of warpage of each substrate after the curing.Type: GrantFiled: May 21, 2002Date of Patent: September 21, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Toshiyuki Fujioka, Akinobu Katayama, Toshikazu Kozono, Kiyoshi Mayahara
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Publication number: 20040142273Abstract: A transfer device in which a material which transmits a laser beam LB is employed as an upper mold, and a photothermal conversion layer is formed thereon. A transfer film, at which a transfer material layer is formed, and a workpiece are superposed and pressured between the upper mold and a lower mold. During this pressuring, the laser beam is irradiated in accordance with a pattern of an organic electroluminescent light-emitting layer that is to be formed on the workpiece. Thus, the photothermal conversion layer is heated and the transfer material layer is softened. As a result, the transfer material layer is cleaved and detached from a temporary support, and a component in the transfer material layer that is to form the organic electroluminescent light-emitting layer is transferred to the workpiece. Accordingly, efficient transfer processing is enabled when a transfer material is transferred to a transfer object by a thermal imaging process.Type: ApplicationFiled: November 7, 2003Publication date: July 22, 2004Inventors: Hiroyuki Nishida, Keisuke Endo
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Publication number: 20040103988Abstract: This application relates to a method and apparatus for heating a surface marking, such as a thermoplastic pattern in an asphalt substrate. The marking may be selected for functional or decorative purposes. The method involves gradually applying heat to the marking to avoid scorching and to ensure a consistent bond with the underlying substrate, even in the case of markings having a very large surface area. In one embodiment the method a portable heating apparatus is provided having infrared heaters mounted for reciprocal movement in a travel path periodically passing over the marking and the underlying substrate. The heating method permits direct visual monitoring of the work site to achieve optimum adhesion of the marking to the asphalt or other substrate.Type: ApplicationFiled: July 21, 2003Publication date: June 3, 2004Inventor: Patrick Carl Wiley
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Publication number: 20040079469Abstract: An improvement in a process of forming ceramic articles comprising oil-based components or extrusion aids, the improvement including removing the oil-based components after drying and prior to firing by flowing a heated gas through the green ceramic honeycomb articles to evaporate and condense the oil-based components, with or without microwave radiation.Type: ApplicationFiled: October 17, 2003Publication date: April 29, 2004Inventors: Yuk F. Chan, David S. Franzen, Jon A. Passmore, Mark A. Spetseris, Gary G. Squier, Elizabeth M. Vileno, Christopher S. Witte
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Patent number: 6726806Abstract: A method and an apparatus for fixing a part and a part support for mounting the part by use of adhesive via an intermediate member are disclosed. The adhesive is implemented by photocuring adhesive while the intermediate member is formed of a material transparent for light. The intermediate member is free from coloring and deformation when illuminated by light for curing the adhesive. The adhesive is prevented from dropping or turning round to other portions during assembly.Type: GrantFiled: February 7, 2001Date of Patent: April 27, 2004Assignee: Ricoh Company, Ltd.Inventors: Hiroshi Takemoto, Shinobu Kanatani, Yoshihiro Morii, Shigeru Fujita
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Publication number: 20040065982Abstract: The present invention is a microwave preheat press. The microwave preheat press includes a first and a second press section which define a press passage therebetween. A compression belt movable along the press passage is contiguous with one of the press sections. The press passage is configured such that it has an initial press section leading into a final press section. A microwave generator is in communication with a microwave waveguide applicator structure assembly such that microwave energy is created and transmitted through the microwave waveguide assembly into the initial compression section.Type: ApplicationFiled: October 3, 2002Publication date: April 8, 2004Inventors: Mark T. Churchland, Robert L. Pike
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Publication number: 20030221785Abstract: A belt seam treatment apparatus includes a support element with a smooth surface that supports the seam region of the belt, a heat source that heats a treatment strip and the belt seam region, and a pressure applicator that forces the treatment strip against the belt seam region. The support element can be a tube over which the belt hangs and can include a vacuum belt hold system that secures the seam region against the tube during treatment. The heat source can be an infrared laser or an infrared lamp. Optics form a heat spot or a heat line on the strip and seam region, and a pressure wheel traverses the seam region after heating to compress the strip and seam and bond a thermoplastic polymer of the strip to the seam region of the belt.Type: ApplicationFiled: May 30, 2002Publication date: December 4, 2003Applicant: Xerox CorporationInventor: Robert C.U. Yu
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Publication number: 20030221783Abstract: Apparatus for welding plastic workpieces together includes a heater block having first and second surfaces; a first heating element for radiating heat from the first surface; and a second heating element for radiating heat from the second surface; wherein the first and second heating elements being separately controlled for temperature. Temperature sensors are provided for detecting temperature of the workpieces at the weld sites. The heating elements preferably are laid out in a non-planar manner such as a parabolic, convex or other curved or angled configuration so as to focus, direct or otherwise concentrate the radiated heat toward the weld site on the workpiece. The invention is particularly suited for welding a part made of a melt processable material such as PFA to a part made of a non-melt processable material such as modified PTFE.Type: ApplicationFiled: June 19, 2003Publication date: December 4, 2003Applicant: Swagelok CompanyInventor: Glenn A. Evans
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Publication number: 20030213552Abstract: Process and apparatus for joining endless polymer materials by means of the transillumination technique. According to the invention, in order to be joined, the endless materials are guided through two contrarotating rollers that press against each other. The first roller consists of a material that is transparent to laser beams and is tubular. The second roller is formed from a material that can be deformed easily at the surface, so that its surface can adapt to the shape of the first roller. Devices for producing a laser beam at the contact surface between the materials to be joined are arranged in the first roller. In this case, the beam is formed as a linear laser beam longitudinally with respect to the direction of movement of the materials so that during the passage, continuous heating of the material up to the melting point is achieved, without an excessively high laser output having to be provided. By means of the process and the apparatus, continuous joining is possible at high speed.Type: ApplicationFiled: June 13, 2002Publication date: November 20, 2003Inventors: Jie-Wei Chen, Adolf Niederberger
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Publication number: 20030196761Abstract: Selection criteria for dyes that predicts efficiency and performance for plastics welding. A first stage quantitative calculation screens dyes that possess an absorption band that can be matched to a laser that is suitable for plastic welding. It also identifies absorption troughs in the visible spectrum and establishes relationships between the relative optical densities of the absorption band and trough. A second stage quantitative calculation screens dyes for their contribution to the transparency of the substrate. By combining these two stages, the usefulness of a candidate dye can be quickly, easily and inexpensively determined.Type: ApplicationFiled: May 19, 2003Publication date: October 23, 2003Inventors: Robert A. Sallavanti, L.P. Frieder
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Patent number: 6619358Abstract: A method and system for bonding plastic parts together utilizing a heat-activated adhesive and at least one infrared lamp are disclosed. The system preferably includes first and second infrared lamps for emitting infrared radiation. A first base section supports a first infrared lamp adjacent the first plastic part and a second base section supports the second infrared lamp adjacent the second plastic part. The system also includes a controller coupled to the first and second infrared lamps for controlling power supplied to the first and second infrared lamps so that the first infrared lamp emits infrared radiation which propagates through the first plastic part and is absorbed by the adhesive and the second infrared lamp emits infrared radiation which propagates through the second plastic part and is absorbed by the adhesive for a time sufficient to heat the adhesive to a desired temperature at which the adhesive is activated.Type: GrantFiled: February 28, 2001Date of Patent: September 16, 2003Assignee: Patent Holding CompanyInventor: John F. Murphy
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Patent number: 6602374Abstract: A system for creating a coil of stamps from a web of stamps is provided. The system includes a security strip feeder which feeds a security strip having first and second sections. A first activator activates only the first section, and an applicator applies the security strip to contact the web of stamps. Thus, the activated first section adheres to the web of stamps, while the second section does not. A cutter cuts the web of stamps into a strip of stamps in a position such that at least a portion of the second section extends beyond the strip of stamps, and a second activator activates the portion of the second section extending beyond the strip. A coiler coils the strip into a coil such that the activated portion of the second section contacts and adheres onto an inner spire of the coil or back onto itself.Type: GrantFiled: December 7, 2001Date of Patent: August 5, 2003Assignee: George Schmitt & Company, Inc.Inventors: William G. Gunther, Anthony A. Penati
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Patent number: 6599386Abstract: A method of preparing a vehicle panel assembly for attaching the panel to a vehicle is disclosed which provides a “ready-to-install” panel assembly. The panel assembly includes first and second spaced sides, with the bead of heat activated adhesive provided on the second side of the panel. The panel and bead are heated preferably by applying shortwave and longwave infrared radiation, with the shortwave infrared radiation being applied to an adhesive free side of the panel to heat the panel and, thereby, indirectly heat the bead of the heat activated adhesive. The longwave infrared radiation is applied to the adhesive side of the panel to directly heat the bead and thereby activate the adhesive. The ready-to-install adhesive may be applied on or adjacent to a gasket, such as a polyvinyl chloride (PVC) molding, a urethane molding, or the like.Type: GrantFiled: March 13, 2001Date of Patent: July 29, 2003Assignee: Donnelly CorporationInventors: Douglas R. Swanson, David E. Nestell, Niall R. Lynam
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Publication number: 20030131941Abstract: An apparatus emits radiation on curable adhesives to bond objects or surfaces together under a variety of ambient conditions. An insulating housing has a cylindrical section and a disc-shaped section defining an interior. A plurality of batteries and an LED array are separated in the interior by an insulating spacer to prevent shorting of the batteries. A switch relay in the interior connects power from the batteries to the LED array when a switching mechanism mounted on the outside of the housing is displaced. This displacement closes the switch relay and connects power to the LED array that emits high-intensity radiation. A cover connected to the cylindrical-shaped section seals the interior from ambient and transmits the high-intensity radiation to cure an adhesive.Type: ApplicationFiled: January 11, 2002Publication date: July 17, 2003Applicant: The United States of America represented by the Secretary of the NavyInventors: Ray Baggett, Billy Courson, Pete Sagasti
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Publication number: 20030094240Abstract: Photon welding devices of this invention comprise a non-coherent photon source, and a light pipe coupled to the photon source at one end. A thin mask is positioned at another end of the light pipe that defines a weld location for photon delivery. A work piece to be bonded by the device comprises a top layer of transparent plastic and a base layer of absorbing plastic. The thin mask is in the form of a reflective coating positioned on the end of the light pipe over all surfaces that are not in contact with the work piece. A device includes a member that imposes a controlled, compressive force to the work piece while it is being welded and during a short time thereafter. The device also includes a member that maintains a desired alignment of the light pipe, top layer of the work piece, and base layer of the work piece during the bonding cycle.Type: ApplicationFiled: January 4, 2002Publication date: May 22, 2003Inventor: Pedro Sarmiento
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Patent number: 6551449Abstract: Electric conductor patterns including antenna coils are formed on one surface of a film. Electronic components are fixed onto the film by a temporary fixing material. A cover film is laminated on the film so that the electrically conductive patterns and the electronic components are covered with the cover film. Simultaneously with the lamination, the electronic components are connected to the electric conductor patterns.Type: GrantFiled: January 4, 2001Date of Patent: April 22, 2003Assignee: Hitachi, Ltd.Inventors: Keiji Fujikawa, Yutaka Hashimoto, Isamu Takaoka, Shinichi Kazui, Hideaki Sasaki, Hitoshi Odashima, Mitsugu Shirai
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Patent number: 6544381Abstract: A device for curing an obscured photosetting compound in a subassembly part has a base for supporting the assembly and a plate mounted to the base. The plate has a lens that concentrates UV light into a narrow slit in the assembly to quickly cure the compound. In an alternate version, the plate has a parabolic opening with a mirrored surface for gathering the UV light. A third version of the invention uses a rotatable fixture to position the assembly beneath a UV laser light source to cure the compound.Type: GrantFiled: May 4, 2001Date of Patent: April 8, 2003Assignee: International Business Machines CorporationInventors: Eric Martin Albertson, Walter Lloyd Prater
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Patent number: 6530412Abstract: A method for temporarily attaching an electrical component to a pad, testing the component, removing and replacing the component if necessary, and making a final attachment of the component to the pad. The method provides for attachment and removal of components, to and from pads located on the substrate of a printed circuit board, wherein the method enables components to be easily removed prior to final assembly without damaging the circuit board or components mounted thereon. The method utilizes a layer of conductive, radiation-curable adhesive placed between the component's lead and the pad. Radiation is then directed through a mask onto a portion of the adhesive layer, which cures the portion while leaving a remaining area of the adhesive layer uncured.Type: GrantFiled: June 21, 2000Date of Patent: March 11, 2003Assignee: International Business Machines CorporationInventors: John E. Cronin, Joseph D. Poole, Michael C. Weller
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Patent number: 6524433Abstract: A self-dispensing fastener for attachment to a substrate by a quick-setting photocuring adhesive has a UV transparent flange for placement against the substrate and UV opaque adhesive reservoir for containing the adhesive in the fastener, and upon pressing the fastener against the substrate the adhesive is expelled into the interface formed between the flange and the substrate for curing by UV radiation.Type: GrantFiled: November 30, 2001Date of Patent: February 25, 2003Inventor: Theodore J. Sweeney, Jr.
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Patent number: 6521083Abstract: A method of and apparatus for activating a ready-to-install heat activated adhesive for attaching a vehicle panel to a vehicle is disclosed which provides a “ready-to-install” panel assembly. The panel assembly includes first and second spaced apart surfaces, with the bead of heat activated adhesive provided on the second surface of the panel. The panel and bead are heated preferably by applying shortwave and longwave infrared radiation, with the shortwave infrared radiation being applied to an adhesive free side of the panel to heat the panel and, thereby, indirectly heat the bead of the heat activated adhesive. For example, where the window panel is such as a laminated windshield or side window or backlite comprising two glass sheets laminated with a polymer inner layer, such as plasticized polyvinyl butyral, or silicone or the like, it is preferable that the heat activation temperature of the adhesive be less than or equal to about 125° C.Type: GrantFiled: October 20, 1999Date of Patent: February 18, 2003Assignee: Donnelly CorporationInventors: Douglas R. Swanson, David E. Nestell, Niall R. Lynam
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Patent number: 6478926Abstract: Apparatus and process to form structural preforms from an electromagnetic energy activated binder and reinforcing material using low cost tooling. The apparatus includes one or more lay-up stations and forming stations.Type: GrantFiled: March 31, 2000Date of Patent: November 12, 2002Assignee: Solectria CorporationInventors: Vasilios Brachos, Vincent Borbone
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Publication number: 20020112822Abstract: A method for manufacturing a printed wiring board, comprising the step of forming a hole by an energy beam such as a laser beam, wherein formation of a resin film by a substrate-material resin oozing to the inner-wall surface of a hole is prevented, by lowering the water-absorption percentage of a substrate material through the dehumidifying step as the preprocess of the hole-forming step for forming a through-hole or non-through-hole for interconnecting circuits formed on both sides or in multiple layers, thereby it is possible to realize high-quality hole-formation by preventing a defective resin film formation and obtain a high-reliability printed wiring board.Type: ApplicationFiled: April 24, 2002Publication date: August 22, 2002Applicant: Matsushita Electric Industrial Co., Ltd.Inventors: Shigeru Yamane, Toshihiro Nishii, Shinji Nakamura, Masayuki Sakai
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Publication number: 20020112815Abstract: A method for manufacturing a printed wiring board, comprising the step of forming a hole by an energy beam such as a laser beam, wherein formation of a resin film by a substrate-material resin oozing to the inner-wall surface of a hole is prevented, by lowering the water-absorption percentage of a substrate material through the dehumidifying step as the preprocess of the hole-forming step for forming a through-hole or non-through-hole for interconnecting circuits formed on both sides or in multiple layers, thereby it is possible to realize high-quality hole-formation by preventing a defective resin film formation and obtain a high-reliability printed wiring board.Type: ApplicationFiled: April 24, 2002Publication date: August 22, 2002Applicant: Matsushita Electric Industrial Co., Ltd.Inventors: Shigeru Yamane, Toshihiro Nishii, Shinji Nakamura, Masayuki Sakai
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Publication number: 20020069973Abstract: A system for creating a coil of stamps from a web of stamps is provided. The system includes a security strip feeder which feeds a security strip having first and second sections. A first activator activates only the first section, and an applicator applies the security strip to contact the web of stamps. Thus, the activated first section adheres to the web of stamps, while the second section does not. A cutter cuts the web of stamps into a strip of stamps in a position such that at least a portion of the second section extends beyond the strip of stamps, and a second activator activates the portion of the second section extending beyond the strip. A coiler coils the strip into a coil such that the activated portion of the second section contacts and adheres onto an inner spire of the coil or back onto itself.Type: ApplicationFiled: December 7, 2001Publication date: June 13, 2002Inventors: William G. Gunther, Anthony A. Penati
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Patent number: 6399918Abstract: A thermal bonding method wherein at least two members are thermally bonded to each other with an adhesive by pressing and heating a laminate formed by laminating at least two members on each other with the adhesive interposed therebetween, comprising placing at least one member of the laminate close to a heated radiation heater and pressing the laminate in a radiation heat-applied state; and an apparatus comprising a radiation heater, a supporting member for supporting the laminate with at least one member of the laminate placed close to the radiation heater, and a pressing unit adapted to approach, contact and press the laminate supported by the supporting member and then move away from the laminate to stop applying a pressure to the same.Type: GrantFiled: March 3, 2000Date of Patent: June 4, 2002Assignee: Japan Brake Industrial Co., Ltd.Inventors: Haruo Komine, Akira Nishimura
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Patent number: 6394158Abstract: A method for the thermal connection of overlapping connecting surfaces (19, 20) of two substrates (17, 18), at least one substrate (18) being 5 transparent and laser energy being applied to the connecting surfaces (19, 20) from a rear side (26) of the transparent substrate (18), laser energy being applied separately to each of the contact pairs (37) constructed between two connecting surfaces (19, 20) of the opposing substrates (17, 18).Type: GrantFiled: July 14, 2000Date of Patent: May 28, 2002Assignee: Pac Tech Packaging Technologies GmbHInventor: Kaveh Momeni
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Patent number: 6394162Abstract: A preferred transmission filter (10) includes a first flange (18) transparent to a laser beam (58) and includes a second flange (20) opaque to the laser beam (58) and meltable upon exposure thereto. The flanges (18, 20) are in registered, abutting relationship with a laser weld bead (62) at the juncture (44) between the flanges (18, 20) to provide a fluid seal circumscribing the filter (10). The preferred filter manufacturing apparatus (12) includes a laser (54) coupled to a robot arm (50) controlled by a programmable logic controller (52). The controller (52) operates the robot arm (50) in order to direct the laser beam (58) through the first flange (18) onto the second flange (20) and along the juncture (44) to form the laser weld bead (62).Type: GrantFiled: December 1, 2000Date of Patent: May 28, 2002Assignees: IBS Filtran Kunstoff-/Metallererzeugnisse GmbH Industriestr, SPX Corporation-FiltranInventors: John W. Gizowski, Markus Beer, J. Thomas Schriempf
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Patent number: 6387209Abstract: An apparatus for sealing films together along a path includes a sealing shoe and a counter shoe defining a clearance through which the films pass. The sealing shoe includes an elongated optical energy source having a length dimension oriented generally parallel to the sealing path; a reflector for focussing light emitted by the energy source; a window transparent to the light and having an outer surface adapted to be oriented toward the counter shoe for sealing the films by the light; and a firing arrangement for activating the energy source. The window and the counter shoe are urged toward one another.Type: GrantFiled: January 31, 2000Date of Patent: May 14, 2002Assignee: SIG Pack Systems AGInventor: Stefan Nettesheim
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Patent number: 6364991Abstract: Curing method and apparatus for curing the lining (4) of a pipe (3) and which comprises a traveling frame (2) for introduction into the pipe (3), a curing device (8) mounted on the frame (2) and operative to cure the inner wall of the lining during travel of the frame along the pipe, and a fluid pressure driven propelling device (11) connected to the frame (2) and operative, upon application of fluid pressure to the pipe, to pull the frame along the pipe.Type: GrantFiled: February 23, 2000Date of Patent: April 2, 2002Assignee: Rice AssociatesInventor: Nigel Leonard Rice
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Patent number: 6334925Abstract: The present invention relates to a method for bonding together two disc substrates, at least one disc substrate having a UV transmissive-visible light reflective information recording layer provided on a UV transmission base. In this method, the disc substrates are bonded together, so that the information recording layer of one disc substrate faces the other disc substrate, by employing UV irradiation to cure a UV curable composition used as a bonding agent. In the case of the present invention, to cure the bonding agent, UV is irradiated in a single or repeating flash so as not to impair the information recording layer. As a result, the bonding agent can be cured in a shorter period of time with less energy consumed as compared to the conventional method of using conditions irradiation of UV light to cure a UV curable composition used as a bonding agent. Accordingly, the present method enables a product disc to be obtained in a shorter time, with less energy used, so that productivity (i.e.Type: GrantFiled: February 3, 1999Date of Patent: January 1, 2002Assignee: Dainippon Ink & Chemical, Inc.Inventors: Kazuo Murakami, Hiroshi Fukutomi, Shoei Ebisawa