Abstract: Devices, methods and systems disclosed herein relate to the application of a protective film on a surface of an electronic device that instantly reduces air bubbles and eliminates the waiting time usually required when using a wet fluid solution. In one embodiment, a roller device may include a carriage or housing and one or more rollers coupled or integrated with the housing, configured to apply a protective material to a surface of the electronic device in a first orientation, and configured to function as a device stand in a second orientation. In addition or alternatively, a roller guide apparatus and/or a wedge may be utilized to assist the roller device in applying the protective material to the surface of the electronic device.

Abstract: A traction unit has carrier sections on which suction cups are mounted that are connected to a vacuum source. The carrier units are driven around the frame by a chain driven by a motor. The frame has sections which move relative to one another in order to permit turning control of the traction unit.

Abstract: Devices, methods and systems disclosed herein relate to the application of a protective film on a surface of an electronic device that instantly reduces air bubbles and eliminates the waiting time usually required when using a wet fluid solution. In one embodiment, a roller device may include a carriage or housing and one or more rollers coupled or integrated with the housing, configured to apply a protective material to a surface of the electronic device in a first orientation, and configured to function as a device stand in a second orientation. In addition or alternatively, a roller guide apparatus and/or a wedge may be utilized to assist the roller device in applying the protective material to the surface of the electronic device.

Abstract: A yield in the step of bonding two members together is improved. A bonding apparatus includes a stage capable of supporting a first member having a sheet-like shape, a fixing mechanism capable of fixing one end portion of a second member having a sheet-like shape so that the second member overlaps with the first member, and a pressurizing mechanism capable of moving from a side of the one end portion of the second member to a side of the other end portion and spreading a bonding layer under pressure between the first member and the second member. The first member and the second member are bonded to each other.

Abstract: A labeler for a labeling machine for attaching labels to containers, having a transfer unit for transferring the labels to the container, the transfer unit being removably fixed at an operating position. In order to allow the labeler to be operated more easily and with less problems, the transfer unit is configured such that, for removal from its operating position, it can first be moved to a handling position.

Abstract: An apparatus for separating a wafer from a carrier includes a platform having an upper surface, a tape feeding unit, a first robot arm, and a controller coupled to the platform. The controller is configured to mount a wafer frame, by using the tape feeding unit, on a wafer of a wafer assembly on the upper surface of the platform. The wafer assembly includes the wafer, a carrier, and a layer of wax between the wafer and the carrier. The controller is also configured to heat the upper surface of the platform to a predetermined temperature and separate, by the first robot arm, the wafer and the wafer frame mounted thereon from the carrier.

Abstract: A composite fabric includes: a fabric backing; an adhesive layer; a midlayer barrier bonded to the fabric backing by the adhesive layer; and an external barrier bonded to the midlayer barrier, wherein the composite fabric has a hydrostatic pressure resistance of at least 100 psi and is sufficiently flexible such that it can be formed into a tube and everted. A process and an apparatus for producing the composite fabric are also disclosed. The composite fabric is particularly suitable for use as a liner in a cured-in-place pipe repair method.

Abstract: Apparatus for the production of a paper web, comprising: a first embossing unit (1) with a first embossing cylinder (2) and a corresponding counter-cylinder (3) for embossing a first paper ply (4); a second embossing unit (5) with a second embossing cylinder (6) and a corresponding counter-cylinder (7) for embossing a second paper ply (8), such that, once embossed, the said plies have a series of oppositely oriented reliefs (R4, R8), said embossing units (1, 5) being synchronized so that the said reliefs are nested into each other; a sizing unit (1C, 2C, 3C) associated with said first embossing cylinder (2) to distribute a predetermined amount of glue on the side of the second ply (8) opposed to that from which the respective reliefs (R8) emerge; means (11) for joining to each other the plies (4, 8) exiting from the apparatus.

Abstract: An object of the present invention is to provide a collet cleaning method and a die bonder using the same in which a collet can be cleaned without adding a new unit, and foreign substances with high adhesive power can be reliably removed without scattering the foreign substances. A die bonder includes a pickup device, a bonding head unit having a collet that absorbs dies from a wafer at the timing of lifting of the pickup device, and a control unit that controls the pickup device and the bonding head unit. The collet is moved to a position of a dicing tape at which no dies of the wafer held by a wafer ring exist to be brought into contact with the adhesive surface of the dicing tape, so that foreign substances attached to the tip end of the collet are removed.

Abstract: Disclosed herein is a method of preparing a magnetic substrate laminated with a PSA and release liner. The method comprises providing a magnetic substrate laminated with a PSA/release liner structure, removing a release liner from the PSA, and reapplying a release liner such that it is shifted in relation to the magnetic substrate to expose a portion of the PSA. A portion of the release liner may extend past an edge of the magnetic substrate, forming a tab to facilitate later removal of the release liner from the PSA. An attachment may be secured to the exposed PSA to create a customizable promotional item which may be further customized by the later removal of the release liner to allow a customized attachment to be affixed to a portion of the PSA.

Abstract: The present invention is a spool-less, continuous bobbin assembly and a method of use for forming a stitch in a stitching surface. The spool-less, continuous bobbin assembly is generally comprised of a needle assembly for an upper thread, a looping assembly for the upper thread and an application assembly to deposit a lower thread material onto a stitching surface.

Abstract: An improved geode breaking method, system, and apparatus are disclosed. A geode can be broken or cut into at least two pieces, or grooved with a circumferential groove. The geode pieces can be reassembled and connected to each other using a bonding material that supports the joint formed between the reassembled pieces. The bonding layer can denote a joint guideline to assist in aligning a geode breaking tool for re-breaking the geode. A support layer can be added for additional strength, support, and geode crumbling prevention. The reassembled geode can be safely and easily re-broken without crumbling the exterior and interior surface of the geode. The geode's interior crystals or concentric lines can be safely appreciated within a piece or section of a reassembled and re-broken geode.

Abstract: Hybrid bonding systems and methods for semiconductor wafers are disclosed. In one embodiment, a hybrid bonding system for semiconductor wafers includes a chamber and a plurality of sub-chambers disposed within the chamber. A robotics handler is disposed within the chamber that is adapted to move a plurality of semiconductor wafers within the chamber between the plurality of sub-chambers. The plurality of sub-chambers includes a first sub-chamber adapted to remove a protection layer from the plurality of semiconductor wafers, and a second sub-chamber adapted to activate top surfaces of the plurality of semiconductor wafers prior to hybrid bonding the plurality of semiconductor wafers together. The plurality of sub-chambers also includes a third sub-chamber adapted to align the plurality of semiconductor wafers and hybrid bond the plurality of semiconductor wafers together.

Abstract: A device and method for elutriating and gluing wood chips. At least one elutriating apparatus is used to fractionate the wood chips into at least one coarse chip fraction and one fine chip fraction. The elutriating apparatus has a fall duct and is designed so that the chip fractions pass through different gluing regions in the fall duct. At least one gluing apparatus is provided in order to glue the chip fractions in the gluing regions. Thus, the chip fractions can be glued in a common apparatus specifically with a glue amount adapted to a particular average chip size.

Abstract: An apparatus and method in which an insert with an undercut is mechanically coupled to a lay up mold for translated movement between an engaged position for molding with an undercut engaging the material to be molded and a remote position in which a resultant molded product maybe removed and the material may be laid up without interference with the undercut, preferably with the mechanical coupling allowing for hinged movement of the insert relative the lay up mold.

Abstract: Disclosed is a sheet winder which enables a sheet roll paper wound in a roll shape to be used in manufacturing of a corrugated cardboard for packing cases, in which the sheet roll paper is obtained by laminating sheet papers printed one by one using a lithography technique as one of the most general and economical printing methods and a roll paper used as a material for manufacturing the corrugated cardboard for packing cases.

Abstract: An aspect of the present embodiment, there is provided a method for fabricating a semiconductor device including placing a semiconductor substrate, onto which a BSG tape bonded via a supporting substrate, on a stage placed a peeling tape in a state that an adhesive surface of the peeling tape is oriented upwards and the BSG tape is oriented downwards to the stage, bonding the peeling tape onto the BSG tape in a state that the BSG tape is retained to be oriented downwards and placed on the adhesive surface of the peeling tape, drawing the peeling tape to a lower side of the stage to peel the peeling tape in a state that the peeling tape is retained to be bonded onto the BSG tape, and supporting the supporting substrate exposed from the BSG tape in the drawing of the peeling tape.

Abstract: The invention relates to a method for producing a fiber composite workpiece. In the method according to the invention, cross-linking silicone is used with the aid of a volatile diluent for infiltrating individual mats of a mat composite. A further object of the present invention is a device for performing the method according to the invention.

Abstract: The present disclosure includes: a joint processing station including a coating unit applying an adhesive to a processing target substrate or a supporting substrate, a first heat processing unit heating the substrates coated with the adhesive, a second heat processing unit heating the substrates to a higher temperature, a reversing unit reversing front and rear surfaces of the substrate, a joint unit joining the processing target substrate and the supporting substrate together by pressing them, and a transfer region for transferring the substrates to the units; and a transfer-in/out station transferring the substrates into/from the joint processing station.

Abstract: The invention is directed to a device for inflating and sealing an inflatable structure, such as inflatable cushions. The device includes an assembly configured for inflating a cushion cavity disposed between first and second layers of a film, and a sealing mechanism that preferably includes a rotary sealing drum, which can include a heat source.

Abstract: A temporary decoration which can be applied by a user to fabrics such as articles of clothing. The temporary decoration may be easily applied to the fabric in a quick and efficient manner without the use of heat or a solvent. Once applied to fabric, the temporary decoration is durable and does not undesirably crack. Additionally, the temporary decoration is easily removable. The present invention also relates to a method for making a temporary decoration.

Abstract: An apparatus and method in which an insert with an undercut is mechanically coupled to a lay up mold for translated movement between an engaged position for molding with an undercut engaging the material to be molded and a remote position in which a resultant molded product maybe removed and the material may be laid up without interference with the undercut, preferably with the mechanical coupling allowing for hinged movement of the insert relative the lay up mold.

Abstract: An improved geode breaking method, system, and apparatus are disclosed. A geode can be broken or cut into at least two pieces, or grooved with a circumferential groove. The geode pieces can be reassembled and connected to each other using a bonding material that supports the joint formed between the reassembled pieces. The bonding layer can denote a joint guideline to assist in aligning a geode breaking tool for re-breaking the geode. A support layer can be added for additional strength, support, and geode crumbling prevention. The reassembled geode can be safely and easily re-broken without crumbling the exterior and interior surface of the geode. The geode's interior crystals or concentric lines can be safely appreciated within a piece or section of a reassembled and re-broken geode.

Abstract: A substrate bonding apparatus and method are provided. The substrate bonding apparatus may include a board having a receiving surface opposite to a substrate fixed at one side thereof, a plurality of chucking members located between the receiving surface of the board and the substrate, and a substrate separation device to separate the substrate from the chucking members. The substrate separation device includes a pusher for pushing the substrate to separate the substrate from the chucking members, and a base plate installed at the receiving surface of the board, the base plate having an installation space to install the pusher formed therein. The pusher protrudes out of the base plate through an inlet and outlet port located at one end of the installation space to pressurize the substrate.

Abstract: Methods and systems for reinforcing the periphery of a semiconductor wafer bonded to a carrier are disclosed. In one embodiment, additional adhesive is applied to the semiconductor wafer prior to bonding. The additional adhesive seeps into a crevice between the carrier and wafer and provides reinforcement. In another embodiment, adhesive is applied to the crevice by a dispenser after the wafer is bonded to the glass carrier.

Abstract: A system and method to attach an object to a structure. The system includes a first membrane, a second membrane and a mounting plate. The method includes covering a portion of the structure with the first membrane and then placing the mounting plate thereupon. The second membrane placed over the mounting plate and subsequently bonded to both the mounting plate and the first membrane. The object is secured to the mounting plate via a fastener attached thereto and extending through the second membrane.

Abstract: The invention relates to an installation for applying glue to fibers for the production of fiberboard, especially MDF board or similar wood material board. Said installation comprises a fiber feed unit having at least one fiber feed conduit which opens into a fiber exit tube via a fiber deflection element and receives the air that is used to transport the fibers, a chute which is located downstream of the fiber exit tube, a glue application device which has spray nozzles for spraying the fibers that emerge from the fiber exit tube and enter the chute with drops of glue, and a collection device, located downstream of the chute and having an air-permeable transport belt for collecting and optionally carrying off the fibers and a suction device located below the transport belt for suctioning air from the chute through the transport belt, the suction device having one or more suction boxes to which one or more suction pipes are connected.

Abstract: A first holding table suction-holds an annular projection of a wafer remaining on a rear face thereof for surrounding a back grinding region. A second holding table having an outer peripheral wall adjacent to an inner wall of the annular projection is inserted into a flat portion inside the annular projection for joining a separating adhesive tape to a protective tape on a surface of the wafer while a flat plane of the flat portion is suction-held. Thereafter, the adhesive tape is separated. Accordingly, the adhesive tape is separated from the surface of the wafer together with the protective tape.

Abstract: The invention is directed to a device for inflating and sealing an inflatable structure, such as inflatable cushions. The device includes an assembly configured for inflating a cushion cavity disposed between first and second layers of a film, and a sealing mechanism that preferably includes a rotary sealing drum, which can include a heat source.

Abstract: An improved apparatus for debonding temporary bonded wafers includes a debonder, a cleaning module and a taping module. A vacuum chuck is used in the debonder for holding the debonded thinned wafer and remains with the thinned debonded wafer during the follow up processes steps of cleaning and mounting onto a dicing tape. In one embodiment the debonded thinned wafer remains onto the vacuum chuck and is moved with the vacuum chuck into the cleaning module and then the taping module. In another embodiment the debonded thinned wafer remains onto the vacuum chuck and first the cleaning module moves over the thinned wafer to clean the wafer and then the taping module moves over the thinned wafer to mount a dicing tape onto the wafer.

Abstract: A system and method to attach an object to a support structure, the system including a fastener having an anti-rotational member, a mounting plate having a raised portion adapted to receive the fastener, and an elastic membrane. The fastener is sandwiched between the mounting plate and the elastic membrane. The raised portion forms a cavity having an inner surface. The inner surface abuts against the surfaces of the fastener, which in turn restricts movement.

Abstract: Epitaxial lift off systems and methods are presented. In one embodiment a tape is disposed on the opposite side of the epitaxial material than the substrate is used to hold the epitaxial material during the etching and removal steps of the ELO process. In various embodiments, the apparatus for removing the ELO film from the substrates without damaging the ELO film may include an etchant reservoir, substrate handling and tape handling mechanisms, including mechanisms to manipulate (e.g., cause tension, peel, widen the etch gap, etc.) the lift off component during the lift off process.

Abstract: A process and system for making a laminated surface covering and the surface covering itself are described. The covering includes several layers bonded to each other. The system performs the process. One example of the process includes passing a first material across a first conveyor, passing a second material across a second conveyor, passing a bonding material across a third conveyor, contacting the first material and the second material to the bonding material, and heating at least one of the first material and the second material. The process also includes introducing the first material, the second material, and the bonding material into a pressure zone such that the bonding material is introduced between a bottom surface of the first material and a top surface of the second material. The process applies pressure to bond the first material and second material together via the bonding material to produce a laminated material.

Abstract: A sheet peeling apparatus 10 comprises: a supporting means 11 for supporting a semiconductor wafer W stuck with an adhesive sheet S; a feeding means 12 for feeding out a peeling tape T; a sticking means 14 for sticking the peeling tape T to the adhesive sheet S; a holding means 15 for holding a tip side in a feeding direction of the peeling tape T; and a peeling means 16 for imparting a peeling force to the adhesive sheet S. The peeling means 16 includes a peeling roller 44, and the peeling roller 44 abuts against an adhesive agent layer side of the peeling tape T stuck on the adhesive sheet S, and peeling off the adhesive sheet S in a state in which a turned-back portion c is formed by turning back a peeled end side of the adhesive sheet S.

Abstract: An improved apparatus for debonding temporary bonded wafers includes a debonder, a cleaning module and a taping module. A vacuum chuck is used in the debonder for holding the debonded thinned wafer and remains with the thinned debonded wafer during the follow up processes steps of cleaning and mounting onto a dicing tape. In one embodiment the debonded thinned wafer remains onto the vacuum chuck and is moved with the vacuum chuck into the cleaning module and then the taping module. In another embodiment the debonded thinned wafer remains onto the vacuum chuck and first the cleaning module moves over the thinned wafer to clean the wafer and then the taping module moves over the thinned wafer to mount a dicing tape onto the wafer.

Abstract: The present disclosure relates to speed change kits adapted to allow converting lines to be reconfigured to operate at different speeds. In one form, a system for fabricating disposable absorbent articles includes a plurality of converting modules; a plurality of absorbent article converting mechanisms; and a speed kit. The plurality of absorbent article converting mechanisms can be configured from a first configuration to a second configuration by modifying the plurality of absorbent article converting mechanisms to include the speed kit. In the first configuration, the plurality of absorbent article converting mechanisms operate to produce absorbent articles at a first speed range; and when in the second configuration, the plurality of absorbent article converting mechanisms operate to produce absorbent articles at a second speed range different from the first speed range.

Abstract: An extremely practical prepreg manufacturing device whereby a fiber body can be easily impregnated with a high-viscosity, low-concentration thermosetting resin using existing hot-melt method equipment, without having to use a solvent. In a prepreg manufacturing device for manufacturing a prepreg (5) by laminating and heating a resin sheet (4) formed by laminating a resin (3) with a release film (2), a resin sheet feeding mechanism (6) for feeding the resin sheet (4) laminated with a conveyed fiber body (1) comprises a release film feeding part (7) for feeding the release film (2), and a resin application part (8) for applying the resin (3) on the release film (2), the resin (3) containing a solvent. The resin sheet feeding mechanism (6) is configured so that the fiber body (1) is laminated with the resin sheet (4) formed by laminating the resin (3) with the release film (2), without the resin sheet (4) being formed into a roll shape.

Abstract: This invention generally pertains to self propagating high temperature synthesis or combustion synthesis as a way of bonding materials. The present invention provides methods and an apparatus for bonding, preferably carbon-carbon composite materials, by combustion synthesis. Generally, the invention involves providing at least two carbon-carbon composite parts to be bonded and interspersing a combustion synthesis material in between the parts with each part in contact with the combustion synthesis material. The combustion synthesis material is then ignited, which initiates the combustion synthesis reaction. Typically, a ceramic material is formed which immediately freezes, bonding the parts together.

Abstract: A method of manufacturing a hygiene product, includes the steps of providing at least a first web (1) and a second web (2), pre-treating the first web and/or the second web, embossing the first web with a décor embossing pattern in a first décor embossing zone (38) having a décor embossing roll (34), and laminating together the first web and the second web in a lamination zone (30), the lamination zone being defined between the décor embossing roll and a lamination roll (36), wherein the décor embossing roll and the lamination roll have a generally-equal surface hardness.

Abstract: A process and an apparatus are described for the treatment of wafers, in particular for the thinning of wafers. A wafer with a carrier layer and an interlayer arranged between the carrier layer and the wafer is also described, in which the interlayer is a plasmapolymeric layer that adheres to the wafer and adheres more strongly to the carrier layer than to the wafer.

Abstract: A substrate bonding apparatus and method are provided. The substrate bonding apparatus may include a board having a receiving surface opposite to a substrate fixed at one side thereof, a plurality of chucking members located between the receiving surface of the board and the substrate, and a substrate separation device to separate the substrate from the chucking members. The substrate separation device includes a pusher for pushing the substrate to separate the substrate from the chucking members, and a base plate installed at the receiving surface of the board, the base plate having an installation space to install the pusher formed therein. The pusher protrudes out of the base plate through an inlet and outlet port located at one end of the installation space to pressurize the substrate.

Abstract: A substrate bonding apparatus including a first chamber including a first surface plate on which a first substrate is received, a surface plate lift for lifting the first surface plate, a second chamber including a second surface plate on which a second substrate to be bonded to the first substrate is received, at least one adhesive included with the first surface plate to adhere to the first substrate, and an adhesive lift for independently lifting the adhesive.

Abstract: An extrusion system is provided. The extrusion system includes a first extrusion assembly and a second extrusion assembly. The first extrusion assembly is configured to continuously form a first extruded web while the second extrusion assembly is configured to continuously extrude a second extruded web. The first and second extrusion assemblies are also configured to cooperate so that the first extruded web is capable of moving in an assembly path wherein the first extruded web can be joined with the second extruded web to thereby continuously form a composite web made of the first and second joined webs.

Abstract: A tool has a body having a blunt end and an adhesive end. The adhesive end has a fastener and an adhesive element. The fastener protrudes from the adhesive end of the body. The adhesive element is made of resin and fastened by the fastener. The paillettes can be adhered more easily and rapidly by the adhesive element than by a user's hand. Thus, using the tool of the present invention to make the illustrated card is convenient for the users.

Abstract: A method of producing a catalyst material with nano-scale structure, the method comprising: introducing a starting powder into a nano-powder production reactor, the starting powder comprising a catalyst material; the nano-powder production reactor nano-sizing the starting powder, thereby producing a nano-powder from the starting powder, the nano-powder comprising a plurality of nano-particles, each nano-particle comprising the catalyst material; and forming a catalyst precursor material from the nano-powder, wherein the catalyst precursor material is a densified bulk porous structure comprising the catalyst material, the catalyst material having a nano-scale structure.

Abstract: Semiconductor workpiece carriers and methods for processing semiconductor workpieces are disclosed herein. In one embodiment, a semiconductor workpiece carrier assembly includes (a) a support structure having an opening sized to receive at least a portion of a semiconductor workpiece, and (b) a replaceable carrier positioned at the opening. The replaceable carrier includes a base and an adhesive layer on the base. The base has a surface, and the adhesive layer covers only a section of the surface of the base. The adhesive layer releasably attaches the replaceable carrier to the support structure.

Abstract: A sheet laminator includes a bonding unit and a restricting unit. The bonding unit bonds a first sheet to a second sheet that includes an adhesive layer. The restricting unit restricts movement of any one of the first sheet and the second sheet thereby preventing bonding between the first sheet and the second sheet before the first sheet and the second sheet reach the bonding unit.

Abstract: A bonding method includes a pasting process of pasting a face which is a face except the element formation surface of a rod, with a predetermined face of an adherend using a bonding material to be heat-cured, an absorption process of fixing angular relation between a direction of the adherend and a direction of the rod into predetermined angular relation by absorbing the adherend and rod on a surface of the stage on the surface of which the adherend and rod, which are pasted in the pasting process, are placed, and a heat cure process of heating and curing the bonding material in a state that the direction of the adherend and the direction of the rod are fixed to the predetermined angular relation by the absorption process.

Abstract: The embossed or printed web material article comprises at least two plies (V1, V2) of tissue paper joined together by gluing and forming at least one multi-ply sheet. The sheet has a principal pattern (D), embossed or printed, in a substantially intermediate position with respect to the surface of the article, and secondary embossed or printed patterns (U, V) of smaller dimensions arranged along the edge lines of the article and interrupted by said edge lines. FIG. 3 schematically shows an axonometric view of the embossing roller (21). The cylindrical surface of which is indicated with 21S. Defined on the surface of the roller are annular i.e. circumferential areas or bands (21C), along which protuberances are arranged to define an embossing pattern, which will be referred to hereunder as circumferential secondary embossing pattern. A longitudinal band (21L) is also represented on the cylindrical surface of the embossing roller.

Abstract: In a surface mounting apparatus having a pair of substrate fixing portions disposed opposite to each other and serving to support and fix opposed ends of a substrate respectively and a mounting head for mounting a component held by an attached nozzle on the substrate which is supported and fixed by the substrate fixing portion, including an air injecting portion disposed close to the substrate fixing portion and serving to inject air like a curtain from an outside of the substrate which is supported and fixed above an upper surface of the substrate, and an air suctioning portion disposed close to the other substrate fixing portion and serving to suction the air at the outside of the substrate which is opposed to an ejecting direction of the air.