Always Out Of Direct Contact With Each Other Patents (Class 165/104.14)
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Patent number: 6918430Abstract: An onboard hydrogen storage unit with heat transfer system for a hydrogen powered vehicle. The system includes a hydrogen storage vessel containing a hydrogen storage alloy configured to receive a stream of hydrogen and provide hydrogen for use in powering a vehicle. During refueling a cooling/heating loop is used to remove the heat of hydride formation from the hydrogen storage alloy and during operation of the vehicle the heating/cooling loop is used to supply heat to the hydrogen storage alloy to aid in hydrogen desorption.Type: GrantFiled: August 14, 2002Date of Patent: July 19, 2005Assignee: Texaco Ovonic Hydrogen Systems LLCInventors: Vitaliy Myasnikov, Rosa Young, Yang Li, Stanford R. Ovshinsky
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Patent number: 6904956Abstract: Apparatus for abstracting heat comprises a container charged with a first liquid and with small auxiliary containers free to circulate in the first liquid. Each of the small auxiliary containers is charged with a second liquid. The first and second liquids each have a selected temperature of transformation that facilitates use of the apparatus to heat or cool a substance contacted by the apparatus.Type: GrantFiled: October 18, 2002Date of Patent: June 14, 2005Inventor: Thomas P. Noel
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Patent number: 6874576Abstract: A device for cooling electric or electronic devices includes a heat exchanger and a adapter means connected to the heat exchanger via a fluid line for connecting the heat exchanger to the electric or electronic device. The heat exchanger, the fluid line and the adapter means contribute to a closed fluid circuit through which a primary fluid may be driven from an output of the heat exchanger to the device and from the device to the heat exchanger, so that waste heat from the device may be transported to the heat exchanger and there be given off to a secondary fluid.Type: GrantFiled: July 24, 2002Date of Patent: April 5, 2005Assignee: Infineon Technologies AGInventor: Johann Grundbacher
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Patent number: 6854510Abstract: A spacecraft, along with a spacecraft radiator system and spacecraft heat dissipation method are disclosed. The spacecraft comprises a body, a plurality of solar arrays, and the spacecraft radiator system. The spacecraft radiator system comprises first and second opposite facing payload radiators, first and second opposite facing deployable radiators, and one or more coupling or loop heat pipes cross coupling opposite facing payload and deployable radiators so that they function in tandem. By cross-coupling the opposite facing payload and deployable radiators, one of the two radiators acting in tandem is always in the shade during solstice seasons. Consequently, the solar load processed by the radiator system is minimized, thereby, increasing the thermal dissipation capability of the radiator system by approximately 15%.Type: GrantFiled: April 24, 2001Date of Patent: February 15, 2005Assignee: Space Systems/Loral, Inc.Inventors: Lenny Low, Susan Sebata
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Patent number: 6789618Abstract: An air handling system including at least one terminal unit for maintaining a serviced volume at a predetermined temperature below the temperature of the air supplied by the central source of the air handling system is provided through the use of a refrigerant means in the form of a passive thermal energy recovery device which provides heat transfer between the outgoing and inflowing air streams provided by the a central air handling system. The heat transfer between air streams is regulated as a function of air velocity and temperature differentials as measured at various points in system which are related specifically to the serviced volume. Environmental control within the serviced volume is exercised by controlling face and bypass dampers to regulate the air flow through the passive heat exchanger and the air exchange rate is controlled by modulating the operation of the dampers or by regulating the air flow into or out of the serviced volume by way of supply and/or exhaust louvers.Type: GrantFiled: September 5, 2001Date of Patent: September 14, 2004Inventor: Frederick J. Pearson
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Publication number: 20040159422Abstract: A wick for use in a heat pipe is provided incorporating particles of micro-encapsulated phase change material bonded together to form the wick. Use of a wick structure comprising micro-encapsulated PCM particles has the advantage of providing an additional heat absorber. This greatly enhances the ability of the heat pipe to absorb excess heat and may help to prevent damage to the heat pipe or heat generating component, such as an electronic device, especially at times of peak thermal loads.Type: ApplicationFiled: February 18, 2003Publication date: August 19, 2004Inventors: Jon Zuo, Donald M. Ernst
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Patent number: 6776221Abstract: A computer system is described of the kind having a frame and a plurality of server unit subassemblies that are insertable into the frame. Each server unit subassembly has a chassis component which engages with a frame component on the frame. Heat can transfer from the chassis component to the frame component, but the server unit subassembly can still be moved out of the frame. In one embodiment, an air duct is located over a plurality of the frame components. Heat transfers from the frame components to air flowing through the duct. A modified capillary pumped loop is used to transfer heat from a processor of the server unit subassembly to thermal components on the frame.Type: GrantFiled: January 4, 2002Date of Patent: August 17, 2004Assignee: Intel CorporationInventors: Stephen W. Montgomery, Barrett M. Faneuf
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Patent number: 6745824Abstract: A heat dissipation device includes a heat sink (20), heat pipes (30), a frame (40), and a fan (50). Each heat pipe has a lower first connecting portion (32) and an upper second connecting portion (34). The heat sink includes a base (21), and parallel fins (27) attached on the base. The base includes a top plate (25), and defines a hermetically sealed chamber. Apertures (23) are defined in one side wall (22) of the base, the apertures receiving the first connecting portions. Through holes (29) are transversely defined through the fins, the through holes receiving the second connecting portions. The frame includes an upper plate (41), and two side plates (47). Two arms (49) of each side plate secures the frame on the heat sink. In operation, working liquid in the chamber transfers heat to the top plate and to the second connecting portions by phase transition.Type: GrantFiled: December 20, 2002Date of Patent: June 8, 2004Assignee: Hon Hai Precision Ind. Co., Ltd.Inventors: Hsieh Kun Lee, Chun-Chi Chen, Winsan Peng
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Publication number: 20040099407Abstract: A stacked array of low profile heat pipes each with a plurality of micro tubes extended therethrough. The stacked low profile heat pipes are placed into thermal connection with heat producing components. A heat transfer fluid is contained in the micro tubes of the low profile heat pipes and removes the heat from the heat producing components.Type: ApplicationFiled: January 15, 2003Publication date: May 27, 2004Applicant: THERMOTEK, INC.Inventors: Overton L. Parish, Tony Quisenberry
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Patent number: 6725907Abstract: A thermosiphon which can be manufactured easily at low costs, having excellent resistance to pressure, without the circulation of a working fluid being hindered. A condenser 3 includes a condensing section 4 composed of extruded members in which a plurality of fine pores 7 are formed, a branching section 5 provided on an upstream side of the fine pores 7 to supply a gaseous working fluid returned from a gas pipe 12 into each of the fine pores 7, and a collecting section 6 provided on a downstream side of the fine pores 7 to collect the working fluid condensed inside the fine pores 7 and then supply the same into a liquid pipe 9. The gas pipe 12 is connected to an upper portion of the branching section 5 and the liquid pipe 9 is connected to a lower portion of the collecting section 6.Type: GrantFiled: January 14, 2003Date of Patent: April 27, 2004Assignee: Twinbird CorporationInventor: Kazuya Sone
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Publication number: 20040074629Abstract: Apparatus for abstracting heat comprises a container charged with a first liquid and with small auxiliary containers free to circulate in the first liquid. Each of the small auxiliary containers is charged with a second liquid. The first and second liquids each have a selected temperature of transformation that facilitates use of the apparatus to heat or cool a substance contacted by the apparatus.Type: ApplicationFiled: October 18, 2002Publication date: April 22, 2004Inventor: Thomas P. Noel
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Publication number: 20040031593Abstract: A heat pipe diode assembly is provided that includes at least two heat pipes and at least two working fluid reservoirs, with one working fluid reservoir arranged in fluid communication with each the heat pipes. A cold finger is arranged in thermal engagement with each of the heat pipes. A device to be cooled is arranged in thermal engagement with a portion of each of the heat pipes. Another embodiment provides a heat pipe diode assembly formed in accordance with the invention includes three heat pipes and six working fluid reservoirs, with two working fluid reservoirs arranged in fluid communication with each of the three heat pipes. Three cold fingers are provided, with one arranged in thermal engagement with each of the three heat pipes. A device to be cooled is arranged in thermal engagement with a portion of each of the three heat pipes. Methods are also provided for operation of a heat pipe diode assembly.Type: ApplicationFiled: March 17, 2003Publication date: February 19, 2004Inventors: Donald M. Ernst, Walter Bienert
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Patent number: 6675887Abstract: A heat pipe assembly comprises a first heat pipe having a condenser and a working fluid. A reservoir communicates with the condenser of the first heat pipe and contains a non-condensable gas which variably permits access of the working fluid to the condenser of the first heat pipe, depending on a pressure of the working fluid. A second heat pipe has an evaporator. At least a portion of the evaporator of the second heat pipe is contained inside of the condenser of the first heat pipe.Type: GrantFiled: March 26, 2002Date of Patent: January 13, 2004Assignee: Thermal Corp.Inventors: Scott D. Garner, G. Yale Eastman
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Patent number: 6672370Abstract: A heat sink includes a heat sink body including a number of fins and a cavity for holding a phase change material and a number of particles to enhance the mixing of the phase change material during the operation of the heat sink. In operation, the body of the heat sink conducts thermal energy to the phase change material. The energy is absorbed during the phase change of the phase change material. After absorbing energy and changing to a liquid state, the phase change material continues to dissipate energy by convection. The convection currents in the cavity are directed by the shape of the cavity surfaces and enhanced by the particles intermixed with the phase change material.Type: GrantFiled: March 14, 2000Date of Patent: January 6, 2004Assignee: Intel CorporationInventors: Damion T. Searls, Terrance J. Dishongh, David Pullen
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Publication number: 20040000394Abstract: A heat-dissipating device includes a thermal superconducting body, a fan unit and a guide pipe. The superconducting body includes a hollow heat transfer body adapted to be disposed on a heat-generating component of an electronic device. The heat transfer body is made of a heat-conducting material and is configured to confine at least one air channel. The fan unit is disposed to draw hot air away from the heat transfer body. The guide pipe has an inlet port in fluid communication with the heat transfer body for collecting hot air from the heat transfer body, an outlet port in fluid communication with the fan unit, and an intermediate pipe portion interconnecting the inlet and outlet ports for guiding the hot air from the inlet port to the outlet port for extraction by the fan unit.Type: ApplicationFiled: September 12, 2002Publication date: January 1, 2004Inventor: Chin-Kuang Luo
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Publication number: 20030196778Abstract: This invention provides a heat pipe including a plurality of pipe parts for performing at least one of absorption of heat and radiation of heat through an outer surface, which are adjacent toward one direction, a flat part including a heat transfer plane created in a flat form for performing at least one of absorption of heat from and radiation of heat into outer space, created on a part of the outer surface of each of the plurality of pipe parts to be integrated with each of the pipe parts, and a fin in a flat form continuing without an uneven part from the heat transfer plane included in the flat part for providing an heat transfer plane further extended from the heat transfer plane toward an adjacent pipe part.Type: ApplicationFiled: September 6, 2002Publication date: October 23, 2003Inventors: Takashi Kobayashi, Takehide Nomura
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Patent number: 6631755Abstract: A thermal module with temporary heat storage. The thermal module includes a heat storage, a heat absorber, a heat dissipater, and a heat pipe for rapidly transferring heat from the heat absorber to the heat dissipater. The heat storage includes a phase change material and is in contact with the heat pipe. When heat quantities generated by the system are greater than a predefined reasonable thermal target, heat in excess of the thermal target is temporarily absorbed into the heat storage through the melting of the PCM. When the heat quantities generated by the system are again less than the thermal target, the PCM re-freezes, releasing the stored heat to be dissipated normally.Type: GrantFiled: July 17, 2002Date of Patent: October 14, 2003Assignee: Compal Electronics, Inc.Inventors: Shao-Tsu Kung, Chen-Hua Liu
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Patent number: 6612293Abstract: An exhaust gas recirculation cooler (EGR cooler) provided in an exhaust gas recirculation line departing from an exhaust system and opening into an intake system of an internal combustion engine is configured as a heat pipe heat exchanger including at least one enclosed and evacuated heat pipe filled with a working medium, the first end of the heat pipe being subject to exhaust gas from the exhaust gas recirculation line and the second end being in contact with a heat sink. In order to provide a compact design which will permit simple and effective cooling of the recycled exhaust gas, the longitudinal axis of the EGR cooler is aligned in parallel with the axis of the at least one heat pipe, so that an essentially axial flow of exhaust gas is obtained in the EGR cooler.Type: GrantFiled: July 19, 2002Date of Patent: September 2, 2003Assignee: AVL List GmbHInventors: Franz Schweinzer, Marko Vide, Jan Marek
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Publication number: 20030136549Abstract: A thermosiphon which can be manufactured easily at low costs, having excellent resistance to pressure, without the circulation of a working fluid being hindered. A condenser 3 includes a condensing section 4 composed of extruded members in which a plurality of fine pores 7 are formed, a branching section 5 provided on an upstream side of the fine pores 7 to supply a gaseous working fluid returned from a gas pipe 12 into each of the fine pores 7, and a collecting section 6 provided on a downstream side of the fine pores 7 to collect the working fluid condensed inside the fine pores 7 and then supply the same into a liquid pipe 9. The gas pipe 12 is connected to an upper portion of the branching section 5 and the liquid pipe 9 is connected to a lower portion of the collecting section 6.Type: ApplicationFiled: January 14, 2003Publication date: July 24, 2003Applicant: Twinbird CorporationInventor: Kazuya Sone
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Patent number: 6591899Abstract: Multi-directional (reversible and parallel) loop heat pipe thermal systems for use on a spacecraft. The multi-directional loop heat pipe thermal systems may comprise reversible or parallel loop heat pipes that provide efficient thermal pathways that are directionally independent between any combination of equipment mounting panels and radiator panels. Loop heat pipes of the reversible loop heat pipe thermal system are coupled between opposite ends of respective evaporator/condenser flanges. The evaporator/condenser flanges each comprise a condenser and an evaporator. The parallel loop heat pipe thermal system comprises pairs or sets of parallel heat pipes that are respectively coupled between a condenser flange and an evaporator flange. The reversible or parallel loop heat pipes may be routed to a multiple number of radiator panels in order to optimize the use of a radiator panel by always transporting heat to the coolest radiator panel.Type: GrantFiled: November 21, 2000Date of Patent: July 15, 2003Assignee: Space Systems/Loral, Inc.Inventor: Eddy M. Yee
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Patent number: 6591902Abstract: An air conditioning system has a plurality of heat pipes including an input coil at the input end of a chiller for the passage of input air there through and an output coil at the output end of a chiller for the passage of output air there through. Each of the heat pipes has a vapor leg and a liquid leg coupling the vapor coil and liquid coil for the flow of a working fluid there through. At least one back flow abater is in the liquid leg for controlling the back flow of the working fluid within the liquid leg.Type: GrantFiled: October 24, 2000Date of Patent: July 15, 2003Inventor: Richard W. Trent
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Publication number: 20030121639Abstract: One object of the present invention is to realize a heat discharger having a high precision and in which heat conduction efficiency is maintained at the bonding between the heat pipe and heat sink. A heat discharger comprises a heat pipe and a heat sink formed separately from the heat pipe and bonded to the heat pipe via solder. The contact surface portion between the heat pipe and the solder and the contact surface portion between the heat sink and the solder are made of a wettable material having a wettablility such that the contacting angle with respect to the solder is 90 degrees or less.Type: ApplicationFiled: August 30, 2002Publication date: July 3, 2003Inventor: Takehide Nomura
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Patent number: 6578629Abstract: An air conditioning system comprising a plurality of heat pipes. Each of the heat pipes includes an input coil at the input end of a chiller for the passage of input air there through and an output coil at the output end of a chiller for the passage of output air there through. Each of the heat pipes also having an inlet leg and an outlet leg coupling an associated input coil and output coil for the flow of a working fluid there through. At least one valve for controlling the flow of the coolant within each heat pipes exists. A tube and shell heat exchanger transfers heat from a chiller fluid to an intermediate portion of the heat pipes.Type: GrantFiled: October 24, 2000Date of Patent: June 17, 2003Inventor: Richard W. Trent
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Patent number: 6499532Abstract: An electric motor cooling system including an electric motor with an air coolant inlet and an air coolant outlet, a first housing extending over and affixed to the electric motor with an air flow passageway therein, a first blower secured to the first housing having an outlet connected to the air coolant inlet of the electric motor, a second housing affixed to the first housing with an air flow passageway therein, a second blower affixed within the second housing so as to force air through the air flow passageway of the second housing, and a heat pipe array affixed within the air flow passageways of the first and second housings such that the heat pipe array has a bottom half within the air flow passageway of the first housing and a top half located in the air flow passageway of the second housing. The first blower is a centrifugal blower.Type: GrantFiled: March 6, 2000Date of Patent: December 31, 2002Inventor: Kevin R. Williams
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Patent number: 6481491Abstract: The invention relates to a device for removing heat from an electronic component mounted on a circuit board. The device uses a working fluid circulated through cooling elements which are integrated into a metal matrix composite structure. The cooling elements are positioned and arranged within the structure to efficiently manage heat dissipation by evacuating the heat from the component in a multi-directional manner.Type: GrantFiled: November 22, 1999Date of Patent: November 19, 2002Assignee: Nokia Telecommunications OyInventors: Carl Kabrell, Reijo Lehtiniemi, Jukka Rantala, Timo Heikkilä, Tapio Tuamainen
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Publication number: 20020153128Abstract: A spacecraft, along with an improved spacecraft radiator system and spacecraft heat dissipation method are disclosed. The spacecraft comprises a body, a plurality of solar arrays, and the spacecraft radiator system. The spacecraft radiator system comprises first and second opposite facing payload radiators, first and second opposite facing deployable radiators, and one or more coupling or loop heat pipes cross coupling opposite facing payload and deployable radiators so that they function in tandem. By cross-coupling the opposite facing payload and deployable radiators, one of the two radiators acting in tandem is always in the shade during solstice seasons. Consequently, the solar load processed by the radiator system is minimized, thereby, increasing the thermal dissipation capability of the radiator system by approximately 15%.Type: ApplicationFiled: April 24, 2001Publication date: October 24, 2002Inventors: Lenny Low, Susan Sebata
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Patent number: 6434001Abstract: A heat exchanger for a computing device and a docking station. The heat exchanger includes a first heat transfer element and a second heat transfer element. The first heat transfer element has a portion thermally coupled to an electronic component. The first and the second heat transfer element conformally engage each other yet are removable from each other.Type: GrantFiled: February 15, 2000Date of Patent: August 13, 2002Assignee: Intel CorporationInventor: Rakesh Bhatia
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Publication number: 20020031740Abstract: The invention relates to method and apparatus for cooling a furnace configured for processing refractory composites. More specifically, the invention is directed to method and apparatus for cooling a furnace more rapidly than prior art methods. According to the invention, a cooling gas is flowed in a closed circuit through the furnace, over the refractory composites disposed within the furnace, and over a cooling element disposed within the furnace. The cooling gas may be flowed by natural convection or by force.Type: ApplicationFiled: February 9, 2001Publication date: March 14, 2002Applicant: The B.F. Goodrich CompanyInventors: Dennis T. Garn, Jerry S. Lee, James W. Rudolph
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Publication number: 20020014323Abstract: The invention relates to a system (1) for exchanging heat between two gaseous fluids (A, B) which are guided in channels. The inventive device has a housing-like module (2) in which an evaporator chamber (5) is separated from a condenser chamber (6) in such a way that it is gas tight. Several heat exchanger tubes (15) extend out of said evaporator chamber (5), via a test area (9) configured between the two chambers (5, 6), via the condenser chamber (6) and into an inspection chamber (14). The inspection chamber (14) is separated from the condenser chamber (6) in such a way that it is gas tight, and the heat-exchanger tubes are replaceable. The longitudinal sections (16) of the heat exchanger tubes (15) situated in the evaporator chamber (5) are protected against corrosion, whilst the longitudinal sections (18) situated in the condenser chamber (6) have fins (19).Type: ApplicationFiled: August 13, 1999Publication date: February 7, 2002Inventor: FRANK ADAMCZYK
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Patent number: 6336500Abstract: A method of and apparatus for controlling heat transfer in a fluidized bed reactor having a heat transfer chamber (312) with a bed (314) of solid particles therein, means (320,322) for introducing fluidizing gas into the heat transfer chamber for fluidizing the bed of solid particles therein and heat transfer surfaces (316) in contact with the bed of solid particles in the heat transfer chamber. Heat is transferred to said heat transfer surfaces from the solid particles. The fluidization of the bed of solid particles is varied according to a periodical function, e.g. by control means (34) periodically varying the flow velocity of fluidizing gas being introduced into the heat transfer chamber. Thereby the instantaneous heat transfer, as well as, the effective heat transfer from solid particles to the heat transfer surfaces may be controlled.Type: GrantFiled: December 22, 1997Date of Patent: January 8, 2002Assignee: Foster Wheeler Energia OyInventor: Timo Hyppanen
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Publication number: 20010047859Abstract: A heat pipe comprising a flat container, and a member selected from a rod, a plate and a mesh, the member being fixedly arranged between narrow walls of the container so that space is provided in the inner circumference of the container both in the direction of width and length of the container.Type: ApplicationFiled: December 4, 1998Publication date: December 6, 2001Inventors: YOSHIO ISHIDA, AKIMI SHUTOU
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Publication number: 20010025702Abstract: A method of and apparatus for controlling heat transfer in a fluidized bed reactor having a heat transfer chamber (312) with a bed (314) of solid particles therein, means (320,322) for introducing fluidizing gas into the heat transfer chamber for fluidizing the bed of solid particles therein and heat transfer surfaces (316) in contact with the bed of solid particles in the heat transfer chamber. Heat is transferred to said heat transfer surfaces from the solid particles. The fluidization of the bed of solid particles is varied according to a periodical function, e.g. by control means (34) periodically varying the flow velocity of fluidizing gas being introduced into the heat transfer chamber. Thereby the instantaneous heat transfer, as well as, the effective heat transfer from solid particles to the heat transfer surfaces may be controlled.Type: ApplicationFiled: December 22, 1997Publication date: October 4, 2001Inventor: TIMO HYPPANEN
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Patent number: 6253560Abstract: Air conditioning system and method in which a refrigerant from a compressor is circulated through a cooling element within a hermetically sealed, thermally insulated cooling compartment to cool a fluid within the compartment, and transferring the cooled fluid out of the compartment for use in cooling a space. In one disclosed embodiment, the fluid which is cooled is air which is blown out of the compartment into the space to be cooled. In another disclosed embodiment, the fluid is a coolant which is contained within a vertically extending tube that extends both within the compartment and through a heat exchanger positioned beneath the compartment, with air being cooled by blowing it through the heat exchanger and then into the space to be cooled.Type: GrantFiled: September 2, 1999Date of Patent: July 3, 2001Inventor: Frank James Cava
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Publication number: 20010004009Abstract: A fluid-to-fluid heat exchanger for use where two fluid streams may be of indeterminate composition, temperature, and flow rate, and, where the two fluid streams may flow at different rates and at different times. Such conditions are found, for example, in the flow patterns of a building's hotwater, cold feed water for a water heater, and drainwater. As defined for heat recovery from drainwater, the present invention comprises a first, central, straight-through heat exchanger tube for cooling flowing drainwater, a second heat exchanger to heat cold water encircling and spaced from the first, and a non-pressurized reservoir between first and second heat exchangers permanently filled with water in thermal contact with first and second heat exchangers. Submerged in the reservoir water there is at least one insulated convection chamber, of small volume, enclosing first heat exchanger with a convection opening uppermost.Type: ApplicationFiled: December 15, 2000Publication date: June 21, 2001Inventor: Winston MacKelvie
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Publication number: 20010001981Abstract: To realize a integrally constructed cooler of the heat pipe type which ensures the achievement of sufficient cooling capacity and the realization of a simple, compact and inexpensive cooler, that is especially low in height, employing and incorporating ingeniously a heat pipe, there is provided a heat pipe type cooler comprising: a heat receiving plate 3; a heat radiator having a configuration of a plurality of horizontally oriented heat radiation plates 5 extending vertically; and a heat pipe H having a generally U or V shaped profile, the middle portion of which is secured to the heat receiving plate 3: and wherein each end of the heat pipe H passes through the heat radiation plates 5.Type: ApplicationFiled: March 19, 1998Publication date: May 31, 2001Applicant: William G. Kratz, Jr.Inventors: AKIRA UEDA, MASUMI SUZUKI
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Patent number: 6230788Abstract: A heat sink comprising: a body having an envelope including a flexible portion for thermal contact with a heat source, the envelope being filled with a thermally conductive liquid; and a thermosyphon having one end disposed at least partly within the liquid in the body to absorb heat from the heat source and another end disposed outside the envelope to dissipate heat.Type: GrantFiled: March 14, 2000Date of Patent: May 15, 2001Assignee: DSO National LaboratoriesInventors: Kok Fah Choo, Chang Yu Liu, Yew Wah Wong, Weng Kong Chan, Kwok Woon Tou