Abstract: A heat exchanger that can mechanically automatically control a level of cooling water according to heat generation of the fuel cell. The heat exchanger includes a housing having a cooling water inlet and an outlet connected to a fuel cell stack, a moving plate which moves reciprocally in the housing and discharges cooling water filled in the housing to the stack when it moves in a one direction and when it receives a steam pressure from the stack it moves in an opposite direction, and an elastic member that applies a force to the moving plate in the one direction. The heat exchanger can automatically maintain the level of cooling water despite a difference in heat generated between a full and a partial load operation of the fuel cell obviating complicated electronics such as a thermo-sensor, a valve, or a controller. Also, under a partial load, the exposure of flow channels to superheated steam is avoided, thereby extending the lifetime of the fuel cell.

Abstract: A cooling apparatus and method are provided for facilitating cooling of an electronic apparatus that includes a semiconductor element. The cooling apparatus includes an evaporator containing a coolant and evaporating the coolant under a reduced pressure lower than an ambient pressure to generate a chilled coolant, a condenser regenerating the coolant from a vapor of the coolant and being fluid-communicated with the evaporator through a bypass line, and a circulating pump and a line supplying the chilled coolant to a heat exchange area of the electronic apparatus to conduct a heat exchange with an air flow passing though the semiconductor element at a hot side of the electronic apparatus and returning the coolant after the heat exchange to the condenser.

Abstract: Disclosed are anodically protected, corrosion resistant, self cleaning, high efficiency, submerged tube and plate heat exchangers. Also disclosed are systems for purifying liquids using the anodically protected, corrosion resistant, self cleaning, high efficiency, submerged tube and plate heat exchangers. Further disclosed are methods for purifying liquids using the anodically protected, corrosion resistant, self cleaning, high efficiency, submerged tube and plate heat exchangers.

Abstract: A method (100) and an apparatus for manufacturing a heat-dissipation device (10) with a vacuum chamber and a working fluid therein are disclosed. The method includes the following steps: vacuuming a hollow metal casing (12) through a first open end (121) thereof until an interior of the casing reaches a predetermined vacuum degree; sealing the first open end; filling a predetermined quantity of working fluid into the casing through a second open end (123) thereof; and sealing the second open end. The apparatus includes a vacuum pump, a liquid-storage tank and a set of processing device, as used respectively for the above vacuuming, liquid-filling and sealing steps. By this apparatus, the heat-dissipation device can be manufactured at a same place without the requirement to shift the casing from one place to another place during the manufacture of the heat-dissipation device.

Abstract: The invention relates to an apparatus for cooling components in spacecraft, comprising a heat radiator (5) and a heat conductor (3; 3a, 3b). A versatile applicability is achieved in such a way that the heat conductor (3, 3a, 3b) penetrates an outside wall (1) of the spacecraft and is provided in the interior of the spacecraft with several coupling places (8) for components to be cooled (20) and/or for other heat conductors (10).

Abstract: A thermosyphon heat exchanger includes a plurality of first conduit elements and a plurality of second conduit elements. Each first conduit element has a heat absorbing portion defining a first plane and a first fluid transfer portion defining a second plane. The first plane and the second plane are twisted relative to each other. Each second conduit element has a heat releasing portion and a second fluid transfer portion or a connection to a fluid return line. At least one first conduit element and at least one second conduit element are connected to each other such that the fluid in the thermosyphon heat exchanger can flow in a closed loop through said first conduit element and said second conduit element.

Abstract: The present invention provides an apparatus including a magnesium alloy vessel that is substantially free of aluminum and zinc, but including magnesium in combination with a gettering metal and a method for making such apparatus. The magnesium alloy vessel has a hollow interior cavity containing a working fluid, with a stable, protective layer formed on the inside wall of the vessel so as to establish non-corrosive compatibility with the working fluid.

Abstract: A water-cooling radiator for a computer chip is provided to lower the temperature of the computer chip. The radiator includes a body on which other elements can be fixed and providing an interface for heat exchange, an internal circulation flow path built inside the body to provide a passage required for the coolant to flow through, and a pump fixed to the side of the body near the computer chip to provide power required for the coolant circulation.

Abstract: A heat dissipating assembly capable of being placed between a circuit board and a casing of an electronic device includes a fan assembly and a bracket. The fan assembly is mounted on the circuit board. The fan assembly includes an enclosure defining a chamber and an opening at a side wall thereof, along with a blower received in the chamber. The bracket is located between the fan assembly and the casing of the electronic device. The bracket has a side wall thereof defining a cutout connected with the chamber. The cutout and the opening of the enclosure are defined at two different sides of the heat dissipating assembly.

Abstract: A heat dissipating apparatus includes a heat pipe, a heat dissipating element, and two heat conducting bases. The pipe body of the heat pipe is formed integrally and has two evaporation ends disposed on both distal ends of the pipe body respectively and a condensation section disposed at a portion of the pipe body for installing the heat dissipating element on the condensation section, and the two heat conducting bases are disposed on the two evaporation ends respectively, such that the invention simply requires connecting the heat dissipating element with the single heat pipe to achieve the effect of reducing the volume or space occupied by the heat dissipating element.

Abstract: A regulating heat exchange and cooling method and system for monitoring and controlling the temperatures of walls subjected to high temperatures. The system is used to cool the inner wall of a thermal system having a double wall, the inner wall being subjected to temperatures equal to or greater than the physical capacity thereof. The system includes a network of tubes which is independent of the thermal system to be cooled. The tubes contain pressurized cooling water which circulates therethrough. The tubes have nozzles which spray and project water in the form of solid cones against the inner wall, the nozzles being controlled by adjustable-flow valves. The network of tubes forms an integral part of the outer wall of the thermal system to be cooled and the system also includes elements for maintaining the water projection area defined by the inner and outer walls in a vacuum condition.

Abstract: The present disclosure relates to a method for exchanging heat in a vapor compression heat transfer system. In particular, it relates to use of an intermediate heat exchanger to improve performance of a vapor compression heat transfer system utilizing a working fluid comprising at least one fluoroolefin. In addition, the present disclosure relates to a vapor compression heat transfer system comprising an intermediate heat exchanger in combination with a dual-row evaporator or a dual-row condenser, or both.

Abstract: A second tank for accommodating a sample is disposed within a first tank. A heater for heating gas is provided inside the second tank. A heater controller controls the heater such that temperature of gas becomes a set temperature. A guide portion which guides condensed dew such that the condensed dew can flow downward and reach the outer surface of the second tank is provided on the inner surface of the first tank.

Abstract: A cooling system for a heat-generating device includes: coolant fluid; an evaporator for holding the coolant fluid and for heating the coolant fluid; said evaporator in close proximity to the heat-generating device for removing unwanted heat. The cooling system also includes a plurality of tubes for providing a flow path for the coolant fluid and gases produced by the evaporator; a heat exchanger through which the tubes pass for cooling the coolant fluid. The heat exchanger includes: a reservoir, a coolant, and a heating element for heating the gas so that it expands and pushes cool coolant fluid back to the evaporator. The heating element may be located inside the reservoir.

Abstract: A heat exchanger assembly includes a plurality of evaporative heat exchangers that are selectively feed evaporant to tailor operation to current heat load in order to maintain operation in thermodynamically extreme operating conditions.

Abstract: A hydrogen fuel automobile has a heat medium passage through which a heat medium which can exchange heat with a drive portion and can be supplied to a heat medium pipe for a hydrogen tank flows. An air cooling apparatus has a compressor for compressing a refrigerant gas, a condenser, an evaporator and a refrigerant circuit. The hydrogen fuel automobile is provided with a bypass passage which branches from the refrigerant circuit so that expanded refrigerant liquid detours the evaporator so as to be drawn into the compressor. A switch portion can switch between a state where the refrigerant liquid passes through the evaporator so as to be drawn into the compressor and a state where the refrigerant liquid detours the evaporator so as to flow through the bypass passage. The hydrogen storage material cooling portion cools the hydrogen storage material in the hydrogen tank using the refrigerant liquid that flows through the bypass passage.

Abstract: A method of manufacturing a heat pipe, including the steps of: providing a hollow body with an open end and an opposite close end; filling a predetermined quantity of working fluid into the hollow body through the open end thereof after an interior of the hollow body having been evacuated to a predetermined vacuum degree; and sealing the open end of the hollow body.

Abstract: The present invention relates to an electric radiating pipe capable of enhancing a heating efficiency in such a manner that a mixture of a porous operation medium and a volatile operation fluid is filled in a radiation pipe, and a porous operation medium is fast heated based on a viscosity difference, and a densely filled operation fluid is phase-changed to a high temperature vapor or a high temperature liquid based on a heated operation medium. In a radiating pipe that includes a certain shaped pipe body, and a heat wire passing through to the interior of the pipe body wherein both ends of the pipe body are sealed by a plugging cap, there is provided an electric radiating pipe that includes a porous non-flammable operation medium and volatile operation fluid being mixed and being filled into the interior of the pipe body.

Abstract: A heat pipe apparatus for transferring heat from a heat source to a heat sink includes a hollow elongate sealed heat pipe having a hot end adapted for thermal coupling to the heat source, and having a cool end adapted for thermal coupling to the heat sink. A port is defined in a wall of the heat pipe, and a source of pressurized working fluid is connected to the port such that working fluid is admitted to an interior of the heat pipe at a working pressure selected such that working fluid in the interior of the heat pipe condenses at the working pressure and a desired temperature. Working fluid condenses at the cool end of the heat pipe, moves from the cool end of the heat pipe to the hot end of the heat pipe, and evaporates at the hot end of the heat pipe.

Abstract: Heating, ventilation, air conditioning, and refrigeration (HVAC&R) systems, heat exchangers, and multichannel tubes are provided which include internal configurations designed to promote mixing. The multichannel tubes include interior walls which form flow channels. The interior walls are interrupted at locations along the multichannel tube in order to provide open spaces between the flow channels where mixing may occur. The mixing that occurs promotes a more homogenous distribution of refrigerant within the multichannel tubes.

Abstract: A method and apparatus for heating a substrate is provided herein. In one embodiment, a substrate heater includes a vessel having an upper member including a top surface for supporting a substrate thereon; a liquid disposed within and partially filling the vessel; and a heat source for providing sufficient heat to the liquid to boil the liquid. Optionally, a pressure controller for regulating the pressure within the vessel may be provided. The substrate is heated by first placing the substrate on the support surface of the vessel of the substrate heater. The liquid contained in the vessel is then boiled. As the liquid is boiling, a uniform film of heated condensation is deposited on a bottom side of the support surface. The heated condensation heats the support surface which in turn, heats the substrate.

Abstract: A small and thin heat pipe with enhanced heat conductivity. Between an upper member having a grid-like upper concave portion on an inside lower surface and a lower member having a grid-like lower concave portion on an inside upper surface are provided intermediate plate members. The members are each formed with multiple vapor diffusion flow paths extending in a planar direction, communicating with the concave portions of the members, respectively. Thus, a sealed space is defined therebetween so that a refrigerant is enclosed therein. Capillary flow paths are formed through a portion of the members except where the vapor diffusion flow paths are formed such that the capillary flow paths extend vertically or both vertically and horizontally, communicating with the concave portions of the members.

Abstract: A heat pipe includes a pipe containing phase changeable working media therein. A wick structure is located on an inner face of the pipe. A space is surrounded by the wick structure in the pipe. At least one muzzle with an inlet and an outlet is positioned inside the pipe; the inlet and the outlet are deferent in radius thereof.

Abstract: A system for maintaining an IC-chip near a set-point temperature while electrical power dissipation in the IC-chip is varied includes a container having an open end with a seal ring. Located in the container is at least one nozzle for spraying liquid coolant droplets on a portion of an IC-module which holds the IC-chip. This spraying of the liquid coolant occurs while the seal ring is pressed against the IC-module. Also, a pressure reducing means is coupled to the container for producing a sub-atmospheric pressure in the space between the container and the IC-module while the seal ring is pressed against the IC-module.

Abstract: A heat transport device includes an evaporator, a condenser, and a vapor channel and a plurality of liquid channels that connect the evaporator and the condenser. The evaporator generates a capillary force to circulate working fluid. This structure prevents the performance deterioration and malfunction due to the entry of vapor-phase working fluid into the liquid channels. Since the cross-sectional areas of the liquid channels gradually decrease from the condenser toward the evaporator, the capillary force at the liquid channels can be increased, and vapor-phase working fluid is prevented from entering the liquid channels. Wicks and the portions of the liquid channels adjacent thereto are filled with liquid-phase working fluid even after dryout occurs, stable operation is achieved.

Abstract: A heat transport device includes an evaporator, a condenser, and a vapor channel and a plurality of liquid channels that connect the evaporator and the condenser. The evaporator generates a capillary force to circulate working fluid. This structure prevents the performance deterioration and malfunction due to the entry of vapor-phase working fluid into the liquid channels. Since the cross-sectional areas of the liquid channels gradually decrease from the condenser toward the evaporator, the capillary force at the liquid channels can be increased, and vapor-phase working fluid is prevented from entering the liquid channels. Wicks and the portions of the liquid channels adjacent thereto are filled with liquid-phase working fluid even after dryout occurs, stable operation is achieved.

Abstract: Heat dissipating apparatus or system for dissipating heat generated by a payload on a spacecraft having a plurality of surfaces. The system includes at least one radiator-condenser coupled to one or more of the surfaces of the spacecraft and a heat pump including an evaporator, a compressor, and an expansion valve coupled in a closed-loop manner to the radiator-condenser. The system components are coupled together using small diameter, thin- and smooth-walled tubing. The system enables the radiator-condenser to be elevated above the source or payload temperature, and, along with the use of thin walled tubing, reduces the mass of the spacecraft. Because the radiator-condenser temperatures are elevated, multiple surfaces of the spacecraft (west, east, earth and aft) can be effectively used as radiating surfaces.

Abstract: Various techniques are disclosed for improving airtight two-phase heat-transfer systems employing a fluid to transfer heat from a heat source to a heat sink while circulating around a fluid circuit, the maximum temperature of the heat sink not exceeding the maximum temperature of the heat source. The properties of those improved systems include (a) maintaining, while the systems are inactive, their internal pressure at a pressure above the saturated-vapor pressure of their heat-transfer fluid; and (b) cooling their internal evaporator surfaces with liquid jets. FIG. 43 illustrates the particular case where a heat-transfer system of the invention is used to cool a piston engine (500) by rejecting, with a condenser (508), heat to the ambient air; and where the system includes a heat-transfer fluid pump (10) and means (401-407) for achieving the former property.

Abstract: Apparatus for cooling a fuel cell stack. The cooling system uses vaporization cooling of the fuel stack and supersonic vapor compression of the vaporized coolant to significantly increase the temperature and pressure of the liquid coolant flowing through a heat exchanger. By increasing the heat rejection temperature of the coolant delivered to the heat exchanger, the heat transfer area of the heat exchanger can be reduced and the mass flow rate of coolant can also be reduced. The increased fluid pressure is used to circulate the coolant through the cooling system, thereby eliminating the circulation pump associated with conventional systems.

Abstract: A cooling system for apparatus powered by electricity, that generates a substantial amount of heat during operation, and the heat must be dissipated to avoid failure of electrical and/or electronic components, such as semiconductor devices and integrated circuits, comprising the electrical apparatus. The cooling system employs water impinged on a heat sink thermally coupled with electrical apparatus, at subatmospheric pressure. The attendant phase change of the water to steam at a reduced temperature due to the subatmospheric pressure improves removal of waste heat to prevent failure of the electrical apparatus.

Abstract: A cooling system for apparatus powered by electricity, that generates a substantial amount of heat during operation, and the heat must be dissipated to avoid failure of electrical and/or electronic components, such as semiconductor devices and integrated circuits, comprising the electrical apparatus. The cooling system employs water impinged on a heat sink thermally coupled with electrical apparatus, at subatmospheric pressure. The attendant phase change of the water to steam at a reduced temperature due to the subatmospheric pressure improves removal of waste heat to prevent failure of the electrical apparatus.

Abstract: A method of cooling at least one heat generating device using a cooling system is disclosed. The method comprises the steps of using at least one pump to cause a fluid to flow in at least one heat exchanger and adjusting a pressure of the fluid to correspondingly adjust a boiling point temperature of the fluid in the at least one heat exchanger. The method can also include the step of providing at least one heat rejector for rejecting heat from the system, the at least one heat rejector being situated downstream of the at least one heat exchanger. The step of adjusting a pressure of the fluid can comprise adjusting a pressure of the fluid during charging and sealing of the system. Further, the step of adjusting a pressure of the fluid can comprise adjusting a composition and volume of a gas and liquid introduced during charging of the system.

Abstract: Methods and apparatuses are provided for removing thermal energy from a nuclear reactor, which are fault tolerant. The apparatus includes at least one heat pipe configured to absorb thermal energy produced by the nuclear reactor. In addition, the apparatus includes a first compartment thermally coupled to the at least one heat pipe. The first compartment is configured to contain a first gas. Furthermore, the apparatus includes a second compartment thermally coupled to the at least one heat pipe. The second compartment is configured to contain a second gas and configured to isolate the second gas from the first gas.

Abstract: Method and apparatus for cooling a fuel cell stack. The cooling system uses vaporization cooling of the fuel stack and supersonic vapor compression of the vaporized coolant to significantly increase the temperature and pressure of the liquid coolant flowing through a heat exchanger. By increasing the heat rejection temperature of the coolant delivered to the heat exchanger, the heat transfer area of the heat exchanger can be reduced and the mass flow rate of coolant can also be reduced. The increased fluid pressure is used to circulate the coolant through the cooling system, thereby eliminating the circulation pump associated with conventional systems.

Abstract: A heat pipe assembly comprises a first heat pipe having a condenser and a working fluid. A reservoir communicates with the condenser of the first heat pipe and contains a non-condensable gas which variably permits access of the working fluid to the condenser of the first heat pipe, depending on a pressure of the working fluid. A second heat pipe has an evaporator. At least a portion of the evaporator of the second heat pipe is contained inside of the condenser of the first heat pipe.

Abstract: An apparatus suitable for low temperature processing and high temperature sterilization comprising a halogenated heat-transfer fluid. The apparatus comprises an expansion device which may optionally comprise a membrane. Another embodiment of the present invention is a method therefor.

Abstract: A heat pipe includes a flow diverter that separates the heat pipe into an evaporator chamber and a condenser chamber. Each of the evaporator chamber and the condenser chamber are coupled to a compressor with a one-way valve. The compressor receives vaporous working fluid from the evaporator chamber, compresses it, and pumps it to the condenser chamber at a higher pressure and temperature. Within the condenser chamber, the working fluid enter a wicking structure and travels around the flow diverter to the evaporator chamber. The compressor can be an acoustic compressor that includes an acoustic resonating chamber. An integrated circuit package can include the combination of the heat pipe and compressor to create a refrigeration cycle that removes heat from an integrated circuit.

Abstract: Rapid cooling apparatus including a vacuum chamber, a vacuum pump in fluid communication with the vacuum chamber for decreasing pressure in the vacuum chamber, a heat-transfer fluid disposed inside the vacuum chamber, and a substance generally sealed in a package in heat-transfer contact with the heat-transfer fluid inside the vacuum chamber. Preferably the package is constructed of an expandable material.

Abstract: The invention relates to an assembly for switching electrical power, wherein a semiconductor switch is arranged in a pressure-resistant vessel which is partially filled with an inert liquid in order to effect a fluid cooling of the semiconductor switch during operation, characterised in that the interior of the vessel is coupled with a cooling circuit, with at least one vapor line leading from the vessel to a radiator, and at least one liquid line leading from the radiator to the vessel, with the liquid line being arranged at least sectionwise within the vapor line and being extended from a connection point at the vessel into the interior of the vessel to such a length that its free end opens below the liquid level of the cooling liquid.

Abstract: The present invention provides a cooling module (100) and a method for forming the cooling module (100). The cooling module (100) is effective in reducing the temperature of heat-generating components mounted on the cooling module (100). The cooling module (100) includes a housing (105), a pressure relief mechanism (200), and a shearing surface (201). The housing (105) includes a cooling material (121) disposed therein. The pressure relief mechanism (200) is disposed within the housing (105) and covers the opening (203) to provide a seal that seals the housing (105). The shearing surface (201) is effective to break the seal upon exceeding a predetermined pressure within the housing (105).

Abstract: Disclosed is an improved heat pipe construction. The heat pipe includes a tubular enclosure with upper and lower ends enclosed by end caps. One such end cap employs a communication port such that a working fluid can be introduced into the interior of the pipe. Water is disclosed as the working fluid in the preferred embodiment. The water is adapted absorb heat from the surrounding atmosphere evaporate and condense it the upper portion of the pipe. Typically, a portion of the water reacts with the container to evolve non-condensable hydrogen gas. Such gas diminishes the effectiveness of the heat pipe. To reduce the hydrogen gas a active agent is employed. The opposite end cap of the pipe includes a container into which a volume of the active agent is positioned. A preferred active agent composition includes 96 percent by weight PbOx and 4 percent by weight PbSo4. The PbOx is preferably electrochemically formed, with x varying between 1.85 and 2.05.