Mechanical Gas Pump Patents (Class 165/121)
  • Patent number: 10408216
    Abstract: A fan motor includes an electric motor including a stationary unit and a rotary unit, an impeller including blades and rotating together with the rotary unit, a housing accommodating the electric motor and the impeller, lead wires connected to the electric motor and extending radially outward, and a guide member. The housing includes a tubular portion extending along a rotation axis and accommodating at least a part of the impeller, a flange portion protruding radially outward from at least a part of the tubular portion, a lead wire outlet port provided in at least a part of the tubular portion, and a vertical groove communicating with the lead wire outlet port and penetrating the flange portion in an axial direction. The guide member is disposed inside the vertical groove, and at least a part of the lead wires is accommodated radially inward of the guide member in the vertical groove.
    Type: Grant
    Filed: April 27, 2017
    Date of Patent: September 10, 2019
    Assignee: NIDEC CORPORATION
    Inventors: Hidenobu Takeshita, Yasuyuki Kaji, Tatsuki Yoshida
  • Patent number: 10411312
    Abstract: A first fin is formed on a first inside wall surface to protrude therefrom. The first fin exchanges heat between fluid and the first inside wall surface. A first fluid passage is divided between a first region that is a space where the first fin is arranged, and a second region that is a space where the first fin is not arranged. Fluid flows from the second region into the first region. The first fin includes an inflow port through which fluid flows into the first region, and an outflow port through which fluid flows out of the first region. The first fin is formed to extend from the inflow port to the outflow port. An area of the inflow port is larger than a cross-sectional area of the first fluid passage when viewed in a flow direction of fluid.
    Type: Grant
    Filed: December 22, 2015
    Date of Patent: September 10, 2019
    Assignee: DENSO CORPORATION
    Inventors: Yoshimitsu Inoue, Koichi Umeda, Koji Yamashita, Hiroyoshi Yamamoto, Shota Iguchi
  • Patent number: 10378836
    Abstract: A water-cooling radiator assembly includes at least one first and one second sealing element and a water-cooling radiator main body formed of a plurality of stacked radiator elements. The second sealing element, the radiator elements and the first sealing element are sequentially stacked from bottom to top and integrally connected through heat treating to form the water-cooling radiator assembly. The first and second sealing elements have one side connected to an upper and a lower side, respectively, of the water-cooling radiator main body to seal a top and a bottom of a helical flow passage in the water-cooling radiator main body. A first and a second coupling section are optionally provided on the first and the second sealing element, respectively, or at a first and a second end of the helical flow passage, respectively; and the first and second coupling sections are fluidly communicable with the helical flow passage.
    Type: Grant
    Filed: September 26, 2016
    Date of Patent: August 13, 2019
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Jung-Yi Chiu, Fu-Kuei Chang
  • Patent number: 10327361
    Abstract: Managing thermal cycles of air temperature within a server rack includes: monitoring air temperature within the server rack; determining that the monitored temperature has fallen below a predetermined minimum threshold; and increasing air temperature within the server rack including capturing warm ambient air.
    Type: Grant
    Filed: April 7, 2017
    Date of Patent: June 18, 2019
    Assignee: Lenovo Enterprise Solutions (Singapore) Pte. Ltd.
    Inventors: Jerry D. Ackaret, Fred A. Bower, III, Gary D. Cudak, Caihong Zhang
  • Patent number: 10316730
    Abstract: A system and method of operating a cooling system for a vehicle engine, wherein one or more motors are operable to rotate one or more fans. Each of the one or more motors is controlled by a motor controller associated with the motor, in response to a control signal received from a system controller and an enable signal received from the vehicle. The motor controller operates the motor at a speed based upon the control signal if the control signal is received, and operates the motor at a predetermined speed if the control signal is not received but the enable signal is received.
    Type: Grant
    Filed: January 6, 2017
    Date of Patent: June 11, 2019
    Assignee: Modine Manufacturing Company
    Inventors: Michael Kis, Derek Boom
  • Patent number: 10321604
    Abstract: A power electronics cooling system includes a ram air fan with one or more blades and a ram air fan motor connected via an output shaft. The ram air fan draws in air and passes it across a heat exchanger to cool one or more cooling liquids. One or more pumps pressurize and pump the cooling liquids to various electronic components, including one or more motor controllers. The pumps may be mechanically or electrically coupled to the output shaft of the ram air fan, such that the motor of the ram air fan provides energy to the pumps.
    Type: Grant
    Filed: October 30, 2017
    Date of Patent: June 11, 2019
    Assignee: HAMILTON SUNDSTRAND CORPORATION
    Inventor: Debabrata Pal
  • Patent number: 10289179
    Abstract: Methods and apparatus relating to techniques for dynamic control of liquid cooling pumps to provide thermal cooling uniformity are described. In an embodiment, modification is made to operation of one or more of: one or more cooling pumps or one or more fans, based at least in part on comparison of one or more detected temperature or noise values at one or more components of a processor with one or more corresponding threshold values. The processor may include the logic that causes the modification and one or more sensors, The sensors are thermally or acoustically coupled to the one or more components of the processor to determine the detected temperature or noise values. Other embodiments are also disclosed and claimed.
    Type: Grant
    Filed: April 21, 2017
    Date of Patent: May 14, 2019
    Assignee: Intel Corporation
    Inventors: Sanjeev S. Jahagirdar, Eric J. Asperheim, Subramaniam Maiyuran, Abhishek R. Appu, Joydeep Ray, Altug Koker, Prasoonkumar Surti, Kiran C. Veernapu
  • Patent number: 10267527
    Abstract: Provided is an outdoor unit for an air-conditioning apparatus, including a heat exchanger having heat exchanger cores stacked in a plurality of stages in a vertical direction of the outdoor unit. Each of the heat exchanger cores includes: a plurality of fins arranged in parallel to each other at intervals therebetween; and heat transfer tubes provided to extend through the fins, through which refrigerant is caused to flow. Each of the fins of the heat exchanger includes a deformable portion configured to be deformable by impacts applied to the deformable portion, which is formed at a position where the fins of the upper one of the heat exchanger cores from among the vertically-adjacent heat exchanger cores comes into contact with the fins of the lower one of the heat exchanger cores from among the vertically-adjacent heat exchanger cores.
    Type: Grant
    Filed: June 4, 2014
    Date of Patent: April 23, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventors: Yutaka Aoyama, Yudai Morikawa
  • Patent number: 10244646
    Abstract: A fastening structure of a detachable door including at least one door and a fastener is provided. The fastener includes a fixing portion, a locking portion and a manual operation portion. The fixing portion is used to fix the fastener on at least one door. The locking portion is used to lock the at least one door onto a housing or unlock the at least one door from the housing. The manual operation portion is used to facilitate a user to move the at least one door under an installed state.
    Type: Grant
    Filed: May 5, 2016
    Date of Patent: March 26, 2019
    Assignee: WISTRON CORPORATION
    Inventor: Chong-Xing Zhu
  • Patent number: 10225962
    Abstract: A power converter includes: a refrigerant flow channel member in which a refrigerant cooling an electronic device flows; a flat refrigerant pipe portion stacked with a power module, provided for a refrigerant cooling the power module to flow therein, and including a contact surface portion contacting the power module to exchange heat; an inlet pipe portion that is disposed at one end of the refrigerant pipe portion and through which the refrigerant flows to the refrigerant pipe portion; an outlet pipe portion that is disposed at the other end of the refrigerant pipe portion and through which the refrigerant flows from the refrigerant pipe portion; an inlet connection portion connecting the inlet pipe portion to the refrigerant flow channel member and formed of a tubular elastic member; and an outlet connection portion connecting the outlet pipe portion to the refrigerant flow channel member and formed of a tubular elastic member.
    Type: Grant
    Filed: August 9, 2017
    Date of Patent: March 5, 2019
    Assignee: Honda Motor Co., Ltd.
    Inventors: Takahiro Uneme, Takahiro Hagimoto, Hiroo Yamaguchi, Shinichi Yataka, Yuko Yamada
  • Patent number: 10222076
    Abstract: An outside unit of an air conditioner that includes a compressor compressing a refrigerant; an outside heat exchanger heat-exchanging the refrigerant with outside air; and an electric unit controlling a cooling cycle in which the refrigerant is circulated, wherein the electric unit includes one surface with which a cooling pipe for cooling the electric unit is disposed to be in contact and the other surface in which a fastening part is provided.
    Type: Grant
    Filed: August 31, 2016
    Date of Patent: March 5, 2019
    Assignee: LG ELECTRONICS INC.
    Inventors: Okkyu Kim, Gangyoun Kim, Wonjae Yi
  • Patent number: 10208621
    Abstract: A surface cooler includes a base component, a plurality of first fins, and a plurality of second fins. The base component has a first surface, a second surface, and a first thermally conductive material. The plurality of first fins extends substantially perpendicular from the first surface and each first fin is characterized by a first height and a first width. The plurality of second fins extends substantially perpendicular from the first surface and each second fin is characterized by a second height and a second width. One or more fins of the plurality of first fins are disposed between a pair of adjacent fins of the plurality of second fins and an average first height of the plurality of first fins is lower than an average second height of the plurality of second fins. The plurality of fins reduces air drag and augments heat transfer capacity of surface cooler.
    Type: Grant
    Filed: December 7, 2015
    Date of Patent: February 19, 2019
    Assignee: GENERAL ELECTRIC COMPANY
    Inventors: Florian Hoefler, Carlos Enrique Diaz, Jorge Alejandro Carretero Benignos
  • Patent number: 10206303
    Abstract: An aisle containment system installed around a pre-existing building column in a data center. The aisle containment system includes a frame defined by wall beams, header frames, and a plurality of posts. A plurality of cabinets are positioned within the frame. Mid-span posts are positioned adjacent building columns located within the frame. The mid-span posts support the wall beams on one side of the frame. A containment column adapter is secured to one of the wall beams and one of the mid-span posts. The containment column adapter seals the gaps between the building column and the wall beam within the frame of the aisle containment system.
    Type: Grant
    Filed: December 6, 2017
    Date of Patent: February 12, 2019
    Assignee: Panduit Corp.
    Inventors: David W. Gustaferro, William A. Bernard
  • Patent number: 10191521
    Abstract: A cooling system for computer systems includes one or more cooling hubs and one or more heat spreading devices. The heat spreading devices have nodes and paths defining inner pathways that enclose a two-phase working fluid. The nodes and paths network acts as links for the two-phase working fluid to absorb and transfer thermal energy from the heat-generating components of the electronic device to the cooling hub. The hub-link structure decouples the direct geometrical relationship between heating components and cooling sources to enable a higher degree of design freedom, space management, and cooling redundancy.
    Type: Grant
    Filed: May 25, 2017
    Date of Patent: January 29, 2019
    Assignee: Coolanyp, LLC
    Inventors: Peng Cheng, Dai Ying Wu
  • Patent number: 10187568
    Abstract: A communication device includes a processor; a cellular transceiver coupled to the processor; an imager with multiple lens and multiple sensors therein to capture a 360 degree video; a plurality of graphic processing units to combine outputs from the sensors to form the 360 degree video, the processor and the graphic processing units operating to keep heat below a predetermined range; and a heat pipe coupled to the processor and the graphic processing units.
    Type: Grant
    Filed: May 2, 2016
    Date of Patent: January 22, 2019
    Inventor: Bao Tran
  • Patent number: 10161405
    Abstract: A cooling apparatus includes an impeller, a motor, a base portion, and a motor circuit board. The impeller includes a plurality of blades and a blade support portion. Of the plurality of blades, at least one pair of circumferentially adjacent blades are arranged to have a channel defined therebetween, the channel extending from axially upper edges to axially lower edges of the blades, and being arranged to be open toward the upper surface of the base portion. The base portion includes a heat source contact portion with which a heat source is to be in contact. At least one of the blades includes a blade edge opposed portion having an axially lower edge arranged opposite to the upper surface of the base portion. An outermost edge portion of the motor circuit board is arranged radially inward of a radially inner end portion of the blade edge opposed portion.
    Type: Grant
    Filed: September 11, 2014
    Date of Patent: December 25, 2018
    Assignee: NIDEC CORPORATION
    Inventors: Takehito Tamaoka, Kazuhiko Fukushima
  • Patent number: 10146076
    Abstract: A curved display device including: a display panel having a curvature; a frame which supports the display panel; and a control circuit coupled to the frame, where the control circuit includes a circuit board coupled to the frame, and an electronic element on a surface of the circuit board opposing the frame.
    Type: Grant
    Filed: April 19, 2016
    Date of Patent: December 4, 2018
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Seungwan Kim, Mingyu Kim, Youngsup Kwon, Byungkyou Min, Jinwon Jang
  • Patent number: 10101756
    Abstract: Systems, methods, and computer programs are disclosed for reducing leakage power of a system on chip (SoC). One such method comprises monitoring a plurality of temperature differentials across a respective plurality of thermoelectric coolers on a system on chip (SoC). Each of the thermoelectric coolers is dedicated to a corresponding one of a plurality of chip sections on the SoC. The thermoelectric coolers are controlled based on the plurality of temperature differentials to minimize a sum of a combined power consumption of the plurality of chip sections and the plurality of corresponding dedicated thermoelectric coolers.
    Type: Grant
    Filed: July 29, 2014
    Date of Patent: October 16, 2018
    Assignee: QUALCOMM Incorporated
    Inventors: Rajat Mittal, Hee Jun Park, Young Hoon Kang
  • Patent number: 10102313
    Abstract: According to various aspects and embodiments, a system and method for use with a raised floor data center is provided. The method according to one aspect includes receiving input data, including data related to at least one data center design parameter, determining tile airflow uniformity using the input data and at least one empirical correlation, implementing an analytical model to determine airflow distribution, the analytical model including at least one empirical formula, and using the tile airflow uniformity and the airflow distribution to evaluate airflow in a data center design.
    Type: Grant
    Filed: December 30, 2014
    Date of Patent: October 16, 2018
    Assignee: SCHNEIDER ELECTRIC IT CORPORATION
    Inventors: James William VanGilder, Xuanhang Zhang
  • Patent number: 10043717
    Abstract: An electronic device includes at least two boards and support pillars. The at least two boards include hole portions. The support pillars inserted into the hole portions such that the at least two boards are held mutually separated. The hole portions include tapered surfaces that incline toward center portions of the hole portions from a surface on a side from which the support pillars of the boards are inserted.
    Type: Grant
    Filed: June 5, 2017
    Date of Patent: August 7, 2018
    Assignee: NIHON DEMPA KOGYO CO., LTD.
    Inventors: Junichi Arai, Masakazu Nishiwaki, Daisaku Nagata
  • Patent number: 10024555
    Abstract: An outdoor unit of an air conditioner includes a partition plate that separates a machine compartment, in which a compressor unit, a refrigerant pipe, and an electrical-part storage are disposed, and an air blower compartment; an electrical-part storage that is disposed so as to extend from the machine compartment side of the partition plate to the air blower compartment side of the partition plate, and that stores therein an electrical part; an auxiliary board that is disposed in the machine compartment and on which an electrical part that is other than the electrical part installed in the electrical-part storage, is installed; and a board fixing portion that is interposed between the electrical-part storage located in the machine compartment and the auxiliary board to fix the auxiliary board thereto.
    Type: Grant
    Filed: January 14, 2015
    Date of Patent: July 17, 2018
    Assignee: Mitsubishi Electric Corporation
    Inventors: Tomoya Yanase, Toshiyuki Kubono, Hiroyuki Jinnai
  • Patent number: 10013034
    Abstract: An embodiment of the invention provides a host chassis and a host, and refers to a display technical field, which can realize uniform heat dissipation, so as to improve the heat dissipation performance of the host. The host chassis comprises: a hollow column enclosure; heat dissipation covers situated at two ends of the column enclosure, the heat dissipation covers match with the column enclosure; a hollow column heat dissipating barrel which is situated inside the column enclosure and disposed in the same orientation with the column enclosure, the column heat dissipating barrel is used for disposing host accessories and for heat conduction for the host accessories; and a cooling fan fixed at one end of the column heat dissipating barrel, the fan is used for blowing cold air from external environment into the column heat dissipating barrel so as to take away heat.
    Type: Grant
    Filed: July 16, 2015
    Date of Patent: July 3, 2018
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., BEIJING BOE CHATANI ELECTRONICS CO., LTD.
    Inventor: Yingli Meng
  • Patent number: 10001819
    Abstract: Systems, methods, apparatuses, and assemblies for data storage systems are provided herein. In one example, a data processing assembly is presented. The data processing assembly includes a midplane assembly configured to electrically couple on a first side to storage modules, compute modules, or graphics modules, electrically couple on a second side to communication modules and one or more power supply modules. The data processing assembly includes a chassis configured to mechanically house and structurally support each of the storage modules, the compute modules, the communication modules, and the one or more power supply modules when coupled to the midplane assembly to form the data processing assembly and allow installation of the data processing assembly into a rackmount environment.
    Type: Grant
    Filed: May 4, 2017
    Date of Patent: June 19, 2018
    Assignee: Liqid Inc.
    Inventors: Andrew Rudolph Heyd, Seth Walsh, Brenden Michael Rust, Christopher R. Long, Jason Breakstone
  • Patent number: 9976473
    Abstract: Methods and systems are provided for reducing corrosion of a charge air cooler and reducing engine misfire due to condensate formation. In response to charge air cooler outlet temperature, electric fan operation and grille shutter opening is adjusted. Electric fan operation and grille shutter opening may also be controlled in response to vehicle operating conditions.
    Type: Grant
    Filed: May 30, 2017
    Date of Patent: May 22, 2018
    Assignee: Ford Global Technologies, LLC
    Inventors: Chris Paul Glugla, Garlan J. Huberts, Gopichandra Surnilla, Daniel Joseph Styles, David Karl Bidner
  • Patent number: 9980152
    Abstract: Various communication systems may benefit from communication between two different radio access technologies. For example, a long term evolution network may benefit from receiving resource availability information from a wireless local area network. A method includes receiving a request from a first RAT at a network node in a second RAT, and at least partially rejecting or at least partially accepting the request. The method also includes sending an indication of the at least partial rejection or at least partial acceptance to the first radio access technology, where the indication is used in determining whether to activate or continue radio access aggregation.
    Type: Grant
    Filed: January 4, 2017
    Date of Patent: May 22, 2018
    Assignee: NOKIA TECHNOLOGIES OY
    Inventors: Daniela Laselva, Jeroen Wigard, Dario Tonesi
  • Patent number: 9961808
    Abstract: A power-electronics assembly includes a plurality of power modules each having a body, a power stage disposed in the body and having opposing major sides, and a coolant channel defined in the body at a location adjacent to one of the major sides. The modules are arranged in a stack such that the coolant channels are interleaved with the power stages. At least one of the bodies defines a passageway extending between adjacent channels to connect the adjacent channels in fluid communication.
    Type: Grant
    Filed: March 9, 2016
    Date of Patent: May 1, 2018
    Assignee: Ford Global Technologies, LLC
    Inventors: Guangyin Lei, Michael W. Degner, Edward Chan-Jiun Jih
  • Patent number: 9945578
    Abstract: A monitored heat exchanger system that includes a heat exchanger unit in operable engagement with a heat generating device, with an at least one service fluid being transferable therebetween, and a monitoring module coupled to the heat exchanger unit. The monitoring module includes a primary microcontroller in operable communication with an at least one sensor assembly. The at least one sensor assembly includes a mounting frame; a support platform; a circuit board; an inner sensor housing configured to extend out and around the circuit board and the support platform; a first magnet coupled to an underside of the inner sensor housing; and a rotating member comprising a plurality of blades, the rotating member being disposed on top of the inner sensor housing.
    Type: Grant
    Filed: September 28, 2017
    Date of Patent: April 17, 2018
    Assignee: Global Heat Transfer ULC
    Inventors: Randy Vanberg, Hamid Reza Zareie Rajani, Seyed Reza Larimi, Morteza Abbasi
  • Patent number: 9926935
    Abstract: A fan assembly (100) includes a chassis portion (101) and a fan receiver (102) coupled to the chassis portion at a first end (105) of the fan receiver. A fan receiver sidewall defines an inner surface (401), an outer surface (402), a receiving opening (403), and a central axis (405). The inner surface can include at least one insertion guiderail key (514,614) oriented substantially parallel with the central axis. The outer surface can include a threaded male member (407) at a second end (106) of the fan receiver. A fan module (103) can nest within the fan receiver sidewall, retained therein by a vented endcap (104) that couples to the threaded male member with a threaded connection.
    Type: Grant
    Filed: April 10, 2015
    Date of Patent: March 27, 2018
    Assignee: ARRIS Enterprises LLC
    Inventors: Carlos Gonzalez Inda, Julio Cesar Ayala Vera, Oswaldo Enrique Linares Riva, Sergio Antonio Delon Canseco, Luis Lopez Moreno
  • Patent number: 9905745
    Abstract: The invention relates to a device for converting thermal energy to electrical energy, comprising at least one thermoelectric module (19) which has an outer surface having a hot side (20) for contacting a heat source and having a cold side (22) for contacting a heat sink, wherein the hot side of the thermoelectric module is thermally conductively connected to a heat source, in particular an exhaust channel (11) of a combustion engine. The device further comprises a cooling channel (25) through which a cooling fluid can flow and which is thermally conductively connected to the cold side of the thermoelectric module. The cooling channel has at least one opening to the cold side of the thermoelectric module and is sealed in a fluid-tight manner around the opening with respect to the hot side of the thermoelectric module.
    Type: Grant
    Filed: October 26, 2011
    Date of Patent: February 27, 2018
    Assignee: FRIEDRICH BOYSEN GMBH & CO. KG
    Inventors: Roland Gauss, Stefan Hoffmann, Karl Stockinger
  • Patent number: 9854704
    Abstract: A heat sink with shape-optimized fins provides for improved heat transfer. Synthetic jets create vortices which enhance heat transfer and cooling of downstream fins, while the shape of the fins limits pressure drop in the flow over the cooling fins.
    Type: Grant
    Filed: July 10, 2014
    Date of Patent: December 26, 2017
    Assignee: General Electric Company
    Inventors: Pradeep Chandra Babu Salapakkam, Ri Li, Mehmet Arik, William Dwight Gerstler, Bryan Patrick Whalen
  • Patent number: 9848507
    Abstract: Disclosed is a heat dissipation module assembly comprising: a base disposed adjacent to a heating unit and a heat dissipation module including one or more heat dissipation fins, the heat dissipation fin having an inlet portion and an outlet portion formed on both sides thereof and a hollow flow channel communicating with the inlet portion and the outlet portion, wherein the one or more heat dissipation fins being stacked to emit heat through the outlet portion, the heat being generated from the heating unit and absorbed by air flowed in through the inlet portion.
    Type: Grant
    Filed: March 30, 2017
    Date of Patent: December 19, 2017
    Assignee: HUMAX CO., LTD.
    Inventor: Jae Mo Ahn
  • Patent number: 9756761
    Abstract: Provided is an electronic apparatus including a cooling fan and a cover configuring an outer wall of an air flow path and having a heat sink arranged therein, and effectively utilizing a frame as a member for heat radiation. A cooling fan 40 is arranged on the opposite side of a circuit board across an upper frame 20 and attached to the upper frame 20. The electronic apparatus includes a cover having a shape for covering the air flow path and defining a wall of the air flow path together with the upper frame 20. Heat sinks 61 and 62 are arranged on the inner side of the cover 50.
    Type: Grant
    Filed: April 18, 2012
    Date of Patent: September 5, 2017
    Assignees: SONY CORPORATION, SONY INTERACTIVE ENTERTAINMENT INC.
    Inventors: Yukito Inoue, Kensuke Ikeda, Daisuke Kanda, Yasuhiro Ootori
  • Patent number: 9739195
    Abstract: A system for increasing air flow across a heat exchanger of a vehicle is described. In one particular example, the system comprises a charge-air cooler coupled via upper and lower brackets to a vehicle body, and an axial dual fan connected to the upper and lower brackets via one or more isolators. With this arrangement, the cooling system described allows for vehicle performance to be enhanced while also increasing the durability and robustness of the system and reducing the noise produced therefrom.
    Type: Grant
    Filed: September 29, 2014
    Date of Patent: August 22, 2017
    Assignee: Ford Global Technologies, LLC
    Inventors: Kenneth J. Hayes, Jim Tyler, Yan Pan, Garrett Michael O'Donohue, Saulo Da Cortes Cervantes
  • Patent number: 9736965
    Abstract: A playback device for an aircraft has a casing; a circuit board; a power unit placed away from the circuit board in a first direction; a heat sink attached to the circuit board; a cooling fan that is placed on an opposite side of the power unit with reference to the circuit board and spaced from a periphery of the casing and that sends an exhaust stream to the heat sink; a partition interposed between the circuit board and the power unit; and first outlets for letting out exhaust streams into which an exhaust stream has diverged upon collision against the partition after passing through the heat sink.
    Type: Grant
    Filed: September 11, 2015
    Date of Patent: August 15, 2017
    Assignee: TEAC Corporation
    Inventors: Daisuke Kaku, Koujiro Tanimoto
  • Patent number: 9730358
    Abstract: An exemplary heat dissipation apparatus includes a bracket, a reticular cover fixed to the bracket and a receiving space being defined with the bracket, and a tray received in the receiving space. The tray includes a first surface and a second surface. A number of first through holes is defined on the bracket. A number of second through holes is defined on the tray respectively corresponding to the first through holes, each of the second through holes extends obliquely from the first surface of the tray to the second surface of the tray relative to a vertical line of the first and second surfaces of the tray. A first magnet is installed on the first surface of the tray, a second magnet corresponding to the first magnet is installed on the bracket.
    Type: Grant
    Filed: February 21, 2014
    Date of Patent: August 8, 2017
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Shih-Chun Huang, Jiunn-Her Li, Chih-Peng Sung
  • Patent number: 9726165
    Abstract: A high-pressure pump includes a pump cover, an air cylinder, a piston, a water cooling device, and a pump seat. The air cylinder is formed by a first air cylinder, a second air cylinder and a third air cylinder whose diameters are progressively reduced and that are coaxially disposed. The piston is also formed by a first piston, a second piston and a third piston whose diameters are progressively reduced and that are respectively disposed in the first air cylinder, the second air cylinder and the third air cylinder. A water cooling device is disposed between the second air cylinder and the third air cylinder.
    Type: Grant
    Filed: March 28, 2014
    Date of Patent: August 8, 2017
    Assignee: Nantong Guangxing Pneumatic Equipment Co., Ltd.
    Inventor: Xuefeng Gao
  • Patent number: 9709294
    Abstract: An air conditioning system includes a housing defining a first airflow path therein between an outside air inlet over a cooling coil and an outlet for delivering outside air from the outside air inlet over the coil to the outlet, a second airflow path between a return air inlet over the cooling coil and to the outlet for delivering return air over the cooling coil, and a third airflow path between the return air inlet and the outlet for delivering return air through the housing without passing over the cooling coil. The system includes outside, return, and bypass air dampers that are sequentially moveable between open and closed positions for directing air through or preventing air from entering the first, second, and third airflow paths, respectively. A controller independently controls the opening and closing of each damper in response to data received from the sensor.
    Type: Grant
    Filed: September 20, 2012
    Date of Patent: July 18, 2017
    Assignee: CONSOLIDATED ENERGY SOLUTIONS INC.
    Inventors: Bryan Cyril Elliott, Phillip Walker, Marty Robbins, Allen Payne
  • Patent number: 9671839
    Abstract: Acoustics management at an information handling system provides reduced acoustic noise with limited performance impact by dynamically changing power dissipation as a function of cooling fan speed and ambient temperature so that preemptive power restrictions prevent excessive thermal conditions that lead to excessive cooling fan speeds and associated acoustics. A maximum cooling fan speed of less than an available maximum is set and maintained by reducing power dissipation unless power dissipation reaches a minimum, after which the minimum power dissipation is maintained and cooling fan speed is allowed to increase.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: June 6, 2017
    Assignee: Dell Products L.P.
    Inventors: Chris E. Peterson, Hasnain Shabbir, Paul T. Artman
  • Patent number: 9664398
    Abstract: The present development is a building air cooling system using cool ground water, e.g. well water. Building air is cooled by coming into direct contact with cool ground water in a compact chamber using PVC packing for maximizing heat transfer efficiency, conserving space and reducing the required ground water pumping power consumption without requiring expensive compression and expansion cycles of the traditional air conditioning systems. If additional cooling is desirable, a second stage traditional air conditioning or heat pump system may also be used.
    Type: Grant
    Filed: August 4, 2013
    Date of Patent: May 30, 2017
    Inventor: Clyde Wesley DeVore
  • Patent number: 9665140
    Abstract: An electrical device having thermal isolation function includes a housing, a heat-generating source, a heat-conductive member, and a thermal isolation plate. The housing includes an accommodation space therein, an inner surface and an outer surface which is opposite to the inner surface. The heat-generating source is disposed in the accommodation space. The heat-conductive member is disposed in the accommodation space, and is in contact with the heat-generating source. The thermal isolation plate is disposed between the heat-conductive member and the inner surface of the housing, and the thermal isolation plate is formed with a vacuum chamber therein.
    Type: Grant
    Filed: October 21, 2014
    Date of Patent: May 30, 2017
    Assignee: Quanta Computer Inc.
    Inventors: Sung-Fong Yang, Chang-Chun Lan, Yu-Nien Huang, Shun-Ta Yu, Wei-Che Yeh
  • Patent number: 9661785
    Abstract: A power conversion apparatus includes an electrical circuit including a heat source, a heat pipe cooler in which a refrigerant is enclosed, the heat pipe cooler configured to cool the heat source, a freeze determiner configured to determine whether the refrigerant is frozen, and an output limiter configured to limit output when the freeze determiner determines that the refrigerant is frozen.
    Type: Grant
    Filed: December 23, 2014
    Date of Patent: May 23, 2017
    Assignee: TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
    Inventors: Yosuke Fujii, Nobuhiro Takahashi
  • Patent number: 9653124
    Abstract: Systems, methods, apparatuses, and assemblies for data storage systems are provided herein. In one example, a data storage assembly is presented. The data storage assembly includes a midplane assembly configured to electrically couple on a first side to storage modules and compute modules, electrically couple on a second side to communication modules and one or more power supply modules. The data storage assembly includes a chassis configured to mechanically house and structurally support each of the storage modules, the compute modules, the communication modules, and the one or more power supply modules when coupled to the midplane assembly to form the data storage assembly and allow installation of the data storage assembly into a rackmount environment.
    Type: Grant
    Filed: September 4, 2015
    Date of Patent: May 16, 2017
    Assignee: Liqid Inc.
    Inventors: Andrew Rudolph Heyd, Seth Walsh, Brenden Michael Rust, Christopher R. Long, Jason Breakstone
  • Patent number: 9631803
    Abstract: A light-emitting diode (LED) lighting apparatus includes an exterior member which covers a heat-dissipating member. Therefore, the LED lighting apparatus may be dustproof and waterproof. The shape of the heat-dissipating member may be modified to increase the surface area thereof and thus effectively dissipate heat.
    Type: Grant
    Filed: September 18, 2014
    Date of Patent: April 25, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong-il Lim, Sung-jin Kim, Byung-kwan Song
  • Patent number: 9625218
    Abstract: A heat dissipation device includes a mounting bracket and a thermal module. The mounting bracket has at least one retaining hole and a mounting section, and the thermal module includes a plurality of radiating fins, to which the mounting bracket is connected. On the radiating fins, at least one engaging zone is provided for correspondingly engaging with the mounting bracket, and at least one locking portion is formed for correspondingly engaging with the retaining hole. With the above structural design, the mounting bracket can be more firmly and stably connected to the thermal module and be more accurately located on the radiating fins without the need of welding, so that the manufacturing cost for welding is saved. A method of manufacturing the heat dissipation device is also disclosed.
    Type: Grant
    Filed: January 15, 2015
    Date of Patent: April 18, 2017
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Sheng-Huang Lin, Yen-Lin Chu
  • Patent number: 9603292
    Abstract: A shield made from aluminum (AL) or an aluminum-based alloy coated with a solderable plating such as nickel or tin provides thermal improvement over existing shielding materials. The shield for electronic components on a circuit board comprising a base having an upper surface and one or more sidewalls extending from a perimeter of the upper surface, the sidewalls configured to engage a fence of the circuit board, and a fin array attached to the upper surface of the base, the fin array having a plurality of stackable fins, each of the stackable fins having a wall and one or more engagement tabs extending from one or more edges of the wall, the engagement tabs interlocking the plurality of stackable fins together.
    Type: Grant
    Filed: December 14, 2015
    Date of Patent: March 21, 2017
    Inventors: Arthur Kurz, Michael Schneider, Bret Barry
  • Patent number: 9603279
    Abstract: A server chassis, including: a first compartment configured to receive one or more central electronics complexes (‘CECs’); and a second compartment configured to receive one or more fans for cooling the one or more CECs, wherein the second compartment is coupled to the first compartment such that: the second compartment is inserted within the first compartment when the second compartment is in an operational position; and the second compartment is outside of the first compartment and rotated relative to the first compartment when the second compartment is in a service position.
    Type: Grant
    Filed: January 5, 2015
    Date of Patent: March 21, 2017
    Assignee: Lenovo Enterprise Solutions (Singapore) Pte. Ltd.
    Inventors: Diane S. Busch, Alvin G. Davis, William M. Megarity, April E. Ruggles, Paul A. Wormsbecher
  • Patent number: 9578780
    Abstract: A heat dissipating device used for a PCB having a heat generating component includes a vapor chamber, a fin set, and a fixture. The vapor chamber is attached to the heat generating component. The fin set is connected above to the vapor chamber. The fixture is fixed to the PCB. The vapor chamber and the fin set are clamped between the fixture and the PCB. The fixture has a press plate which is pressed against a top of the fin set. Therefore, the press plate presses the vapor chamber without direct contact. That is, the applied pressure is concentrated on the fin set and then distributed evenly to the vapor chamber, which prevents deformation of the vapor chamber due to uneven pressure and further achieves the effect of the vapor chamber being attached smoothly to the heat generating component.
    Type: Grant
    Filed: October 16, 2015
    Date of Patent: February 21, 2017
    Assignee: CHAUN-CHOUNG TECHNOLOGY CORP.
    Inventors: Po-Chou Shih, Heng-Chi Hsu, Tun-Ta Chen
  • Patent number: 9575521
    Abstract: An external chassis wall liquid cooling system includes a chassis defining a chassis housing. A chassis wall is located on the chassis and includes a first surface that is located adjacent the chassis housing and a second surface that is located opposite the chassis wall from the first surface and that provides an outer surface of the chassis. A liquid cooling channel is defined by the chassis wall and extends through the chassis wall between the first surface and the second surface. A liquid is located in the liquid cooling channel, and a pump is coupled to the liquid cooling channel and configured to move the liquid through the liquid cooling channel. A fan system in the chassis housing may move air past heat producing components to transfer heat produced by those heat producing components, and the liquid may further dissipate that heat out of the chassis.
    Type: Grant
    Filed: July 30, 2015
    Date of Patent: February 21, 2017
    Assignee: Dell Products L.P.
    Inventors: Travis Christian North, David Michael Meyers, Shawn Paul Hoss, Austin Michael Shelnutt
  • Patent number: 9574569
    Abstract: A recirculation fan includes a casing, a covering member, a wind-guiding device, a passive impeller, and an active impeller. The covering member is coupled with the casing to define an accommodation space. The wind-guiding device is disposed on the covering member, and includes a wind-guiding cover and a magnetoresistive structure. The magnetoresistive structure is disposed on the covering member and the wind-guiding cover. The passive impeller is disposed within the accommodation space. The active impeller is disposed within the accommodation space and located beside the passive impeller for generating a wind to drive rotation of the passive impeller and the wind-guiding cover. In response to a magnetic torque resulted from a magnetic vortex of the magnetoresistive structure, a rotating speed of the wind-guiding cover is slowed down.
    Type: Grant
    Filed: May 24, 2012
    Date of Patent: February 21, 2017
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Shun-Chen Chang, Wen-Bin Liu, Kun-Fu Chuang
  • Patent number: D773626
    Type: Grant
    Filed: July 28, 2015
    Date of Patent: December 6, 2016
    Assignee: Mitsubishi Electric Corporation
    Inventors: Takayuki Nishiguchi, Jangryul Rim