Abstract: A heat dissipation sheet includes a first sheet composed of a plurality of first carbon nanotubes, and a second sheet composed of a plurality of second carbon nanotubes, wherein the first sheet and the second sheet are coupled in a stacked state, and the first carbon nanotubes and the second carbon nanotubes are different in an amount of deformation when pressure is applied.

Abstract: An electronic apparatus includes: a chassis; a heat generating element provided in the chassis; and a cooling device that has a cooling fin, a heat pipe connecting the cooling fin and the heat generating element, and a pressing assembly pressing the heat pipe against the heat generating element, and is provided in the chassis. The heat pipe has: a heat absorbing section that absorbs heat generated by the heat generating element; and a thin plate section having a thickness which is smaller than that of the heat absorbing section. The pressing assembly has: a base assembly relatively fixed to the chassis; and a bridge section that is provided integrally with the base assembly and placed on a surface of the thin plate section in such a manner as to extend over the heat pipe in a width direction.

Abstract: An IC die includes a temperature control element suitable for three-dimensional IC package with enhanced thermal control and management. The temperature control element may assist temperature control of the IC die when in operation. In one example, the temperature control element may have a plurality of thermal dissipating features disposed on a first surface of the IC die to efficiently control and dissipate the thermal energy from the IC die when in operation. A second surface opposite to the first surface of the IC die may include a plurality of devices, such as semiconductors transistors, devices, electrical components, circuits, or the like, that may generate thermal energy when in operation. The temperature control element may provide an IC die with high efficiency of heat dissipation that is suitable for 3D IC package structures and requirements.

Abstract: A heat distribution device comprising a main body, a recessed cavity positioned within the main body, the recessed cavity having an interior surface, a peripheral wall extending around and defining the interior surface, and a central point within the recessed cavity. A plurality of ribs may extend away from the interior surface of the recessed cavity. The plurality of ribs may be concentrically arranged around the central point and define a plurality of channels therebetween. Each of the plurality of ribs may have a top surface that slopes toward or away from the central point. The plurality of ribs may be arranged so that the top surfaces of the plurality of ribs collectively form a collective sloped surface within the heat distribution device.

Abstract: A heat dissipation device includes a plurality of fins, at least one first heat pipe and at least one second heat pipe. Each of the fins includes a main body and two first deflectors. The main body has an inflow side, an outflow side and two first communication openings. The first communication openings are located between the inflow side and the outflow side. The first deflectors are arranged obliquely relative to the main body and respectively located on sides of the first communication openings. Air flowing out of the first communication openings is guided by the first deflectors to flow into an area between the first deflectors. The first heat pipe is located between the first deflectors. The second heat pipe is located on one side of one of the first deflectors located relatively far away from the other one of the first deflectors.

Abstract: A converter includes a housing; a heat-generating component disposed inside the housing; and a heat-dissipating module disposed on the heat-generating component and having a heat-dissipating member, an inlet adjacently disposed on one side of the heat-dissipating member, and an outlet adjacently disposed on the other side of the heat-dissipating member. The heat-dissipating member includes a plurality of heat-dissipating fins and a plurality of flow paths disposed in a direction from the inlet toward the outlet, and the plurality of flow paths are disposed overlapping with the heat-generating component in the vertical direction. A distance between two outermost heat-dissipating fins in a second direction of the heat-dissipating member, among the plurality of heat-dissipating fins, is greater at a central region between the inlet and the outlet of the heat-dissipating member than at a first region near the outlet of the heat-dissipating.

Abstract: A composite substrate includes a base layer formed of a composite material containing diamond and a metal, the base layer a first surface, and a second surface opposite to the first surface; a flat layer having a lower surface bonded to the first surface of the base layer, and an upper surface having a surface roughness Ra of 10 nm or less; and an insulating layer directly bonded to the upper surface of the flat layer.

Abstract: A computing device includes a heat dissipation component, a heating or cooling apparatus, and a printed circuit board. The heating or cooling apparatus includes a heating or cooling component and a wire, and the heating or cooling component is affixed to a surface of the heat dissipation component. The printed circuit board includes a printed circuit board component, and the heat dissipation component is affixed to the printed circuit board component and configured to heat or cool the printed circuit board component.

Abstract: A horizontal Dewar flask is used with an optical metrology device, which may advantageously reduce the vertical height of the device. A thermal transfer member provides thermal transfer between a liquefied gas cooled sensor and liquefied gas in a chamber of the Dewar flask. To compensate for the loss of thermal transfer from the sensor as the liquefied gas evaporates and changes to a gaseous state, the thermal transfer member biases heat transfer to the liquefied gas that is at the bottom of the chamber. The thermal transfer member may have a larger surface area at a bottom portion of the thermal transfer member than the upper portion. For example, the thermal transfer member may include one or more projections that extend into the liquefied gas with greater density at the bottom of the chamber than at the top of the chamber.

Abstract: The invention relates generally to liquid-repellent coatings, and in particular, to porous liquid-repellent coatings, a method of preparing the porous liquid-repellent coatings, and a method of characterizing a porous surface for the liquid-repellent coatings. The invention further relates to a porous liquid-repellent coating comprising a porous layer of a transition metal oxide and/or hydroxide and a layer of a liquid-repellent compound deposited onto the porous layer of the transition metal oxide and/or hydroxide, wherein the porous layer of the transition metal oxide and/or hydroxide is comprised of a plurality of surface pores of varying angles with an average angle that is re-entrant.

Abstract: A cooling apparatus includes a coolant passage provided in a device to be cooled. The coolant passage is configured in such a manner that coolant passes through the coolant passage. The coolant passage includes a wall surface, first ribs, and second ribs. The first ribs and the second ribs are provided on at least a part of the wall surface. The first ribs protrude from the wall surface toward inside of the coolant passage and extend in a first direction. The second ribs protrude from the wall surface toward the inside of the coolant passage and extend in a second direction crossing the first direction. The first ribs and the second ribs are disposed alternately when viewed in at least one direction.

Abstract: A computing device comprises a housing, a heat-generating electronic component, at least one additional electronic component, and a liquid cooling module. The heat-generating component, the at least one additional electronic component, and the liquid cooling module are all positioned inside the housing. The liquid cooling module is configured to cool the heat-generating electronic component, and includes at least one movable radiator. The at least one movable radiator is configured to move between a first position and a second position. When the at least one movable radiator is in the first position, the at least one movable radiator blocks access to the at least one additional electronic component within the housing. When the at least one movable radiator is in the second position, the at least one movable radiator allows access to the at least one additional electronic component within the housing.

Abstract: A power conversion device includes: a housing; and a cover coupled to the housing, the cover includes a plate portion, a heat conduction portion coupled to the plate portion, and a refrigerant pipe, the plate portion includes a first groove in which the refrigerant pipe is disposed, and the depth of one end of the first groove is smaller than that of the other end.

Abstract: To provide a thermoelectric conversion module member which has a high connecting property between a thermoelectric conversion layer and a diffusion prevention layer and is also excellent in heat resistance. A thermoelectric conversion module member comprising a thermoelectric conversion layer and a diffusion prevention layer in contact with the above-described thermoelectric conversion layer, wherein the above-described thermoelectric conversion layer is a layer containing a thermoelectric conversion material having a silicon element or a tellurium element, the above-described diffusion prevention layer is a layer containing a metal and the same thermoelectric conversion material as that contained in the above-described thermoelectric conversion layer, and the amount of the above-described thermoelectric conversion material in the above-described diffusion prevention layer is 10 to 50 parts by weight with respect to 100 parts by weight of the above-described metal.

Abstract: A pulsating vapor chamber has an inner board, a first outer board, a second outer board, an asymmetric loop, and a working fluid. The inner board has a first surface and a second surface. The first and second outer boards are mounted on the first surface and the second surface of the inner board respectively. The asymmetric loop is located between the first and second outer boards and has multiple channels communicating with each other in sequence. A part of the channels are formed between the first outer board and the inner board, and the remaining channels are formed between the second outer board and the inner board. With the asymmetric loop, even if the vapor chamber is disposed horizontally, pressure may be changed by different amount in the channels so that the working fluid is still able to oscillate or circulate.

Abstract: A heat dissipating device includes a power distribution assembly and two convergence delivery assemblies. The power distribution assembly includes a first cooling reservoir, a second cooling reservoir, multiple cooling pumps disposed on the first cooling reservoir, and a serial pipeline and a cooling head corresponding to each of the cooling pumps respectively. The two convergence delivery assemblies separately communicate with first cooling reservoir and the second cooling reservoir, and are separately arranged on two sides of the power distribution assembly. The serial pipeline is connected with the cooling head to communicate between the first cooling reservoir and the second cooling reservoir.

Abstract: A heat exchanger having an integrated support structure particularly suited for thermal management of heat generating components such as battery thermal management applications or thermal management of other electronic components is disclosed. The heat exchanger includes a top plate and a base tray defining a plurality of fluid channels that extend between an inlet manifold area and an outlet manifold area. The top plate has a first side defining a primary heat transfer area and a second side for effecting a sealing relationship between the top plate and the base tray. In some instances, the top plate includes a thermally conductive material while the base tray includes a non-thermally conductive material. In some instances the base tray cooperates with a cover portion to define an enclosure for housing the heat generating components.

Abstract: An electronic apparatus with a cooling system includes a chassis having a mounting slot, and a removable device. The removable device includes a housing detachably disposed in the mounting slot; a first pump disposed in the housing, and detachably affixed to a bottom of the housing; a second pump detachably affixed to the bottom of the housing, and connected to the first pump; and a tank disposed on the first pump and configured to store cooling liquid. when the first pump or the second pump is operating, the cooling liquid in the tank flows into the first pump, and the cooling liquid in the first pump flows into the second pump.

Abstract: The present invention provides a hybrid adsorption heat exchanging device comprising: at least one tubular or micro channel structure for carrying a heat transfer fluid; the external surface of said structure being provided with extensions in at least two locations; said extensions forming a bed therebetween for providing one or more adsorbent materials; a coating of adsorbent material being provided on at least a part of said extensions.

Abstract: A fluid handling system includes a console configured to connect with a first electrical interface that is configured to connect to a plurality of components of the fluid handling system, the console including a second electrical interface configured to connect with the first electrical interface, a display, and one or more hardware processors. A control system includes the one or more hardware processors and a non-transitory memory storing instructions that, when executed, cause the control system to: detect an electrical signal from a first component of the plurality of components of the fluid handling system responsive to a caretaker performing a first instruction; determine a system state of the fluid handling system based at least in part on the electrical signal from the first component; compare the system state with a predetermined state condition corresponding to said first instruction; and output an indication on the display of the system state.

Abstract: An electronic module assembly includes a circuit card assembly (CCA) with heat generating electronic components. A connector is electrically connected to the heat generating electronic components, wherein the connector is positioned at a connection end of the CCA. A heatsink is mounted to the CCA, connected in thermal communication with the electronic components. An undulating channel feature is defined along a lateral edge of the heatsink relative to the connector. One or more channels of the undulating channel feature are aligned with an insertion axis defined by the connector.

Abstract: The present disclosure discloses a control device, which comprises: a circuit board; a heat dissipation cover comprising a heat dissipation cover plate and a plurality of heat dissipation fins arranged on the heat dissipation cover plate, wherein the heat dissipation cover plate covers the circuit board, and a groove is formed between the plurality of heat dissipation fins; a thermally conductive strip disposed between the circuit board and the heat dissipation cover plate; and a fan arranged in the groove. The heat dissipation cover disclosed herein covers the circuit board as a holistic upper cover, the heat of the circuit board is conducted to the heat dissipation cover through the thermally conductive strip, and the fan in the through groove generate an airflow to dissipate heat, thereby realizing sealing, dustproof and heat dissipation of the circuit board simultaneously.

Abstract: An electronic device includes an integrated circuit and a heat exchanger. The heat exchanger includes a heat pipe and a first plurality of cooling fins and a second plurality of cooling fins. The heat pipe is thermally coupled to the integrated circuit and has an evaporator portion and a condenser portion, where the condenser portion extends away from the evaporator portion. The first plurality of cooling fins are attached to the condenser portion and proximate to the evaporation portion and form a plenum having a first associated pressure drop when a cooling fluid flows across the first plurality of cooling fins at a first velocity. The second plurality of cooling fins are attached to the condenser portion and distal from the evaporation portion and form a flow path having a second associated pressure drop when the cooling fluid flows across the second plurality of cooling fins at the first velocity.

Abstract: An adjustable vessel holder, such as an adjustable beverage container holder, is adjustable between a first position and a second position and includes a sleeve and at least one closure coupled to the sleeve. The at least one closure is configured to have a closed position and an open position. In the closed position, the adjustable vessel holder is in the first position and is configured to receive a vessel having a first size. In the open position of the closure, the adjustable vessel holder is in the second position and is configured to receive a different vessel having a second size. In some vessel holders, in the first position, a top end has a first internal perimeter, and in the second position, the top end has a second internal perimeter that is larger than the first internal perimeter.

Abstract: A shared mold manufacturing method for industrial lighting devices includes the following steps: putting a metal material in a mold to execute a casting molding step to generate a semi-finished product; the semi-finished product has a plate portion and a box portion disposed on the plate portion; taking the semi-finished product from the mold and performing a cooling step to cool the semi-finished product; performing a separating step to separate the plate portion from the box portion; executing a re-processing step for the plate portion and the box portion in order to obtain a heat sink and a driver; and performing a combining step to combine the heat sink with the driver.

Abstract: A flexible heat dissipation device includes an evaporator, a vapor tube, a liquid tube and a condenser. The evaporator has at least one vapor chamber. A capillary structure and a working fluid are received in the vapor chamber. Two ends of the vapor tube is respectively in communication with one end of the evaporator and the condenser. Two ends of the liquid tube are respectively in communication with the evaporator and the condenser, whereby the evaporator, the vapor tube, the condenser and the liquid tube form a loop for the working fluid to flow through. At least one bellows section is disposed on one or both of the vapor tube and the liquid tube. The bellows section has multiple waved stripes. More than one of the heights, widths and pitches of the multiple waved stripes are equal to or unequal to each other.

Abstract: A device for transferring heat from a device component to an environment includes a heat plate connected to a spring. A first fastener attaches the spring to the heat plate at a first location. A second fastener, such as a rivet, attaches the spring to the heat plate at each of a second and a third location. The second fastener includes a tab on and extending above the heat plate and corresponding tab slot on the spring. The spring is riveted to the heat plate at the first location and a second spring member accepts the tab at each of the second location and the third location. Ribs on a top surface of spring facilitate thermal coupling of the spring to the component when the device is assembled. One or more spring curvatures facilitate vertical deflection and horizontal extension of the spring during device assembly.

Abstract: A cryogenic device includes: a hermetic container; a cryocooler including a mounting portion mounted on the container, a connecting part extending from the mounting portion into the container in an axial direction of the cryocooler, and a cooling stage attached to the connecting part and disposed in the container; and a member to be cooled that is disposed in the container with a gap, which is configured to allow heat to be exchanged, between the cooling stage and the member. The cooling stage includes a cold fin extending in a direction perpendicular to the axial direction. A fin receiving groove recessed in the direction perpendicular to the axial direction is formed in the member to be cooled and extends in the axial direction, and the member to be cooled receives the cold fin in the fin receiving groove with the gap.

Abstract: A heat exchanger includes a housing having a heat exchanger core and a precooling flow structure disposed therein. The heat exchanger core is configured for exchanging heat between a first fluid and a second fluid. The precooling flow structure is coupled to each of the housing and an inlet end of the heat exchanger core with respect to a flow of the first fluid. An interior of the precooling flow structure is configured to convey the first fluid therethrough, The precooling flow structure includes at least one precooling tube extending through the interior of the precooling flow structure with each of the at least one precooling tubes configured to convey the second fluid therethrough in order to precool the first fluid before the first fluid enters the inlet end of the heat exchanger core.

Abstract: A solid state drive (SSD) apparatus includes a case including an air tunnel disposed between an inner plate and an upper wall and an accommodation space between the inner plate and a lower wall. The air tunnel extends in a first direction, and both end parts of the air tunnel are exposed to the outside. A substrate is disposed in the accommodation space. At least one semiconductor chip is disposed on the substrate.

Abstract: Various apparatus are disclosed for lifting heat sinks during insertion of optical modules into transceiver cages (e.g., housings). The apparatus also provide for lifting of the heat sink during removal of the optical modules from the transceiver cages. While the heat sink is lifted during insertion or removal, the heat sink is in contact with the surface of the optical module when the optical module is fully inserted in the transceiver cage. Lifting of the heat sink during insertion and removal of the optical module allows a thermal interface material (TIM) to be placed on the surface of the heat sink in contact with the optical module to improve thermal conduction between the optical module and the heat sink.

Abstract: Provided is a high heat radiation thin film. The high heat radiation thin film may comprise a metal substrate, and a carbon layer which is disposed on the metal substrate and is thicker than 2.5 nm and thinner than 10 nm.

Abstract: A double-sided expanded plate riveting structure and a double-sided expanded plate riveting method are disclosed. By providing an upright portion, a bottom end of the upright portion is bent toward at least one side to form a folded portion, and at least one side of the folded portion partially extends beyond a plane corresponding to an outer side of an expanded structure for a press head to perform a pressing operation, which effectively avoids a bend and deformation of a double-sided expanded plate in the riveting process.

Abstract: A cooling section (2) is situated in a rolling line or upstream or downstream of the rolling line. A hot metal rolled material (1) is cooled in the cooling section. A control device (13) of the cooling section (2) dynamically determines setpoint actuation states (S1*) for control valves (10) situated in supply lines (8) and actuates the control valves (10) accordingly. Main flows (F1) of a liquid, water-based coolant (7) are supplied to application devices (6) of the cooling section (2) via the supply lines (8) in accordance with the actuation. The supply lines (8) conduct the main flows (F1) to buffer regions (12) of the application devices (6). Proceeding from there, cooling flows (F) of the coolant (7) are applied to the hot rolled material (1). The control device (13) also dynamically determines setpoint actuation states (S2*) for active devices (16) and actuates the active devices (16) accordingly.

Abstract: Provided is a cover for pressing a printed circuit board on a heat sink, the cover comprising a metal sheet and one or more domes arranged in the metal sheet, wherein each dome is associated with one or more slits in the shape of ring segments in the metal sheet, the ring segment-shaped slits being provided in the metal sheet side by side and spaced apart from each other, the ring segment-shaped slits surrounding the dome they are associated with. At least at one end of each ring segment-shaped slit a slit extension may be provided in the metal sheet, the slit extension at least in part pointing away from the dome the ring segment-shaped slit is associated with. Further provided is an electronic appliance that includes such a cover, a heat sink and an electronic circuit board sandwiched there between.

Abstract: Embodiments of the present disclosure generally relate to an electrostatic chuck assembly suitable for use in cryogenic applications. In one or more embodiments, an electrostatic chuck assembly is provided and includes an electrostatic chuck having a substrate supporting surface opposite a bottom surface, a cooling plate having a top surface, where the cooling plate contains an aluminum alloy having a coefficient of thermal expansion (CTE) of less than 22 ppm/° C., and a bonding layer securing the bottom surface of the electrostatic chuck and the top surface of the cooling plate, where the bonding layer contains a silicone material.

Abstract: A thermal bridge includes an upper bridge assembly including upper plates arranged in an upper plate stack and a lower bridge assembly including lower plates arranged in a lower plate stack. Outer ends of the lower plates face and thermally couple to an electrical component. The upper plates and the lower plates are arranged in plate pairs. A spring element forces the upper plates and the lower plates of the plate pairs apart. The upper plates include upper limit tabs and the lower plates include lower limit tabs. The upper limit tabs and the lower limit tabs operate to limit spreading apart of the upper plates and the lower plates against the opening forces of the spring element.

Abstract: A fan tray for an enclosure containing devices to be cooled is provided. The fan tray includes a top cover having a top surface and a bottom surface facing opposite the top surface, wherein, when the fan tray is mated to the enclosure, (i) the top surface is exposed relative to outside the enclosure and (ii) the bottom surface is contained within the enclosure, a fan-receiving portion extending from the bottom surface of the top cover and configured to receive one or more fans, and one or more electrical connectors configured to provide electrical power to the one or more fans.

Abstract: Embodiments include heat pump systems with gas bypasses and related methods. In one embodiment, a system may include a gas bypass tank having a bypass inlet, a liquid outlet, and a vapor outlet, and a first splitting valve having a first splitter outlet in fluid communication with the bypass inlet, a first splitter inlet in fluid communication with the liquid outlet, and a first switching path configured to switch between a first conduit path in fluid communication with a first coil system and a second conduit path in fluid communication with a second coil system.

Abstract: An apparatus includes a motherboard with a processor socket, a load frame connected to the motherboard adjacent to at least two sides of the processor socket, and a processor retainer rotatably connected to the load frame, the processor retainer being positionable in a closed position, an opened position, and an installation position. The processor retainer extends over the processor socket when the processor retainer is in the closed position.

Abstract: A computer includes a casing, an electronic assembly, and a water cooling assembly. The casing, forms an accommodation space. The casing has an interior fluid channel located at at least one side of the casing, and a fluid inlet and a fluid outlet which are in fluid communication with the interior fluid channel. The electronic assembly is located in the accommodation space. The water cooling assembly includes a first water block and a radiator. The first water block is in thermal contact with the electronic assembly, the first water block, the radiator, and the interior fluid channel located at the at least one side of the casing are in fluid communication with each other so as to form a circulation channel, and the fluid inlet and the fluid outlet of the casing are respectively in fluid communication with the radiator and the first water block.

Abstract: Provided is an outdoor unit of an air conditioner. The outdoor unit of the air conditioner includes a heat exchanger, a base arranged below the heat exchanger and including a first part including a drain hole formed to correspond to the heat exchanger to discharge water generated from the heat exchanger, and a second part formed to have a stepped portion with the first part, and a leg provided below the base and including a panel formed to slope while being spaced apart from the base such that the water is discharged through the drain hole.

Abstract: A power module according implementations of the present disclosure includes a bonding layer for bonding two adjacent members. The bonding layer is formed by melting, applying, and solidifying a bonding material that has excellent thermal conductivity and electrical conductivity. The melted bonding material includes a plurality of anti-tilting members. The two members bonded during the process of solidifying the melted bonding material are supported by the plurality of anti-tilting members. This may allow tilting caused during the formation of the bonding layer to be suppressed.

Abstract: A semiconductor device includes a circuit substrate, a semiconductor package, and a metallic cover. The semiconductor package is disposed on the circuit substrate. The metallic cover is disposed over the semiconductor package and over the circuit substrate. The metallic cover comprises a lid and outer flanges. The lid overlies the semiconductor package. The outer flanges are disposed at edges of the lid, are connected with the lid, extend from the lid towards the circuit substrate, and face side surfaces of the semiconductor package. The lid has a first region that is located over the semiconductor package and is thicker than a second region that is located outside a footprint of the semiconductor package.

Abstract: A head-mountable device can provide a cooling module that effectively manages heat while also minimizing noise, vibration, leakage, power consumption, size, and weight. To dissipate heat, the cooling module with a fan can be operated to move air through a chamber within the head-mountable device. An integrated heat sink can provide heat dissipation properties by drawing heat away from heat-generating components and into the chamber. The integrated heat sink can include a base plate that defines at least a portion of the chamber in which the blades of the fan are positioned. The integrated heat sink can further include fins between the chamber and an outlet. The fins can be integrated with the base plate to maximize heat dissipation and reduce the number of interfaces between separate parts.

Abstract: An apparatus includes at least one heat pipe that is adapted to be thermally coupled to an integrated circuit and has an evaporator portion and a first condenser portion, wherein the first condenser portion extends away from the evaporator portion; a first plurality of cooling fins that is attached to the first condenser portion; a first movable support that is thermally coupled to the first condenser portion and is configured to move a second plurality of cooling fins relative to the first plurality of cooling fins; and the second plurality of cooling fins, which is attached to the first movable support.

Abstract: A system for designing a circuitry configuration of heat-exchanger units includes an interface to acquire design parameters the heat-exchanger units, a memory to store computer-executable programs including a relaxed decision diagram formation module, and a processor, in connection with the memory, configured to perform the computer-executable programs. The computer-executable programs include steps of providing a configuration of the heat-exchanger units, providing the design parameters of the heat-exchanger units acquired via the interface, generating a relaxed decision diagram based on the design parameters, creating constraints with respect to connections of the heat-exchanger units according to the relaxed decision diagram, and generating feasible configurations of the heat-exchanger units by a mixed-integer-programing method using the constraints.

Abstract: An aluminum alloy brazing sheet may include a sacrificial material having a function of a brazing material on at least one surface of a core material, wherein the sacrificial material has a composition containing: in a mass %, 2% to 5% of Si; 3% to 5% of Zn; and an Al balance with inevitable impurities the core material is made of an Al—Mn-based alloy, an in the core material before brazing, Al—Mn based secondary particles having an equivalent circle diameter of 100 to 400 nm are distributed with a number density of 0.3 to 5 particles/?m2.

Abstract: A human-interface device and a guiding apparatus for a visually impaired user including such human-interface device. The human-interface device includes a tactile module arranged to provide a set of haptic signals to a user, wherein the tactile module has a plurality of tactile units each arranged to provide at least a first haptic signal and operable to cooperate with one or more of other tactile units to provide different haptic signals.

Abstract: In a housing of a vehicle control device are formed a suction port for taking outdoor air and a discharge port for discharging air taken in through the suction port. A flow passage that connects the suction port and the discharge port is formed inside the housing. A blocking member, a radiator, and a blower are provided in the flow passage. The blocking member is provided at a position where the blocking member faces at least a portion of an opening face of the suction port in the flow passage and a distance between the blocking member and the suction port is in a predetermined range.