Abstract: Example implementations relate to an electronic system providing a thermal management of a removable device when connected to a host device of the electronic system. The host device includes a cooling component having a first surface, and a plurality of first blocks of magnetic materials coupled to the cooling component. The removable device includes a heat spreader having a second surface, a plurality of second blocks of magnetic materials coupled to the heat spreader, and a TIM disposed on the second surface. The removable device is detachably connectable to the host device. When the removable device is connected to the host device, and magnetic forces applied by at least one of the first blocks or second blocks to couple respective blocks to each other, the first blocks is aligned with the second blocks such that the first surface is in thermal communication with the second surface through the TIM.

Abstract: A cooling table includes a first portion, a second portion, a first path, a second path and a third path. An electrostatic chuck is provided on the first portion, and the first portion is provided on the second portion. The first path is provided within the first portion, and the second path is provided within the second portion. The third path is connected to the first path and the second path. A chiller unit is connected to the first path and the second path. The first path is extended within the first portion along the electrostatic chuck, and the second path is extended within the second portion along the electrostatic chuck. A coolant outputted from the chiller unit passes through the first path, the third path and the second path in sequence, and then is inputted to the chiller unit.

Abstract: Modular heat sinks are provided that support configurations using combinations of cooling and expansion card components, whereby the expansion card may support coupled devices. Heat sinks may include a fin set that is permanently fixed to the heat sink and a second fin set that can be decoupled from a location on the heat sink base. The second fin set can instead be replaced on the heat sink base by an expansion card connector, such as a M.2 expansion card connector. In some embodiments, an expansion card connector also includes a fin set, with the expansion card connector fastened on top of that fin set. The fin set to which the expansion card connector is fastened may include multiple tiers of fins of different heights that may conform to the space available to the heat sink, thus maximize cooling capabilities of the heat sink while also supporting an expansion card.

Abstract: The present utility model provides an electronic device and a power module thereof. The power module of the present utility model includes: a first circuit board, a second circuit board, a radiator and a power device; where the heat dissipation surface of the power device is in thermal contact with the radiator, and the heat dissipation surface of the power device is parallel to the first surface of the first circuit board. The present utility model improves the heat dissipation efficiency of the power device by mounting the power device on the second circuit board and thermally contacting the radiating surface of the power device with the radiator, and at the same time, the arrangement of the second circuit board also makes the assembly of the entire power module more convenient.

Abstract: A mounting frame apparatus is provided for embedding cards within an electronics system and includes a multi-card swappable subsystem. The apparatus further includes a chassis for containing the multi-card swappable subsystem. One or more heatsinks are used for cooling cards disposed in the four-card swappable subsystem.

Abstract: Provided are an electric device and a heat radiator capable of suppressing vibration caused by external stress of the heat radiator. The electric device includes a substrate; an electronic component attached to the substrate; and a heat radiator including at least one first fin, and a second fin facing the first fin, thermally connected to the first fin, and provided at a position closer to an attachment surface of the substrate than any of the first fins. The heat radiator is thermally connected to the electronic component, and one end of an attachment member is attached to the first fin, and another end of the attachment member is attached to the substrate. The attachment member has a height with respect to the attachment surface that is higher than a thickness of the first fin.

Abstract: An automobile beverage holder including a holding assembly, a mounting assembly and a vehicle assembly is disclosed. The holding assembly includes a beverage holder having a sizing platform that allows for accommodating different size beverage containers within the beverage holder. The beverage holder includes a vent opening which allows for an air conditioning system to blow air for cooling or heating of the beverage container within the beverage holder. A hingedly mounted lid covers the beverage holder for accelerated heating or cooling. The mounting assembly includes a vent bracket which mounts to the beverage holder to allow for clips of the mounting assembly to attach to an air vent of an automobile. The clips allow for retrofitting of the beverage holder to existing automobiles. The clips also allow for quick attaching and detaching of the beverage holder. Importantly, the beverage holder is made of a temperature transferring material.

Abstract: The present disclosure provides a power module, a power module assembly and an assembling method thereof. The power module assembly includes a housing, a resilient bracket, a circuit board, a power device and a fastening unit. The housing includes a first heat-dissipation surface. The resilient bracket is pre-fastened on the housing. The resilient bracket is located near the first heat-dissipation surface and configured with the first heat-dissipation surface to form an accommodating space. The circuit board is configured to assemble on the housing. The power device is plugged in the circuit board and accommodated in the accommodating space. The fastening unit is pre-fastened on the housing and pressing the resilient bracket. While the resilient bracket pushes against the power device, the power device is attached to the first heat-dissipation surface.

Abstract: A cooling apparatus for a pluggable module comprises a pluggable module cage to house the pluggable module and a heat pipe coupled with a hot interface at one end and a cold interface at another end. The cooling apparatus further comprises an attachment mechanism for attaching the hot interface and the heat pipe to the pluggable module. The attachment mechanism permits mobility required to insert and secure the pluggable module in place inside the pluggable module cage to allow a good thermal coupling between the hot interface and the pluggable module.

Abstract: An electrostatic chuck for retaining a substrate is provided herein. In some embodiments, an electrostatic chuck for retaining a substrate may include a susceptor including an electrically conductive susceptor base having one or more cooling channels formed in an upper surface thereof; a raised central support disposed over the one or more cooling channels; and a dielectric top plate disposed on the raised central support, wherein the dielectric top plate has an embossed top surface, and wherein the dielectric top plate and raised central support include a plurality of holes to facilitate delivery of a cooling gas one or more cooling channels to a backside of the substrate when disposed on the embossed top surface of the dielectric top plate.

Abstract: A substrate treatment apparatus includes a brush moving mechanism which moves a shaft to which a cleaning brush is attached. The brush body includes a substrate contact portion of a pillar-shaped portion. The substrate treatment apparatus further includes a correcting member and a relatively-positioning mechanism. When the correcting member is placed in a target position, a contact portion of the correcting member overlaps an object portion which is a combination of a design contact portion and a belt-shaped annular portion in an outer surface of a design pillar-shaped portion of a design body of a design brush. The contact portion is formed to have an inverted shape of the object portion of the design brush, and a portion of the contact portion, which corresponds to the belt-shaped annular portion, is a center-axis facing surface which faces a center axis of the shaft.

Abstract: A surgical instrument includes a heat generating component, a heat sink, and elongate shaft, an elongate thermal conduit, and a movable contact structure. The elongate shaft extends from the heat generating component to the heat sink. The elongate thermal conduit is coupled to the heat generating component and extends within the elongate shaft between the heat generating component and the heat sink. The movable contact structure is positioned within the heat sink and is thermally coupled between the elongate thermal conduit and the heat sink. The elongate thermal conduit extends into the movable contact structure and the movable contact structure is movable relative to the heat sink.

Abstract: A plasma processing apparatus includes: a base that has an electrode body provided with a placing surface on which a substrate is placed and a pedestal which supports the electrode body; a lid that is liftable and lowerable with respect to the base and forms a sealed space for performing plasma processing on the substrate placed on the placing surface by being lowered to come into close contact with the pedestal; a cover that is provided integrally with the lid and covers at least a part of an outer edge of the substrate placed on the placing surface when the sealed space is formed; and a guide that is disposed around the electrode body.

Abstract: Embodiments described herein generally related to a substrate processing apparatus. In one embodiment, a process kit for a substrate processing chamber disclosed herein. The process kit includes an edge ring having a top surface and a bottom surface. An adjustable tuning ring is positioned beneath the bottom surface of the edge ring. The adjustable tuning ring has an upper surface and a lower surface. The lower surface is configured to interface with an actuating mechanism configured to move the adjustable tuning ring relative to the edge ring.

Abstract: A base station for an activity monitoring system that facilitates live monitoring of a plurality of individuals. The base station may include a ventilation channel and a heat sink for cooling a control module disposed within the base station. The base station may be water resistant so as to protect the control module from water damage. The base station may also have an egg-shape for facilitating the drainage of water off the base station and to reduce the force of an impact on the base station.

Abstract: A substrate processing apparatus includes a substrate holder, a rotating mechanism, a processing liquid discharge unit, and a gas discharge unit. The processing liquid discharge unit discharges a liquid flow of a processing liquid such that the liquid flow comes into contact with a landing position in a rotation path of a peripheral portion of an upper surface of the substrate being rotated. The gas discharge unit discharges a first gas flow of an inert gas from above toward a first position upstream from the landing position in a direction of rotation of the substrate in the rotation path, and discharges a second gas flow of the inert gas from above toward a second position upstream from the first position in the direction of rotation of the substrate in the rotation path. The kinetic energy of the second gas flow is lower than the kinetic energy of the first gas flow.

Abstract: An information processing apparatus includes a power supply, a fan that causes air to flow into the power supply, and a power distributor that is disposed in front of or in back of the power supply in a direction of flow of the air due to the fan and that is electrically coupled to the power supply, wherein a vent through which the air passes is formed in a surface of the power distributor that faces the power supply.

Abstract: An information handling system (IHS) includes a node enclosure containing one or more heat-generating functional components. A cold plate is attached to an inner surface of the node enclosure. The cold plate presents a conduction surface to a selected at least one of the one or more heat-generating functional components. A spring is positioned between the inner surface of the node enclosure and the cold plate. The spring positions the conduction surface into conductive proximity with the selected at least one of the one or more heat-generating functional components.

Abstract: A cooling and heating cup holder may include an inner body accommodating a drink container, a heat exchanger including an inlet formed therein while discharging air introduced by the inlet into the inner body through a blower hole, heat exchanging pins provided in the heat exchanger, a thermoelectric element having a first side entirely adhered to a rear surface of the heat exchanger, a heat radiator coupled to a second side of the thermoelectric element, an outer body forming a circulating space between the inner body and the outer body, and a blower fan transferring air to the inlet of the heat exchanger.

Abstract: A device may have: a frame section having a cage with a first receiving portion and a second receiving portion, the second receiving portion receiving a module; a first plate having an end, the first plate being received by the first receiving portion; a heat pipe having a first end attached to the end of the first plate and having a second end; a second plate attached to the second end of the heat pipe; and a spring attached to the first plate to bias the first plate against the module, the first plate being capable of receiving heat dissipated by the module, the heat pipe being capable of receiving the heat received by the first plate and transferring the heat to the second plate, the second plate receiving the heat transferred by the heat pipe and dissipating the received heat.

Abstract: Methods and related apparatus support a work piece during a physical vapor deposition. An aluminium support having a support surface coated with a heat absorbent coating is provided. The support is cooled to around 100° C. and a PVD process is performed such that, with cooling, the work piece temperature is between 350° C. and 450° C. The coating is inert and/or ultra-high voltage compatible.

Abstract: The embodiments described herein generally relate to a method and apparatus for providing a back up system of Directional and Inclination (D&I) information to be gathered and transmitted in addition to primary D&I sensors currently employed in industry. A downhole probe assembly including primary sensors, back up sensors and a controller is disclosed. The primary sensors comprise primary accelerometers and primary magnetometers configured to gather information relating to each of orthogonal axes X, Y and Z. The back up sensors comprise back up accelerometers configured to gather information relating to each of orthogonal axes X, Y and Z, the back up accelerometers being solid state accelerometers. The controller is in electrical communication with the primary sensors and the back up sensors.

Abstract: A coupling system as a thermal interface between a waste-heat generator and a waste-heat receiver includes a first body having a first contact area, and a second body having a second contact area, with the first and second contact areas abutting one another for heat exchange. A tongue and groove connection having at least one tongue and at least one groove extends in a longitudinal direction for connecting and tensioning the first and second contact areas.

Abstract: Methods and heat treatment apparatus for heating a substrate and any layer carried on the substrate during a bake process. A heat exchange gap between the substrate and a heated support is at least partially filled by a gas having a high thermal conductivity. The high thermal conductivity gas is introduced into the heat exchange gap by displacing a lower thermal conductivity originally present in the heat exchange gap when the substrate is loaded. Heat transfer across the heat exchange gap is mediated by the high thermal conductivity gas.

Abstract: A processing device for producing semiconductor layers and coated substrates treated with elemental selenium and/or sulphur includes an evacuable processing chamber for receiving a substrate to be processed. The substrate has a metal layer and/or a layer containing metal. A heating device provides convective heating of the substrate to a predetermined temperature. A first source of elementary selenium and/or sulphur vapor is located outside the processing chamber and connected to the processing chamber via a first feed line and/or a second source of elementary selenium and/or sulphur vapor is located inside the processing chamber. The elementary selenium and/or sulphur vapor is guided past the metal layer and/or layer containing metal, chemically reacting said layer with selenium or sulphur in a targeted manner. The substrate is heated and the elementary selenium and/or sulphur vapor is mixed and guided past the substrate by forced convection of a gas conveying device.

Abstract: The present invention relates to a substrate gripping apparatus includes a base, a plurality of support posts which are vertically movable relative to the base, a lifting mechanism configured to lift the support posts, and a substrate holder and a substrate guide member mounted to each of the support posts. Each of the support posts includes a relative movement mechanism configured to move the substrate holder in such a direction that the substrate holder releases a peripheral portion of a substrate, while raising the substrate guide member relative to the substrate holder, when the support post moves upward, and to move the substrate holder in such a direction that the substrate holder grips the peripheral portion of the substrate, while lowering the substrate guide member relative to the substrate holder, when the support post moves downward.

Abstract: The present invention provides: an epitaxial film forming method capable of fabricating a +c-polarity epitaxial film made of a Group III nitride semiconductor by sputtering; and a vacuum processing apparatus suitable for this epitaxial film forming method. In one embodiment of the present invention, a Group III nitride semiconductor thin film is epitaxially grown by sputtering on an ?-Al2O3 substrate heated to a desired temperature by using a heater. First, the ?-Al2O3 substrate is disposed on a substrate holder including the heater in such a way that the ?-Al2O3 substrate is disposed away from the heater by a predetermined distance. Then, an epitaxial film of a Group III nitride semiconductor thin film is formed on the ?-Al2O3 substrate in the state where the ?-Al2O3 substrate is disposed away from the heater by the predetermined distance.

Abstract: A process kit comprises a ring assembly that is placed about a substrate support in a substrate processing chamber to reduce deposition of process deposits on the chamber components and on an overhang edge of the substrate. The process kit includes a deposition ring, cover ring, and anti-lift bracket, and can also include a unitary shield. A target is also described.

Abstract: Embodiments of electrostatic chucks for substrate processing are provided herein. In some embodiments, an electrostatic chuck may include a puck for supporting a substrate, the puck formed from a dielectric material and having a chucking electrode disposed within the puck proximate a support surface of the puck to electrostatically retain the substrate when disposed on the puck; a base having a ring extending from the base to support the puck; and a spacer disposed between the base and the puck to support the puck above the base such that a gap is formed between the puck and the base, wherein the spacer supports the puck proximate a peripheral edge of the puck.

Abstract: A heat dissipating device includes a base and a heat dissipating fin. The base includes an accommodating recess formed thereon. The heat dissipating fin includes a heat dissipating portion and a fixing portion, wherein the heat dissipating portion extends from the fixing portion, and the fixing portion has a first recess structure. The base and the heat dissipating fin are combined with each other by a punching process, such that the fixing portion is fixed in the accommodating recess in a tight-fitting manner and a first side wall of the accommodating recess is embedded in the first recess structure.

Abstract: An electronic device includes a motherboard, a plurality of heating modules arranged on the motherboard, a first electronic module arranged on a front side of the motherboard along a longitudinal direction, a second electronic module stacked above the first electronic module, a wind scooper and a fan module being located on a rear side of the motherboard along the transverse direction and facing the heating modules and the second electronic module. The wind scooper covers the heating modules, and has a partition board to form a lower-layer airflow passage and an upper-layer airflow passage. The wind scooper guides a first airflow from the fan module to flow through the heating modules along the lower-layer airflow passage, and guides a second airflow from the fan module to flow to the second electronic module through the upper-layer airflow passage, without flowing through the heating modules.

Abstract: This disclosure relates to an apparatus and method 10 for protecting an electronic circuit from an airflow. The apparatus 10 comprises a base 12, wherein said base 12 comprises a cover means for covering at least part of the electronic circuit. The apparatus further comprises a guide means for guiding an airflow around the electronic circuit.

Abstract: The purpose of the present invention is to provide a power semiconductor device which has a light weight, high heat dissipation efficiency, and high rigidity. The power semiconductor device including a base 1, semiconductor circuits 2 which are arranged on the base 1, and a cooling fin 3 which cools each of the semiconductor circuits 2, in which one or more protruding portions 1a, 1b are formed on the base 1, widths of the protruding portions 1a, 1b in a direction parallel to the base 1 surface being longer than a thickness of the base 1, thereby providing power semiconductor devices 100, 200, 300, 400 which have a light weight, high heat dissipation efficiency, and high rigidity.

Abstract: A semiconductor switch insulation protection device and a power supply assembly. Said semiconductor switch protection device comprises a semiconductor switch having a metal component, an insulation component, and a pin installed at a bottom plane of said insulation component, and an insulation protection cover having a body with a second hole and a side belt. A front surface of said metal component is installed on a back surface of said insulation component. A metal portion, with a first hole and having a first height, is extended above an upper plane of said insulation component. Said second hole and said side belt are extended toward a back surface of said body, respectively, to form a hole column having a second height and a sidewall having a third height. Said metal portion is disposed in a groove formed by said back surface of said body, hole column and sidewall.

Abstract: A sample temperature control chamber is described for a benchtop X-ray machine and/or full-protection X-ray machine, which comprises (a) a first chamber part (11) and a second chamber part (12) which can be connected together and are configured so as to form a closed chamber, (b) a sample holder, (c) an integrated temperature control device for controlling the temperature of a sample (P) which is provided on the sample holder, and (d) an active cooling system for dissipating heat from the sample temperature control chamber, the active cooling system comprising a heat sink and/or a fan. A system for X-ray-based analysis of a sample, in particular for X-ray diffraction measurements, is also described.

Abstract: A heat dissipating device includes a chamber with an evaporation portion and a condensation portion, the chamber including a refrigerant. The chamber further includes an evaporation portion scraping brush provided corresponding to the evaporation portion, the evaporation portion scraping brush being able to sweep relative to an inner surface of the evaporation portion. A refrigerant liquid film is formed on the inner surface of the evaporation portion. Since the fluid refrigerant is uniformly applied to an inner surface of the evaporation portion to form a liquid film, the heat dissipating ability of the heat pipe heat dissipating device is improved, and the heat dissipating uniformity of the heat pipe heat dissipating device is enhanced. A heat dissipating method is also provided.

Abstract: A heat dissipation device includes a base and a fastener. The fastener includes a neck portion, a head portion formed at one end of the neck portion, and an engaging portion formed at another opposite end of the neck portion. The base defines a receiving portion through the base. The receiving portion includes an inserting hole and a mounting hole communicating with the inserting hole. A flange extends upwardly from the base toward the mounting hole. The engaging portion extends through the inserting hole from a top of the base to make the neck portion enter the inserting hole. The neck portion is then crushed into the mounting hole from the inserting hole. A top face of the head portion abuts the flange, a bottom face of the head portion abuts the base.

Abstract: The add-on heat sink includes an elongate base having a plurality of fins extending from a surface thereof. A magnetic layer is disposed on the bottom of the base, which permits the add-on heat sink to be installed on any ferromagnetic heated surface. The magnetic layer is composed of either a polymer matrix having a plurality of thermally conductive structural components and a plurality of magnetic particles dispersed therein, or a thermally conductive polymer having magnetic particles dispersed therein. Alternatively, if the heated surface is not ferromagnetic, the heat sink may be magnetically attached by adhesively attaching mating magnetic and ferromagnetic pads to the heat sink and to the heated surface. This configuration allows the add-on heat sink to be installed with minimal footprint. Optionally, a fan may be magnetically attached to the heat sink to cool the heated surface by both conduction and convection.

Abstract: Retainers are described that comprise at least one center body component comprising a plurality of center body troughs, and at least one compatible component comprising a plurality of compatible troughs, wherein at least part of the plurality of the compatible troughs couple with at least part of the plurality of center body troughs. In addition, thermal displacement devices are described that incorporate at least one retainers and at least one additional component, wherein the at least one retainer is coupled at least in part to the at least one additional component through a contact area or a substrate, surface or combination thereof, wherein the at least one retainer is coupled with the substrate, surface or combination thereof through a contact area.

Abstract: A cold chassis and method of making a cold chassis for electronic modules featuring the fabrication of individual brazed cooling ribs each including microchannels along the length thereof and a peripheral flange. A set of adjacent ribs are secured together and assembled onto at least one face of a frame member. The rib flanges are sealed (e.g., friction stir welded) with respect to the frame member.

Abstract: A heat dissipating device includes a base, a heat dissipating fin and a protruding member. The heat dissipating fin includes a heat dissipating portion, a fixing portion fixed in the base, and a first overflow-proof structure. The first overflow-proof structure is connected between the heat dissipating portion and the fixing portion. A width of the first overflow-proof structure is larger than a width of the heat dissipating portion. A first hole is formed on the heat dissipating portion and the first overflow-proof structure. The protruding member includes a second overflow-proof structure and a first protruding portion protruding from an upper surface of the second overflow-proof structure. The protruding member is disposed in the first hole, and a lower surface of the second overflow-proof structure and a lower surface of the first overflow-proof structure are coplanar.

Abstract: An electrical equipment chassis includes a frame open to a first side and an opposite second side and a power board located near a mid-plane of the chassis coupling power supply modules to first networking modules and a second networking module. A first region open to the first side can receive first power supply modules. A second region open to the first side is adjacent to the first region and can receive the first networking modules and the second networking module oriented with a first orientation. A third region open to the second side can receive fan trays with fans and third networking modules. The third networking modules are oriented orthogonal to the first orientation. The power board at least partially separates the first and third regions and only partially separates the second and third regions. The chassis permits air flow from the first side to the second side.

Abstract: A temperature control device for temperature control of a component is provided, whereby the component is in an electrical and/or an electronic component, having a tube and a housing element, whereby a first fluid can flow through the tube and a second fluid can flow around the temperature control device. The housing element is formed by a cup-like cover, which is connected to the tube and forms a receiving area for the component in which the component is taken up.

Abstract: A device for use with a heat source, a multi-well sample plate, and a plurality of samples includes a substantially solid block of thermally conductive material having a first side and a second side generally opposite the first side; a first array of apertures on the first side of the block that aligns with wells of a first portion of the sample plate; and a second array of apertures on the second side of the block; wherein, in a first mode, the first array of apertures retains and engages with the sample plate to conduct heat from the heat source to the plate, and in a second mode, the second array of apertures retains and engages with the samples to conduct heat from the heat source to the samples. Two blocks may be combined together to accommodate a standard 96 well plate.

Abstract: An electronic device includes a circuit board, a tray abutting a bottom surface of the circuit board, and a heat sink attached to a top surface of the circuit board. The circuit board includes a heat generating chip, and a number of through holes defined in the circuit board. The tray includes a number of clipping members. A number of elastic members are attached to the heat sink. The number of clipping members extend through the number of through holes and engaged with the plurality of elastic members, and the number of elastic members are deformable to disengage from the number of clipping members.

Abstract: An air duct includes a top wall and a blocking plate. The top wall includes a limiting block, a resilient arm, and a pair of hooks. A latching slot is defined between the pair of hooks. The blocking plate is rotatably secured to the top panel and includes a body and a shaft connected to the body. The shaft is rotatably engaged in the latching slot. The limiting block and the resilient arm abut two opposite surfaces of the body and block the body preventing the blocking plate from rotating relative to the top wall. The blocking plate is adapted to abut an electronic component and guide airflow towards the electronic component.

Abstract: A cooling system includes an evaporator assembly configured to thermally contact one or more memory modules and absorb thermal energy from the one or more memory modules. A condenser assembly is thermally coupled to the evaporative assembly and configured to receive and dissipate at least a portion of the thermal energy absorbed by the evaporative assembly.

Abstract: A motor bearing heat dissipation structure includes a metal base, a heat conducting element connected to the metal base and including a wall portion and an extended portion, and a plastic bearing cup located around an outer side of the wall portion of the heat conducting element and fixed to the metal base. The plastic bearing cup internally defines a bearing receiving hole. The extended portion is horizontally extended from an upper end of the wall portion toward a center of the plastic bearing cup. A bearing is received in the bearing receiving hole and seated on the extended portion, so that heat produced by the bearing when it rotates along with a rotary shaft of a motor is transferred from the extended portion of the heat conducting element to the metal base for dissipation. A fan using such motor bearing heat dissipation structure is also disclosed.

Abstract: A threaded cooling apparatus includes a head having a heat exchanger and a shaft having a threaded section configured to mechanically fasten the head to a structure. The heat exchanger is configured to exchange heat with a coolant flowing through the head. The shaft also includes first and second cooling channels. The first cooling channel is configured to deliver the coolant to the heat exchanger, and the second cooling channel is configured to exhaust the coolant from the heat exchanger. The apparatus may also include a first seal between the head and the structure that is configured to reduce or prevent coolant loss. The apparatus may further include a second seal that is configured to reduce or prevent coolant flow between the first and second cooling channels that bypasses the heat exchanger.

Abstract: Heat exchanger comprising at least a heat exchanger space, a burner space and a water conducting channel, wherein the heat exchanger comprises a body having at least one slot and at least one cassette insertable into said at least one slot, said cassette comprising at least part of a water conducting channel.