Abstract: The invention relates to an electric conductor (L), made of an electrically conductive material comprising aluminum. The electric conductor is surrounded at least in a region intended for the connection of an electric contact element by a protective layer (3) serving the corrosion protection. The conductive material (2) is formed around a steel wire (1) having a diameter between 0.05 mm and 0.2 mm and a fracture strength of at least 1000 N/mm2 and having such a wall thickness that a conductor (L) having a diameter between 0.10 mm and 0.40 mm is obtained, onto which the protective layer (3) is applied having a thickness of at least 0.5 ?m.

Abstract: One method of fabricating hybrid conductors includes complexing conductive metal elements (e.g., silver, gold, copper), transition metal elements, alloys, wires, or combinations thereof, with carbon nanotube materials. In the alternative, the hybrid conductors may be formed by doping the carbon nanotube materials in salt solutions.

Abstract: An aluminum alloy, an aluminum alloy wire, an aluminum alloy stranded wire, a covered electric wire, and a wire harness that are of high toughness and high electrical conductivity, and a method of manufacturing an aluminum alloy wire are provided. The aluminum alloy wire contains not less than 0.005% and not more than 2.2% by mass of Fe, and a remainder including Al and an impurity. It may further contain not less than 0.005% and not more than 1.0% by mass in total of at least one additive element selected from Mg, Si, Cu, Zn, Ni, Mn, Ag, Cr, and Zr. The Al alloy wire has an electrical conductivity of not less than 58% IACS and an elongation of not less than 10%. The Al alloy wire is manufactured through the successive steps of casting, rolling, wiredrawing, and softening treatment.

Abstract: A wire bonding joint structure of a joint pad in which electroless surface treatment plating layers of joint pads configured by a nickel layer/a palladium layer/a gold layer are connected to each other by a metal wire and when the metal wire is joined to the electroless surface treatment plating layer, a depth of the wire bonding pad formed by wedge deformation is 1.0 m or more. The electroless surface treatment layer of the joint pad can lower strength and hardness of the wire bonding pad of which the surface is treated to improve follow-up capability between a gold wire and the bonding pad, such that a joint area between the gold and the bonding pad is maximized, thereby increasing joinability at the wire bonding finish process by wedge pressure and greatly improving wire bonding workability.

Abstract: A center conductor for a cable is provided, the center conductor includes: an interior portion comprising steel and an exterior portion formed over the interior portion. The exterior portion includes at least one layer comprising a metallic material differing from the steel interior portion. The exterior portion is configured to design specific signal loss characteristics, at various operating frequencies, of a signal flowing through the exterior portion.

Abstract: Bioelectrodes, methods of making bioelectrodes and methods of using bioelectrodes are provided. The bioelectrodes have an electrically-conductive substrate coated with an electroconductive polymer. The bioelectrode exhibits ohmic behavior over a range of about 1 Hz to about 100 KHz, where ohmic behavior means that the value of the impedance is independent of the signal frequency over the range of interest. The bioelectrode can transmit or receive an electrical signal between the electrically conductive substrate and the biological component through the conductive polymer.

Abstract: A wire structure, which may be configured for a semiconductor device, is disclosed. The wire may include an elongate flexible core formed of a conductor material and a cladding layer covering an outer surface of the core. The cladding layer may be a conductor. In various aspects the cladding layer and core have a different grain sizes. An average grain size of the core material may several orders of magnitude greater than an average grain size of the cladding layer material. The cladding layer may be an alloy having a varying concentration of a minor component across its thickness. Methods of forming a wire structure are also disclosed.

Abstract: The conductive paste contains the following dispersed in a binder resin dissolved in a solvent: a plurality of particles comprising aluminum and/or an aluminum-containing alloy; and an oxide-comprising powder. The oxide contains vanadium with a valence no greater than 4 and a glass phase. In the method for manufacturing an electronic component, the conductive paste is applied to a substrate and fired, forming electrode wiring. The electronic component is provided with electrode wiring that has: a plurality of particles comprising aluminum and/or an aluminum-containing alloy; and an oxide affixing the particles to a substrate. The oxide contains vanadium with a valence no greater than 4. A compound layer containing vanadium and aluminum is formed on the surfaces of the particles, and the vanadium in the compound layer includes vanadium with a valence no greater than 4. This results in an electrode wiring with high reliability and water resistance.

Abstract: The object of the invention is an electrode comprising a continuous current collector (1) wherein 50% or more of the surface of said collector has a roughness Ra1 comprised between 0.8 and 15 ?m, measured for a base length comprised between 2 and 200 ?m, said collector being coated with a mixture (2) comprising active carbon having a specific surface area greater than or equal to 500 m2/g and a binder comprising a mixture of at least one cellulosic compound and at least one styrenic copolymer. The object of the invention is also an asymmetric supercapacitor comprising at least one electrode according to the invention. The invention also relates to a method for making a carbon electrode for an asymmetric supercapacitor.

Abstract: The present invention is directed to a method for forming a patterned conductive film, which comprises the step of bringing a substrate having a layer made of platinum microcrystal particles formed thereon in a pattern and a complex of an amine compound and an aluminum hydride into contact with each other at a temperature of 50 to 120° C. According to the present invention, there is provided a method for forming a patterned conductive layer, which can ensure electrical bonding with a substrate and also can be suitably applied to various electronic devices, simply without requiring a massive and heavy apparatus.

Abstract: The invention relates to an electro-optical or electromechanical structural component, in particular LED, connector or also stamped grid, or sliding element, consisting of a rolled metal substrate of a metal strip or a sheet produced therefrom and made of Cu or a Cu alloy strip, Al or an Al alloy strip, Fe or a Fe alloy strip, Ti or a Ti alloy strip, Ni or a Ni alloy strip or a stainless steel strip, which has a specially structured surface. The structure of the surface allows joining using optical methods even in the case of highly reflective surface coatings and simultaneously improves the functional properties of the components used.

Abstract: A method of manufacturing a composite conductive component comprising the steps of providing at least two blanks of metallic material, said blanks consisting of dissimilar metallic materials; placing said blanks in edge to edge or in partially overlapping relationship with one another, solid state joining said blanks to each other, by rolling or welding, so as to form a composite body, rolling said composite body along the joint over the entire width of the composite body to reduce the thickness thereof, and cutting the rolled composite body across the joint to produce at least two composite conductive components, each comprising the metallic materials of said at least two blanks and having a joint between said at least two different metallic materials. A composite conductive component comprises at least a first portion of a first metallic material and at least a second portion of a second metallic material, said first and second metallic materials being dissimilar from each other is produced by the method.

Abstract: Disclosed are: an electrically conductive element having high electrical conductivity; a photosensitive material for formation of an electrically conductive element, which is suitable for producing the electrically conductive element; and an electrode. The electrically conductive element comprises: a support; a metal pattern layer comprising an electrically conductive metal; and an electrically conductive microparticle-containing layer comprising needle-shaped electrically conductive microparticles having an average long axis length of from 0.2 ?m to 20 ?m, an average short axis length of from 0.01 ?m to 0.02 ?m, and an aspect ratio of 20 or more, a binder, and a sucrose fatty acid ester.

Abstract: A metallization can be used for components working with acoustic waves. The metallization includes a base having a bottom layer comprising titanium, and an upper layer comprising copper. A top layer of the metallization disposed on the base comprises aluminum.

Abstract: An electrical conductor includes a metallic substrate having a surface and an organic compound coating deposited on the surface. The organic compound coating may comprise a graphene coating, a carbon nanotube (CNT) coating or a blended graphene/CNT coating. The organic compound coating defines a separable interface of the electrical conductor configured to be mated to and unmated from a mating conductor. The organic compound coating is electrically conductive. The organic compound coating has a lower friction coefficient than the surface of the metallic substrate.

Abstract: A semiconductor-device bonding wire includes a core member formed of an electrically-conductive metal, and a skin layer mainly composed of a face-centered cubic metal different from the core member and formed thereon. An orientation ratio of <111> orientations in crystalline orientations <hkl> in a wire lengthwise direction at a crystal face of a surface of the skin layer is greater than or equal to 50%, and the <111> orientations have an angular difference relative to the wire lengthwise direction, the angular difference being within 15 degrees.

Abstract: It is to provide a method for manufacturing a metal electrode having transition metal oxide coating layer and a metal electrode manufactured thereby, which eliminates a contact resistance problem and simultaneously improves electric conductivity of the electrode by using a one body electrode, which is not requiring separate current collector and binder, and further maintains pseudo-capacitance from the redox reaction by coating the metal surface with a transition metal oxide.

Abstract: Provided are an electrode structure capable of suppressing a leakage current, having a high capacitance, allowing an electrical short circuit caused through contact with an electrolyte to be suppressed, and operable to be applied as an anode of a capacitor; a method for manufacturing the electrode structure; and a capacitor including the electrode structure. The method for manufacturing the electrode structure includes: a covering layer formation step of forming on a surface of an aluminum material a covering layer of a dielectric precursor including valve metal; and a reduction heating step of heating in a reducing atmosphere including no carbon the aluminum material having the covering layer formed thereon.

Abstract: A transparent conductive material, including a substantially transparent carbon nanotube layer, and a metal layer deposited onto the carbon nanotube layer, in which the metal layer increases an electrical conductance of the transparent conductive material without substantially reducing an optical transmittance of the transparent conductive material.

Abstract: An arrangement of elongated nanowires that include titanium silicide or tungsten silicide may be grown on the exterior surfaces of many individual electrically conductive microfibers of much larger diameter. Each of the nanowires is structurally defined by an elongated, centralized titanium silicide or tungsten silicide nanocore that terminates in a distally spaced gold particle and which is co-axially surrounded by a removable amorphous nanoshell. A gold-directed catalytic growth mechanism initiated during a low pressure chemical vapor deposition process is used to grow the nanowires uniformly along the entire length and circumference of the electrically conductive microfibers where growth is intended. The titanium silicide- or tungsten silicide-based nanowires can be used in a variety electrical, electrochemical, and semiconductor applications.

Abstract: The present invention provides an electricity transmission body that is capable of realizing both tensile strength and elongation while having high electrical conductivity and that is also capable of adequately preventing poor conductivity attributable to the occurrence of cracking, and a production method thereof. The present invention is an electricity transmission body provided with an Al alloy conductive wire containing an Al alloy that contains 1.2 to 2.2% by mass of Fe, 0.15 to 0.4% by mass of Si, and 0.06 to 0.2% by mass of Cu, with the remainder being formed of Al and unavoidable impurities, and the mass ratio of Ti/Fe being 0.00045 to 0.00750.

Abstract: An electronic-component lead terminal includes a lead terminal one end of which is connectable to an electronic component and the other end of which is connectable to an electrode, and a solder-wicking prevention area formed on a surface of the lead terminal so as to intersect a solder-wicking direction oriented from the other end toward the one end, the solder-wicking prevention area including a plurality of portions projecting to a downstream side in the solder-wicking direction.

Abstract: Disclosed is an electrochemical capacitor which comprises an element, an electrolyte, and an outer case that houses the element and the electrolyte. The element comprises: a negative electrode that is obtained by forming a negative electrode layer on the surface of a collector, the negative electrode layer containing a carbon material in which lithium ions are absorbed; a positive electrode that is obtained by forming a positive electrode layer on the surface of a collector, the positive electrode layer absorbing ions; and a separator that is interposed between the negative electrode and the positive electrode. The electrolyte contains lithium ions. A coating film that contains lithium carbonate is formed on the surface of the carbon material that is contained in the negative electrode layer.

Abstract: Disclosed is a thermally conductive, electrically insulating composite film, including interface layers disposed on the top and bottom surface of a metal substrate, and an insulation layer. Because the film has thermal conductivity and electric insulation properties, it can be disposed between the chips of a stack chip package structure, thereby dissipating the heat in horizontal and vertical directions simultaneously.

Abstract: A manufacturing apparatus for deposition of a material on a carrier body and an electrode for use with the manufacturing apparatus are provided. The manufacturing apparatus includes a housing that defines a chamber. The housing also defines an inlet for introducing a gas into the chamber and an outlet for exhausting the gas from the chamber. At least one electrode is disposed through the housing with the electrode at least partially disposed within the chamber. The electrode has an exterior surface. The exterior surface has a contact region that is adapted to contact a socket. A contact region coating is disposed on the contact region of the electrode for maintaining electrical conductivity between the electrode and the socket. The contact region coating has an electrical conductivity of at least 7×106 Siemens/meter at room temperature and a greater wear resistance than nickel as measured in mm3/N*m.

Abstract: A nano-hole array for improving contact conductance of a conductor element that consists of a first layer and a second layer is provided. The nano-hole array formed between the first and second layers comprises a plurality of holes. The contact conductance of the conductor element is enhanced by reducing the hole size of the hole array, increasing the occupation rate of the hole array, and performing thermal annealing.

Abstract: Disclosed is a structure of electrolessly palladium (Pd) and gold (Au) plated films on a bonding pad, comprising a Pd plated layer on the bonding pad; and an Au plated layer on the Pd plated layer. Also disclosed is an assembled structure formed of the electrolessly Pd—Au plated films wire-bonded with a copper (Cu) or Pd—Cu wire to the Au plated layer. In addition, a process for producing the structure of the electrolessly Pd—Au plated films and an assembling process for the assembled structure are disclosed. According to the present invention, the Pd plated layer is used to replace the conventional nickel layer so as to enhance the wire-bonding strength between the Cu or Pd—Cu wire and the bonding pad.

Abstract: Methods of forming gold-aluminum electrical interconnects are described. The method may include interposing a diffusion retardant layer between the gold and the aluminum, the diffusion retardant layer including regions containing and regions substantially devoid of a diffusion retardant material; bringing into contact the diffusion retardant layer, the gold, and the aluminum; forming alloys of gold and the diffusion retardant material in regions containing the material and forming gold-aluminum intermetallic compounds in regions substantially devoid of the material; and forming a continuous electrically conducting path between the aluminum and the gold. A structure for gold-aluminum interconnect is provided. The structure may include an aluminum alloy bond pad and a diffusion retardant layer in contact with the bond pad, the diffusion retardant layer including regions containing and regions substantially devoid of a diffusion retardant material.

Abstract: Disclosed herein are electrodes having a multi-layered structure, including at least two active material layers formed on an electrode current collector or including at least two active material layers formed on an electrode current collector, wherein at least two active material layers are stacked thereon, and a supercapacitor comprising the same. The electrodes including at least two active material layers configured of the activated carbon layer having large specific surface area and the graphene layer having excellent electrical conductivity in order to reduce the internal resistance and stacked in a multi layered structure are manufactured and the supercapacitor includes the electrodes to increase capacitance due to the large specific surface area of the activated carbon and reduce the internal resistance due to excellent electrical conductivity of the graphene, thereby making it possible to improve the capacitance and electrical conductivity.

Abstract: There is provided a bonding wire for semiconductor, capable of ensuring a favorable wedge bondability even when bonded to a palladium-plated lead frame, superior in oxidation resistivity and having a core wire of copper or a copper alloy. This bonding wire comprises: a core wire of copper or a copper alloy; a coating layer containing palladium and having a thickness of 10 to 200 nm; and an alloy layer formed on a surface of the coating layer, such alloy layer containing a noble metal and palladium and having a thickness of 1 to 80 nm. The aforementioned noble metal is either silver or metal, and a concentration of such noble metal in the alloy layer is not less than 10% and not more than 75% by volume.

Abstract: An electrode base in which a lead wire made of aluminum is bonded to a surface of a glass substrate that is a thin-film base having a plate thickness of about 0.7 to 2.0 mm, by using an ultrasonic bonding method. An external lead-out electrode made of copper is formed so as to extend from a surface of one end portion of the lead wire to a region outside the glass substrate. The lead wire functions as an internal signal receiver, and the external lead-out electrode has an external signal transmission function.

Abstract: The present invention provides a conductive contact terminal for surface mounting on a substrate. In the conductive contact terminal, an elastic core imparts elasticity to the contact terminal. A metal layer covers the outer portion of the elastic core. A conductive adhesive layer is interposed between the elastic core and the metal layer to bond the elastic core and the metal layer to each other. The conductive contact terminal has a low electrical resistance, does not exhibit a deformation in the material even in a high-temperature reflow soldering process, and does not lose conductivity even though a metal layer, which imparts electrical conductivity to the conductive contact terminal, is broken.

Abstract: Transparent conductors and methods of forming same are provided. A transparent conductor can include a nanostructure layer and a low sheet resistance grid disposed on a transfer film surface having an acceptable level of surface roughness. The presence of the low sheet resistance grid lowers the sheet resistance of the transparent conductor to an acceptable level. After release of the transparent conductor from the transfer film, the surface roughness of the transparent conductor will be at least comparable to the surface roughness of the transfer film.

Abstract: Disclosed herein is a conductive film. The conductive film includes: a base member; a transparent electrode formed on the base member; and electrode wirings connected to one side or both sides of the transparent electrode and having a first metal layer formed on the lower portion thereof and a second metal layer made of a metal different from the first metal layer and formed to be thicker than the thickness of the first metal layer stacked on the upper portion thereof. The conductive film and the method for manufacturing the same form the electrode wirings by stacking the second metal layer on the upper portion of the first metal layer to prevent the second metal layer from being spread to both sides due to the first metal layer. As a result, the present invention can form the fine electrode wirings and reduce the non-display region of the conductive film.

Abstract: Nanowire array compositions in which nanowires containing at least one Group IV metal (e.g., Si or Ge) in a single layer or core-shell nanowire structure, wherein, in particular embodiments, the nanowires have a transition metal core and/or are surrounded by or embedded within a metal oxide or metal oxide-ionic liquid ordered host material. The nanowire compositions are incorporated into the anodes of lithium ion batteries. Methods of preparing the nanowire compositions, particularly by low temperature methods, are also described.

Abstract: A solar cell lead wire includes a strip-shaped conductive material formed by rolling a wire, and upper and lower melt solder-plated layers formed to be flat on upper and lower surfaces, respectively, of the strip-shaped conductive material by supplying melt solder thereto.

Abstract: Bond wires for integrated circuits are implemented using a variety of methods. Using one such method, a composite bond wire is produced for use in an integrated circuit. A conductive material is melted and mixed with a material of particles less than 100 micrometers in size to create a mixture. The mixture is used to create the composite bond wire. A composite wire having an inner core and an outer layer having a higher conductivity than the inner core is also provided. The outer layer is designed to be thicker than the skin depth at the operating frequency for carrying AC signals.

Abstract: The present invention relates to a terminal structure. The terminal structure includes: a terminal having: a conductor layer containing at least one metal selected from gold, silver, and copper; a first layer containing nickel and phosphorus, laid on the conductor layer; a second layer having a smaller atomic ratio of nickel to phosphorus than the first layer and containing Ni3P, laid on the first layer; a third layer containing a first intermetallic compound of an Ni—P—Sn type, laid on the second layer; and a fourth layer containing a second intermetallic compound of an Ni—Cu—Sn type, laid on the third layer; and a solder layer on the fourth layer of the terminal. Ra2 is larger than Ra1, where Ra1 is a surface roughness of the third layer on the second layer side and Ra2 is a surface roughness of the third layer on the fourth layer side.

Abstract: The present invention relates to a terminal structure and an electronic device having the terminal structure. The terminal structure includes: a terminal having: a conductor layer containing at least one metal selected from gold, silver, and copper; a first layer containing nickel and phosphorus, laid on the conductor layer; a second layer having a smaller atomic ratio of nickel to phosphorus than the first layer and containing Ni3P, laid on the first layer; and a third layer containing a first intermetallic compound of an Ni—Cu—Sn type, laid on the second layer; and a solder layer on the third layer of the terminal. A second intermetallic compound of an Ni—P—Sn type partly covers a surface of the second layer on the third layer side and a maximum thickness of the second intermetallic compound in a lamination direction is from 0.05 to 0.7 ?m.

Abstract: Composite transparent conductors are described, which comprise a primary conductive medium based on metal nanowires and a secondary conductive medium based on a continuous conductive film.

Abstract: A system and method for actively damping tension members modulates the natural frequency of shape memory alloys incorporated into tension members, such as suspension ropes or cables. The frequency of the tension member can be modulated by heating the shape memory alloy, such modulation preventing potentially destructive resonance with natural exciting forces.

Abstract: The present invention provides a coating 10 provided on a conductor 20, the coating 10 has a first layer 12 containing palladium and a second layer 14 containing gold from the conductor 20 side, the first layer 12 has a first region 31 on the conductor 20 side and a second region 32 arranged nearer to the second layer 14 than the first region 31, and the second region 32 has a higher phosphorus concentration than the first region 31.

Abstract: A process of making efficient metal bump bonding with relative low temperature, preferably lower than the melting point of Indium, is described. To obtaining a lower processing temperature (preferred embodiments have a melting point of <100° C.), a metal or alloy layer is deposited on the indium bump surface. Preferably, the material is chosen such that the metal or alloy forms a passivation layer that is more resistant to oxidation than the underlying indium material. The passivation material is also preferably chosen to form a low melting temperature alloy with indium at the indium bump surface. This is typically accomplished by diffusion of the passivation material into the indium to form a diffusion layer alloy. Various metals, including Ga, Bi, Sn, Pb and Cd, that can be used to form a binary to quaternary low melting point alloy with indium.

Abstract: Method of depositing a buffer layer of epitaxial metal oxide on a functionalised surface of a textured metal substrate, said method comprising the following steps: (1) a layer is deposited of a precursor of an oxide of the type A2?xB2+xO7 where A represents a metal of valency 3 or a mixture of several of these metals, and B a metal of valency 4, and x is a number between ?0.1 and +0.1, from a solution of carboxylates of said metals A and B, (2) said layer of oxide precursor is left to dry, (3) heat treatment is carried out in order to pyrolyse said oxide precursor and to form the oxide, at least part of said heat treatment being carried out under a flow of reducing gas.

Abstract: Disclosed herein is a conductive electrode pattern used as an electrode of a solar cell. The conductive electrode pattern includes a lower metal layer and an upper metal layer vertically disposed on a substrate, wherein any one of the lower metal layer and the upper metal layer includes silver (Ag) and the other one of the lower metal layer and the upper metal layer includes a metal of transition metals, different from that of the lower metal layer.

Abstract: Terminal pins comprising a core of a first electrically conductive material selectively coated with a layer of a second electrically conductive material for incorporated into feedthrough filter capacitor assemblies are described. The feedthrough filter capacitor assemblies are particularly useful for incorporation into implantable medical devices such as cardiac pacemakers, cardioverter defibrillators, and the like, to decouple and shield internal electronic components of the medical device from undesirable electromagnetic interference (EMI) signals.

Abstract: A terminal for an engaging type connector includes a punched Cu alloy strip as a base material, a coating formed on the Cu alloy strip by postplating processes and including a Sn layer, and a Cu—Sn alloy layer sandwiched between the base material and the Sn layer. The Sn layer is smoothed by a reflowing process. The terminal has an engaging part and a solder-bonding part, and the surface of a part of the base material corresponding to the engaging part has a surface roughness higher than that of the surface of the base material corresponding to the solder-bonding part. The engaging part has a low frictional property and the solder-bonding part has improved solder wettability.

Abstract: An improved method for interconnecting thin film solar cells to form solar cell modules is provided, the method comprising using a flat metallic mesh formed from a thin metallic strip to provide a current collection grid over a thin film solar cell. The method is particularly useful for forming interconnections between thin film solar cells deposited on flexible substrates. The rectangular cross sectional shape of the mesh elements provides an increased area of electrical contact to the solar cell compared to the small tangential area provided by elements of circular cross section. Mesh elements can be made higher rather than wider to improve conductivity without proportionally increasing shading loss. Various coatings can be applied to the mesh to improve its performance, provide corrosion resistance, and improve its cosmetic appearance.

Abstract: The invention relates to a wire electrode (1, 1?) for electric discharge cutting processes and a method for the production thereof. The wire electrode (1, 1?) has a core (2) containing a metal or a metal alloy, and a coating (3, 4; 3, 4, 5) that surrounds the core (2) and includes one or more coating layers (3, 4, 5), at least one (3) of which contains a phase mixture of ?-brass and/or ??-brass and ?-brass. In said at least one coating layer (3) containing ?-brass and/or ??-brass and ?-brass, the ?-phase and/or ??-phase and the ?-phase are arranged next to each other in a fine-grained structure in which the mean size of the ?-brass and/or ??-brass grains and the ?-brass grains amounts to a maximum of 5 ?m relative to the cross-section extending perpendicular to the longitudinal axis of the wire electrode (1, 1?).

Abstract: A junction body has a first member and a second member each of which is provided with a joining surface whose main component is copper. A solder member containing, in a tin-base solder material, a three-dimensional web structure whose main component is copper is provided between the first member and the second member. A copper-tin alloy whose average thickness is 2 ?m or more but 20 ?m or less is provided between the joining surfaces and the three-dimensional web structure.