Abstract: A cable termination that enables the attachment of SMA connectors to controlled-impedance cables with a conductive foil wrap shield; for the separate ferrule embodiment, the sheath is stripped back on the cable, exposing the foil shield surrounding the dielectric; a ferrule is slid or clamped over the foil shield and bonded; the face of the ferrule is dressed so that the foil shield and dielectric are flush with the ferrule face and the signal conductor protrudes from the face this cable subassembly is installed in the boss of a housing that prevents movement of the ferrules relative to each other and so that each ferrule face is aligned with an opening in the boss through which an SMA connector barrel is attached to the ferrule a cover secures the cable subassembly in the housing.

Abstract: A printed wiring board includes a resin insulating layer, a metal post formed in the insulating layer and protruding from first surface of the insulating layer, a conductor layer formed on second surface of the insulating layer, and a via conductor penetrating through the insulating layer and connecting the metal post and conductor layer. The metal post has a protruding portion protruding from the first surface of the insulating layer and an embedded portion connected to the protruding portion and embedded in the insulating layer such that the protruding portion does not extend onto the insulating layer, and the metal post has upper and side surfaces such that the side surface has unevenness including a first unevenness on side surface of the protruding portion and a second unevenness formed on side surface of the embedded portion and having a size that is larger than a size of the first unevenness.

Abstract: An applying method includes the following steps. Firstly, a conductive adhesive including a plurality of conductive particles and an insulating binder is provided. Then, a carrier plate is provided. Then, a patterned adhesive is formed on the carrier plate by the conductive adhesive, wherein the patterned adhesive includes a first transferring portion. Then, a manufacturing device including a needle is provided. Then, the needle of the manufacturing device is moved to contact the first transferring portion. Then, the transferring portion is transferred to a board by the manufacturing device.

Abstract: A device comprising a first package and a second package coupled to the first package. The first package includes a first substrate, at least one gradient interconnect structure coupled to the first substrate, and a first integrated device coupled to the first substrate. The second package includes a second substrate and a second integrated device coupled to the second substrate. The second substrate is coupled to the at least one gradient interconnect structure.

Abstract: In an embodiment a composite semiconductor component includes a carrier substrate having a plurality of projecting elements projecting from a first main surface of the carrier substrate, an electrically conductive material electrically conductively connected to a contact region of the carrier substrate and located on at least one of the projecting elements, some of the projecting elements not being covered with the electrically conductive material and a semiconductor chip arranged on the carrier substrate and having at a first surface at least one contact pad electrically connected to the electrically conductive material on at least one element, wherein, at a position at which the contact pad and the electrically conductive material on the projecting element are in each case in contact with one another, the contact pad has a larger lateral extent than the projecting element in each case.

Abstract: A metal probe structure and a method for fabricating the same are provided. The metal probe structure includes a multi-layer substrate, a first flexible dielectric layer, a second flexible dielectric layer, and a plurality of first metal components. The first flexible dielectric layer is disposed over the multi-layer substrate and has a conductive layer formed thereover. The second flexible dielectric layer is disposed over the first flexible dielectric layer to cover the conductive layer. The plurality of first metal components is disposed over the conductive layer and partially in the second flexible dielectric layer to serve as a metal probe.

Abstract: A printed circuit board includes a first insulating layer, an embedded pattern embedded in one surface of the first insulating layer, a pad formed on the one surface of the first insulating layer, and a post, wherein the center of a side surface of the post is in contact with the one surface of the first insulating layer.

Abstract: A circuit board having a high reflectivity includes a wiring board, a first solder resist layer, and a second solder resist layer. The wiring board includes a wiring layer on an outer side, the wiring layer including wiring and a bond pad spaced from the wiring. The first solder resist layer, with opening and groove, covers the wiring layer, the bond pad is exposed from the opening but spaced from the first solder resist layer. The second solder resist layer infills the groove and covers the first solder resist layer but does not make contact with the mounting surface of the bond pad. A method for manufacturing such circuit board is also disclosed.

Abstract: A semiconductor device, including a first board, a second board having a plurality of through holes passing therethrough, and a plurality of external terminals that are respectively press-fitted into the plurality of through holes of the second board, one end portion of each external terminal passing through the corresponding through hole and being fixed to a front surface of the first board. The second board is a printed circuit board that further includes, in a top view thereof, a plurality of support regions, each having one of the plurality of through holes formed therein, and a plurality of buffer regions respectively surrounding the plurality of support regions, each buffer region having at least one buffer hole and at least one torsion portion formed therein, the at least one torsion portion being connected to the support region surrounded by each buffer region.

Abstract: An electronic measuring device includes a main printed circuit assembly and one or more channel modules. At least one channel module includes a channel printed circuit board and a first insulating housing that defines a cavity covering at least part of electrical elements mounted on the channel printed circuit board. A first conductive shielding frame is placed on the first insulating housing and is separated from the channel printed circuit board by the first insulating housing. The first conductive shielding frame covers the electrical elements mounted on the channel printed circuit board. A second insulating housing sandwiches the first conductive shielding frame between the second insulating housing and the first insulating housing which lengthens an electrical path from the first conductive shielding frame to the channel printed circuit board.

Abstract: A functional contactor is provided. Provided according to an exemplary embodiment of the present invention is a functional contactor comprising: a conductor which has elasticity and comes into contact with a conductor of an electronic device; a functional element which is connected to the conductor having elasticity and has a first and a second electrode respectively disposed on at least a part of an upper and a lower surface thereof; and a solder through which a lower surface of the conductor having elasticity is coupled with the first electrode of the functional element. The first electrode includes a first part outwardly extending from the lower surface of the conductor having elasticity along one side surface of the conductor having elasticity, and the solder includes an exposure part formed between the first part and a partial lateral surface of the one side surface of the conductor having elasticity.

Abstract: A substrate structure is provided. The substrate structure includes a substrate, a first redistribution structure, a first adhesive layer and a first connecting component. The substrate includes a first conductor on a first surface thereof. The first redistribution structure is disposed over the substrate. The first adhesive layer is disposed between the substrate and the first redistribution structure. The first connecting component is electrically connected with the first conductor, penetrates through the first adhesive layer into the first redistribution structure, and electrically connects the substrate to the first redistribution structure.

Abstract: The semiconductor module includes a semiconductor chip and a semiconductor chip. The semiconductor chip includes an optical device such as an optical waveguide, an optical receiver, and a grating coupler, and a wiring formed over the optical device. The semiconductor chip includes a semiconductor element such as a MISFET formed in the semiconductor substrate, and a wiring formed over the semiconductor element. a top surface of the semiconductor chip is laminated to a top surface of the semiconductor chip such that the wirings are in direct contact with each other. In the semiconductor substrate, a through hole having a circular shape in plan view is formed, in the through hole, an insulating film is formed as a cladding layer, and the semiconductor substrate surrounded by the through hole constitutes an optical waveguide.

Abstract: A resin multilayer board includes a substrate including a stack of resin layers, and a first metal pin including a first end portion exposed at a first main surface of the substrate and penetrating through at least one of the resin layers in a thickness direction, wherein a gap is provided at a portion of an interface between a lateral side of the first metal pin and the resin layer.

Abstract: A method of fabricating a circuit board structure is provided. The method includes providing a core substrate; forming an insulation layer on the core substrate; forming a patterned metal layer on the insulation layer, wherein the patterned metal layer includes a wiring layer and a pad; forming a first metal pillar on the pad, wherein the first metal pillar has a top surface; and forming a first solder resist layer on the patterned metal layer and the first metal pillar, wherein the first solder resist layer has a first opening exposing the first metal pillar, and the first opening has a bottom surface, wherein the top surface of the metal pillar is higher than or equal to the bottom surface of the first opening.

Abstract: A package includes first package component and a second package component. The first package component includes a first electrical connector at a surface of the first package component, and a first solder region on a surface of the first electrical connector. The second package component includes a second electrical connector at a surface of the second package component, and a second solder region on a surface of the second electrical connector. A metal pin has a first end bonded to the first solder region, and a second end bonded to the second solder region.

Abstract: A multilayer ceramic substrate includes: a plurality of ceramic layers 300a, 300b stacked together; a via hole 400a, 400b provided in each of the plurality of ceramic layers, the via holes of the plurality of ceramic layers being connected together in a layer stacking direction of the plurality of ceramic layers; a via wire 406a, 406b including an electrical conductor filled into each of the via holes; a first conductor 404a, 404b provided on an upper surface of at least one of the plurality of ceramic layers, the first conductor having an annular or partially annular shape surrounding the via wire; and a second conductor 403a, 403b including a first portion and a second portion, the first portion being located outside the first conductor on the upper surface of the at least one ceramic layer, the second portion overlying the first conductor, and an inner rim of the second portion being located outside an inner rim of the first conductor, wherein a thickness of the first conductor 404a, 404b is greater than a

Abstract: An electronic device socket includes a barrel having a lumen extending therethrough. The barrel includes a proximal barrel portion having a first outer diameter; a tapering region extending distally from the proximal barrel portion, the tapering region extending both distally and radially inward towards a central axis of the barrel; a plurality of fingers extending distally from the tapering region, the plurality of fingers are all parallel to one another and the central axis; and a dimple contact area extending from each of the plurality of fingers extending radially inward and distally. The barrel is configured to make full contact with an electronic pin only at the dimple contact area.

Abstract: This invention can be used as mini-micro-switching, up to macro switching. An electronic module having several input copper circuit traces, and several output copper traces, or wires, with some traces having disconnects, consisting of drilled holes, which can be bridged by conductive fasteners. This invention is also solving switching of differing functions both in the industry, and after that the product is in the market and the customer requests switching options. Selecting a switching options can be accomplished on a module, by first remove a conductive fastener from one position and attach the fastener in a second position on copper traces. Where the fastener is removed and not re-inserted, an open circuit trace occurs. Thereby accomplishing: selecting, reversing, or switching of one, or of a multiple of circuits.

Abstract: An electronic device connected to a wire is provided, including a printed circuit board having a hole, a hollow tube, a plurality of blades separated from each other, and a solder, wherein the wire in inserted into the hollow tube and electrically connected to the printed circuit board. The hollow tube is extended through the hole. The solder is connected to the blades and the printed circuit board. The blades are connected to the hollow tube, and a reflex angle is formed between the inner wall of the hollow tube and each of the blades.

Abstract: A circuit board disclosed herein includes a threaded receptor, one or more alignment holes, and one or more pads. The threaded receptor is configured to receive a component with a threaded screw. Each of the one or more alignment holes are configured to receive an alignment pin located on the component. Each of the one or more pads are configured to electrically connect to a pogo pin on the component.

Abstract: An ink layer of an electrically conductive ink is formed on a sheet-like base and then the base is bent-deformed before the ink layer is cured, followed by curing the ink layer, thereby forming wiring. The ink layer is pliable during the bending deformation of the base, preventing breakage of the ink layer associated with the bending deformation of the base, and preventing damage to the wiring even when the wiring is finely formed.

Abstract: A wiring board (1) includes an insulating substrate (11) having a cutout (12) opened in a main surface and a side surface of the insulating substrate (11), and an inner electrode (13) formed on an inner surface of the cutout (12). The inner electrode (13) includes a plurality of metal layers. The inner electrode (13) includes, as an intermediate layer, at least one metal layer (17b) selected from the group consisting of a nickel layer, a chromium layer, a platinum layer, and a titanium layer, and includes a gold layer as an outermost layer (17a). The metal layer (17b) is exposed at an outer edge portion of the inner electrode (13).

Abstract: Provided are a conducting substrate and a method for preparing the same. The method for preparing the conducting substrate according to an embodiment of the present application includes a) providing a substrate comprising a conducting layer; b) forming a metal layer on the entire surface of the substrate comprising the conducting layer; c) forming an insulating layer pattern on the metal layer; d) forming a metal layer pattern by over-etching the metal layer by using the insulating layer pattern as a mask; and e) reforming the insulating layer pattern.

Abstract: The present disclosure provides a novel apparatus and method for printing circuitry that can dispense conducting traces, insulating traces, solder paste, and other materials onto a substrate material in a manner that allows for convenient prototyping of printed circuit boards.

Abstract: An electronic system without using solder balls between electrical components, and without using interposer between chips and package substrate, without using a discrete system board for the chip package to mount. A chip is wrapped by molding material, a first redistribution circuitry is built on a bottom side of the molding material; a second redistribution circuitry is built on a bottom side of the first redistribution circuitry. A third redistribution circuitry is built on a bottom side of the second redistribution circuitry. Plated metal vias are configured between each two of the electrical components.

Abstract: A pillar structure, and a method of forming, for a substrate is provided. The pillar structure may have one or more tiers, where each tier may have a conical shape or a spherical shape. In an embodiment, the pillar structure is used in a bump-on-trace (BOT) configuration. The pillar structures may have circular shape or an elongated shape in a plan view. The substrate may be coupled to another substrate. In an embodiment, the another substrate may have raised conductive traces onto which the pillar structure may be coupled.

Abstract: It is an object of the invention to provide a guide plate for a probe card with fine through holes at tight pitches and with increased strength. The guide plate 100 for a probe card includes a metal base 110; first insulation layers 120; and metal layers 130. The metal base 110 has a plurality of through holes 111 to receive probes therethrough, and inner walls of the through holes 111. The first insulation layers 120 are of tuboid shape and provided on the respective inner walls of the through holes 111 of the metal base 110. The metal layers 130 are provided on the first insulation layers 120.

Abstract: A coaxial copper pillar for signal transmission with signal shield is disclosed so that signal integrity for the signal passes transmission is maintained. One embodiment shows at least one coaxial copper pillar is made as a terminal connector for a chip package, the coaxial copper pillars are made adaptive for electrically coupling the chip package to a mother board.

Abstract: An electronic system without using solder balls between electrical components, and without using interposer between chips and package substrate, without using a discrete system board for the chip package to mount. A chip is wrapped by molding material, a first redistribution circuitry is built on a bottom side of the molding material; a second redistribution circuitry is built on a bottom side of the first redistribution circuitry. A third redistribution circuitry is built on a bottom side of the second redistribution circuitry. Plated metal vias are configured between each two of the electrical components.

Abstract: A semiconductor device according to an embodiment includes a semiconductor chip, a cap disposed to face the semiconductor chip, and having a through-hole electrode arranged in a through hole, and a bump electrode provided between the semiconductor chip and the cap, wherein the bump electrode is in a protruding shape connecting the semiconductor chip and the through-hole electrode, and wherein at least a portion of the bump electrode is included in the through-hole electrode, and electrically connected thereto, so that the adhesive performance between the cap and the bump electrode can be increased.

Abstract: A method for fabricating thin crystalline photovoltaic cells is disclosed. In one aspect, the method includes: forming a weakening layer in a surface portion of a semiconductor substrate; epitaxially growing a stack of semiconductor layers on the substrate for forming an active layer of the photovoltaic cell, the stack having a first thermal coefficient of expansion; providing on the stack patterned contact layer for forming electrical contacts of the photovoltaic cell, the patterned contact layer having a second thermal coefficient of expansion different from the first thermal coefficient of expansion. The process of providing a patterned contact layer simultaneously induces a tensile stress in the weakening layer, resulting in a lift-off from the substrate of a structure including the stack of semiconductor layers and the patterned contact layer.

Abstract: The invention relates to a contact pin, comprising an angular end section, which is in particular designed for connecting to a wire or plug, wherein the angular end section has an angular cross-section. According to the invention, the contact pin has a round end section that is opposite the angular end section and that is designed for soldering to a circuit board. The round end section has a cross-section that is round at least in some sections of the circumference.

Abstract: An integrated circuit includes a substrate having a surface and an inductor disposed over the surface of the substrate. The inductor includes a first conductive line disposed over the surface and first conductive structures disposed over and electrically coupled with the first conductive line. The inductor includes second conductive structures disposed over and electrically coupled with the first conductive structures. The inductor includes a second conductive line disposed over and electrically coupled with the second conductive structures. The inductor includes third conductive structures disposed over and electrically coupled with the first conductive line and at least one fourth conductive structure disposed over and electrically coupled with the third conductive structures. The inductor includes a third conductive line disposed over and electrically coupled with the at least one fourth conductive structure, the third conductive line extending substantially parallel to the second conductive line.

Abstract: The invention relates to a method for producing populated or unpopulated circuit boards or individual circuits as individual panels (2) from a complete panel (1) having a circuit board base material (4), wherein the particular individual panel (2) is removed from the complete panel (1) using a laser, wherein the individual panel is fastened to the complete panel (1) by means of metal connections (3) before the individual panel (2) is removed, the circuit board base material (4) is removed except for the metal connections (3), and the individual panels (2) are separated from, in particular pressed out of, the complete panel (1) after the circuit board base material (4) has been removed.

Abstract: A composite interposer can include a substrate element and a support element. The substrate element can have first and second opposite surfaces defining a thickness of 200 microns or less, and can have a plurality of contacts exposed at the first surface and electrically conductive structure extending through the thickness. The support element can have a body of at least one of dielectric or semiconductor material exposed at a second surface of the support element, openings extending through a thickness of the body, conductive vias extending within at least some of the openings in a direction of the thickness of the body, and terminals exposed at a first surface of the support element. The second surface of the support element can be united with the second surface of the substrate element. The terminals can be electrically connected with the contacts through the conductive vias and the electrically conductive structure.

Abstract: The present invention is a rhodium alloy suitable for wire for a probe pin, the rhodium alloy comprising 30 to 150 ppm of Fe, 80 to 350 ppm of Ir and 100 to 300 ppm of Pt as additive elements, and the balance being Rh. A probe pin composed of the material maintains processability of rhodium, has stable contact resistance even at a low contact pressure, and has excellent strength and antifouling properties, and therefore, can be used in a stable manner for a long period.

Abstract: The present invention is directed to a semiconductor device including a semiconductor substrate, a through hole penetrating the semiconductor substrate, a base film covering the through hole, a conductive layer disposed on the base film, an insulating film formed on the side wall of the through hole, and a conductive material embedded in the through hole via the insulating film, in which the base film has a stepped portion formed by an opening pattern that selectively exposes the conductive layer therethrough into the through hole, and in which the conductive material is connected electrically to the conductive layer through the opening pattern.

Abstract: A semiconductor device comprises an integrated circuit including a wire bond pad and a passivation material, and a first gap between a first selected portion of the wire bond pad and the passivation material. The first gap is positioned to contain at least a first portion of a splash of the wire bond pad formed during a wire bond process.

Abstract: A connection structure includes a column electrode; a first connecting portion connected to one end of the column electrode; and a second connecting portion connected to another end of the column electrode via solder, wherein a height of the column electrode is a width of the first connecting portion or greater.

Abstract: A printed circuit board (1), having a front side (2) for population with at least one semiconductor light source (4) and having at least one securing element (6) accessible via a rear side (3), wherein the at least one securing element (6) is embodied as an electrical through-conduction element for at least one of the semiconductor light sources.

Abstract: A mounting board having a plurality of terminals. The ends of each of the plurality of terminals are inserted into and soldered to through-holes positioned in a printed board, and the terminals are mounted on the printed board. A plurality of pedestals are disposed on one side of the printed board. The pedestals support the terminals. The pedestals are integrally coupled to one another through deformable coupling portions. Mutual displacements among the pedestals are allowed by the coupling portions.

Abstract: Some embodiments relate to micro vias in printed circuit boards (PCBs). In an example, a PCB may include a PCB substrate and a micro via. The micro via may extend between opposing surfaces of the PCB substrate and may have a diameter less than or equal to about 100 microns. In another example, a method of forming micro vias in a PCB may include forming a through hole in a PCB substrate of the PCB. The method may also include positioning a pillar that is electrically conductive within the through hole. The method may also include backfilling the through hole around the pillar with an epoxy backfill.

Abstract: An engine control unit including a substantially rectangular printed circuit board in which a microcontroller is mounted. The printed circuit board includes a connector portion in which connection terminals are provided to be arranged in one side edge portion along the longitudinal direction thereof. The connection terminals of the connector portion include connection terminals for input on one side in the longitudinal direction and connection terminals for output on the other side with respect to a setting position. A microcontroller is disposed at substantially the center portion of the printed circuit board in the longitudinal direction thereof. An electronic component as an input interface circuit is disposed on the one side in the longitudinal direction, and an electronic component as an output interface circuit is disposed on the other side.

Abstract: An apparatus relating generally to a substrate is disclosed. In this apparatus, a post extends from the substrate. The post includes a conductor member. An upper portion of the post extends above an upper surface of the substrate. An exterior surface of the post associated with the upper portion is in contact with a dielectric layer. The dielectric layer is disposed on the upper surface of the substrate and adjacent to the post to provide a dielectric collar for the post. An exterior surface of the dielectric collar is in contact with a conductor layer. The conductor layer is disposed adjacent to the dielectric collar to provide a metal collar for the post, where a top surface of each of the conductor member, the dielectric collar and the metal collar have formed thereon a bond structure for interconnection of the metal collar and the conductor member.

Abstract: Components and methods of making the same are disclosed herein. In one embodiment, a method of forming a component comprises forming metal anchoring elements at a first surface of a support element having first and second oppositely facing surfaces, the support element having a thickness extending in a first direction between the first and second surfaces, wherein each anchoring element has a downwardly facing overhang surface; and then forming posts having first ends proximate the first surface and second ends disposed above the respective first ends and above the first surface, wherein a laterally extending portion of each post contacts at least a first area of the overhang surface of the respective anchoring element and extends downwardly therefrom, and the overhang surface of the anchoring element resists axial and shear forces applied to the posts at positions above the anchoring elements.

Abstract: There is provided a circuit board to which a solder ball composed of a lead (Pb)-free solder is to be connected, a semiconductor device including an electrode and a solder ball composed of a lead (Pb)-free solder disposed on the electrode, and a method of manufacturing the semiconductor device, in which mounting reliability can be improved by enhancing the bonding strength (adhesion strength) between the solder ball composed of a lead (Pb)-free solder and the electrode.

Abstract: A method, and structures for implementing enhanced interconnects for high conductivity applications. An interconnect structure includes an electrically conductive interconnect member having a predefined shape with spaced apart end portions extending between a first plane and a second plane. A winded graphene ribbon is carried around the electrically conductive interconnect member, providing increased electrical current carrying capability and increased thermal conductivity.

Abstract: A method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board according to one example embodiment includes simultaneously extruding a plurality of materials in the cross-sectional shape of the Z-directed component to form an extruded object with the plurality of materials arranged relative to each other in their operative positions for the Z-directed component. The extrusion of a first portion of at least one of the materials in the extruded object is staggered relative to the extrusion of a second portion of the at least one of the materials in the extruded object. At least a segment of the extruded object is fired. The fired segment forms the Z-directed component insertable into a mounting hole in a printed circuit board.

Abstract: Stacked arrays of components are disclosed. In one embodiment, a first and a second layer of components are electrically and mechanically coupled to a thin interposer disposed between the first and second layers. The first layer can be configured to attach the stacked array to a host printed circuit board. The interposer can insulate the components from one another and also couple signals between the components on the first and second layers. In one embodiment, the components in the first and second layers are passive components.