Liquid Sealed Joint Patents (Class 174/31.5)
  • Patent number: 11963303
    Abstract: An electronic device including: a multilayer printed circuit board; and a molded retaining body; wherein the printed circuit board is formed of structured layers of conducting and non-conducting materials adhered together, the conducting materials form conductor tracks and contact areas, the printed circuit board being stiffened in a rigid region by stiffening material, the rigid region having electronic components and encapsulated in an epoxy; the printed circuit board having a flexible region that is more flexible than the rigid region, the flexible region having contact areas; the retaining body having an arc-shape formed on a radial inner side of the retaining body for arrangement on an inner tube of an endoscope; the retaining body having, on a radial outer side, a receiving contour for receiving and shaping the printed circuit board; and the retaining body having a retainer for holding the printed circuit board in a bent state.
    Type: Grant
    Filed: August 10, 2021
    Date of Patent: April 16, 2024
    Assignee: OLYMPUS WINTER & IBE GMBH
    Inventors: Sebastian Jungbauer, Sven Pabst, Martin Wieters
  • Patent number: 8050527
    Abstract: In one of the embodiments there is disclosed a self healing optical fiber cable assembly comprising an elongated optical fiber core having a cladding layer, a buffer layer, a sealing layer that seals any microcracks or defects in the buffer layer, the cladding layer, and the optical fiber core, and, an outer protection layer, wherein an end of the outer layer is connected to a strain relief device to provide expansion protection to the cable assembly and to minimize strain on the cable assembly, and further wherein an end of the strain relief device is connected to an optical fiber module. The cable assembly may further comprise a constraining layer and/or a strengthening layer. There is also disclosed a method of making a self healing optical fiber cable assembly.
    Type: Grant
    Filed: November 10, 2008
    Date of Patent: November 1, 2011
    Assignee: The Boeing Company
    Inventor: Kenneth C. Noddings
  • Patent number: 7694734
    Abstract: A method and apparatus are provided for insulating electrical connections to a resonator from fluid downhole under extreme pressure and temperature conditions downhole. The method and apparatus provide a pliable insulator that maintains electrical isolation between a resonator electrical connection during exposure to high pressures downhole. The insulator is substantially chemically non reactive so that the insulator maintains electrical isolation between the resonator electrical connections during exposure to fluids downhole. The insulator has a thermal coefficient of expansion in a range so that the insulator maintains electrical isolation between the resonator electrical connections during exposure to high temperatures downhole.
    Type: Grant
    Filed: October 31, 2005
    Date of Patent: April 13, 2010
    Assignee: Baker Hughes Incorporated
    Inventors: Rocco DiFoggio, Christopher J. Powell, Peter W. Reittinger, Louis Perez, Jr., Srdjan Stankovic, Paul Bergren
  • Patent number: 6815608
    Abstract: Sufficient dielectric strength needs to be ensured for the high voltage connection (13-11) of the high voltage electrical equipment such as a pattern generation system for focused ion beam processing and observation (1), without enlarging the equipment. The present invention seals an insulating liquid (13-113a) or gas (13-113b) in the space (13-113) between the connection bushing on the power supply side (13-111) and the flange on the power receiving side (13-112), and applies the water repellent treatment (13-111c) to a surface of the connection bushing or flange on the power receiving side, which the surface faces the space (13-113). Such a configuration provides compact electrical equipment with high dielectric strength, which can prevent the condensation or moisture absorption on the insulation surface in the space of the high voltage connection and can prevent the leakage current increase even under high humidity environment.
    Type: Grant
    Filed: September 3, 2003
    Date of Patent: November 9, 2004
    Assignee: Hitachi, Ltd.
    Inventors: Takanori Sato, Ryouzou Takeuchi, Hiroyasu Kaga