Conductive Shell With Nonconductive Core Patents (Class 174/356)
  • Patent number: 11646509
    Abstract: A grounding elastic contact and an electronic device including the same. The grounding elastic contact includes an elastic core, and a double-sided polyethylene terephthalate (PET) tape, a polyimide (PI) film, and a conductive layer, where the PI film is laminated and bonded on an outer side of the double-sided PET tape; a middle region of the double-sided PET tape is attached to an upper surface of the elastic core; after passing through left and right sides of the elastic core respectively, two ends of the double-sided PET tape are laminated on a lower surface of the elastic core; the conductive layer includes one end bonded on the upper surface of the elastic core, and the other end passing through the left side of the elastic core; the double-sided PET tape includes a PET backing and an adhesive coated on two sides of the PET backing.
    Type: Grant
    Filed: July 6, 2022
    Date of Patent: May 9, 2023
    Assignee: Shenzhen Johan Material Technology Co., Ltd.
    Inventors: Mujiu Chen, Fang Chen, Qiao Chen, Jingyun Liu
  • Patent number: 11026355
    Abstract: Disclosed are a housing for receiving an electronic device and an electronic system having the same. The electronic system includes a case having lower and upper cases detachably combined with the lower case, a circuit board arranged in an inner space of the case and secured to the lower case such that at least a grounding line and at least a connection line are provided with the circuit board, a plurality of devices arranged on the circuit board such that each device is separated from one another by the grounding line and is connected with one another by the connection line, and at least an electromagnetic shielding member embedded onto the upper case such that the electromagnetic shielding member is in contact with the grounding line around the device to provide a shielding space receiving the device. The device is protected from unexpected electromagnetic waves by the electromagnetic shielding member.
    Type: Grant
    Filed: June 18, 2019
    Date of Patent: June 1, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hee-Won Kang, Nam-Su Kim, In-Hyuk Ko, Eun-Ji Moon
  • Patent number: 11013155
    Abstract: Disclosed is an electromagnetic wave shielding structure. The electromagnetic wave shielding structure comprises: a printed circuit board having a plurality of elements mounted therein and having a ground pad surrounding the plurality of elements; an insulation member made of a pre-molded insulating material and attached to the printed circuit board to surround the plurality of elements; and a conductive coating layer covering an exterior surface of the insulation member, wherein the conductive coating layer is connected to the ground pad.
    Type: Grant
    Filed: January 30, 2019
    Date of Patent: May 18, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ilju Mun, Hosuk Kang
  • Patent number: 10894397
    Abstract: Provided is a process for producing a graphene foam laminate for use as a sealing material, the process comprising (a) providing a layer of graphene foam; and (b) laminating the layer of graphene foam with one layer of permeation-resistant polymer to form a two-layer laminate or with two layers of permeation-resistant polymer to form a three-layer laminate wherein the graphene foam layer is sandwiched between the two permeation-resistant polymer layers. The two permeation-resistant polymer layers can be the same or different in composition. The product is a new, novel, unexpected, and patently distinct class of highly conducting, elastic, thermally stable, and strong sealing materials.
    Type: Grant
    Filed: July 9, 2018
    Date of Patent: January 19, 2021
    Assignee: Global Graphene Group, Inc.
    Inventors: Yi-jun Lin, Aruna Zhamu, Bor Z. Jang
  • Patent number: 10306815
    Abstract: Disclosed is an electromagnetic interference (EMI) gasket capable of reliably shielding an electronic component accommodated therein from electromagnetic waves. The EMI gasket includes an elastic core which includes a first surface and a second surface opposite to each other in a thickness direction and a through hole passing through the first and second surfaces and an electroconductive cover which adheres to the first surface with an adhesive interposed therebetween. Here, parts of the cover which face the through hole are incised to integrally form a plurality of blocking parts, and the blocking parts cover and adhere to sidewalls of the through hole.
    Type: Grant
    Filed: November 5, 2018
    Date of Patent: May 28, 2019
    Assignee: Joinset Co., Ltd.
    Inventors: Sun-Ki Kim, Sung-Ho Cho, Byung-Sun Jung, Eung-Won Kim
  • Patent number: 10299416
    Abstract: Technologies are described for shielding electronic components. In one embodiment, a conductive gasket includes a gasket body. A conductive shield has a plurality of projections extending therefrom sufficient to deform the gasket body to couple the conductive shield and the conductive gasket together. The projections can be pointed teeth designed for penetrating the conductive gasket so as to electrically and mechanically couple the conductive shield to the conductive gasket. The conductive gasket can be stacked onto the conductive shield to form a sidewall, which can be mounted on a PCB. A conductive cover can then be placed on the conductive gasket to create a cavity in which electronic components can be positioned.
    Type: Grant
    Filed: June 28, 2016
    Date of Patent: May 21, 2019
    Assignee: Microsoft Technology Licensing, LLC
    Inventor: Ville Vehkapera
  • Patent number: 10212863
    Abstract: An electromagnetic interference (EMI) shielding gasket is disclosed, the gasket having a series of slots thereon. The gasket may include an electrically-conductive outer layer adhered to a resiliently compressible core, and may further include a pressure sensitive adhesive thereon for adhering the gasket to a substrate. Each slot is a portion of the gasket that has been removed from the gasket by, for example, cutting a portion of the outer layer and core and removing a substantial majority of the core and all but the base of the gasket, thereby leaving a strip of electrically-conductive outer layer in each slot.
    Type: Grant
    Filed: March 22, 2018
    Date of Patent: February 19, 2019
    Assignee: Laird Technologies Inc.
    Inventor: Shelby Ball
  • Patent number: 10178817
    Abstract: Embodiments provide an electromagnetic shielding material and a method for packaging an optical module, where the electromagnetic shielding material includes an electromagnetic shield layer. The electromagnetic shield layer includes an external flux guide layer, an insulation medium layer, and an internal flux guide layer. The external flux guide layer is of a mesh structure, and each mesh forms a first guiding unit. The first guiding unit is of a tapered structure, and the guiding unit forms a first included angle with a horizontal direction. The first included angle is greater than 0 degrees and less than 90 degrees. A cross section of the electromagnetic shield layer is in a sawtooth shape.
    Type: Grant
    Filed: January 31, 2017
    Date of Patent: January 8, 2019
    Assignee: Huawei Technologies Co., Ltd
    Inventors: Min Zhou, Huafeng Lin, Zhenxing Liao
  • Patent number: 10178788
    Abstract: In order to manufacture an input and output device industrial use as cost-effectively as possible, while also fulfilling the demanding requirements in an industrial environment, it is provided that the frame of the input and output device is assembled from a plurality of individual frame sections which are connected to one another at the corners in order to form the frame and which are firmly bonded at the adjoining connecting surfaces in order to form a fully sealed external front face of the frame and a fully sealed external peripheral surface of the frame.
    Type: Grant
    Filed: June 15, 2015
    Date of Patent: January 8, 2019
    Assignee: B&R INDUSTRIAL AUTOMATION GMBH
    Inventors: Hermann Esterbauer, Johann Wimmer
  • Patent number: 10135104
    Abstract: The present disclosure relates to a waveguide gasket (1) arranged for electrically sealing a waveguide interface (2) between a first contact end (7) and second contact end (8) of the waveguide gasket. The waveguide gasket (1) comprises a plurality of electrically conducting members (3) that are positioned along a circumference (4) along which the waveguide gasket (1) extends. Each electrically conducting member (3) has a first end (5) and a second end (6) compressibly separable by a variable first height (h1) along a first direction (d1). Each first end (5) faces the first contact end (7) and each second end (6) faces the second side contact end (8), where each first contact end (7) and each second contact end (8) are separated by a variable second height (h2) along the first direction (d1), At least one electrically conducting member (3) is arranged to expand only along said circumference (4) when compressed.
    Type: Grant
    Filed: December 15, 2015
    Date of Patent: November 20, 2018
    Assignee: TELEFONAKTIEBOLAGET LM ERICSSON (PUBL)
    Inventors: Lars Bolander, Ove Persson
  • Patent number: 10058014
    Abstract: An apparatus suitable for EMC shielding applications comprises a first component comprising an electrically conductive first surface, and a gasket member comprising an electrically conductive exterior surface. The exterior surface is configured to couple with an electrically conductive second surface of a second component. The apparatus further comprises an adhesive layer disposed between the first component and the gasket member. The adhesive layer comprises an arrangement of conductive fibers, the conductive fibers extending along respective long axes between the first surface and the exterior surface.
    Type: Grant
    Filed: December 13, 2017
    Date of Patent: August 21, 2018
    Assignee: International Business Machines Corporation
    Inventors: Samuel R. Connor, Joseph Kuczynski, Stuart B. Benefield, Jonathan Jackson
  • Patent number: 9876319
    Abstract: A shield is described for minimizing leakage of electromagnetic waves from a connector/chassis interface. The shield includes a conductive strip sized to at least partially surround an aperture in a chassis, where the chassis receives a connector port assembly through the aperture. The conductive strip includes an outer portion affixed to an interior surface of the chassis, and an inner portion able to be manipulated to at least partially cover one or more gaps between the connector port assembly and the chassis.
    Type: Grant
    Filed: July 8, 2014
    Date of Patent: January 23, 2018
    Assignee: CISCO TECHNOLOGY, INC.
    Inventors: Huasheng Zhao, Zheng Yin, Hongmei Fan, Yingchun Shu, Jinghan Yu, Alpesh Bhobe
  • Patent number: 9832556
    Abstract: There are provided a microphone stand having a connector supporting groove, and a microphone body supported by the microphone stand as a result of insertion of a connector case into the connector supporting groove. A resilient conductive cloth which comes into contact with the connector case is arranged in the connector supporting groove, with the connector case inserted in the connector supporting groove. The conductive cloth is preferably arranged in a ring shape along a lower bottom portion of the annularly formed connector supporting groove. This configuration mitigates rattling generated between the connector supporting groove and the connector case, thereby suppressing generation of a vibration noise due to microphone shaking.
    Type: Grant
    Filed: June 10, 2016
    Date of Patent: November 28, 2017
    Assignee: KABUSHIKI KAISHA AUDIO-TECHNICA
    Inventor: Hiroshi Akino
  • Patent number: 9601819
    Abstract: A dielectric wave guide (DWG) has a dielectric core member that has a first dielectric constant value. A cladding surrounding the dielectric core member has a second dielectric constant value that is lower than the first dielectric constant. A mating end of the DWG is configured for mating with a second DWG having a matching non-planar shaped mating end. A deformable material is disposed on the surface of the mating end of the DWG, such that when mated to a second DWG, the deformable material fills a gap region between the mating ends of the DWG and the second DWG.
    Type: Grant
    Filed: April 1, 2013
    Date of Patent: March 21, 2017
    Assignee: Texas Instruments Incorporated
    Inventors: Juan Alejandro Herbsommer, Gerd Schuppener, Robert Floyd Payne
  • Patent number: 9531853
    Abstract: An electronic device including a rear cover, a transparent front cover, a first electronic element, a second electronic element, a conductive tape, and an elastomer is provided. The transparent front cover is disposed on the rear cover. The first electronic element is disposed between the transparent front cover and the rear cover. The second electronic element is disposed between the first electronic element and the rear cover. The conductive tape is disposed between the first electronic element and the second electronic element, and contacts the first electronic element and the second electronic element to electrically connect the first electronic element to the second electronic element. The elastomer is disposed between the first electronic element and the second electronic element, and is attached to the conductive tape under pressure. An electronic module including the first electronic element, the second electronic element, the conductive tape, and the elastomer above is provided.
    Type: Grant
    Filed: November 1, 2013
    Date of Patent: December 27, 2016
    Assignee: HTC Corporation
    Inventors: I-Cheng Chuang, Yu-Jing Liao, Ying-Yen Cheng, Chih-Wei Tu
  • Patent number: 9226433
    Abstract: A fabric over foam electromagnetic interference gasket has a body of indefinite length, and includes a layer of dielectric material thereon. The gasket may be compressed between two substrates and provide electrical conductivity in one axis and EMI shielding and nonconductivity in a perpendicular axis.
    Type: Grant
    Filed: November 10, 2014
    Date of Patent: December 29, 2015
    Assignee: Laird Technologies, Inc.
    Inventors: Kelly Cook, Tomas Hrcek, Michael Poulsen, Sri Talpallikar
  • Patent number: 9083089
    Abstract: In one exemplary embodiment of the invention, an electrical grounding device for dissimilar metals is provided. The device includes a body comprising adjacent first and second plate portions, the body including a first surface formed from a first metal and an opposite second surface formed from a second metal. The first plate portion is folded onto the second plate portion such that a portion of the first surface of the first plate portion contacts a portion of the first surface of the second plate portion. The first surface of the first plate portion is configured to couple to a first component formed from the first metal and the second surface of the second plate portion is configured to couple to a second component formed from the second metal, the body electrically coupling the first component and the second component to facilitate electrically connecting the first and second components.
    Type: Grant
    Filed: July 9, 2013
    Date of Patent: July 14, 2015
    Assignee: GM Global Technology Operations LLC
    Inventors: David R. Petrucci, Harpal Singh, Donald R. Seyerle, William A. Schumacher, Louis Meli
  • Patent number: 9078351
    Abstract: According to one embodiment, a grounding gasket includes a main body and a projecting part. The main body is configured to be interposed between a ground part and a substrate and contact the ground part and the substrate. The projecting part projects from the main body. The projecting part is configured to extend through a through-hole which is opened in the substrate, project to a side opposite to a side on which the ground part is located, and contact a conductive component mounted on the substrate.
    Type: Grant
    Filed: August 30, 2013
    Date of Patent: July 7, 2015
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Tomohiro Matano, Motoyuki Hirakata
  • Publication number: 20150090486
    Abstract: A fabric over foam electromagnetic interference gasket has a body of indefinite length, and includes a layer of dielectric material thereon. The gasket may be compressed between two substrates and provide electrical conductivity in one axis and EMI shielding and nonconductivity in a perpendicular axis.
    Type: Application
    Filed: November 10, 2014
    Publication date: April 2, 2015
    Inventors: Kelly Cook, Tomas Hrcek, Michael Poulsen, Sri Talpallikar
  • Patent number: 8964408
    Abstract: An electromagnetic interference (EMI) absorber includes an EMI conductive sheet having first and second portions, the first portion absorbing EMI from an EMI absorption target and the second portion for conducting EMI to an EMI discharge target, and an elastic member covered by the first portion.
    Type: Grant
    Filed: October 8, 2008
    Date of Patent: February 24, 2015
    Assignee: Samsung Display Co., Ltd.
    Inventors: Sung-Kyu Lee, Ju-Geun Kim
  • Patent number: 8884168
    Abstract: A fabric over foam electromagnetic interference gasket has a body of indefinite length, and includes a layer of dielectric material thereon. The gasket may be compressed between two substrates and provide electrical conductivity in one axis and EMI shielding and nonconductivity in a perpendicular axis.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: November 11, 2014
    Assignee: Laird Technologies, Inc.
    Inventors: Kelly Cook, Thomas Hrcek, Michael Poulsen, Sri Talpallikar
  • Publication number: 20140262471
    Abstract: A fabric over foam electromagnetic interference gasket has a body of indefinite length, and includes a layer of dielectric material thereon. The gasket may be compressed between two substrates and provide electrical conductivity in one axis and EMI shielding and nonconductivity in a perpendicular axis.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Applicant: LAIRD TECHNOLOGIES, INC.
    Inventors: Kelly Cook, Tomas Hrcek, Michael Poulsen, Sri Talpallikar
  • Patent number: 8748754
    Abstract: A system and method of forming a patterned conformal structure for an electrical system is disclosed. The conformal structure includes a dielectric coating shaped to conform to a surface of an electrical system, with the dielectric coating having a plurality of openings therein positioned over contact pads on the surface of the electrical system. The conformal structure also includes a patterned conductive coating layered on the dielectric coating and on the contact pads such that an electrical connection is formed between the patterned conductive coating and the contact pads. The patterned conductive coating comprises at least one of an interconnect system, a shielding structure, and a thermal path.
    Type: Grant
    Filed: November 22, 2011
    Date of Patent: June 10, 2014
    Assignee: General Electric Company
    Inventors: Christopher James Kapusta, Donald Paul Cunningham
  • Publication number: 20140097014
    Abstract: Disclosed are a surface mount gasket and a method of manufacturing the same. The surface mount gasket includes a laminated sheet comprising a solderable metal layer and a core layer adjoining one surface of the metal layer, and a plating layer surrounding the laminated sheet.
    Type: Application
    Filed: June 8, 2011
    Publication date: April 10, 2014
    Inventor: Chul Soo Choi
  • Patent number: 8674237
    Abstract: A method and structures are provided for implementing press-lock electromagnetic compatibility (EMC) gaskets. A gasket includes a plurality of fasteners received through a plurality of corresponding mounting apertures in a perforated support surface for precise placement, and retention without adhesives. The corresponding mounting apertures have a diameter smaller than 1/20th of a wavelength of the highest frequency to be suppressed to remain independent of the shielding required. The gasket defines a cavity receiving compliant foam, and includes an absorber.
    Type: Grant
    Filed: August 23, 2012
    Date of Patent: March 18, 2014
    Assignee: International Business Machines Corporation
    Inventors: Don A. Gilliland, Rebeccah J. Vossberg
  • Publication number: 20130335285
    Abstract: Electronic devices may be provided with conductive structures such as displays and conductive housing walls. Conductive gaskets may be used to form electrical paths between opposing conductive structures in an electronic device. During device assembly, a conductive gasket may be compressed between opposing conductive structures. The conductive gasket may be formed from a conductive gasket wall structure. The conductive gasket wall structure may surround and at least partly enclose an air-filled cavity. Conductive gasket wall structures may be formed from conductive fabric, dielectric sheets coated with metal, or other conductive wall materials. The interior of a conductive gasket may be hollow and completely devoid of supporting structures or may contain internal structures for biasing the conductive gasket wall outwards. Planar gaskets and gaskets with other cross sections may be provided.
    Type: Application
    Filed: June 19, 2012
    Publication date: December 19, 2013
    Applicant: Apple Inc.
    Inventors: David P. Tarkington, Michelle Rae Goldberg, Nicholas A. Rundle, Peter N. Jeziorek, Jonathan M. Haylock, Jerzy Guterman
  • Patent number: 8481867
    Abstract: Compressible grounding pads with two conductor layers separated by a compressible foam layer comprise: (A) A first conductor layer, e.g., copper foil; (B) A first adhesive layer in direct contact with a part of the first conductor layer, the first conductor layer extending beyond the first adhesive layer; (C) A foam layer in direct contact with one facial side of the first adhesive layer; (D) A second adhesive layer in direct contact with the opposite facial side of foam layer; (E) A second conductor layer, e.g., copper foil, in direct contact with the second adhesive layer, the second conductor layer extending beyond the second adhesive layer such that the second conductor layer joins with the first conductor layer; (F) An electrically conductive third adhesive layer in direct contact with the facial surface opposite the facial surface that is in direct contact with the second conductor layer; and (G) An optional release liner in direct contact with the third adhesive layer.
    Type: Grant
    Filed: July 20, 2011
    Date of Patent: July 9, 2013
    Assignee: Brady Converting AB
    Inventor: Alf Martin Book
  • Publication number: 20120018211
    Abstract: Compressible grounding pads with two conductor layers separated by a compressible foam layer comprise: (A) A first conductor layer, e.g., copper foil; (B) A first adhesive layer in direct contact with a part of the first conductor layer, the first conductor layer extending beyond the first adhesive layer; (C) A foam layer in direct contact with one facial side of the first adhesive layer; (D) A second adhesive layer in direct contact with the opposite facial side of foam layer; (E) A second conductor layer, e.g., copper foil, in direct contact with the second adhesive layer, the second conductor layer extending beyond the second adhesive layer such that the second conductor layer joins with the first conductor layer; (F) An electrically conductive third adhesive layer in direct contact with the facial surface opposite the facial surface that is in direct contact with the second conductor layer; and (G) An optional release liner in direct contact with the third adhesive layer.
    Type: Application
    Filed: July 20, 2011
    Publication date: January 26, 2012
    Inventor: Alf Martin Book
  • Patent number: 8081490
    Abstract: An apparatus includes a computer chassis and a motherboard. The motherboard defines a mounting aperture and a securing hole. The mounting aperture includes a large hole and a small hole communicating with the large hole. The computer chassis includes a bottom plate which defines a screw hole therein. A first convex projection is formed on the bottom plate. A hollow pillar is formed on the first convex projection. The pillar defines a through hole extending through the pillar and the first convex projection. A blind rivet is mounted in the through hole. The blind rivet includes a cap located above the pillar. The cap has an area larger than the small hole. The motherboard is slidable between a first position and a second position. In the first position the motherboard is located on the first convex projection, the pillar extends in the large hole of the motherboard and the cap is positioned above the motherboard.
    Type: Grant
    Filed: July 15, 2009
    Date of Patent: December 20, 2011
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Yun-Lung Chen, Rui-Peng Shen
  • Patent number: 8067701
    Abstract: An apparatus providing one or more I/O connections to a computer. The apparatus includes a Faraday cage generally about a flex cable, or other computing element, that may translate when the I/O ports to the computer are utilized. The embodiment maintains the Faraday cage for the flex cable or element as the I/O port housing opens or closes.
    Type: Grant
    Filed: August 29, 2008
    Date of Patent: November 29, 2011
    Assignee: Apple Inc.
    Inventors: Steven Keiper, John Brock, Eugene Kim, John Schen, Steve Cabral, Dave Hardell
  • Patent number: 7880095
    Abstract: A gasket is interposed between a circuit board that generates electromagnetic waves and a conductive member, and includes an elastic member separating the circuit board from the conductive member. The gasket is electrically connected with the circuit board by a conductive layer to receive the electromagnetic waves from the circuit board. The conductive layer is covered with an insulating layer except for a contact area where the conductive layer is coupled with the circuit board. The insulating layer blocks the electromagnetic waves received from the circuit board. The electromagnetic wave noise of a display apparatus is reduced even if a contact failure occurs between the gasket and a top chassis.
    Type: Grant
    Filed: September 21, 2007
    Date of Patent: February 1, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ha-Yun Kang, Gun-Ho Kim, Jae-Kook Kim
  • Patent number: 7732714
    Abstract: An electrically conductive gasket for paint masking. In one embodiment of the present invention, the gasket includes a core, an electrically conductive cover that is applied to the core with adhesive. A film of material is attached to the outer surface of the electrically conductive cover which functions as a removable mask. The various embodiments of the gasket may be fabricated from materials capable of withstanding relatively high temperatures and may be provided in a variety of different shapes.
    Type: Grant
    Filed: December 2, 2005
    Date of Patent: June 8, 2010
    Assignee: Jemic Shielding Technology
    Inventors: Clark S. Hammaker, John F. Dietrich
  • Patent number: 7659483
    Abstract: A gasket for shielding a seam between two surfaces includes a resilient member, a first electrode, a second electrode and a conductive layer. The resilient member has a first side and an opposite second side. The first electrode is disposed on the first side of the resilient member. The second electrode is disposed on the second side of the resilient member. The conductive layer envelops at least a portion of the resilient member, the first electrode and the second electrode. The resilient member includes a material that is compressed when a first potential is applied between the first electrode and the second electrode and that is decompressed when a second potential, different from the first potential, is applied between the first electrode and the second electrode.
    Type: Grant
    Filed: May 21, 2008
    Date of Patent: February 9, 2010
    Assignee: International Business Machines Corporation
    Inventors: Don A Gilliland, Sophia S. Lau
  • Publication number: 20090231218
    Abstract: A frame assembly for a composite panel includes a first frame having a first frame contact surface transverse to a first frame mount surface and a second frame having a second frame contact surface transverse to a second frame mount surface, the first frame mount surface receivable within the second frame mount surface to provide a conductive communication path therebetween.
    Type: Application
    Filed: March 12, 2008
    Publication date: September 17, 2009
    Inventors: Ralph D. Brunks, Scott M. Mortensen
  • Publication number: 20090114438
    Abstract: According to various aspects, exemplary embodiments are provided of fabric-over-foam EMI gaskets. In one exemplary embodiment, a fabric-over-foam EMI gasket generally includes a resiliently compressible foam core and an outer electrically-conductive fabric layer. At least one slit extends generally transversely across an upper surface portion of a longitudinally extending region of the gasket.
    Type: Application
    Filed: February 4, 2008
    Publication date: May 7, 2009
    Applicant: LAIRD TECHNOLOGIES, INC.
    Inventor: Philip van Haaster
  • Patent number: 7498524
    Abstract: Enclosures and gasket assemblies for reducing EMI for computer systems and other electronic devices are disclosed. In an exemplary embodiment a gasket assembly for reducing EMI may comprise a soft core sizable to extend along at least the length of an opening in an EMI housing. The gasket assembly may also comprise a plurality of fingers positionable at spaced-apart positions along the entire length of the opening in the EMI housing, the plurality of fingers maintaining conductivity between mating surfaces of the EMI housing.
    Type: Grant
    Filed: April 23, 2007
    Date of Patent: March 3, 2009
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventor: Colin E. Brench
  • Publication number: 20090008431
    Abstract: Apparatus, which is useful as both a conductive gasket and a grounding pad, which has a compressible elastomeric substrate having at least one side surface and two ends, a conductive elastomeric layer adjacent to all of the side surfaces of the compressible substrate, and a metal layer adjacent to the conductive layer.
    Type: Application
    Filed: July 3, 2007
    Publication date: January 8, 2009
    Inventors: Kossi Zonvide, Jeremy Trethewey
  • Patent number: 7473855
    Abstract: A HF sealing strip (1) for electromagnetically shielded, insertable electronic modules comprises a core (2) of an elastically deformable material and a cover (3) of a flexible, conductive textile fabric. The cross section of the core (2) corresponds to an isosceles triangle with obtuse angle at the top. One section of the cover (3) forms a level contact surface (4), to which adhesive strips (7a; 7b; 8) are attached. In the region of the edges for the contact surface (4), the cover (3) of a textile fabric is used to form double-layer flaps (6a, 6b) without an elastic core. These flaps (6a, 6b) form reinforced, level outside edges of the HF sealing strip (1), which can thus better withstand shearing forces transverse to the contact surface (4).
    Type: Grant
    Filed: March 13, 2006
    Date of Patent: January 6, 2009
    Assignees: Schroff GmbH, MTC Micro Tech Components GmbH
    Inventors: Paul Rutherford, Michael Joist, Peter Dratwa
  • Patent number: 7470866
    Abstract: An electrically conductive gasket and methods of manufacturing electrically conductive gaskets. In one embodiment, the gasket includes a core that supports an electrically conductive cover thereon. The electrically conductive cover may be attached to the core or portions of the core by one or more adhesives used to also affix the gasket to an electrically conductive object. In other embodiments, a mechanical fastener may be affixed to the core by the one or more adhesives employed to affix the electrically conductive cover to the core.
    Type: Grant
    Filed: November 18, 2004
    Date of Patent: December 30, 2008
    Assignee: Jemic Shielding Technology
    Inventors: John F. Dietrich, Clark S. Hammaker
  • Patent number: 7456365
    Abstract: A gasket for shielding a seam between two surfaces includes a resilient member, a first electrode, a second electrode and a conductive layer. The resilient member has a first side and an opposite second side. The first electrode is disposed on the first side of the resilient member. The second electrode is disposed on the second side of the resilient member. The conductive layer envelops at least a portion of the resilient member, the first electrode and the second electrode. The resilient member includes a material that is compressed when a first potential is applied between the first electrode and the second electrode and that is decompressed when a second potential, different from the first potential, is applied between the first electrode and the second electrode.
    Type: Grant
    Filed: September 7, 2006
    Date of Patent: November 25, 2008
    Assignee: International Business Machines Corporation
    Inventors: Don A. Gilliland, Sophia S. Lau
  • Patent number: 7446264
    Abstract: An electromagnetic wave shielding gasket comprising a gasket body integrated with an electroconductive non-woven fabric or woven fabric, a seal part being provided, while avoiding the area of the electroconductive non-woven fabric or woven fabric, where the gasket body, preferably a gasket body with a lip-shaped projection, is integrated at the edge with the electroconductive non-woven fabric or woven fabric, and particularly preferably an annular gasket body with a lip-shaped projection is integrated at the inner peripheral edge with the outer peripheral edge of the annular body of the electroconductive non-woven fabric or woven fabric.
    Type: Grant
    Filed: November 24, 2005
    Date of Patent: November 4, 2008
    Assignee: NOK Corporation
    Inventors: Yutaka Kouda, Keiichi Miyajima, Takeshi Yamada, Tomohiro Inoue
  • Patent number: 7402761
    Abstract: Disclosed is an electric conductive gasket including: an electric conductive sheet having a natural pulp base, a soft aluminum foil adhered to a surface of the natural pulp base with an adhesive being interposed therebetween, and a hot melt layer formed on the other surface of the natural pulp base; and a nonconductive elastic member overlapped to be continuously encompassed by the electric conductive sheet, to be adhered by the hot melt layer.
    Type: Grant
    Filed: May 26, 2006
    Date of Patent: July 22, 2008
    Assignee: Joinset Co., Ltd.
    Inventor: Sun-Ki Kim
  • Patent number: 7339119
    Abstract: A harness outlet structure of an engine permitting a reliable shield at a harness outlet of the engine. The structure includes a wiring harness is clamped by a shield cover and an engine main body via a grommet bracket. The grommet bracket includes a groove having a width equivalent to the thickness of the shield cover disposed circumferentially between two flange portions of the grommet bracket. A harness overall for shielding the wiring harness is mounted externally on a proximal end of the grommet bracket. The harness overall is a shield outer jacket body formed from braided metal fibers. The harness overall is inserted over an outside of the proximal end of the grommet bracket until one end of the harness overall contacts the flange portion. The harness overall is then joined by a coupling ring.
    Type: Grant
    Filed: March 31, 2006
    Date of Patent: March 4, 2008
    Assignee: Honda Motor Co., Ltd.
    Inventors: Akira Hamazu, Mamoru Mikame, Daisuke Hayashi, Kiyoaki Yokoyama, Hiroshi Uruno
  • Patent number: 7326861
    Abstract: The present invention insulates the source of noise efficiently by forming a thick noise insulating portion to the cover to tightly seal a drive unit which generates heat and noise and at the same time, increases the cooling effect of cooling fins by making the surface areas of the cooling fin ends that are away from the noise insulating portion wide by the amount equivalent to the surface area of the cooling fins decreased by the noise insulating portion provided, and obtains the shielding cover that is excellent in both cooling and noise insulation.
    Type: Grant
    Filed: January 19, 2005
    Date of Patent: February 5, 2008
    Assignees: Kabushiki Kaisha Toshiba, Toshiba Tec Kabushiki Kaisha
    Inventor: Takahiro Kojima
  • Patent number: 7292459
    Abstract: A handheld communication apparatus includes a metallic insert molding member, a circuit board and a shielding frame. The metallic insert molding member includes a metal plate. An electronic component is mounted on the circuit board. The shielding frame defines opposite first and second openings, wherein the shielding frame is bonded to the metal plate of the metallic insert molding member at the first opening, thereby forming a shielding case. The electronic component on the circuit board is inserted into the second opening of the shielding frame to be shielded by the shielding case.
    Type: Grant
    Filed: May 31, 2006
    Date of Patent: November 6, 2007
    Assignee: Arima Communications Corp.
    Inventor: Szu Wei Wang
  • Patent number: 6958527
    Abstract: A wiring board includes a substrate, and an interconnect pattern which is formed on the substrate and includes a land. A penetration hole, which exposes the substrate, is formed in the land. The penetration hole is formed in a region along a periphery of the land.
    Type: Grant
    Filed: September 4, 2003
    Date of Patent: October 25, 2005
    Assignee: Seiko Epson Corporation
    Inventor: Terunao Hanaoka
  • Patent number: 6742361
    Abstract: An apparatus for delivering a spray of cooling liquid to opposed shear blades of an apparatus for shearing a stream of molten glass into gobs, the apparatus having liquid outlets (24, 26) that lead to spray nozzles. A liquid is intermittently delivered at a low pressure to the liquid outlets (24, 26) from separate liquid inlets (20, 22, respectively), each of the outlets (24, 26) having a solenoid valve (28, 30, respectively), in a line leading thereto. The nozzles that receive liquid from the outlets (24, 26) are periodically purged of accumulated coagulated coolant or other debris by pumping coolant therethrough at a substantially higher pressure.
    Type: Grant
    Filed: October 1, 2001
    Date of Patent: June 1, 2004
    Assignee: Owens-Brockway Glass Container Inc.
    Inventors: George A. Nickey, John M. Slifco
  • Patent number: 5761047
    Abstract: An electrical assembly having a first member and a second member which form a housing for a circuit board. At least one rib extends from an inner face of the first member. The connector assembly also includes an electrical connector disposed in the housing having at least one contact arm contacting the circuit board. The rib contacts the connector and urges the connector against the circuit board. With this invention there is no need to heat stake or otherwise secure the connector to the board.
    Type: Grant
    Filed: May 29, 1996
    Date of Patent: June 2, 1998
    Assignee: UT Automotive Dearborn, Inc.
    Inventors: Steven Settles, Jennifer Wever
  • Patent number: 5401914
    Abstract: A shielding vent for an electromagnetic interference shielded enclosure having an electrically conducting wall shield includes a mounting plate or flange through which extends a vent pipe with an internal septum plate or divider extending axially along at least a portion of the inner length of the vent pipe. The mounting flange is secured to a wall of the shielded enclosure over an opening in the wall and to the wall shield to insure that the integrity of the shielding for the enclosure is maintained. With the mounting flange so mounted on the wall of the enclosure, the vent pipe extends through the opening in the wall of the enclosure and provides fluid communication between an internal region of the enclosure and a region external of the enclosure. The septum plate has a cross section in the shape of a cross so that at least a portion of the length of the cylindrically shaped vent pipe is subdivided into four parallel, axially extending equal fluid flow sections.
    Type: Grant
    Filed: February 3, 1993
    Date of Patent: March 28, 1995
    Assignee: The Curran Company
    Inventors: William E. Curran, Joseph C. Weibler, Michael T. Egan
  • Patent number: 4433206
    Abstract: An EMI shielded connector assembly for a cable connector is formed of aluminum and has an aperture 44 therein to receive potting compound 46 to secure the wires 28 to the connector body. The braided inner cover 26 of the cable 24 is formed into a pig tail 34 and is secured in the back-shell 40 by the potting compound 46. Between the braided inner cover 26 and the braided outer cover 30 which is the braided shield, a ferrule member 60 is positioned on the cable and the outer cover 30 is braided over the ferrule member 60. Next the ferrule clamping member 62 is positioned over the ferrule member 60 in such a position that the groove 68 overrides the ring 66. The two ferrule member 60 and 62 are pressed together and form a strain relief means 38. The strain relief means 38 is welded 42 to the back-shell 40 and a rivet 48 plugs the potting aperture 44 in the back-shell 40 after which a rubberized boot 50 is formed over the enclosure.
    Type: Grant
    Filed: December 10, 1981
    Date of Patent: February 21, 1984
    Assignee: The Bendix Corporation
    Inventor: John Lewis