Abstract: The present disclosure is related to electronic devices. At least some embodiments of the present disclosure relate to an electronic device comprising a circuit board, a first connector, and a second connector. The first connector and the second connector are disposed on the circuit board. The first connector is different from the second connector. The second connector is adjacent to the first connector. The first connector is arranged along a reference line in a first direction, and the second connector is adjacent to the reference line in the first direction.

Abstract: To provide an electronic control device capable of suppressing leakage of radio-frequency radiation noise, radiated from a noise source, to the outside.

Abstract: A display device includes a base substrate including a display area and a non-display area at a periphery of the display area; a first signal wiring on the non-display area of the base substrate and including a first wiring part and a second wiring part connected to the first wiring part; and a printed circuit board including a lead wiring on the first signal wiring. The second wiring part includes an open part passing through a surface of the second wiring part in a thickness direction, the second wiring part includes a long side extending along a first direction and a short side extending along a second direction intersecting the first direction, and a separation distance between the open part and an end of the short side of the second wiring part in the first direction is within about 0.4 times the long side of the second wiring part.

Abstract: Electronic equipment includes a printed board having a front surface on which a ground pattern is formed and a shield member disposed opposed to the front surface of the printed board. The shield member has a strip-shaped region that is opposed to the ground pattern and protrudes toward the printed board, and is fastened to the printed board by screws that pass through a respective one of a plurality of screw holes made in the strip-shaped region. Either one of the shield member and the printed board has a protruding part that is formed projectingly toward the other and causes the strip-shaped region and the ground pattern to get contact with each other at a position sandwiched by adjacent two screw holes in the strip-shaped region in plan view.

Abstract: According to an embodiment of the present disclosure, a connecting device included in an electronic device may comprise a movable part including at least one contacting part, an elastic part extending from the movable part and including a plurality of bends alternately arranged to allow the movable part to move in a first direction, and a support extending from the elastic part. Other various embodiments are also possible.

Abstract: A housing structure of a printed circuit board with a connector includes the printed circuit board on which an electronic component is implemented, the connector implemented on an end portion of the printed circuit board, the connector including a fitted portion fitted with a mating component which is a connection target, and a housing accommodating the printed circuit board and the connector. The housing includes a first case surrounding the printed circuit board and a second case covering the connector. The second case includes a first surface portion arranged at a side where the fitted portion of the connector is provided, and at least one second surface portion which is nonparallel to the first surface portion.

Abstract: A shield structure includes a shield bracket, a shield cover, and a shield layer. The shield cover is formed with openings. The shield layer is spliced with the shield cover through a conductive tape layer and covers all openings. The shield cover is formed with openings and a light shield layer is spliced with the shield cover and covers the openings, greatly reducing the weight of the shield cover while ensuring the shielding effect, without compressing space for other elements. The shield layer is thin, capable of lowering down the shield, dissipating heat effectively, reducing the temperature of the whole machine and providing a good environment for the operation of the whole machine, without affecting the shielding effect; and the conductive tape layer is spliced with the shield layer, thus allowing multiple assembling without damaging the whole structure, and facilitating subsequent repair.

Abstract: An electrical junction box that includes a circuit board on which a coil element is installed; a partition wall that surrounds the coil element and separates an installation region on the circuit board on which the coil element is installed from a region around the installation region; a frame that is formed in one piece with the partition wall and surrounds the circuit board; a heat dissipation plate on which the circuit board and the frame are placed; and a cover that covers the circuit board from the frame side, wherein the coil element is fixed to the partition wall using a synthetic resin material, and wherein the frame and the heat dissipation plate are positioned relative to each other through a recess-projection engagement, and the cover is fixed to the heat dissipation plate using screws.

Abstract: Semiconductor devices and methods of manufacture thereof are disclosed. In some embodiments, a method of manufacturing a device includes coupling a first semiconductor device to a second semiconductor device by spacers. The first semiconductor device has first contact pads disposed thereon, and the second semiconductor device has second contact pads disposed thereon. The method includes forming an immersion interconnection between the first contact pads of the first semiconductor device and the second contact pads of the second semiconductor device.

Abstract: A shielding assembly is disclosed, the assembly including at least a board level shield and a heat sink. The assembly may include a board level shield that includes both a lid and a fence, and may also include a thermal interface material, where the assembly may be mounted on a printed circuit board to provide both EMI shielding and thermal management of heat-generating electronic components or heat sources on the circuit board. The heat sink includes at least one pin, and the shield includes at least one complementary perforation relative to the pin, such that an assembled device of the disclosure provides both EMI shielding and thermal management while permitting the transfer of thermal energy via the heat sink pin through the board level shield perforation.

Abstract: Some embodiments include a privacy/security apparatus for a portable communication device that includes a housing assembly configured to at least partially attenuate at least one of sound energy, acoustic energy, and electromagnetic energy including light, optical, and IR energy and RF radiation from passing through the housing assembly. The housing assembly includes a Faraday cage with two or more portions, and at least one protective shell coupled to or forming at least one aperture. The at least one aperture is configured and arranged to at least partially enclose the portable communication device so that at least a portion of the portable communication device is positioned within at least one portion of the Faraday cage, and the at least one seal coupled or integrated with the protective shell. The housing assembly can be an articulating assembly, a sliding assembly, and can include an active acoustic jamming or passive acoustic attenuation element.

Abstract: A method for manufacturing a semiconductor package and the semiconductor package are provided. The method for manufacturing a semiconductor package may include arranging a conductive elastic plate over a package substrate including through slits disposed along edges of a chip mounting region and a conductive guard rails providing a concave trench shape, and bending the conductive elastic plate. Edge portions of the conductive elastic plate may be inserted into the trenches of the conductive guard rails and supported by the conductive guard rails by a force trying to stretch by the elastic restoring force of the wing portions of the conductive elastic plate.

Abstract: A backlight assembly includes a light source, a light-guiding member, a mold frame and a printed circuit board (“PCB”). The light source generates light. The light-guiding member guides the light generated from the light source. The mold frame receives the light-guiding member. An opening is formed through a side of the mold frame. The PCB drives the light source, and includes an extension portion extending through the opening of the mold frame.

Abstract: Shielding performance and protection from radiated RF energy at a cable's point of entry to an enclosure are improved when a shield of the cable is AC coupled around an entire opening of the enclosure using a discoidal capacitor. The capacitor may be electrically coupled to the shield and the enclosure around the entire inner and outer circumferences of the discoidal capacitor. Compared to traditional DC coupling or the use of a drain wire and traditional capacitor, using the discoidal capacitor lowers inductance and improves shielding of the opening itself while improving AC filtering characteristics and preventing ground loops.

Abstract: A circuit board and a method of manufacturing the same are provided. The circuit board includes: a multilayer board in which a plurality of conductive layers with desired patterns formed therein, and a plurality of insulating layers are stacked; a plurality of through holes penetrating the multilayer board; cylindrical recesses each formed around a through hole corresponding thereto, having a diameter larger than that of the through hole, having a depth from an outermost surface of the insulating layer to a surface of the conductive layer for electrical connection, and partially exposing the surface of the predetermined conductive layer; and a plurality of conductive terminals fitted into the through holes.

Abstract: Disclosed is a laminated (or non-laminated) conductive interconnection for joining an integrated circuit device to a device carrier, where the conductive interconnection comprises alternating metal layers and polymer layers. In addition, the polymer can include dendrites, metal projections from the carrier or device, and/or micelle brushes on the outer portion of the polymer. The polymer layers include metal particles and the alternating metal layers and polymer layers form either a cube-shaped structure or a cylinder-shaped structure.

Abstract: A radiation shielded module (120, 500, 600, 700) and method of shielding microelectronic devices (126, 412, 618, and 718) including a single interconnect substrate (110, 400, 612, 712) having a first side (122, 410, 620, 720) and a second side (124, 416, 610, 710). At least one microelectronic device is coupled to the first side of the single interconnect substrate. A shielding structure (100, 200, 300, 614, 714) is coupled to the single interconnect substrate and configured to shield radio frequency interference (RFI) and electromagnetic interference (EMI) that propagate through at least a portion of the single interconnect substrate.

Abstract: The replacement lid for an electromagnetic shielding device is generally planar with stenciled solder segments formed immediately inwardly adjacent from the periphery thereof. The replacement lid is installed onto an electromagnetic shielding device by placing the stenciled solder segments against the walls of the electromagnetic shielding device so that the unstenciled side of the replacement lid is exposed. The installer then applies a heat source to the unstenciled side of the replacement lid thereby melting the solder and forming a bond between the replacement lid and the shielding device. The replacement lid may be manufactured by securing the replacement lid between a platen and a stencil and using a squeegee to apply solder paste through the stencil onto the replacement lid.

Abstract: An electronic device and coupled flexible circuit board and method of manufacturing. The electronic device is coupled to the flexible circuit board by a plurality of Z-interconnections. The electronic device includes a substrate with electronic components coupled to it. The substrate also has a plurality of device electrical contacts coupled to its back surface that are electrically coupled to the electronic components. The flexible circuit board includes a flexible substrate having a front surface and a back surface and a plurality of circuit board electrical contacts coupled to the front surface of the flexible substrate. The plurality of circuit board electrical contacts correspond to plurality of device electrical contacts. Each Z-interconnection is electrically and mechanically coupled to one device electrical contact and a corresponding circuit board electrical contact.

Abstract: A ballast housing having a uniform generally rectangular cross section is formed, preferably by extrusion, to accommodate any of a number of ballasts of varying sizes. Exterior sidewalls are formed with longitudinal grooves, one of which contains a pair of cylindrical members. A separate mounting plate carries screws which contact the cylindrical members and permit the cylindrical members to act as hinges permitting the housing to pivot away from the mounting plate. Closure plates are secured to each end of the housing and standard threaded ports may be formed in each closure plate as well as in the extruded member for mounting lighting fixtures or conduits carrying wires. Mating openings are formed on the backside of the housing member and the mounting plate for the passage of power leads to the ballast in the housing.