Joints Patents (Class 174/363)
  • Patent number: 11942357
    Abstract: A placement apparatus for placing a workpiece is provided. The placement apparatus includes a stage on which a workpiece can be placed in a processing vessel; an edge ring including a locking part which is disposed on the stage so as to surround a periphery of the workpiece; a conductive connecting member connected with the edge ring at the locking part; and a first contacting member configured to cause the edge ring to contact the stage, while the edge ring is connected with the connecting member.
    Type: Grant
    Filed: July 7, 2022
    Date of Patent: March 26, 2024
    Assignee: Tokyo Electron Limited
    Inventors: Yohei Uchida, Naoki Sugawa, Katsushi Abe, Tsuyoshi Hida
  • Patent number: 11497151
    Abstract: A sealing arrangement includes: a first machine element and a second machine element, each made of an electrically-conductive material; and a seal. The first and second machine elements are sealed against one another by the seal. At least one of the machine elements is made of an electrically-conductive plastic which is at least partially covered by an electrically-insulating, injection-molded skin as a result of production. The seal has an electrically-conductive support body. The support body has at least one substantially mandrel-shaped projection comprising an electrically-conductive material which is arranged on a side of the support body facing the injection-molded skin and completely penetrates the injection-molded skin.
    Type: Grant
    Filed: March 9, 2021
    Date of Patent: November 8, 2022
    Assignee: CARL FREUDENBERG KG
    Inventors: Herve Di Meo, Marina Nussko, Matthias Hauer, Volker Schroiff, Marco Sutter
  • Patent number: 11481007
    Abstract: A computer cases includes a rear panel with a slot field and an expansion card with a slot bracket that is fixed laterally to the slot field by a screw. An opening is cut out on the rear panel next to the slot field so that the screw for fixing the expansion card is easily accessible and can be easily mounted with a corresponding tool.
    Type: Grant
    Filed: December 2, 2020
    Date of Patent: October 25, 2022
    Assignee: Fujitsu Client Computing Limited
    Inventors: August Scherer, Lutz Rösler
  • Patent number: 11291130
    Abstract: A casing includes a substrate, a protection layer, a bottom coating layer, a coating film layer, and a surface coating layer. The protection layer is formed on the substrate. The bottom coating layer is formed on the protection layer. The coating film layer is formed on the bottom coating layer. The surface coating layer is formed on the coating film layer. One of a surface of the substrate where the protection layer is formed on, a surface of the protection layer where the bottom coating layer is formed on, and a surface of the bottom coating layer where the coating film layer is formed on has a concave-convex pattern.
    Type: Grant
    Filed: February 4, 2021
    Date of Patent: March 29, 2022
    Assignee: Acer Incorporated
    Inventors: Wen-Hsin Lin, Cheng-Nan Ling, Wen-Chieh Tai
  • Patent number: 11234350
    Abstract: A housing device for isolating electromagnetic interference emitting devices includes a structural frame for housing the electromagnetic interference emitting devices. The housing device further includes a non-structural electromagnetic interference isolating enclosure. The non-structural electromagnetic interference isolating enclosure is for encapsulating the structural frame. The non-structural electromagnetic interference isolating enclosure includes an access portion that enables the structural frame to be accessed. The access portion includes a vent.
    Type: Grant
    Filed: August 21, 2019
    Date of Patent: January 25, 2022
    Assignee: Dell Products L.P.
    Inventors: Steven Embleton, Eric Michael Tunks, Ben John Sy, James Don Curlee, Joshua S. Keup
  • Patent number: 11216046
    Abstract: A laminate curtain can suppress electromagnetic radiation leakage from an electronic appliance, as well as assist in managing cables interconnected to the electronic appliance. More specifically, a laminate curtain can include a conductive elastomer panel that absorbs spurious electromagnetic radiation generated by the electronic appliance, a conductive adhesive film disposed along one side of the conductive elastomer panel, and a conductive support frame affixed to the conductive adhesive film. The laminate curtain can be installed within a mounting frame, which secures the laminate curtain to the electronic appliance. Electromagnetic radiation that is absorbed by the conductive elastomer panel can travel to the electronic appliance via the conductive adhesive film, the conductive support frame, and the mounting frame. Thus, the conductive elastomer panel can be used to form a ground plane that catches and shunts the spurious electromagnetic radiation to the electronic appliance, which is grounded.
    Type: Grant
    Filed: May 30, 2019
    Date of Patent: January 4, 2022
    Assignee: Gigamon Inc.
    Inventors: Henry Baum, Ravichandran Venkatachalam
  • Patent number: 11212949
    Abstract: A solid state drive device is provided. The solid state drive device includes a lower plate which includes a lower flat part, and a lower side wall protruding from the lower flat part primarily in a first direction, an upper plate which includes an upper flat part facing the lower flat part, and an upper side wall protruding from the upper flat part primarily in a second direction opposite to the first direction. The solid state drive device further includes a gasket including a metal material formed in at least a part of a region in which the lower side wall and the upper side wall overlap each other.
    Type: Grant
    Filed: March 19, 2020
    Date of Patent: December 28, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ji Yong Kim, Sunk-Ki Lee, Su In Kim
  • Patent number: 11147194
    Abstract: A housing device for isolating electromagnetic interference emitting devices includes a structural frame. The structural frame of the housing device is for housing the electromagnetic interference emitting devices. The housing device further includes an electromagnetic interference isolating enclosure. The electromagnetic interference isolating enclosure of the housing device is non-structural. The electromagnetic interference isolating enclosure of the housing device is for encapsulating the structural frame.
    Type: Grant
    Filed: August 21, 2019
    Date of Patent: October 12, 2021
    Assignee: Dell Products L.P.
    Inventors: Steven Embleton, Ben John Sy, Eric Michael Tunks, James Don Curlee, Joshua S. Keup
  • Patent number: 11047628
    Abstract: An electronic device having an improved heating state is disclosed. The disclosed electronic device can comprise: a housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a printed circuit board inserted between the first surface and the second surface; an electronic component disposed on the printed circuit board; a shielding structure mounted on the printed circuit board, and including a conductive structure for at least partially surrounding the electronic device; and a heat pipe including a first end portion and a second end portion, wherein the first end portion is thermally coupled to a portion of the shielding structure, and the first end portion is disposed closer to the shielding structure than the second end portion. Additionally, other examples are possible.
    Type: Grant
    Filed: February 14, 2017
    Date of Patent: June 29, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Haejin Lee, Kyungha Koo, Chunghyo Jung, Se-Young Jang, Jungje Bang, Jaeheung Ye, Chi-Hyun Cho
  • Patent number: 10966334
    Abstract: A casing includes a substrate, a protection layer, a bottom coating layer, a coating film layer, and a surface coating layer. The substrate has a first surface. The protection layer covers the first surface and has a second surface opposite to the first surface. The bottom coating layer covers the second surface and has a third surface opposite to the second surface. The coating film layer covers the third surface and has a fourth surface opposite to the third surface. The surface coating layer covers the fourth surface. One of the first surface, the second surface, and the third surface has a concave-convex pattern.
    Type: Grant
    Filed: December 9, 2019
    Date of Patent: March 30, 2021
    Assignee: Acer Incorporated
    Inventors: Wen-Hsin Lin, Cheng-Nan Ling, Wen-Chieh Tai
  • Patent number: 10798849
    Abstract: An electronic device having an improved heating state is disclosed. The disclosed electronic device can comprise: a housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a printed circuit board inserted between the first surface and the second surface; an electronic component disposed on the printed circuit board; a shielding structure mounted on the printed circuit board, and including a conductive structure for at least partially surrounding the electronic device; and a heat pipe including a first end portion and a second end portion, wherein the first end portion is thermally coupled to a portion of the shielding structure, and the first end portion is disposed closer to the shielding structure than the second end portion. Additionally, other examples are possible.
    Type: Grant
    Filed: July 18, 2019
    Date of Patent: October 6, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Haejin Lee, Kyungha Koo, Chunghyo Jung, Se-Young Jang, Jungje Bang, Jaeheung Ye, Chi-Hyun Cho
  • Patent number: 10790621
    Abstract: A portable information communications terminal includes a wiring board on which a ground pattern is formed, a connector including connector pins and mounted on the wiring board, a housing that has electrical conductivity and accommodates the wiring board on which the connector is mounted, an electroconductive connector shell (first shield member) that covers at least a portion of the connector pins, which are included in the connector, and that is electrically connected to the ground pattern of the wiring board, an electroconductive second shield member that is disposed so as not to be in contact with the connector shell and to cover the connector pins including a portion of the connector pins, the portion being not covered with the connector shell. The electroconductive second shield member is electrically connected to the housing, and an insulating member is interposed between the connector shell and the second shield member.
    Type: Grant
    Filed: October 10, 2019
    Date of Patent: September 29, 2020
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Kenichi Ito
  • Patent number: 10756494
    Abstract: A portable information communications terminal includes a wiring board on which a ground pattern is formed, a connector including connector pins and mounted on the wiring board, a housing that has electrical conductivity and accommodates the wiring board on which the connector is mounted, an electroconductive connector shell (first shield member) that covers at least a portion of the connector pins, which are included in the connector, and that is electrically connected to the ground pattern of the wiring board, an electroconductive second shield member that is disposed so as not to be in contact with the connector shell and to cover the connector pins including a portion of the connector pins, the portion being not covered with the connector shell. The electroconductive second shield member is electrically connected to the housing, and an insulating member is interposed between the connector shell and the second shield member.
    Type: Grant
    Filed: October 10, 2019
    Date of Patent: August 25, 2020
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Kenichi Ito
  • Patent number: 10535936
    Abstract: The invention relates to a system for retaining a component to a surface which includes a surface; a component; and at least two elements. Each element has a base connected to the surface, the at least two elements provide means for retaining the component to the surface, wherein a first means is biased to a first position in which the first means extend beyond an edge of a first base such that when the component is placed on the surface the first means are configured to move to a second position in order to retain the component in its position relative to the surface. The component provides at least one cavity defined by at least two inner faces, and wherein upon placement of the component on the surface, the base of each element is situated solely within the at least one cavity of the component.
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: January 14, 2020
    Assignee: HARWIN PLC
    Inventors: Robert Webber, Sam Bennett, Mark Plested, Andrew McQuilken
  • Patent number: 10485120
    Abstract: An enclosure assembly includes a plurality of enclosures. Each enclosure of the plurality of enclosures includes a cabinet including an interior surface defining an interior volume, and a door mounted relative to a respective opening of each cabinet. An interlocking device interlocks a first door of a first enclosure of the plurality of enclosures, a second door of a second enclosure of the plurality of enclosures, and a third door of a third enclosure of the plurality of enclosures. The interlocking device is operable to selectively fasten each of the first door, the second door, and the third door in a closed position.
    Type: Grant
    Filed: October 3, 2018
    Date of Patent: November 19, 2019
    Assignee: EATON INTELLIGENT POWER LIMITED
    Inventors: James W. Adams, Nick E. Klus, Scott Bradley
  • Patent number: 10477741
    Abstract: An inductive power transmission system electromagnetic field shielding apparatus includes an enclosure. The enclosure is configured to surround an electronic device and an inductive power transmitter that inductively transmits power to the electronic device. A communication window or high pass filter is formed in the enclosure. The communication window may include an arrangement of one or more conductive materials defining one or more apertures. The enclosure and the communication window block passage of magnetic flux generated by the inductive power transmitter. The communication window allows passage of communication transmissions associated with the electronic device.
    Type: Grant
    Filed: February 9, 2016
    Date of Patent: November 12, 2019
    Assignee: APPLE INC.
    Inventors: Mun Soo Bae, Bing Jiang, Haejoon Jung, Indranil S. Sen, Mohit Narang, Ruben Caballero
  • Patent number: 10426066
    Abstract: An electrical member comprises a housing and an electromagnetic shielding. The electromagnetic shielding is formed at least in sections by an electrically conductive coating on the housing.
    Type: Grant
    Filed: February 1, 2018
    Date of Patent: September 24, 2019
    Assignee: TE Connectivity Germany GmbH
    Inventor: Christian Heller
  • Patent number: 10206316
    Abstract: An enclosure for holding a printed circuit board includes a housing portion of metal containing at least about 90% magnesium and formed by a semi-solid metal casting process of thixomolding, and including first and second housing portions each including a closed end and an open end with a plurality of teeth where the first and second portions join together in a clamshell arrangement to define an enclosed space for holding the printed circuit board. The teeth of the first housing portion may be aligned to overlap and to engage corresponding ones of the teeth of the second housing portion in physical and electrical contact for blocking electromagnetic interference (EMI) with the housing portions closed together. A method of forming a housing portion of an enclosure for holding a printed circuit board is also provided, and which includes steps of thixomolding magnesium to form the housing portion with integrally-formed teeth.
    Type: Grant
    Filed: January 18, 2018
    Date of Patent: February 12, 2019
    Assignee: VISTEON GLOBAL TECHNOLOGIES, INC.
    Inventor: Marcus Walter Koch
  • Patent number: 10144362
    Abstract: An instrument panel includes a panel body in which an opening is provided to extend from a fitting part for the display device to a part located on a display rear side with respect to the fitting part, when a display front side is defined as a side toward which a display surface of the display device faces in the instrument panel in which the display device is fitted, the display rear side is defined as a side opposite to the display front side, and the fitting part is defined as a part in which the display device is fitted in the instrument panel; and a cover that is attached to the panel body and that covers, from an outside of the panel body, a part of the opening that is located on the display rear side with respect to the fitting part.
    Type: Grant
    Filed: August 7, 2017
    Date of Patent: December 4, 2018
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventor: Manami Suzuki
  • Patent number: 10104816
    Abstract: A board includes a first magnetic conductive plate and a second magnetic conductive plate. The first magnetic conductive plate has a first magnetic conductive direction. The second magnetic conductive plate overlaps with the first magnetic conductive plate. The second magnetic conductive plate has a second magnetic conductive direction. The first magnetic conductive direction and the second magnetic conductive direction cross.
    Type: Grant
    Filed: February 5, 2016
    Date of Patent: October 16, 2018
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chwen Yu, Chih-Ming Tsao
  • Patent number: 10054350
    Abstract: A removable cooling module for a refrigerator includes a cooling unit positioned in a housing and removably coupled with a top wall of the refrigerator. An ice maker is coupled to the cooling unit. An ice bin is disposed in the housing and is adapted to receive and store ice from the ice maker. A duct is in communication with the cooling unit and is adapted to convey ice from the removable cooling module to an ice dispenser.
    Type: Grant
    Filed: May 18, 2012
    Date of Patent: August 21, 2018
    Assignee: Whirlpool Corporation
    Inventors: Rameet Singh Grewal, Steven J. Kuehl, Andrew D. Litch, Douglas D. Leclear, Lorraine J. Westlake, Guolian Wu
  • Patent number: 10026575
    Abstract: A reed switch relay comprises a PCB base (1) and a control assembly (2) electrically connected to the PCB base. The control assembly is mounted on the PCB base by a surface mount technology. The control assembly comprises a hollow coil (21) mounted on the PCB base, a reed switch (22) mounted in the hollow coil, and a shield layer (23) sleeving the outer surface of the hollow coil, the reed switch comprises pins, the shield layer is connected with the pins of the reed switch. In the reed relay, the control assembly is mounted on the PCB base though a surface mount technology, which ensures position tolerance and precision of the reed switch, implements full mechanization of product production, increases productivity, and satisfies requirements of mass production, thereby increasing economic benefits.
    Type: Grant
    Filed: March 11, 2014
    Date of Patent: July 17, 2018
    Assignee: SHENZHEN ZHIYOU BATTERY INTEGRATION TECHNOLOGY CO., LTD
    Inventor: Shugang Gong
  • Patent number: 9991603
    Abstract: A device, intended to be fixed on a wall, for absorbing electromagnetic waves. The absorption device comprises a metal plate intended to be fixed on the wall, a dielectric panel at a distance from the metal plate and delimiting, with the metal plate, a volume between the metal plate and the dielectric panel, an array of resistive dipoles, all the resistive dipoles being fixed on the same face of the dielectric panel, and each comprising two metal platelets at a distance from one another and a resistor arranged between the opposing edges of two neighboring metal platelets.
    Type: Grant
    Filed: April 29, 2016
    Date of Patent: June 5, 2018
    Assignee: Airbus Operations (SAS)
    Inventors: Andrew Thain, Anass Jaber, Alexandre Herve
  • Patent number: 9980368
    Abstract: A shielding device mounted upon a printed circuit board comprises a shielding shell including a top wall, a sidewall and at least a clamping means extending downwardly therefrom respectively, which surrounds a receiving cavity defined by the shielding shell; at least a bracket removably clamped within said clamping means and fixed upon said printed circuit board; wherein the clamping means includes a first clamping part and a second clamping part respectively abutting elastically against two opposite sides of said bracket.
    Type: Grant
    Filed: August 18, 2016
    Date of Patent: May 22, 2018
    Assignee: FOXCOMM INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Xun Wu, Guo-Xiang Niu
  • Patent number: 9949385
    Abstract: A semiconductor module includes a base plate, a substrate on the base plate and carrying at least one semiconductor chip, a housing attached to the base plate and at least partially enclosing the substrate, and at least one terminal having one end which protrudes from the housing and another end which has a terminal foot attached on a terminal pad of the metallization by means of ultrasonic welding. The housing has a protective wall which encloses the terminal and divides an interior space of the housing into an unprotected region and a protected region. The protective wall is formed such that a gap is formed between the substrate and the protective wall. The gap is designed to carry a fluid flow such that particles produced during the ultrasonic welding of the terminal foot to the terminal pad are prevented from penetrating into the protected region from the unprotected region.
    Type: Grant
    Filed: July 2, 2015
    Date of Patent: April 17, 2018
    Assignee: ABB Schweiz AG
    Inventors: Samuel Hartmann, David Guillon, David Hajas, Markus Thut
  • Patent number: 9929131
    Abstract: A method of fabricating a semiconductor package includes mounting a plurality of semiconductor chips on a substrate in a stripped state, forming a mold layer to cover the semiconductor chips, cutting the mold layer and the substrate to form unit packages separated from each other, and forming a shielding layer on the mold layer of each of the unit packages, wherein each of the unit packages includes a corresponding one of the semiconductor chips, wherein the mold layer in each of the unit packages includes side surfaces, a top surface, and corner regions, and wherein each of the corner regions of the mold layer includes a first corner, which is connected to a corresponding one of the side surfaces and has a first curvature radius, and a second corner, which is connected to the top surface and has a second curvature radius smaller than the first curvature radius.
    Type: Grant
    Filed: November 18, 2016
    Date of Patent: March 27, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyein Yoo, Yeongseok Kim
  • Patent number: 9812804
    Abstract: In accordance with some embodiments, a high speed connection may be implemented using pogo-pins. The use of pogo-pins may be advantageous because accurate alignment is not required, connection force is generally lower than with other connections and appearance is often highly advantageous. Through the use of a moveable metal shield, an advantageous high speed connection for high speed signaling may be implemented between the two devices.
    Type: Grant
    Filed: March 27, 2014
    Date of Patent: November 7, 2017
    Assignee: Intel Corporation
    Inventors: Hao-Han Hsu, Yun Ling, Xiang Li
  • Patent number: 9807916
    Abstract: A circuit module includes a wiring substrate having a mount surface, a conductor pattern, and an insulating protective layer, the mount surface having first and second areas, the conductor pattern being formed along a boundary between the first and second areas on the mount surface, the insulating protective layer being formed on the mount surface, the insulating protective layer covering the mount surface and the conductor pattern; a plurality of electronic components mounted on the first and second areas; an insulating sealing layer having a trench, the insulating sealing layer covering the plurality of electronic components, the trench having a depth such that the trench penetrates the protective layer to reach a surface of the conductive pattern; and a conductive shield having first and second shield portions, the first shield portion covering an outer surface of the sealing layer, the second shield portion being electrically connected to the conductor pattern.
    Type: Grant
    Filed: November 26, 2013
    Date of Patent: October 31, 2017
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Kenzo Kitazaki, Masaya Shimamura, Eiji Mugiya, Takehiko Kai
  • Patent number: 9743564
    Abstract: An electronic device may have a printed circuit to which electrical components are mounted. Electromagnetic shields may be mounted to the printed circuit over the components to suppress interference. A shield may have a metal frame covered with a conductive fabric. The conductive fabric may cover an opening in the top of the frame. An insulating layer may be formed on the lower surface of the conductive fabric to prevent shorts between components on the printed circuit and the conductive fabric. An insulating cap such as an elastomeric polymer cap may also be formed over each component to provide electrical isolation between the components and the conductive fabric. Shields may be formed by coupling shield cans to subscriber identity module shields or other metal structures in a device. Intervening wall structures may be removed to help provide additional shielding volume.
    Type: Grant
    Filed: August 19, 2015
    Date of Patent: August 22, 2017
    Assignee: Apple Inc.
    Inventors: Shayan Malek, David A. Pakula, Gregory N. Stephens, Jason Sloey
  • Patent number: 9723767
    Abstract: On a circuit board configured to transmit a signal, a pulse transformer is provided on a path used for transmitting the signal of the circuit board. A shield member is provided on the circuit board to prevent noise, which is generated due to noise current flowing in a noise line pattern, from entering the pulse transformer. The shield member covers a part of a surface of at least one pulse transformer, the part intersecting concentric circles (which represent a magnetic field generated by the noise current) whose central axis extends along the direction in which the noise current flows.
    Type: Grant
    Filed: July 17, 2012
    Date of Patent: August 1, 2017
    Assignee: OMRON CORPORATION
    Inventors: Toshiyuki Kojima, Megumu Asano
  • Patent number: 9655419
    Abstract: A personal communication device holder includes: a first housing component including a tubular data signal blocking body having a capped end and a male mating end; a second housing component including a tubular data signal blocking body having a capped end and a female mating end sized to receive the male mating end of the first housing component; a first liner material disposed on an inner surface of the first housing so as to leave an outer surface of the data signal blocking material of the male mating end exposed; a second liner material disposed on an inner surface of the second housing so as to leave an inner surface of the data signal blocking material of the female mating end exposed; and a data signal blocking gasket positioned between the exposed outer surface of the male mating end and the exposed inner surface of the female mating end.
    Type: Grant
    Filed: December 3, 2013
    Date of Patent: May 23, 2017
    Inventor: Michael J. Nash
  • Patent number: 9575148
    Abstract: In a method for guiding brachytherapy radiation treatment the patient is supported on a table and an MR magnet is brought into the treatment bunker through doors for imaging while the after-loader for the radiation source delivery is stored away in a storage location outside the RF shield. A safety system controls movement of the after-loader and the magnet. Images of the patient obtained while the patient is on the table are used to locate the applicator with respect to the lesion and organs-at-risk. The MR and X-ray compatible patient support table with MR coil integration includes a removable end-extension, which provides pelvic access for applicator insertion.
    Type: Grant
    Filed: November 5, 2013
    Date of Patent: February 21, 2017
    Assignee: Imris Inc.
    Inventors: Jeff Winter, Meir Dahan, Labros Petropoulos, Brendan Guyot, Alexis Denis
  • Patent number: 9577507
    Abstract: Disclosed is an inverter assembly without galvanic isolation, the inverter assembly including a PCB mounted with a power supply circuit unit, an inverter unit, an analogue circuit unit and a controller, a first ground circuit pattern to supply a ground power to the power supply circuit unit and the inverter unit, a second ground circuit pattern to supply the ground power to the analogue circuit unit, a third ground circuit pattern to supply the ground power to the controller, a first bead between the first ground circuit pattern and the second ground circuit pattern to isolate an impedance between the first ground circuit pattern and the second ground circuit pattern, and a second bead between the second ground circuit pattern and the third ground circuit pattern to isolate an impedance between the second ground circuit pattern and the third ground circuit pattern.
    Type: Grant
    Filed: June 19, 2015
    Date of Patent: February 21, 2017
    Assignee: LSIS CO., LTD.
    Inventors: Deokyoung Lim, Chun Suk Yang
  • Patent number: 9335205
    Abstract: The invention relates to a control device comprising a housing (2) with a first housing part (20) and a second housing part (21), a printed circuit board (3) arranged in the housing (2), a plug element (4) which has a plurality of contacts (40) and is connected to the printed circuit board (3) both mechanically and electrically, and a vibration-sensitive sensor, wherein the plug element (4) is firmly connected to one of the housing parts (20, 21) by means of a mechanical connection (5), wherein the mechanical connection (5) has a protruding element (50) and a receiving element (51) with a recess (7) for receiving the protruding element (50), wherein the recess (7) has a base region (9), a first wall region (10) and a second wall region (30), and wherein a first rib (11) is arranged on the first wall region (10) and a second rib (12) is arranged on the second wall region (30).
    Type: Grant
    Filed: September 16, 2011
    Date of Patent: May 10, 2016
    Assignee: Robert Bosch GmbH
    Inventors: Volker Luhr, Matthias Faas, Hamed Feridouni
  • Patent number: 9229483
    Abstract: A personal electronics case that is operable to inhibit the transmission of radiation in the direction of a user. The personal electronics case includes four walls and a first bottom layer contiguously formed to define an interior volume. A cavity is adjacent and underneath the first bottom layer and is of similar size. Secured within the cavity is a radiation shield that is operable to inhibit the transmission of radiation. A second bottom layer is adjacent to the cavity opposite the first bottom layer. A keeper is mounted within a void in the body to facilitate the releasable securing of the radiation shield within the cavity.
    Type: Grant
    Filed: August 15, 2014
    Date of Patent: January 5, 2016
    Inventor: Shahriar Davaran
  • Patent number: 9115707
    Abstract: An inverter module and an integrated-inverter electric compressor using the same, which can eliminate noise interference, noise leakage, and the like attributable to a smoothing capacitor accommodated therein and which can be reduced in size and weight is provided. An inverter module (11) includes a resin module case (17); a power system board (15) provided on a bottom side of the module case (17); and a control board (19) provided on an upper side of the module case (17). A smoothing capacitor (18) connected to a power supply line for the power system board (15) is incorporated into the module case (17), and the smoothing capacitor (18) is electromagnetically shielded with respect to the power system board (15) and the control board (19).
    Type: Grant
    Filed: June 2, 2010
    Date of Patent: August 25, 2015
    Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Makoto Hattori, Hidetaka Sato, Takashi Nakagami, Kazunori Teshima, Mitsuaki Arita, Masashi Fujita
  • Patent number: 9113550
    Abstract: An apparatus comprises an electrically conductive sheet material having a transparency. The sheet material being flexible to fold to form a pouch configured to enclose a portable computing device. The sheet material is configured to seal side edges of the pouch with edges of the sheet being in electrical engagement. A sealing member is configured to close an opening of the pouch to enclose the portable computing device within the pouch. The closure member is further configured to create an electrical engagement across the opening of the pouch in which the closed pouch structure mitigates electro-magnetic pulse damage and radio waves in general to the enclosed portable computing device, enables viewing of displays of the enclosed portable computing device, and enables manipulation of controls of the enclosed portable computing device while allowing access through wireless to the outside world.
    Type: Grant
    Filed: June 20, 2013
    Date of Patent: August 18, 2015
    Inventor: Joel Ho
  • Patent number: 9054779
    Abstract: Examples provide various systems and method associated with intercepting radio frequency interference. In various examples, a wireless integrated circuit module comprises radio frequency connectors. An RF interference shield covers the RF connectors to intercept and ground interference.
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: June 9, 2015
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chang-Cheng Hsieh, Leo Joseph Gerten, Hung-Wen Cheng
  • Patent number: 8921710
    Abstract: An electromagnetic shielding configuration comprising a first electrically conductive wall having a first surface and a second electrically conductive wall having a second surface. The first surface is oppositely disposed from the second surface, wherein interfacing of the first conductive wall and the second conductive wall forms an enclosure wall. The first surface comprises at least one stepped edge forming a plurality of surfaces of unequal lateral displacement, and a corrugated surface on at least one of the plurality of surfaces, the corrugated surface formed by a series of apices extending radially from the first surface. The second surface is substantially a conjugate of the first surface.
    Type: Grant
    Filed: August 27, 2012
    Date of Patent: December 30, 2014
    Assignee: Finisar Corporation
    Inventors: Tat Ming Teo, Jinxiang Liu
  • Publication number: 20130313015
    Abstract: A grounding adapter to be used with a cable comprises a central band, a plurality of upper extensions, and a plurality of lower extensions. The central band may include an upper side, an opposing lower side, a left side, and an opposing right side to form a rectangle. The upper extensions may be spaced apart and coupled to the upper side of the central band. The lower extensions may be spaced apart and coupled to the lower side of the central band. Each upper extension and lower extension may have an isosceles triangle shape with a first side and a second side of equal length and a rounded corner therebetween. The lower extensions may be offset from the upper extensions such that a space between any two lower extensions aligns with an upper extension.
    Type: Application
    Filed: May 22, 2012
    Publication date: November 28, 2013
    Applicant: LINDSAY CORPORATION
    Inventor: Arnel Berton Citurs
  • Publication number: 20130220693
    Abstract: A panel for an electromagnetic shield includes a light-weight, porous, electrically-conductive, fluid-permeable planar core layer defined between generally parallel first and second surfaces and a first face sheet laminated to the first surface of the core layer with rigidity properties superior to the rigidity properties of the core layer. The thickness of the first face sheet is substantially less than the thickness of the core layer. The core layer is made of metallic foam or a metal coating on an electrically-nonconductive, porous, nonmetallic substrate chosen from among nonwoven fibrous matting, paper, and open-cell nonmetallic foam. Also, the core layer may also may be made up of liberated branching metal nanostrands or a plurality of electrically-coupled, electrically-conductive particles, each taking the from of an electrically-nonconductive, nonmetallic substrate with a metal coating.
    Type: Application
    Filed: April 5, 2013
    Publication date: August 29, 2013
    Applicant: Conductive Composites Company, LLC
    Inventor: Conductive Composites Company, LLC
  • Publication number: 20130175081
    Abstract: A differential signal transmission cable includes a pair of differential signal lines arranged in parallel to each other, an insulation for bundle-covering the pair of differential signal lines, and a shield conductor wound around an outer periphery of the insulation The insulation is configured such that an outer circumference thereof in a cross section perpendicular to a longitudinal direction thereof has an oval shape formed with a continuous convex arc-curve The oval shape has a width in a first direction along the arrangement direction of the pair of differential signal lines being larger than a width in a second direction orthogonal to the first direction
    Type: Application
    Filed: July 16, 2012
    Publication date: July 11, 2013
    Applicant: Hitachi Cable, Ltd.
    Inventors: Haruyuki WATANABE, Takahiro SUGIYAMA, Akinari NAKAYAMA, Masafumi KAGA, Sohei KODAMA
  • Patent number: 8476532
    Abstract: A multilayer flexible printed circuit board disclosed in the present application is a multilayer flexible printed circuit board in which a ground layer, an insulating layer and a signal wiring layer in which signal wiring is formed are laminated in sequence, with the multilayer flexible printed circuit board including a protruding portion protruding laterally, and a ground that is electrically connected to the ground layer being formed on at least one surface of the protruding portion, in order to have shielding properties that can cope with high speed signal transmission performed via the signal wiring layer.
    Type: Grant
    Filed: October 13, 2011
    Date of Patent: July 2, 2013
    Assignee: Panasonic Corporation
    Inventors: Naofumi Kitano, Tetsuya Esaki
  • Publication number: 20130153284
    Abstract: A lead frame package structure with low EMI includes at least a die holder each for supporting a die, and at least a lead frame each including a first terminal for connecting a printed circuit board, a second terminal for connecting the die, and a lead for connecting the first terminal and the second terminal, wherein the height of the lead is lower than the height of the first terminal and the second terminal.
    Type: Application
    Filed: March 8, 2012
    Publication date: June 20, 2013
    Inventor: Yu-Chang Pai
  • Patent number: 8253036
    Abstract: The present invention discloses a joint structure between the wall elements of a light-weight magnetically shielded room. In the joint structure, the end of the aluminum plate of the element is stepped and its surface roughened. In addition to this, the aluminum plate is coated, for example, with tin to improve the electrical contact. The joint includes ? metal plates which are used to make a magnetic contact between the ? metal plates of the elements. The compression force achieved by means of bolts is transmitted to the joint by means of an aluminum moulding. The non-continuous compression force is balanced over the entire joint area by using presser rubbers. The joint structure is protected by means of supporting profiles which are used to electrically couple the thinner aluminum plate of the sandwich type wall element to the thinner aluminum plate of an adjacent element. The thinner aluminum plate and the supporting profile can also be coated, for example, with tin to improve the contact.
    Type: Grant
    Filed: September 8, 2005
    Date of Patent: August 28, 2012
    Assignee: Elekta AB (Publ)
    Inventors: Juha Simola, Petteri Laine, Heikki Rakkolainen
  • Patent number: 8253037
    Abstract: An electromagnetic shielding configuration comprising a first electrically conductive wall having a first surface and a second electrically conductive wall having a second surface. The first surface is oppositely disposed from the second surface, wherein interfacing of the first conductive wall and the second conductive wall forms an enclosure wall. The first surface comprises at least one stepped edge forming a plurality of surfaces of unequal lateral displacement, and a corrugated surface on at least one of the plurality of surfaces, the corrugated surface formed by a series of apices extending radially from the first surface. The second surface is substantially a conjugate of the first surface.
    Type: Grant
    Filed: November 10, 2009
    Date of Patent: August 28, 2012
    Assignee: Finisar Corporation
    Inventors: Tat Ming Teo, Jinxiang Liu
  • Patent number: 7985931
    Abstract: An enclosure for a connector is disclosed. The enclosure includes two or more enclosure parts, each having a joint such that the enclosure parts are fit together to constitute the enclosure. The joint may have a continuation of linear segments to form a shape like mountains, wherein the length of each segment is smaller than a wavelength corresponding to an operational frequency.
    Type: Grant
    Filed: October 31, 2007
    Date of Patent: July 26, 2011
    Assignee: Fujitsu Component Limited
    Inventors: Junichi Akama, Mitsuru Kobayashi
  • Patent number: 7960656
    Abstract: Enclosures for at least partially shielding an at least partially enclosed volume from electromagnetic interference and various methods for producing such enclosures are described. Enclosures for at least partially shielding an at least partially enclosed volume from electromagnetic interference may be prepared by bonding at least two sections of carbon foam with a carbonizable binder to provide an enclosure, wherein said enclosure defines an at least partially enclosed volume, and carbonizing the carbonizable binder to provide an electrically conductive carbon char. An enclosure for at least partially shielding an at least partially enclosed volume from electromagnetic interference may include at least two sections of electrically conductive carbon foam interconnected by an electrically conductive carbon char. The electrically conductive carbon char is substantially electrically continuous with the sections of electrically conductive carbon foam.
    Type: Grant
    Filed: June 2, 2006
    Date of Patent: June 14, 2011
    Assignee: Touchstone Research Laboratory, Ltd.
    Inventor: Thomas M. Matviya
  • Publication number: 20110128715
    Abstract: A shield case includes a first shield member and a second shield member coupled to the first shield member to form the shield case. a concave portion is capable of accommodating a sealing member for sealing inner space of the shield case by contacting the first shield member and the second shield member, and is formed on the second shield member. On each of the first shield member and the second shield member, a paint film portion is formed on an area of the shield case external to the concave portion. On the first shield member or the second shield member or combination thereof, a convex portion is formed on the area of the shield case on the inner space side and internal to the concave portion. The surfaces of the first shield member and the second shield member contact each other at the convex portion.
    Type: Application
    Filed: November 30, 2010
    Publication date: June 2, 2011
    Applicant: FUJITSU LIMITED
    Inventors: Kazuya NOGUCHI, Hiromi Maeda, Toshimitsu Kobayashi, Atsushi Kaneko, Yoshihiro Waki, Masaki Yamamoto
  • Publication number: 20100263924
    Abstract: A combined environmental and electromagnetic rotary seal. The invention is adapted for use between two mutually rotating components of an electromagnetic energy transmission system and provides simultaneous protection against contamination from the environment and unwanted electromagnetic leakage. In the illustrative embodiment, a first set of grooves is cut into the exterior of a first conductive cylindrical component whose interior contains a portion of a millimeter-wave beam waveguide energy transmission system, the grooves comprising the electromagnetic portion of the seal and a second set of grooves is cut into the interior of the conductive housing enclosing the first conductive cylindrical component.
    Type: Application
    Filed: June 8, 2010
    Publication date: October 21, 2010
    Inventors: David Crouch, Vincent Giancola, Kenneth W. Brown