Abstract: Disclosed is an electromagnetic wave shielding sheet for use in wireless power transmission which suppresses electromagnetic wave leakage in a broad range and which is easily adaptable to various types of wireless power transmitters. The disclosed electromagnetic wave shielding sheet is used in a wireless transmitter and has a multilayer structure including at least one metal layer and at least one magnetic material layer.

Abstract: An electromagnetic shielding composite, comprising a copper foil having a thickness of 5 to 15 ?m, a Ni coating on one surface of the copper foil at a coating amount of 90 to 5000 ?g/dm2, a Cr oxide layer formed on the surface of the Ni coating at 5 to 100 ?g/dm2 based on the Cr mass, and a resin layer laminated on the opposite surface of the copper foil.

Abstract: Compressible grounding pads with two conductor layers separated by a compressible foam layer comprise: (A) A first conductor layer, e.g., copper foil; (B) A first adhesive layer in direct contact with a part of the first conductor layer, the first conductor layer extending beyond the first adhesive layer; (C) A foam layer in direct contact with one facial side of the first adhesive layer; (D) A second adhesive layer in direct contact with the opposite facial side of foam layer; (E) A second conductor layer, e.g., copper foil, in direct contact with the second adhesive layer, the second conductor layer extending beyond the second adhesive layer such that the second conductor layer joins with the first conductor layer; (F) An electrically conductive third adhesive layer in direct contact with the facial surface opposite the facial surface that is in direct contact with the second conductor layer; and (G) An optional release liner in direct contact with the third adhesive layer.

Abstract: A composite material for electromagnetic interference shielding is provided. The composite material comprises a stack including at least two electrically conductive nanoscale fiber films, which are spaced apart from one another by at least one insulating gap positioned between the at least two nanoscale fiber films. The stack is effective to provide a substantial multiple internal reflection effect.

Abstract: An electromagnetic shielded sleeve containing a multilayer composite material formed in such a way as to define at least one longitudinal channel configured to enclose and carry a cable. The multilayer composite material contains a first textile, an electromagnetic shielding material, and a second textile, where the electromagnetic shielding material is located between the first textile and the second textile.

Abstract: A panel for an electromagnetic shield includes a light-weight, porous, electrically-conductive, fluid-permeable planar core layer defined between generally parallel first and second surfaces and a first face sheet laminated to the first surface of the core layer with rigidity properties superior to the rigidity properties of the core layer. The thickness of the first face sheet is substantially less than the thickness of the core layer. The core layer is made of metallic foam or a metal coating on an electrically-nonconductive, porous, nonmetallic substrate chosen from among nonwoven fibrous matting, paper, and open-cell nonmetallic foam. Also, the core layer may also may be made up of liberated branching metal nanostrands or a plurality of electrically-coupled, electrically-conductive particles, each taking the from of an electrically-nonconductive, nonmetallic substrate with a metal coating.

Abstract: System and method for EMI shielding for a CD-SEM are described. One embodiment is a scanning electron microscope (“SEM”) comprising an electron gun for producing an electron beam directed toward a sample; a secondary electron (“SE”) detector for detecting secondary electrons reflected from the sample in response to the electron beam; and a dual-layer shield disposed around and enclosing the SE detector. The shield comprises a magnetic shielding lamina layer and a metallic foil layer.

Abstract: A housing for an electromagnetic-radiation-emitting optoelectronic component. Exterior side faces of the housing are at least partly provided with a screening layer suitable for screening an electromagnetic radiation. A lateral emission of electromagnetic radiation from the housing, which is disadvantageous for many applications, is thereby intended to be avoided. An electromagnetic-radiation-emitting component having a housing of this type and a method for producing a corresponding housing or component are additionally described.

Abstract: An electromagnetic shield has a first patterned or apertured layer having non-conductive materials and conductive material and a second patterned or apertured layer having non-conductive materials and conductive material. The conductive material may be a metal, a carbon composite, or a polymer composite. The non-conductive materials in the first patterned or apertured layer may be randomly located or located in a predetermined segmented pattern such that the non-conductive materials in the first patterned or apertured layer are located in a predetermined segmented pattern with respect to locations of the non-conductive materials in the second patterned or apertured layer.

Abstract: A yarn or multi-fiber formed of a plurality of micron diameter stainless steel monofilaments which have been rendered more conductive by one or more coatings of electrolytically-deposited metal or metal alloy materials. The metallized yarn provided by the invention has a very low electrical resistance, with consequent benefit in electrical performance, and is particularly useful as an RFI/EMI shielding material.

Abstract: A method for manufacturing anti-EMI shields on computer chassis, the method includes the following steps. The anti-EMI plate is glued to the computer chassis. The anti-EMI plate is pressed onto the plate by a pressing machine, and then the plate is quick dried with the anti-EMI plate by a drying machine. The plate is cut into desired dimension with the anti-EMI plate by a cutting machine, and the plate is stamped into desired shape with the anti-EMI plate by a stamping machine.

Abstract: A printed board having an input/output terminal that connects with a component in an image formation apparatus through a cable, and a control circuit that controls the component, the printed board which includes a conductive pattern on which a capacitor that suppresses an emission of an electromagnetic wave from the cable is mounted between a grounding surface and a signal line from the input/output terminal, the conductive pattern being formed in the vicinity of the input/output terminal.

Abstract: A shielding article includes a polymeric conductive layer and a protective layer disposed adjacent the polymeric conductive layer. The polymeric conductive layer provides electromagnetic shielding characteristics so as to prevent receipt of data from a radio frequency information component by an external device when the component is located between the external device on one side and the polymeric conductive and protective layers on the other side. The shielding article may be shaped to substantially surround the radio frequency information component.

Abstract: The invention relates to an electromagnetic screening structure on or in a non-conductive carrier material in which non-conductive metal compounds are placed. The screening structure comprises a flat metal seed layer formed on or in the carrier material, which is formed through metal seeds that have been released through electromagnetic radiation, and a flat metal coating which is applied over the metal seed layer and which is in contact with said metal seed layer. The invention additionally relates to an electronic or optoelectronic used with the screening structure and a method for manufacturing the screening structure. In a further aspect of the invention, an electronic or optoelectronic assembly is provided with a carrier element, wherein at least one additional electrical or optoelectronic component is arranged on the surface of the carrier material and is in contact with conductor path structures formed on the carrier surface.

Abstract: A complementary mirror image embedded planar resistor architecture is provided. In the architecture, a complementary hollow structure is formed on a ground plane or an electrode plane to minimize the parasitic resistance, so as to efficiently enhance the application frequency. In addition, in some cases, some signal transmission lines pass through the position below the embedded planar resistor, and if there is no shield at all, serious interference or cross talk phenomenon occurs. Therefore, the complementary hollow structure of the ground plane, the electrode plane, or a power layer adjacent to the embedded planar resistor is designed to be a mesh structure, so as to reduce the interference or cross talk phenomenon. In this manner, the whole resistor structure has preferable high frequency electrical characteristic in the circuit.

Abstract: The objective of the present invention is to provide a shield method and shield material enabling to hold a flexibility degree with an enclosure shape and to make electronic component enclosures small and thin types. The shield method for electronic component enclosures in the present invention comprises a process in which a conductive layer is formed at a basic sheet and a shield sheet forming a non-hardening adhesive layer at the counter face to the basic layer is punched out to fit in individual electronic component enclosures for forming the shield materials, a process in which the shield material is attached to said electronic component enclosure, and a process in which a conductive adhesive is formed between a ground electrode set at said electronic component enclosure and the conductive layer to connect electrically.

Abstract: A shielding device configured to provide EMI and ESD protection includes an anti-ESD layer, a conductive layer, and an EMI blocking layer attached to each other in sequence. In addition, a supporting layer can be optionally attached to the EMI blocking layer to increase the strength of the shielding device.

Abstract: Systems and methods for minimizing the transmission and reception of electromagnetic interference (“EMI”) are provided. A member having first and second sides and at least one edge can be formed to correspond to the interior of an enclosure. At least one aperture can penetrate the member from the first side to the second side, forming at least one internal edge. A conductive layer can be disposed on or about the first side, the second side, the at least one edge, and the at least one internal edge of the member, thereby encapsulating the member.

Abstract: An electromagnetic shielding coating covers a lens coated with an optical coating. A light shielding coating covers the optical coating. The electromagnetic shielding coating covers the light shielding coating. The electromagnetic shielding coating includes a first stainless steel layer and a second copper layer. The first stainless steel layer contains stainless steel, and is formed on the light shielding coating directly. The second copper layer is formed on the first metal layer.

Abstract: An exemplary light blocking plate includes a light pervious substrate, a filter film formed on the light pervious substrate, and a metal film layer formed on the light pervious substrate and the optical filter film. The metal film layer defines a through hole to expose a central portion of the optical filter film.

Abstract: An EMI/RF absorbing film may comprise a polymer resin, and metallic flakes dispersed in the resin. A method for manufacturing an EMI/RF absorbing material. The method may include dispersing metallic flake in the polymer resin, applying the polymer resin and dispersed metallic flake on a releasable medium, curing the polymer resin to form a film, and releasing the cured polymer resin film from the release medium.

Abstract: An exemplary electromagnetic interference shielding structure, includes a substrate and a metallic film formed on at least one surface of the substrate. The substrate is made of an alloy of Ni and Fe, and the metallic film is made of an alloy of Ni, Fe, Cu and Mo.

Abstract: A circuit board includes a plurality of signal lines and a plurality of shielding walls. The shield walls are disposed between the signal lines. Each shield wall includes an upper surface, a lower surface, a rectangular groove, a first metal layer and a second metal layer. The lower surface is opposite to the upper surface. The rectangular groove extends from the upper surface to the lower surface. The first metal layer is disposed on the upper surface. The second metal layer is disposed in the rectangular groove and electrically connected to the first metal layer.

Abstract: An electronic device and a high frequency circuit board thereof are disclosed. The high frequency circuit board includes a first dielectric layer, a first signal line formed on the first dielectric layer, a second dielectric layer overlaying the first dielectric layer and covering the first signal line, and a first EMI shielding layer overlaying the second dielectric layer. The first EMI shielding layer has a gap formed thereon. The gap is formed at a position corresponding to the position of the first signal line.

Abstract: Provided is an electromagnetic shield sheet having an excellent electromagnetic shielding effect which can be sufficiently exhibited even when the sheet has a reduced thickness and a reduced weight. Furthermore, the electromagnetic shield sheet has an excellent molding efficiency and flexibility and can be used in a desired shape such as various shapes of a power supply box, an inner wall, or an electronic device for electromagnetic shielding. An RFID plate using the electromagnetic shield sheet is also provided. The electromagnetic shield sheet A has a polymer composition layer obtained by mixing a conductive material with a polymer material. The sheet A is formed by layering at least two of polymer composition layers 1, 2, 3 having different dielectric constants. The RFID plate is formed by layering the electromagnetic shield sheet A, an IC, and an antenna circuit.

Abstract: An apparatus is provided comprising a chassis of a sheet of an electrically conductive material having a substantially non-conductive coating. An exposed portion of the chassis can be deformed to provide at least one protrusion such that the non-conductive coating on the at least one protrusion is thinner than a portion of the sheet spaced apart from the at least one protrusion to provide a conductivity path through the sheet.

Abstract: The invention provides metal compositions, including silver compositions, and thermal imaging donors prepared with the compositions. The donors are useful for thermal transfer patterning of a metal layers and optionally, a corresponding proximate portion of an additional transfer layer onto a thermal imaging receiver. The compositions are useful for dry fabrication of electronic devices. Also provided are patterned multilayer compositions comprising one or more base film(s), and one or more patterned metal layers, including EMI shields and touchpad sensors.

Abstract: An electromagnetic interference shielded panel and method of manufacture. The panel includes one or more frame members having a rib adapted to provide sacrificial material when a first skin member is welded to the frame member. The first skin member is welded to the frame members of a frame assembly prior to bonding of a core member and a second skin member to the first skin member and frame assembly.

Abstract: The present invention provides printed circuit boards, EMI shields, and methods that provide an EMI absorbing material and an EMI reflecting material. In one embodiment, the EMI shield comprises a shield body and an EMI absorbing material coupled to the shield body.

Abstract: Methods and apparatus for shielding an object from relative high electromagnetic radio frequencies while allowing airflow to pass to and from the object are disclosed. According to one aspect of the present invention, a shield arrangement that shields a chassis includes at least a first plane and a second plane. The first plane has a thickness and defines a first plurality of openings that include a first opening and a second opening that are separated by at least a distance that is a function of the thickness. The second plane defines at least a third opening, and is approximately parallel to the first plane. The second plane is spaced apart from the first plane by a spacing that is a function of at least the thickness.

Abstract: Disclosed is a flexible foil including a thin and flexible foil that isolates electromagnetic waves. The foil has a smooth surface and an opposite surface on which a plurality of three-dimensional raised projections is formed and consecutively lined up. A slicing-facilitated, flexible thinned layer is formed between adjacent ones of the projections. The foil can be deflected to enclose an electronic device that generates electromagnetic waves with the projections facing the electronic device so that the electromagnetic waves are confined inside the enclosure formed by the foil and dispersed and dissipated by reflection and diffraction in multiple angles caused by the projections so as to prevent leakage of electromagnetic waves and to protect electronic components close to the electromagnetic wave generating device from interference by the electromagnetic waves.

Abstract: A coating layer for blocking EMI is disclosed, which comprises a base substrate, and a deposition member formed at one surface of the base substrate, comprising a plurality of repetitive unit films which include metal layers and high refraction layers, wherein any one of the outmost metal layers of the deposition member has a minimum thickness among the metal layers. Also, an optical filter which includes the coating layer and a display apparatus are disclosed.

Abstract: The purpose of the present invention is to provide an easy-to-manufacture electromagnetic wave absorption material usable from submillimeter wave region to millimeter wave region with an excellent radio wave absorbing performance and a variety of usage thereof. The present invention is characterized by an electromagnetic wave absorption material comprised of a dispersions of at least one of the materials: a multi-layer hollow globule of carbon, a schungite carbon, and the schungite ore; mixed into a matter having a high electrical resistivity. The invention is further characterized by an electronic device, an optical transmission module, an optical reception module, a high frequency telecommunication equipment, and a stop-free automated tollgate system, wherein at least a part of their board, electronic element, and circuit wiring are covered with said electromagnetic wave absorption material.

Abstract: The present invention provides printed circuit boards, EMI shields, and methods that provide an EMI absorbing material and an EMI reflecting material. In one embodiment, the EMI shield comprises a shield body and an EMI absorbing material coupled to the shield body.

Abstract: A construction system for shielding a room includes a plurality of inter-fitting panels (100, 100?) adapted for mounting to structural surfaces (10, 12, 14, 16) of a room. Each of the panels has at least two layers (120, 130) of lead that are offset one with respect to the other in two directions to define a recessed lip (102, 104) on two adjacent sides of the panel and an overhanging lip (106, 108) on the remaining two sides of the panel.