Connection Patents (Class 174/541)
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Patent number: 8383963Abstract: To provide an electrical junction box having a new structure that includes a plurality of electrical component mounting sections that are open in an upper surface, such that (1) the structure is provided with a drainage groove for preventing accumulation of water without requiring any special space, and (2) the structure can eliminate a problem of heat generation from electrical components. An electrical junction box includes a first and second electrical component mounting section units. A plurality of electrical component mounting sections are arranged in straight lines to from the first and second units, respectively. The first and second electrical component mounting segment units are separated apart from each other by a given distance and are arranged in parallel with each other. A heat radiation drainage groove is provided between opposed portions of peripheral walls that constitute the adjacent first and second units.Type: GrantFiled: June 15, 2010Date of Patent: February 26, 2013Assignee: Sumitomo Wiring Systems, Ltd.Inventor: Takumi Ejima
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Patent number: 8378235Abstract: Vertical bus bars are mounted on a first surface of a box main body. A connection terminal of the vertical bus bars projects inside a fitting peripheral wall of a connector fitting portion provided to a second surface of the box main body. A retainer is provided off of the electrical component connection portion, the retainer holding the vertical bus bars disengageably from the first surface.Type: GrantFiled: September 9, 2010Date of Patent: February 19, 2013Assignee: Sumitomo Wiring Systems, Ltd.Inventor: Toshiyuki Matsui
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Patent number: 8378236Abstract: A vertical bus bar is provided to a side of a relay mount portion. A flat bus bar portion is integrally provided extending from an end edge portion of the vertical bus bar to an opening of a terminal connection hole of the relay mount portion. A plurality of connection terminals, including a connection terminal for a switch, are integrally provided to the flat bus bar portion.Type: GrantFiled: September 23, 2010Date of Patent: February 19, 2013Assignee: Sumitomo Wiring Systems, Ltd.Inventor: Toshiyuki Matsui
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Patent number: 8338720Abstract: An enclosure is provided for a vehicle. The enclosure comprises (a) a housing and (b) a cover for the housing. At least one of the housing and the cover includes a mounting portion for attaching the at least one of the housing and the cover to a vehicle and a compliant portion connected to the mounting portion. The compliant portion is plastically deformable.Type: GrantFiled: October 8, 2009Date of Patent: December 25, 2012Assignee: TRW Automotive U.S. LLCInventors: Anthony Burgi, Mike Blossfeld
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Patent number: 8325491Abstract: A device for fastening an electronic module on a mounting rail and an electronic module fastened with the device on a mounting rail are provided. The device has a displaceable nose, encompassing a profile of the mounting rail together with a stationary nose provided on the back of a housing of the electronic module. The displaceable nose is configured as a clamping profile of a slide. By plugging in mechanical anchorings, the device is mounted in recesses of the housing on the back of the electronic module. The device has a spring mechanism provided to support the electronic module on the housing. A clamping force of the device on the mounting rail results from a force to the slide applied by the spring mechanism. An end of the slide opposite of the displaceable nose protrudes beyond the housing of the electronic module for the manual displacement of the displaceable nose.Type: GrantFiled: December 6, 2007Date of Patent: December 4, 2012Assignee: Siemens AktiengesellschaftInventors: Franz Hecht, Martin Krauβ, Markus Müller, Raphael Paschka
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Patent number: 8309865Abstract: A sensor unit 10 is provided with a metal plate 20 and a resin molded article 30 is formed integral to the metal plate 20. Busbars 50 are arranged in the resin molded article 30 and include exposed end portions 52 exposed from the resin molded article 30. Connecting portions 52A are provided at the leading ends of the exposed end portions 52 and are riveted to an oil temperature sensor 41 on the metal plate 20. Opposite lateral sides of the exposed end portions 52 are partly in contact with the resin molded article 30.Type: GrantFiled: November 12, 2009Date of Patent: November 13, 2012Assignee: Sumitomo Wiring Systems, Ltd.Inventors: Akihito Maegawa, Shinyu Nagashima
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Patent number: 8301003Abstract: A fiber optic cable network interconnection system for installation in an interconnection apparatus. The system includes a connector package having at least one connector adapter and configured to support a portion of a connectorized cable. The system also includes at least one cable package that includes at least one length of cable and that is configured for storing a portion of the cable on substantially the exterior of the connector package. The cable package is sized to pass through the interconnection apparatus interior from the front opening to the rear opening as the connector package is inserted in the interconnection apparatus. Methods of installing the system in the interconnection apparatus are also disclosed.Type: GrantFiled: May 14, 2010Date of Patent: October 30, 2012Assignee: Corning Cable Systems LLCInventors: Cesar A. de los Santos Campos, Robert W. Dennis, Maximiliano G. Laborde, Jania A. Murillo, Victoria A. Valderrabano
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Patent number: 8278567Abstract: In a structure where an electronic component is mounted on a glass base material, an external electrode is provided on an opposite side to the component mounted on the base, and a through electrode and the base are welded to each other at a temperature equal to or higher than a glass softening point, electrical conduction is ensured between the electronic component and the external electrode. An electronic device includes a base, a through electrode which pass through the base and has a metal film formed on both end surfaces after an insulating material on the surface is removed by polishing, an electronic component which is provided on one surface of the through electrode through a connection portion, an external electrode which is provided on an opposite side to a side of the base on which the electronic component is provided, and a cap which protects the electronic component on the base.Type: GrantFiled: June 21, 2010Date of Patent: October 2, 2012Assignee: Seiko Instruments Inc.Inventors: Takahiko Nakamura, Keiji Sato, Hitoshi Takeuchi, Daisuke Terada, Kiyoshi Aratake, Masashi Numata
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Patent number: 8269116Abstract: A circuit board case with an electrical connector comprises a case member having formed thereon a connector mating portion, and a connection member accommodated in the case member and mounted on the connector mating portion to electrically connect the counterpart connector and the circuit board. The connection member comprises a terminal provided with a first bar portion and a second bar portion, and a first fixing member which holds the first bar portion of the terminal and is mounted on the connector mating portion of the case member to fix the terminal, and a second fixing member which holds the second bar portion and is mounted on the case member to regulate movement of the terminal in a direction in which the first bar portion extends into the case member.Type: GrantFiled: January 15, 2009Date of Patent: September 18, 2012Inventors: Tsugio Ambo, Katsuji Shimazawa, Yoshikazu Tanaka, Tomohiko Muto
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Patent number: 8263880Abstract: A module of electric and/or electronic components, wherein the module is cast with a curable electrically insulating casting material in a housing, characterized in that at least one terminal extending at least slightly into the housing and remaining accessible from outside the housing is provided on the housing, is electrically connected to the module, and is cast together with the module from the inside.Type: GrantFiled: May 27, 2009Date of Patent: September 11, 2012Inventor: Hilmar Kraus
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Patent number: 8183473Abstract: Disclosed is a power package for an electrical device of an Electronic Control Unit (ECU) in an Electric Power Steering (EPS) system, the power package including: a housing which is formed with an upper part and a lower part and is formed to be in a two-step structure where substrate layers are provided on each of the upper and lower parts; a Printed Circuit Board (PCB) layer which is provided on the lower part of the housing and has a path line formed thereon to flow a current; and an LTCC layer which is provided on the upper part of the housing, is connected to the PCB layer through wire-bonding, and is formed of a Low Temperature Co-fired Ceramics. The power package for an electrical device can expand areas of the PCB and LTCC layers, thereby enhancing freedom degree of design of the PCB and LTCC layers and reducing a size of the entire case.Type: GrantFiled: November 18, 2009Date of Patent: May 22, 2012Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Gyu Man Hwang, Dae Hyeong Lee, Bong Gyun Kim
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Publication number: 20120111628Abstract: An electronic device includes a base body, which has a top side and also an underside lying opposite the top side. The base body has connection locations at its underside. An electronic component is arranged at the base body at the top side of the base body. The base body has at least one side area having at least one point of inspection having a first region and second region. The second region is embodied as an indentation in the first region. The first and the second region contain different materials.Type: ApplicationFiled: June 22, 2010Publication date: May 10, 2012Inventors: Michael Zitzlsperger, Stefan Groetsch
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Patent number: 8164007Abstract: Method for fabricating a conductive elastomeric seal, which includes a set of springs plated with an electrically conductive material. Initially, the set of springs can be held in a z-axis position in a mold cavity shaped like a seal. A liquid elastomer can be injected into the mold cavity in such a manner that the elastomer can be over molded around and through coils of each spring. Finally, the elastomer seal with the springs can be removed from the mold cavity, when the elastomer is cured. Ends of each spring can be kept free from the elastomer during over-molding such that the elastomeric seal can provide an electrical contact with a pressure sensor die and electrical leads molded into a sensor housing. Such a conductive elastomeric seal can prevent a die-edge shorting with the sense die in order to achieve long-term sensor reliability and performance.Type: GrantFiled: July 16, 2008Date of Patent: April 24, 2012Assignee: Honeywell InternationalInventors: Brian Speldrich, Richard Wade
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Patent number: 8158894Abstract: A housing having at least one electrical component situated therein and at least one electrical feed line, the housing having at least one through-opening, the electrical feed line being guided through the through-opening from an external environment into the interior of the housing, and there being an electrical connection between the electrical component and the electrical feed line.Type: GrantFiled: September 6, 2006Date of Patent: April 17, 2012Assignee: Robert Bosch GmbHInventors: Christian Ohl, Alexander Steinert
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Patent number: 8124890Abstract: An electronic device includes: a housing; an electronic component provided inside the housing; and a holding member provided between an inner wall of the housing and the electronic component and configured to hold the electronic component. The holding member is configured to hold a first region of a major surface of the electronic component located on a first end surface side, and the holding member is configured not to hold a second region of the major surface of the electronic component located on a second end surface side opposed to the first end surface side.Type: GrantFiled: January 29, 2009Date of Patent: February 28, 2012Assignee: Kabushiki Kaisha ToshibaInventor: Jun Morimoto
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Patent number: 8063319Abstract: An electrical junction box may include a casing with a lower casing member and an upper casing member. A multi-layered circuit board may be retained in the electrical junction box. The multi-layered circuit board may contain a lower layer circuit board, an upper layer circuit board and an insulation plate that is disposed between and supports the lower layer circuit board and the upper layer circuit board. A rib and a boss may project from the lower casing member and may contact the insulation plate without contacting either the lower layer circuit board or the upper layer circuit board. In this manner, no physical stress is applied to a surface of either the lower layer circuit board or the upper layer circuit board thereby preventing detachment of an electronic component from the multi-layered circuit board.Type: GrantFiled: August 20, 2009Date of Patent: November 22, 2011Assignee: Sumitomo Wiring Systems, Ltd.Inventor: Takashi Miyamoto
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Patent number: 8063294Abstract: A combining housing has first, second and third connectors. A music player has a first line adapted to be coupled to the first connector. A special effects box has a second line adapted to be coupled to the second connector. Earphones have a third line adapted to be coupled to the third connector. A musical instrument has a supplemental line adapted to be coupled to the special effects box. Positive, negative and ground wires are within each of the lines and continue within the combining housing. An electrical assembly includes the positive, negative and ground wires. The positive lines are coupled together within the combining housing forming a first junction. The negative wires are coupled together within the combining housing forming a second junction. The ground wires are coupled together within the housing forming a third junction.Type: GrantFiled: February 12, 2010Date of Patent: November 22, 2011Inventor: Stephen W. Amberg, II
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Patent number: 8053683Abstract: An equipment container retention and bonding system including a dagger pin block assembly that includes a mounting dagger pin and a bonding member formed of a compressive electrically conductive material that is retained on a surface of the dagger pin block assembly wherein the bonding member is compressed between the contact surface on the equipment container and the dagger pin block assembly when the fastening mechanism secures the equipment container in the mounting tray to form an EMI/EMC bonding connection between the mounting tray and the equipment container having an electrical resistance of less than 2.5 milli-ohms under vibration and other loading conditions encountered during use of the system.Type: GrantFiled: March 30, 2009Date of Patent: November 8, 2011Assignee: Lockheed Martin CorporationInventors: Douglas A. Slocum, John G. Davis, Jamey Kelsall, John A. Stubecki
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Patent number: 8035040Abstract: An electric current sensor is disposed in an upper end part of a casing in an electrical junction box. A detecting bus bar penetrates a through-hole in the electric current sensor so that opposite ends of the detecting bus bar project from the through-hole. A bolt hole is provided in an input side portion on one end projecting from the through-hole. Bolt holes are provided in an output side portion on the other end projecting from the through-hole. A bolt hole is provided in an input side bus bar. The input side bus bar is disposed below the input side portion so that the bolt hole is communicated with the bolt hole. Bolt holes are provided in output side bus bars. The output side bus bars are disposed below the output side portion so that the bolt holes are communicated with the bolt holes. Bolts are inserted downward into the communicated bolt holes to secure the electric current sensor to the input and output side bus bars.Type: GrantFiled: May 28, 2009Date of Patent: October 11, 2011Assignee: Sumitomo Wiring Systems, Ltd.Inventor: Kenichi Nishikawa
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Publication number: 20110222250Abstract: An electrical component (100) includes a housing (1), a number of terminals (2) molded within housing and at least one electrical element (3). The housing has at least a side wall (11) having a number of recesses (112) and an internal cavity (15). Each terminal has a first end (23) extending to a bottom of the side wall and formed with a platform portion (231) located onto the bottom of the side wall and aligned with the corresponding recess. The electrical element has a number of wires (321) wrapped thereon. One end of the wire extends outward the cavity through the recess and is soldered onto the corresponding platform portion.Type: ApplicationFiled: May 24, 2011Publication date: September 15, 2011Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: HONG-BO ZHANG, ZHENG-HUA XU, CHAO-TUNG HUANG
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Patent number: 8014167Abstract: A hermetically sealed housing having a base deck, a cover member and a seal assembly constructed of a liquid crystal material (LCM), the base deck and cover member forming an enclosure containing an inert gas atmosphere. Various embodiments have the LCM seal bonded to one or both of the base deck and cover member and bonded to seal the enclosure by molding, compression, adhesive bonding, thermoplastic welding or soldering, or a combination of such.Type: GrantFiled: September 7, 2007Date of Patent: September 6, 2011Assignee: Seagate Technology LLCInventors: Neal F. Gunderson, Daniel D. Dittmer, Michael A. Mewes
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Publication number: 20110188224Abstract: An electronic device includes: an insulting casing having a first wall part and a second wall part that extends in a direction intersecting the first wall part; a contained component contained in the casing and provided at the first wall part at a position in the vicinity of the second wall part; and a conductive adhesive provided at the first wall part and comprising a first end portion electrically connected to the contained component and a second end portion provided at a position different from that of the first end portion.Type: ApplicationFiled: October 12, 2010Publication date: August 4, 2011Inventors: Takahiro Sugai, Takahisa Funayama
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Patent number: 7961477Abstract: A housing comprising a liquid-tight electric bushing is provided. The housing comprises an opening and a printed circuit board comprising at least first and second layers. The first layer is a top side of the printed circuit board and spans the opening. A first contact element is disposed on the top side and in a blind bore through the first layer that extends to the second layer. The second layer is a conductor track in the interior of the printed circuit board.Type: GrantFiled: December 27, 2004Date of Patent: June 14, 2011Assignee: Siemens AktiengesellschaftInventors: Josef Deuringer, Richard Eichhorn, Lars Lauer, Gerd Mörsberger, Paul Ponnath, Roland Rabe
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Patent number: 7947911Abstract: A method of forming an anti-tamper mesh on an electronic device. The method includes forming at least one terminal on the electronic device and forming a conductive mesh on at least one surface of the electronic device, wherein the conductive mesh is in electrical contact with the terminal, and wherein the terminal facilitates electrical conduction between the conductive mesh and an electrical detection circuit.Type: GrantFiled: November 26, 2007Date of Patent: May 24, 2011Assignee: Teledyne Technologies IncorporatedInventors: Cuong V. Pham, David E. Chubin, Robert A. Clarke, Aaron D. Kuan
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Patent number: 7943866Abstract: A housing of the present invention can house an electronic device therein and is provided with a cable housing capable of housing a part of a cable. The cable housing is formed of a depression and a protrusion extending out from a part of a first sidewall of the depression toward a fourth sidewall of the depression along a second sidewall, a third sidewall, and a bottom wall of the depression. At a boundary portion between a housing area and a passing area, a distance between the second sidewall and the third sidewall in the housing area is longer than a distance between the second sidewall and the third sidewall in the passing area.Type: GrantFiled: March 3, 2009Date of Patent: May 17, 2011Assignee: Buffalo Inc.Inventors: Makoto Oya, Jun Matsui
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Publication number: 20110100706Abstract: A vertical bus bar is provided to a side of a relay mount portion. A flat bus bar portion is integrally provided extending from an end edge portion of the vertical bus bar to an opening of a terminal connection hole of the relay mount portion. A plurality of connection terminals, including a connection terminal for a switch, are integrally provided to the flat bus bar portion.Type: ApplicationFiled: September 23, 2010Publication date: May 5, 2011Applicant: SUMITOMO WIRING SYSTEMS, LTD.Inventor: Toshiyuki MATSUI
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Patent number: 7911801Abstract: A laminate includes base material layers and interlayer constraining layers disposed therebetween. The base material layers are formed of a sintered body of a first powder including a glass material and a first ceramic material, and the interlayer constraining layer includes a second powder including a second ceramic material that will not be sintered at a temperature for melting the glass material, and is in such a state that the second powder adheres together by diffusion or flow of a portion of the first powder including the glass material included in the base material layer at the time of baking. The incorporated element is in such a state that an entire periphery thereof is covered with the interlayer constraining layer.Type: GrantFiled: January 22, 2010Date of Patent: March 22, 2011Assignee: Murata Manufacturing Co., Ltd.Inventors: Yuichi Iida, Osamu Chikagawa
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Patent number: 7897883Abstract: A lead-mounting seat includes a conductive seat body including a lead-mounting plate and spaced apart first and second insert legs that extend from the lead-mounting plate and that have different geometric shapes. The lead-mounting plate is formed with a plurality of lead-mounting holes. Each of the first and second insert legs has a connecting end connected to the lead-mounting plate, and a free end opposite to the connecting end. Each of the first and second insert legs is reduced in width from the connecting end to the free end.Type: GrantFiled: June 13, 2008Date of Patent: March 1, 2011Assignee: T.Y.C. Brother Industrial Co., Ltd.Inventor: Yueh-Hsun Yang
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Patent number: 7884289Abstract: The present invention relates to a method for manufacturing an electronic assembly (50) comprising an electronic component, a cavity and a substrate which method comprises; —providing an electronic component (10) having a first pattern with a substantially closed configuration; —providing a cover (18) on a surface of the electronic component, which cover together with said surface defines a cavity (20), the closed configuration of the first pattern substantially enclosing the cover at said surface; —providing a substrate (30) having a second pattern with a substantially closed configuration, which closed configuration at least partially corresponds to the closed configuration of the first pattern and comprises a solder pad; —disposing solder material at the solder pad; —positioning the electronic component and the substrate so as to align both the substantially closed configurations of the first and second pattern, while the substrate supports a top surface (28) of the cover; —reflow-soldering the solder mateType: GrantFiled: April 11, 2007Date of Patent: February 8, 2011Assignee: NXP B.V.Inventors: Johannes W. Weekamp, Cornelis Slob, Jacob M. Scheer, Freerk E. Van Straten
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Patent number: 7885076Abstract: An electronic device such as an AC/DC power adapter includes a conductive heat dissipation system. The device contains heat generating components and is powered via power supply leads by an external power supply circuit. The device further contains a thermally conductive mass that is thermally coupled to both the heat generating components and to the power supply leads. When the power supply leads are coupled to receive electricity from the external power supply circuit, heat generated by the device is thermally conducted into the external power supply circuit via the power supply leads.Type: GrantFiled: September 6, 2005Date of Patent: February 8, 2011Assignee: Flextronics AP, LLCInventors: Bahman Sharifipour, Arian Jansen
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Patent number: 7875812Abstract: A method and apparatus for protecting a heat sensitive component from high temperature, mechanical shock and moisture are provided. An enclosure includes an outer housing surrounding an inner cavity configured to receive a heat sensitive component therein, a cover configured to matingly engage the outer housing such that the inner cavity is sealed from an environment external to the enclosure, wherein at least one of the outer housing and the cover are formed from a ceramic material.Type: GrantFiled: July 31, 2008Date of Patent: January 25, 2011Assignee: GE Aviation Systems, LLCInventor: Joseph B. Steffler
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Publication number: 20110013912Abstract: In one example, a header assembly for use in a communication device has a base that includes a plurality of single ports through which a corresponding plurality of leads extends. The leads are retained in their respective single ports by a retainer material. Additionally, the base includes one or more plural ports through which two or more leads extend.Type: ApplicationFiled: July 20, 2009Publication date: January 20, 2011Inventors: Martin A. Kalberer, Hongyu Deng, Maziar Amirkiai
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Patent number: 7868258Abstract: A radio frequency (RF) module assembly includes a substrate on which a predetermined component is mounted, the substrate comprising a connection terminal, and an RF module mounted on the substrate and processing a predetermined RF signal. The RF module includes a housing forming a body, a jack receiving and transmitting a predetermined RF signal, a jack receiving part provided at the housing to allow the jack to be inserted inside the housing and received, and a terminal connected to a connection terminal of the substrate.Type: GrantFiled: August 27, 2008Date of Patent: January 11, 2011Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jong Gi Ryu, In Jong Jang, Ki Hoon Won
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Patent number: 7864531Abstract: An electronic device includes an FPC, a circuit chip arranged on the flexible flat cable, a heat sink arranged on the circuit chip to release a heat of the circuit chip, and an elastic member arranged on a lower surface of the FPC. The upper surface of the FPC is large enough to cover a contact surface of the circuit chip. The elastic member does not overlap with an apex portion of the circuit chip, but overlaps with the circuit chip at an inner side of the apex portion. Therefore the elastic member does not press the FPC against the apex portion of the circuit chip. Accordingly, the FPC at a position corresponding to an apex of the circuit chip is suppressed from being distorted, and there is no fear of breaking of wire and exfoliation of the circuit chip.Type: GrantFiled: April 8, 2008Date of Patent: January 4, 2011Assignee: Brother Kogyo Kabushiki KaishaInventors: Yasuhiro Kato, Shigeru Suzuki, Koji Imai
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Patent number: 7863527Abstract: An integrated circuit includes a positive lead defining a first pocket and a negative lead spaced apart from the positive lead that defines a second pocket that is aligned with the first pocket. The first and second pockets are adapted to receive and hold an electrical device such as a capacitor therein.Type: GrantFiled: November 13, 2007Date of Patent: January 4, 2011Assignee: Continental Automotive Systems US, Inc.Inventor: Gaetan Vich
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Patent number: 7847200Abstract: Certain exemplary embodiments can provide a terminal box adapted to be releasably and/or operatively attached to a selected electric motor of a plurality of electric motors. The terminal box can be adapted to receive a plurality of electrical wires. The plurality of electrical wires can be adapted to convey electrical energy to the selected electric motor.Type: GrantFiled: September 19, 2007Date of Patent: December 7, 2010Assignee: Siemens Industry, Inc.Inventors: Kevin Dause, David Beckman, William Finley, Benjamin Flick, Michael Laubenthal
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Publication number: 20100282507Abstract: The invention relates to a molded housing (1) for an electronic circuit for installation in electronic devices and/or applications, in particular sensors or pick-ups characterized by force fit zones (7). According to the invention, the molded housing (1) has force fit zones (7). The invention also relates to an electronic module, in particular an acceleration sensor (28) according to the preamble of claim 16. Said acceleration sensor has a molded housing (1) that has force fit zones (7).Type: ApplicationFiled: July 9, 2007Publication date: November 11, 2010Inventor: Ronny Ludwig
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Patent number: 7759584Abstract: An electronic part equipped unit includes a case body that includes a first recess portion for containing an electronic part and a second recess portion for containing a relay terminal which is connected to the electronic part, a wire side terminal to which a middle portion of a wire is attached, and a cover member to which the wire side terminal is attached. The wire side terminal is brought into contact with the relay terminal when the cover member to which the wire side terminal is attached is fitted to the second recess portion of the case body. A positioning rib for restricting the relay terminal is provided on a bottom portion of the second recess portion of the cover body. The wire side terminal has a rib contact portion.Type: GrantFiled: July 3, 2008Date of Patent: July 20, 2010Assignee: Yazaki CorporationInventor: Tomohiko Shimizu
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Patent number: 7667146Abstract: An attachment device for attachment of an electrical or electronic device to a top-hat rail, including an attachable or integrated carrier plate, and a lockable fastener. The carrier plate has a holding device. The fastener is axially movable relative to the carrier plate and has an elongated base region, metal catch hooks, and a spring tongue punched out of the base region. The carrier plate has a projection protruding in a direction of the fastener, and arranged corresponding to the spring tongue.Type: GrantFiled: December 7, 2007Date of Patent: February 23, 2010Assignee: i f m electronic GmbHInventor: Marco Eckardt
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Publication number: 20090242269Abstract: According to one embodiment, a printed circuit board comprises a printed wiring board and a connection device mounted on the printed wiring board. The connection device comprises a main body, a casing enclosing the main body, a receiving section provided in the casing to receive a connector, and terminals extending through the main body and electrically connected to the connector in the receiving section. The main body includes a first portion extending into the receiving section in such a manner as to protect the tip portion of each terminal and a second portion arranged in a position corresponding to a proximal portion on the other end of the terminal with respect to the tip portion and fixed to the casing. The first portion is prepared independently of the second portion.Type: ApplicationFiled: December 29, 2008Publication date: October 1, 2009Applicant: Kabushiki Kaisha ToshibaInventor: Masashi Watanabe
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Patent number: 7570481Abstract: A base assembly is provided for a power pedestal including an elongated housing and a plurality of electrical conductors enclosable by the elongated housing. The elongated housing has a first end and a second end disposed opposite and distal from the first end. The base assembly includes a power pedestal base member having a first end and a second end disposed opposite and distal from the first end. The second end of the base member is structured to be coupled to a platform. A connecting mechanism, such as a hinge assembly, is disposed at or about the first end of the base member and removably couples the first end of the elongated housing to the base member without a number of separate fasteners, thereby facilitating removal of the elongated housing from the base member. An electrical bus mount may be removably coupled to a mounting surface of the base member.Type: GrantFiled: April 12, 2007Date of Patent: August 4, 2009Assignee: Eaton CorporationInventors: Paul D. Seff, Alston G. Brooks, Gregory S. Nailler
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Patent number: 7511233Abstract: The present invention is a flash memory drive including a printed circuit board, a male connector mounted to the printed circuit board, a female connector mounted to the printed circuit board, a flash memory chip mounted on the printed circuit board and electrically coupled to the male connector and the female connector and a download/copy logic chip for enabling data to be transferred to or from the flash memory chip. The female connector is configured to mate with another male connector for transferring data to or from the flash memory chip.Type: GrantFiled: January 3, 2005Date of Patent: March 31, 2009Inventor: Alan L. Pocrass
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Publication number: 20090065248Abstract: Certain exemplary embodiments can provide a terminal box adapted to be releasably and/or operatively attached to a selected electric motor of a plurality of electric motors. The terminal box can be adapted to receive a plurality of electrical wires. The plurality of electrical wires can be adapted to convey electrical energy to the selected electric motor.Type: ApplicationFiled: September 7, 2007Publication date: March 12, 2009Inventors: Bill Finley, Michael Laubenthal, David Beckman, Kevin Dause, Benjamin Flick
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Patent number: 7498525Abstract: A card type peripheral apparatus is disclosed which can be removably inserted not only into a slot of an electronic apparatus of a small size but also into a slot of an external apparatus readily and with certainty. The apparatus includes a first case, an electronic part accommodated in the first case, and a connector provided at a first end in the lengthwise direction of the first case for electrically connecting an external apparatus to the electronic part. The attachment includes a second case. Mounting portions are provided at a second end in the lengthwise direction of the first case and a first end in the lengthwise direction of the second case such that the first and second cases are removably attached to each other at the mounting portions thereof while the lengthwise directions thereof are juxtaposed with each other.Type: GrantFiled: September 8, 2005Date of Patent: March 3, 2009Assignee: Sony CorporationInventors: Yoshitaka Aoka, Keiichi Tsutsui
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Patent number: 7488904Abstract: A sensor unit (1) has a metal plate (10), a resin molded portion (20) and an oil temperature sensor (2). Busbars (4) made of a metal are arranged in the resin molded portion (20). Since the busbars (4) are insert-molded while having the exposed ends (4A) thereof tightly held by a pair of forming dies, a distance between the exposed ends (4A) and the placing surface 10A is held constant. Further, gate marks (5D) of the oil temperature sensor (2) are accommodated in recesses (10B) of the placing surface (10) and engaging grooves (9) and engaging projections (26A) are engaged. Thus, the oil temperature sensor (2) can be held in a proper posture. Additionally, the oil temperature sensor (2) can be held on the placing surface (10A) by riveting the exposed end (4A) and a terminal (8) of the oil temperature sensor (2).Type: GrantFiled: June 21, 2007Date of Patent: February 10, 2009Assignee: Sumitomo Wiring Systems, Ltd.Inventors: Akihito Maegawa, Shinyu Nagashima
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Publication number: 20080236886Abstract: The invention concerns a panel box, for the electrical connection of a photovoltaic module for a solar installation, with a base piece (1) for mounting on the photovoltaic module and for the electrical connection of a connection line of the photovoltaic module, and with another part for placement on the base piece (1). According to the invention, the other part is designed as a functional part (2), having at least one functional device performing an electrical and/or electronic function. This provides a panel box which is easy to install and, what is more, it enables an easy replacement of a defective component in event of a fault.Type: ApplicationFiled: March 26, 2008Publication date: October 2, 2008Applicants: GUNTHER SPELSBERG GMBH & CO. KG, MULTI-CONTACT AGInventors: Walter Gerull, Anton Burge-Allenspach
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Patent number: 7420132Abstract: The present invention provides busway plug fitting having a housing assembly and a toggle mechanism disposed therein having at least two operatively linked operating handles. A first assembly is disposed on a first side member of the housing assembly and structured to move between a first position and a second position. The second handle assembly is disposed on a second, perpendicular side of the housing assembly and also structured to move between a first position and a second position. The toggle mechanism is coupled to the external coupling construct of the operating device and structured to move between a first position and a second position. The first and second handle assemblies are operatively linked by the toggle mechanism. In this configuration, a user may operate either handle assembly to actuate the operating device disposed with in the busway plug fitting.Type: GrantFiled: July 10, 2006Date of Patent: September 2, 2008Assignee: Eaton CorporationInventors: Arthur J. Jur, Stephen W. Oneufer, Phillip D. Miller
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Patent number: 7420817Abstract: An apparatus and method for a near hermetic chip carrier package having a base die and a lid die each formed of a substantially impermeable material and conjoined by a semi-permeable sheet or tape substrate of only a few thousands of an inch thickness that is formed of two or more thermotropic liquid crystal polymer (LCP) films laminated over a selected number of metal electrical conductors carrying signals into and out of package.Type: GrantFiled: January 9, 2006Date of Patent: September 2, 2008Assignee: Honeywell International Inc.Inventor: Mark H. Eskridge
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Patent number: 7414204Abstract: A display device including a display panel, a chassis base connected to the plasma display panel, the chassis base supporting the plasma display panel, and a flexible printed circuit having a driver integrated circuit thereon installed on the chassis base while being pressed by a protective plate. A step structure is formed on the chassis base where the flexible printed circuit is attached. Furthermore, the flexible printed circuit area where the driver integrated circuit is placed may be in contact with a heat dissipating material located in an accommodating portion formed in the chassis base.Type: GrantFiled: October 19, 2004Date of Patent: August 19, 2008Assignee: Samsung SDI Co., Ltd.Inventors: Joong-Ha Ahn, Myoung-Kon Kim
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Patent number: RE43720Abstract: A multi-chip device which includes a plurality of integrated circuit die disposed one over another. Each integrated circuit die includes one or a plurality of bond pads. One or a plurality of conductors are disposed to electrically couple the bond pads of vertically adjacent integrated circuit die. Each conductor is designed, calculated, specified and/or predetermined to have a length so as to behave as a segment in a multi-drop transmission line. The multi-drop transmission line may be terminated at one end or utilized in a flow-through approach. In one embodiment, an integrated circuit die may be horizontally offset with respect to a vertically adjacent integrated circuit die to expose the periphery region. In another embodiment, each integrated circuit die may be stacked and aligned in a vertical column. In this embodiment, a spacer such as a thermally conductive spacer is disposed between each integrated circuit die in the stack.Type: GrantFiled: September 15, 2005Date of Patent: October 9, 2012Assignee: Rambus Inc.Inventors: Donald V. Perino, Sayeh Khalili