Abstract: The invention provides an electric apparatus unit which can be easily assembled. The electric apparatus module includes an upper case, a lower case assembled with the upper case and having an opening, an electric apparatus unit accommodated in the upper case and the lower case, a connection unit including a board, a connector mounted on the board and connected to the electric apparatus unit, and a connecting member, a first end of the connecting member attached to the board and a second end of the connecting member guided to outside of the lower case through the opening, and an assembling portion provided on the connection unit and the lower case and assembling the connection unit to the lower case, the assembling portion enabling the board to move along surficial direction of the board and restricting the board to move in a direction perpendicular to the surface of the board.

Abstract: An apparatus for heatsink attachment and a method for forming the apparatus. The apparatus includes a substrate, a semiconductor chip on top of and physically attached to the substrate, and a lid on top of the substrate. The lid includes a first thermally conductive material. The apparatus further includes a heatsink on top of the lid. The heatsink includes a second thermally conductive material. The semiconductor chip and the substrate share a common interface surface that defines a reference direction perpendicular to the common interface surface and pointing from the substrate towards the semiconductor chip. The lid is disposed between the substrate and the heatsink. The lid includes a first protruding member. The first protruding member of the lid is farther away from the substrate than a portion of the heatsink in the reference direction.

Abstract: A grid array socket pin field is protected during manufacture of an information handling system with a dust cap having first and second attachment devices. The first attachment device secures the cap to the socket during assembly of the socket in the computer. The second attachment device secures the cap to a load mechanism assemble proximate the socket. Engagement of the second attachment device to the cap automatically releases the cap from the socket to allow removal of the cap from the socket by actuation of the load mechanism to an open position. The second attachment device secures the cap to the load mechanism until a processor is placed in the socket.

Abstract: An electric component includes a substrate, a function element provided on the substrate, a first sealing body provided on the substrate to cover the function element at a certain distance, the first sealing body including multiple apertures communicating with an internal space formed between the first sealing body and the substrate, and a second sealing body provided on the first sealing body and configured to occlude the multiple apertures. Here, a boundary between the first sealing body and the substrate is curved in a direction to narrow the internal space.

Abstract: A thermostat is provided that includes a lock disposed in a sub-base, which includes a cam coupled to the lock to permit rotation of the cam between an unlocked and a locked position. The cam includes an offset portion that is configured to rotate over a vertical retaining portion of the thermostat housing, to retain the thermostat housing to the sub-base. The cam further includes an outwardly extending portion, wherein the outwardly extending portion is configured to rotate adjacent to a door that is pivotally coupled to the thermostat housing. When the cam is in the locking position, pivoting of the door is impeded by the outwardly extending portion of the cam, to resist pivotal movement of the door and thereby inhibit access to one or more input means or controls of the thermostat.

Abstract: An enclosure for electronic circuitry is provided which has a first housing member having at least one protrusion formed in a wall and a second housing member having at least one slot for receiving the at least one protrusion and securing the second housing member to the first housing member. The second housing member and the first housing member have one or more continuous electrical ground contact surfaces. The second housing member is secured to the first housing member so that there is an interference fit between the at least one protrusion and at least one slot and so that there are one or more continuous electrical ground contact surfaces between the first housing member and the second housing member. A method of assembling an enclosure for electronic circuitry is provided.

Abstract: An apparatus for heatsink attachment. The apparatus includes a substrate, a semiconductor chip on top of and physically attached to the substrate, and a lid on top of the substrate. The lid includes a first thermally conductive material. The apparatus further includes a heatsink on top of the lid. The heatsink includes a second thermally conductive material. The semiconductor chip and the substrate share a common interface surface that defines a reference direction perpendicular to the common interface surface and pointing from the substrate towards the semiconductor chip. The lid is disposed between the substrate and the heatsink. The lid includes a first protruding member. The first protruding member of the lid is farther away from the substrate than a portion of the heatsink in the reference direction.

Abstract: A ganged electrical device which supports electrical components. The ganged electrical device includes a housing having first and second opposed elongate side walls and a pair of end walls joining the side walls. The first and second side walls include cooperative attachment structure for attaching the first side wall of one housing to a second side wall of another identical housing to place the respective first and second side walls in side-by-side engagement.

Abstract: A mounting box for installation on an exterior wall of a building. The mounting box has a box-shaped structure having a substantially horizontally disposed top surface when in situ, a nailing flange around a perimeter of the box-shaped structure, a downwardly and outwardly inclined shoulder on each side of the top surface, the shoulders each having a shoulder surface and a plurality of notches along an outer edge of the shoulder surface which attract and constrain the flow of water along the shoulders.

Abstract: An apparatus, system, and method for a tray to receive and couple a nonvolatile memory device to an electronic device disposed within a housing, are disclosed herein.

Abstract: An electrical enclosure that includes a sidewall, a back and a top, defining an interior. The top of the enclosure is adapted to open and provide access to the interior. The enclosure includes a backplane mounted to the interior of the enclosure. The backplane has at least one cutout where the cutout is positioned on the backplane to align with an obstacle positioned on the enclosure sidewall and extending into the enclosure interior.

Abstract: A computer front bezel assembly includes a front panel (10), a front bezel (30), and a driving member (50). The front panel defines a securing opening (14). The front bezel is attached to a first surface of the front panel. A resilient engaging portion (38) with barb-shaped end is formed on the front bezel for engaging with the securing opening. The driving member is attached to a second surface of the front panel. The second surface is opposite to the first surface. The front panel includes a driving clip (572). When the driving member is slid, the driving clip urges the resilient engaging portion to deform, thereby the resilient engaging portion disengaging from the securing opening of the front panel.