With Base Treatment Patents (Class 204/207)
  • Patent number: 11560640
    Abstract: The purpose of the present invention is to provide a filling plating system and a filling plating method capable of filling plating sufficiently even if the plating is interrupted between electrolytic plating cells. A filling plating system for forming filling plating in a via hole and/or a through hole of a work to be plated, comprising: a plurality of electrolytic plating cells; and an additive adhesion region arranged between each of the plurality of electrolytic plating cells, wherein solution containing one or more kinds of additive selected from at least a leveler comprising nitrogen-containing organic compound, a brightener comprising sulfur-containing organic compound, and a carrier comprising polyether compound, is directly adhered to the work to be plated at the additive adhesion region.
    Type: Grant
    Filed: December 26, 2017
    Date of Patent: January 24, 2023
    Assignee: C. Uyemura & Co., Ltd.
    Inventors: Takuya Okamachi, Naoyuki Omura, Kanako Matsuda
  • Patent number: 9730330
    Abstract: A compliant electronic device is presented. The device may be, for example a wearable display for sports applications. The compliant electronic device comprises a thin sheet with a regular pattern of openings optimized to provide maximum compliance. The device may be partially or completely embedded in foam or other highly stretchable and compressible material that, while preserving compliance, protects the device from untoward environmental influences.
    Type: Grant
    Filed: November 21, 2014
    Date of Patent: August 8, 2017
    Assignee: H4 Engineering, Inc.
    Inventors: Christopher T. Boyle, Alexander G. Sammons, Denes Marton, Scott K. Taylor
  • Patent number: 8888967
    Abstract: A process for creating porous anode foil for use in an electrolytic capacitor of an implantable cardioverter defibrillator is provided. The process includes electrochemical drilling a plurality of etched metal foils in sequence one after the other in a bath containing electrochemical drilling (ECD) solution initially having a pH of less than 5. Alternatively, an etched foil sheet may be passed through the bath in a substantially continuous manner such that a portion of said etched foil sheet is in contact with the ECD solution is electrochemically drilled to generate pores.
    Type: Grant
    Filed: May 30, 2013
    Date of Patent: November 18, 2014
    Assignee: Pacesetter, Inc.
    Inventors: Jason Hemphill, Thomas F. Strange
  • Patent number: 8398827
    Abstract: Two rotating members placed to face each other and nipping a web such that only an end of the web provided with conductivity is pressed are provided, at least one of the rotating members serves as a feeding electrode, and these rotating members are rotated about the same velocity to a transportation velocity of the web.
    Type: Grant
    Filed: June 25, 2012
    Date of Patent: March 19, 2013
    Assignees: Toray Industries, Inc., Toray Advanced Film Co., Ltd.
    Inventors: Mamoru Kawashita, Fumiyasu Nomura, Shintaro Kuge, Toru Miyake
  • Patent number: 8187440
    Abstract: A method of coating a magnesium-based substrate includes applying a first potential of electric current to the substrate and, after applying, immersing the substrate in an electrocoat coating composition. After immersing, a second potential of electric current is applied between the substrate and a counter electrode to deposit the electrocoat coating composition onto the substrate. The second potential is greater than the first potential. The method also includes curing the electrocoat coating composition to form a cured film and thereby coat the substrate. An electrocoat coating system includes the magnesium-based substrate, and the cured film disposed on the substrate and formed from the electrocoat coating composition. The substrate exhibits a negative charge from an applied first potential of electric current of ? approximately 40 V prior to contact with the electrocoat coating composition.
    Type: Grant
    Filed: August 13, 2009
    Date of Patent: May 29, 2012
    Assignee: GM Global Technology Operations LLC
    Inventor: Guangling Song
  • Patent number: 8178904
    Abstract: A gate array of a semiconductor substrate on which plural unit cells are arranged in parallel, the unit cells having the same pattern that includes a source potential region VDD, a PMOS, an NMOS and a ground potential region GND. Metal wiring lines being formed, with an insulating layer between, on the unit cells, with contacts that make electrical connection between the metal wiring lines and the unit cell transistors. The gate wiring of a transistor in a non-used unit cell is used in place of a metal wiring line. By doing so, the area of metal wiring lines in a gate array is reduced and the array wiring efficiency is increased.
    Type: Grant
    Filed: December 10, 2010
    Date of Patent: May 15, 2012
    Assignee: Oki Semiconductor Co., Ltd.
    Inventor: Hirofumi Uchida
  • Patent number: 7955487
    Abstract: The invention relates to a device and method for electrolytically treating flat work pieces (1), more especially for electrolytically treating electrically conductive structures S that are electrically insulated against each other on the surfaces of the work pieces. The method comprises conveying and processing the work pieces (1) on the conveying paths T?, T? in the device, said device comprising at least one assembly A located between tow conveying paths, said assembly including a first and a second rotatable contacting electrode (2, 8) with the contacting electrodes being associated each with one of the conveying paths, and first contacting electrodes (2) abutting against the work pieces being conveyed in a first conveying path T?, and being spaced from the second conveying path T? and second contacting electrodes (8) abutting against the work pieces being conveyed in the second conveying path T? and being spaced to the first conveying path T?.
    Type: Grant
    Filed: June 15, 2005
    Date of Patent: June 7, 2011
    Assignee: Atotech Deutschland GmbH
    Inventors: Franz Kohnle, Klaus Hechler
  • Patent number: 7837839
    Abstract: The invention relates to an apparatus for galvanically depositing an electrically conductive layer onto a carrier on which, at least in some regions, a starter layer suitable for electroplating is disposed. The apparatus has an electroplating bath in which an electrolyte for depositing conductive material is provided, at least two contact rollers which are disposed outside of the electroplating bath and which can be connected as cathode and/or anodes, and at least one deflection roller which is connected between the contact rollers, the position of the deflection roller being changeable between two contact rollers such that by changing the position of the deflection roller a distance to be covered by the carrier and which is formed between two contact points of two adjacent contact rollers corresponds to the extension of the starter layer to be coated.
    Type: Grant
    Filed: June 6, 2007
    Date of Patent: November 23, 2010
    Assignee: BCT Coating Technologies AG
    Inventors: Peter Fleissner, Johannes Fleissner
  • Patent number: 7771572
    Abstract: A cone crusher fixed toothed plate fixing structure, including an upper chamber, a locking device, a fixed toothed plate and a plurality of bolt members. A passageway penetrates the interior of the upper chamber, and the fixed toothed plate, provided with protrusions corresponding to protruding pieces of the upper chamber and stop pieces of the locking device and clasping notches corresponding to indentations of the upper cover and recesses of the locking device, is disposed therein, and a ledge located interior of the passageway enables the locking device to be disposed thereon. The plurality of bolt members are rotated and bolted into a plurality of screw holes to enable abutting against the ledge, whereupon a locking action raises the fixed toothed plate and attaches it to the upper chamber, thereby enabling the fixed toothed plate G to realize simple assembly of the fixing structure, and achieve effectiveness to crush stones.
    Type: Grant
    Filed: February 8, 2007
    Date of Patent: August 10, 2010
    Assignee: Minyu Machinery Corp., Ltd.
    Inventor: Hou-Kun Lee
  • Patent number: 7678242
    Abstract: Disclosed is a system and a method for manufacturing flexible copper clad laminate film capable of efficiently electroplating both surfaces of a polyimide-based film to form copper plating layers thereon while making it easy to repair and maintain the apparatus or clean its plating or cleaning bath. The system includes a pickling device adapted to spray a pickling liquid to both surfaces of a to-be-plated film to remove oxide coatings from the copper coatings; a number of water-cleaning devices for removing the pickling liquid and copper electrolyte remaining on the film; at least one plating device positioned between the water-cleaning devices to form copper plating layers on both surfaces of the film; an antirust device for preventing the copper plating layers, which have been formed by the plating device, from rusting; and a drying device for drying the antirust liquid on the film, which has been subjected to antirust treatment.
    Type: Grant
    Filed: December 5, 2005
    Date of Patent: March 16, 2010
    Assignee: Korea Institute of Industrial Technology
    Inventors: Hong Kee Lee, Seong-Ho Son, Seok Bon Koo
  • Patent number: 7611584
    Abstract: A metal film-plating system including an unwinding process part configured to provide a film, a degreasing process part configured to remove impurities from the film, an etching process part configured to perform an etching process on the film, a neutralizing process part configured to perform a neutralizing process on the film, a coupling process part configured to couple the neutralized film with a coupling agent, a catalyst-adding process part configured to adsorb a catalyst onto the coupled film, an underplating process part configured to perform an underplating process on the film, and a plating process part configured to perform a plating process on the film. Further, at least one of the unwinding process part, the degreasing process part, the etching process part, the neutralizing process part, the coupling process part, the catalyst-adding process part, the underplating process part, and the plating process part includes a wetting apparatus configured to perform a wetting operation.
    Type: Grant
    Filed: February 15, 2006
    Date of Patent: November 3, 2009
    Assignee: LG Electronics Inc.
    Inventors: Myung Ho Park, Woon Soo Kim, Min Keun Seo
  • Patent number: 7097755
    Abstract: The present invention provides an apparatus for electrochemical mechanical processing of a surface of a workpiece by utilizing a process solution. The apparatus of the present invention includes an electrode touching the process solution, a belt workpiece surface influencing device extended between a supply spool and a receiving spool. During the process, the surface of the workpiece is placed in proximity of the workpiece surface influencing device and the process solution is flowed through the process section and onto the surface while a potential difference is applied between the electrode and the surface of the workpiece.
    Type: Grant
    Filed: November 4, 2002
    Date of Patent: August 29, 2006
    Assignee: ASM Nutool, Inc.
    Inventors: Bulent M. Basol, Halit N. Yakupoglu, Cyprian E. Uzoh, Homayoun Talieh
  • Patent number: 7045053
    Abstract: An apparatus for the superficial electrolytic treatment of metal strips, comprising several separate and non-communicating tanks, or containers, located along the path of metal strip (13). A series of electrodes in pairs (14?, 15?, 14?, 15?, 14??, 15??), arranged as tunnels, is situated along the path. Each pair is associated with a container (2?, 2?, 2??), in which an electrod 14?, 14?, 14??) of each pair is located above the strip and the other (15?, 15?, 15??) is located below said strip, in a reciprocally opposits position and at an appropriate distance. The electrode pairs alternately have opposite polarity and each of them is respectively associated with a container. Rollers (3, 3?, 3?, 3??) in pairs for strip pressing are situated at the common border of adjacent containes for the galvanic separation of the strip surface areas facing the electrode pairs of opposite polarity.
    Type: Grant
    Filed: September 21, 2001
    Date of Patent: May 16, 2006
    Assignee: Danieli & C.Officine Meccaniche S.p.A.
    Inventors: Ralf Matzka, Dieter Gruchot
  • Patent number: 6939447
    Abstract: A method of electro-plating comprises providing an anode current for a target, applying an electron beam to the surface of a target and passing electrolyte between said target and anode, thereby to deposit material on said target. An electron beam gun directs an electron beam onto web while anode provides a current thereby depositing material on the web.
    Type: Grant
    Filed: February 14, 2003
    Date of Patent: September 6, 2005
    Assignee: TDAO Limited
    Inventor: John Michael Lowe
  • Patent number: 6929734
    Abstract: The apparatus is provided with a wire guiding means disposed in a liquid bath for turning the direction of a wire to feed the wire into and out of the bath contained by the liquid. The wire guiding means includes a tubular conduit having a first open end disposed in the liquid, a second open end disposed above the liquid, and a middle curved portion for guiding the wire through the tubular conduit. The tubular conduit can be at least partially filled with the liquid. Preferably, the treatment liquid is an electrodeposition liquid. A plurality of the tubular conduits may be disposed in the bath substantially parallel with each other. Preferably the first open end is connected to a bottom portion of the bath through a coupling such that the treatment liquid in the bath can flows into the tubular conduit. The second open end is positioned higher than the first open end.
    Type: Grant
    Filed: August 5, 2002
    Date of Patent: August 16, 2005
    Assignee: Goto Electronic, Co., Ltd.
    Inventor: Yoshihide Goto
  • Patent number: 6890670
    Abstract: The present invention is directed to methods for making magnetically modified electrodes and electrodes made according to the method. Such electrodes are useful as electrodes in batteries, such as Ni-MH batteries, Ni—Cd batteries, Ni—Zn batteries and Ni—Fe batteries.
    Type: Grant
    Filed: September 16, 2003
    Date of Patent: May 10, 2005
    Assignee: University of Iowa Research Foundation
    Inventors: Johna Leddy, Pengcheng Zou
  • Patent number: 6837973
    Abstract: A process and apparatus are provided for producing an electrolytically coated, hot-rolled steel strip without any intervening strips. The apparatus includes a chemical pickling section being combined in one line with an electrolytic coating section containing electrolytic cells so that the pickled steel strip is fed directly to the electrolytic coating section without any intermediate steps. The spent electrolyte solution from the electrocoating section to the pickling section to pickle the steel. The spent pickling acid can also be used to generate the electrolyte solution that is fed to the electrocoating section.
    Type: Grant
    Filed: July 29, 1999
    Date of Patent: January 4, 2005
    Assignee: Andritz-Patentverwaltungs-Gesellschaft m.b.H.
    Inventor: Wilhelm Karner
  • Patent number: 6800186
    Abstract: A continuous strip is electrochemically processed in an electrolytic processing bath using either a thin flexible or resilient dielectric wiping blade or an open web, plastic mesh to wipe bubbles of gas from the surface, sever dendritic material, if such is present, and to remove a surface layer of partially depleted electrolytic solution, replacing with fresh solution and to stabilize strip portions extending between support rolls. The resilient dielectric wiper blade is preferably used with perforated anodes which allow fresh electrolytic solution to flow into the space between the anodes and the strip surface after being expelled by passage of the strip past the wiping blade. The wiping blades may also be angularly oriented with respect to the strip to increase the wiping effectiveness.
    Type: Grant
    Filed: July 7, 1998
    Date of Patent: October 5, 2004
    Inventors: James L. Forand, Harold M. Keeney, Erik S. Van Anglen
  • Publication number: 20040159549
    Abstract: An apparatus and method for fabricating metal fibers using electroforming are provided in which continuous metal fibers can be fabricated. Here, any kind of metal which can be electroplated is electro-deposited on the surface of a negative electrode in diameter of a desired size corresponding to a plurality of non-conductive patterns of the negative electrode surface in an electrolyzer, and the electro-deposited metal is continuously separated.
    Type: Application
    Filed: February 14, 2003
    Publication date: August 19, 2004
    Inventors: Yong Bum Park, Chang Sung Ha
  • Publication number: 20030127320
    Abstract: A multi-process workpiece apparatus is disclosed. The multi-process workpiece apparatus includes an electrochemical deposition apparatus which has a wafer contacting surface having at least one electrical conductor disposed therein. The multi-process workpiece apparatus also includes a planarization apparatus and at least one workpiece handling robot configured to transport a workpiece from the electrochemical deposition apparatus to the planarization apparatus.
    Type: Application
    Filed: November 27, 2002
    Publication date: July 10, 2003
    Inventors: Ismail Emesh, Saket Chadda
  • Publication number: 20030116428
    Abstract: An apparatus in which opposed nozzle assemblies are utilized to clean residual material, such as a metallic paste, from an article, such as a screening mask. Each of the nozzle assemblies has a first set of nozzles for spraying a cleaning agent onto the article in a first pattern to first chemically and mechanically remove residual material from the article. At least one of the nozzle assemblies has a second set of nozzles for spraying a cleaning agent onto the article in a second pattern while simultaneously applying a voltage between the second set of nozzles and the article to then chemically and electrolytically remove the remaining residual material from the article.
    Type: Application
    Filed: December 21, 2001
    Publication date: June 26, 2003
    Applicant: International Business Machines Corporation
    Inventors: Raschid Jose Bezama, John F. Harmuth, Jason Scott Miller, Randall Jason Werner
  • Patent number: 6372101
    Abstract: An apparatus for preventing drag-out is provided. The apparatus is arranged at an exit where a workpiece leaves a plating chamber. Brush members are arranged to contact both sides of the workpiece as it leaves the plating chamber. The brush members are adjustably arranged in a housing such that the angle of the brush member relative to the workpiece can be varied. A locking mechanism is provided to hold the brush member at a selected angle. The entire apparatus is adjustably inward and outward with respect to the workpiece as well as with respect to the plating chamber.
    Type: Grant
    Filed: September 8, 1999
    Date of Patent: April 16, 2002
    Assignee: International Business Machines Corporation
    Inventors: Ralph A. Barrese, Allen H. Hopkins, John J. Konrad, Donald L. Putman, David A. Space, Jr.
  • Patent number: 6322673
    Abstract: Apparatus for use in a continuous electrochemical treating line and a method for electrochemically treating at least one surface of a continuous web moving through an electrolyte solution contained within a tank. The apparatus includes at least one electrode extending across the surface of the continuous web in combination with at least two rigid, non-conductive, and non-polar bumper devices also extending the continuous web surface. The bumper devices include a slick contact surface positioned against the continuous web surface at spaced apart locations that prevent the continuous web from moving outside a pass-line through the electrolyte solution and arcing against the electrode. The bumper devices may comprise either a bumper strip or a conduit.
    Type: Grant
    Filed: December 18, 1999
    Date of Patent: November 27, 2001
    Assignee: Electroplating Technologies, Ltd.
    Inventor: James L. Forand
  • Patent number: 6217725
    Abstract: A resilient dielectric wiper blade is mounted between electrodes and a workpiece, particularly in an anodizing operation, to wipe bubbles of oxygen from the anodic work surface, to remove a surface layer of excessively heated electrolytic solution and replace with fresh cooler solution, and in the case of flexible strip processing, to stabilize the strip between cathodes. The resilient dielectric wiper blade is preferably used with perforated electrodes to facilitate removal of overheated electrolytic solution and replace with freshly circulated solution.
    Type: Grant
    Filed: October 20, 1997
    Date of Patent: April 17, 2001
    Assignee: Electroplating Technologies Ltd.
    Inventors: Erik S. Van Anglen, Harold M. Keeney, James L. Forand
  • Patent number: 6200452
    Abstract: A method and an apparatus for the continuous chromium-plating of elongated members such as bars and the like: the bar to be plated is fed and rotated through at least one tubular shaped chromium-plating anode into which an electrolytic solution suitable for depositing a layer of chromium on the bar, as the latter advances through the said anode, is supplied. The electrolytic solution is supplied into the anode from the bottom upwards, through sets of holes over the bottom and the upper surfaces of the anode; the bottom holes communicate with a pressure balancing and flow distribution chamber for the electrolytic solution. This results in an electrolytic flow upwardly directed in a perpendicular direction to the longitudinal axis of the bar, the temperature of which may be controlled by changing the flow rate of the electrolytic solution circulating inside the anode.
    Type: Grant
    Filed: December 1, 1999
    Date of Patent: March 13, 2001
    Inventor: Giovanna Angelini
  • Patent number: 6187166
    Abstract: A method and system for electroplating a metal coating onto a continuous part, such as the leadframe stock used in packaging integrated circuits, whereby the method comprises plating metal from a series of plating baths having the same or compatible chemical composition, supplying a continuous electrical connection between the D.C. power supply via a rotating contact held in intimate contact with the cathode, and cooling the contact by using the plating solution itself.
    Type: Grant
    Filed: April 16, 1999
    Date of Patent: February 13, 2001
    Assignee: Texas Instruments Incorporated
    Inventors: Paul R. Moehle, David M. Drew, Stephen J. Smith
  • Patent number: 5938913
    Abstract: Process for electrolytic treatment of continuous running material in which the material runs through an electrolytic liquid and electric potential is applied to the material. In order to guarantee freedom from differential potential in the material to be treated in any form of electrolytic treatment, the differential potential in the treated material is measured after electrolytic treatment and at least the same degree of inverse compensating potential is applied to the material.
    Type: Grant
    Filed: April 8, 1997
    Date of Patent: August 17, 1999
    Assignee: Andritz-Patentverwaltungs-Gesellschaft m.b.H.
    Inventors: Jovan Starcevic, Karl Siegmund
  • Patent number: 5837120
    Abstract: A continuous strip is electrochemically processed in an electrolytic processing bath using either a thin flexible or resilient dielectric wiping blade or an open web, plastic mesh to wipe bubbles of gas from the surface, sever dendritic material, if such is present, and to remove a surface layer of partially depleted electrolytic solution, replacing with fresh solution and to stabilize strip portions extending between support rolls. The resilient dielectric wiper blade is preferably used with perforated anodes which allow fresh electrolytic solution to flow into the space between the anodes and the strip surface after being expelled by passage of the strip past the wiping blade. The wiping blades may also be angularly oriented with respect to the strip to increase the wiping effectiveness.
    Type: Grant
    Filed: December 15, 1995
    Date of Patent: November 17, 1998
    Assignee: Electroplating Technologies, Inc.
    Inventors: James L. Forand, Harold M. Keeney, Erik S. Vananglen
  • Patent number: 5800694
    Abstract: The invention concerns a process for pickling material strips made of steel, in particular stainless steel, where the strip passes through at last one pickling bath with at least one pickling acid. It is above all characterized by the fact that the acid concentration and/or the acid composition is controlled as a function of the material quality, of the pre-treatment and of the operating parameters of the pickling plant. Furthermore, the invention concerns a plant for carrying out the process, where at least two circulation tanks having different acid concentrations and/or acid compositions are provided.
    Type: Grant
    Filed: February 15, 1996
    Date of Patent: September 1, 1998
    Assignee: Andritz-Patentverwaltungs-Gesellschaft m.b.H.
    Inventors: Jovan Starcevic, Erich Mahr
  • Patent number: 5786556
    Abstract: A method and a device for performing the method of electrolytic pickling of a metal strip. The metal strip continuously passes through an electrolyte bath which has an electrolyte circulating through a closed system. Crevices are formed on both sides of the metal with electrodes which are located above the top crevice and below the bottom crevice. The electrodes are of opposite polarity and are chemically resistant to the electrolyte. An electrical current is passed from one electrode, through one crevice, through the metal, through the other crevice and to the other electrode which results in the electrolytic pickling of the metal.
    Type: Grant
    Filed: November 9, 1995
    Date of Patent: July 28, 1998
    Assignee: Swedish Pickling AB
    Inventors: Conny Gronlund, Kaj Gronlund
  • Patent number: 5779864
    Abstract: Disclosed herein are methods of measuring, adjusting and uniformalizing a sectional area ratio of a metal-covered electric wire, a method of cleaning an electric wire, a method of manufacturing a metal-covered electric wire, an apparatus for measuring a sectional area ratio of a metal-covered electric wire, and an apparatus for electropolishing a metal-covered electric wire.Electric resistance values of first and second materials are previously stored respectively so that a sectional area ratio of a metal-covered electric wire is calculated on the basis of the as-stored values and an actually measured electric resistance value of the metal-covered electric wire. Measurement and uniformalization of a sectional area ratio of a metal-covered electric wire and cleaning of an electric wire are carried out by dissolving surface layer parts of the electric wires by electropolishing.
    Type: Grant
    Filed: January 28, 1997
    Date of Patent: July 14, 1998
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Akira Mikumo, Kenichi Takahashi, Masanobu Koganeya
  • Patent number: 5679233
    Abstract: A resilient dielectric wiper blade is mounted between electrodes and a workpiece, particularly in an anodizing operation, to wipe bubbles of oxygen from the anodic work surface, to remove a surface layer of excessively heated electrolytic solution and replace with fresh cooler solution, and in the case of flexible strip processing, to stabilize the strip between cathodes. The resilient dielectric wiper blade is preferably used with perforated electrodes to facilitate removal of overheated electrolytic solution and replace with freshly circulated solution.
    Type: Grant
    Filed: September 25, 1995
    Date of Patent: October 21, 1997
    Assignee: Electroplating Technologies Ltd.
    Inventors: Erik S. Van Anglen, James L. Forand, Harold M. Keeney
  • Patent number: 5507924
    Abstract: Disclosed herein are methods of measuring, adjusting and uniformalizing a sectional area ratio of a metal-covered electric wire, a method of cleaning an electric wire, a method of manufacturing a metal-covered electric wire, an apparatus for measuring a sectional area ratio of a metal-covered electric wire, and an apparatus for electropolishing a metal-covered electric wire.Electric resistance values of first and second materials are previously stored respectively so that a sectional area ratio of a metal-covered electric wire is calculated on the basis of the as-stored values and an actually measured electric resistance value of the metal-covered electric wire. Measurement and uniformalization of a sectional area ratio of a metal-covered electric wire and cleaning of an electric wire are carried out by dissolving surface layer parts of the electric wires by electropolishing.
    Type: Grant
    Filed: January 31, 1994
    Date of Patent: April 16, 1996
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Akira Mikumo, Kenichi Takahashi, Masanobu Koganeya
  • Patent number: 5476578
    Abstract: A continuous strip is electrolytically coated in an electrolytic coating bath using a thin flexible or resilient dielectric wiping blade to wipe bubbles of hydrogen from the surface, sever dendritic material, if such is present as the coating thickens, and to remove a surface layer of partially depleted electrolytic solution, replacing with fresh solution and to stabilize strip portions extending between support rolls. The resilient dielectric wiper blade is preferably used with perforated anodes which allow fresh electrolytic solution to flow into the space between the anodes and the strip surface after being expelled by passage of the strip past the wiping blade. The orifices in the anode may be differentially sized to eliminate cavitation behind the wiping blades. The wiping blades may be chevron shaped to increase the wiping effect and pumps may be used to increase the flow of electrolytic solution into and out of the space between the anodes and the strip.
    Type: Grant
    Filed: September 30, 1994
    Date of Patent: December 19, 1995
    Assignee: Electroplating Technologies, Ltd.
    Inventors: James L. Forand, Harold M. Keeney, Erik S. Van Anglen
  • Patent number: 5425862
    Abstract: Apparatus for the electroplating of thin plastic films (1), which are provided on one or both sides with a conductive coating and, if appropriate, may be provided with through-holes, comprises a conveying device (20 to 23) which moves the plastic film (1) horizontally in the region of the chamber (6) filled with electrolyte. The bonding devices (9 to 16), which bring the plastic film (1) to cathodic potential, are located outside the chamber (6) in the "dry". The conveying device includes at least one pair of squeezing rolls at both the inlet and the outlet of chamber (6), the circumferential speed of the pairs of squeezing rolls increasing in the direction of movement of the plastic film (1).
    Type: Grant
    Filed: March 3, 1994
    Date of Patent: June 20, 1995
    Assignee: Hans Hollmuller Maschinenbau GmbH & Co
    Inventors: Bernd Hartmann, Abraham Holtzmann, Rainer Haas, Werner Renz
  • Patent number: 5409594
    Abstract: An ultrasonic agitator (10) for generating turbulence in the vicinity of elongated metal workpieces (12) such as newly formed strands of wire. The system includes a bath (14) that is filled with a cleaning solution (16). The workpiece is introduced into the bath so as to move along a predetermined path of travel. One or more transducers (20, 24) are disposed in the bath to produce ultrasonic waves in the cleaning solution. The transducers are further configured and spaced so that the focal points of the vibrations substantially coincide with the path of travel with the workpiece. The transducers are driven by a signal generator (28) that causes the transducers to vibrate at a frequency between 0.5 and 3.0 MHz. The vibrations of the transducers produce ultrasonic waves that can be used to scrub off contaminants from the surface of the workpiece.
    Type: Grant
    Filed: November 23, 1993
    Date of Patent: April 25, 1995
    Assignee: Dynamotive Corporation
    Inventors: Muhammed M. Al-Jiboory, Richard R. Timewell
  • Patent number: 5236574
    Abstract: A continuous multi-layer plating line for steel sheet which includes a hot-galvanizing apparatus to form a galvanized coating and optionally to alloy the coating and an electroplating apparatus to form an electroplated coating on the galvanized coating. Between the hot-galvanizing apparatus and the electroplating apparatus, a post-galvanizing surface treatment apparatus effective for removing surface oxide contaminants and activating the surface of the galvanized coating is disposed and the galvanized steel sheet is treated thereby prior to electroplating. The post-galvanizing surface treatment may be carried out by applying an alkali solution or an acid which can dissolve aluminum oxide to the galvanized coating, by alkali electrolysis, by cathodic electrolysis, by cooling the galvanized steel sheet with an alkali solution, or by skin-pass rolling using an alkali solution or an acid which can dissolve aluminum oxide as a skin-pass roling liquid.
    Type: Grant
    Filed: May 7, 1990
    Date of Patent: August 17, 1993
    Assignee: Sumitomo Metal Industries, Ltd.
    Inventors: Kazuhide Oshima, Hisakazu Morino, Tomio Kondo, Yasuo Shimada, Tadashi Nonaka, Hiroshi Oishi, Yoshikazu Yamanaka, Yoshihiko Hoboh, Atsuhisa Yakawa
  • Patent number: 4895633
    Abstract: A method and apparatus for molten salt electroplating a steel member are disclosed, in which the surface of the steel member is activated by anodic treatment and the molten salt electroplating is performed on the activated surface of said steel member.
    Type: Grant
    Filed: June 3, 1988
    Date of Patent: January 23, 1990
    Assignees: Sumitomo Metal Industries, Ltd., Mitsubishi Jukogyo Kabushiki Kaisha
    Inventors: Hirohisa Seto, Atsuyoshi Shibuya, Junichi Uchida, Toshio Nakamori, Hirotaka Nakabayashi, Kenichi Yanagi, Yukio Kanda, Junkichi Yoneda, Katsufuma Hidaka, Yoshio Shimozato, Yuuji Furuzawa, Hajime Shimasaki, Toshio Taguchi
  • Patent number: 4865699
    Abstract: Anodizing current is prevented from being carried downstream by an aluminum web after anodizing in a continuous anodizing process. An anode is placed in a post-treatment cell containing an electrolyte which is electrically connected to a cathode in the anodizing cell via a source of DC current which is independent of the source of anodizing current. The web polarity is switched from positive to negative and a voltage greater than the exist voltage of the web is applied to prevent anodizing current from being carried downstream in the web after anodizing.
    Type: Grant
    Filed: June 24, 1988
    Date of Patent: September 12, 1989
    Inventors: Howard A. Fromson, Robert F. Gracia
  • Patent number: 4840716
    Abstract: The automatic plant for the continuous electroplating treatment of metal bars according to this invention comprises, in succession, an automatic introduction unit for bars to be treated, a degreasing and cleaning unit for the bars, an electrolytic treatment unit having one or more successive cells and associated devices for electrical contact with the bars in movement, a handling device for the bars, a final polishing or burnishing unit for the bars and an extraction and storage unit for the treated bars, wherein the automatic introduction unit for the bars possesses means for reciprocal electrical and mechanical connection in alignment of the bars successively introduced and the extraction unit possesses means for separating the successive bars and for storing them side by side, the handling device for the bars carrying out an axial movement of them simultaneously with rotation of the bars on themselves.
    Type: Grant
    Filed: June 22, 1988
    Date of Patent: June 20, 1989
    Inventor: Sergio Angelini
  • Patent number: 4820395
    Abstract: The cell for continuous electrolytic deposition treatment of bars or the like according to the invention comprises a closed vessel containing at least one tubular anode through which a bar for electrolytic processing can be conveyed in the axial direction, the bar being inserted into the vessel and leaving the vessel through respective inlet and outlet mouthpieces equipped with sealing means, means being present for supplying a flow of electrolytic bath to the anode or anodes and transferring the bath from the anode to the vessel, producing a flow of the bath inside the anode and parallel to the bar to be processed, dielectric spacing means also being present between the bar inlet mouthpiece and the end of the adjacent anode and adapted to define a zone of controlled chemical attack before electroplating begins.
    Type: Grant
    Filed: September 11, 1987
    Date of Patent: April 11, 1989
    Inventor: Sergio Angelini
  • Patent number: 4814054
    Abstract: Producing one-side zinc electroplated strip having enhanced phosphating characteristics. Prior to electroplating, the non-electroplated side of the steel strip is cathodically pickled. Cathodic pickling minimizes staining and etching to the non-electroplated strip surface by the zinc electrolyte during electroplating of the opposite strip surface.
    Type: Grant
    Filed: September 30, 1988
    Date of Patent: March 21, 1989
    Assignee: Armco Inc.
    Inventors: Timothy R. Roberts, David M. Smith, Alan F. Gibson, Douglas J. Robbins
  • Patent number: 4759837
    Abstract: The invention relates to a process and an apparatus for electrolytically depositing, in a moving mode, a continuous film of nickel on metal wire for electrical use. The process comprises using an activation bath and a nickel-plating bath in which the current density is reduced in the upstream portion of the nickel plating bath and/or the downstream portion of the activation bath and the acidity of the nickel-plating bath is so regulated as to develop the nickel in the form of strongly adhering globules of small diameter, which completely cover the wire. The reduction in the above mentioned current density and control in respect of the current density profile along the bath may be achieved by acting on the position of the electrodes in the bath and/or by interposing screens between the electrodes and the wire.
    Type: Grant
    Filed: July 14, 1987
    Date of Patent: July 26, 1988
    Assignee: Aluminium Pechiney
    Inventors: Jacques Lefebvre, Philippe Gimenez, Gabriel Colombier, Armand Golay, Jean S. Safrany
  • Patent number: 4552627
    Abstract: The present invention relates to a technique for improving the adhesive properties of a metal or metal alloy material by reducing the number of bare spots and unplated regions on each treated surface of the metal or metal alloy material. The technique comprises electrolytically forming a substantially uniform metal oxide layer on at least one surface of the material, chemically converting the oxide layer into a substantially uniform layer of fresh metal, and thereafter electrolytically forming a plurality of dendritic structures on the at least one surface. The technique of the present invention has particular utility in improving the adhesive properties of wrought copper and copper alloy foils. An apparatus for performing the technique is also described.
    Type: Grant
    Filed: November 13, 1984
    Date of Patent: November 12, 1985
    Assignee: Olin Corporation
    Inventor: Arvind Parthasarathi
  • Patent number: 4551210
    Abstract: The present invention relates to a treatment for improving the laminate adhesion of metal and metal alloy materials, particularly copper and copper alloy foils. The treatment comprises electrolytically forming a plurality of dendrites on a surface of the metal or metal alloy material and bonding the dendrites thereto. The dendrites are formed on and bonded to the metal or metal alloy material surface by one or more treatment anodes positioned at an angle to the material being treated and a single current source.
    Type: Grant
    Filed: November 13, 1984
    Date of Patent: November 5, 1985
    Assignee: Olin Corporation
    Inventor: Arvind Parthasarathi
  • Patent number: 4549941
    Abstract: The present invention relates to a treatment for improving the adhesive properties of metallic foils to be used in electrical and electronic applications. The treatment of the present invention comprises applying a light substantially uniform layer of metal to at least one surface of the metallic foil just prior to the formation of a plurality of dendritic structures on the surface. The metal layer renders the surface or surfaces to be treated more uniformly electrochemically active and consequently more receptive to the subsequent dendritic treatment. The treatment of the present invention has particular utility in improving the adhesive properties of wrought copper and copper alloy foils. An apparatus for performing the present treatment is also described.
    Type: Grant
    Filed: November 13, 1984
    Date of Patent: October 29, 1985
    Assignee: Olin Corporation
    Inventors: Arvind Parthasarathi, Ned W. Polan
  • Patent number: 4545885
    Abstract: A selective electroplating apparatus including a masking member and a back-up plate for supporting a metal strip of lead frame therebetween. Electrolyte or electroplating liquid is sprayed through an aperture of the masking member onto a selective portion of the strip. Electric voltage is applied between an anode and the cathodically charged lead frame strip to form an electroplated layer on the selective portion of the strip. The masking member and the back-up plate are brought toward each other to support and contact the strip therebetween and away from each other to define a clearance therebetween, in each cycle of the electroplating process. Cleaning liquid is sprayed into the clearance defined between the masking member and the back-up plate during or after they are brought away from each other.
    Type: Grant
    Filed: August 14, 1984
    Date of Patent: October 8, 1985
    Assignee: Shinko Electric Industries Co., Inc.
    Inventors: Kuniyuki Hori, Kiyoshi Kitazawa
  • Patent number: 4532014
    Abstract: The present invention relates to a system for aligning a plurality of rollers in a metal or metal alloy foil production line. The alignment system comprises a reference frame having a longitudinal dimension parallel to the direction of foil travel through the production line and an optical alignment system movably mounted to the frame. The optical alignment system comprises a laser beam generator, beam splitters and a mirror for generating an orthogonal reference frame for aligning each foil contacting roller in the production line.
    Type: Grant
    Filed: November 13, 1984
    Date of Patent: July 30, 1985
    Assignee: Olin Corporation
    Inventors: Ned W. Polan, Raymond J. Smialek, Arvind Parthasarathi, Peter E. Sevier
  • Patent number: 4518636
    Abstract: A method of selective plating a component, which method includes contacting upper and lower faces of the component with upper and lower masks, respectively, so that the lower mask exposes a part of the component to be plated, positioning the component over a plating tank and selective plating the component with a plating medium, the plating pressure and the hardness of the material of the upper mask being such that the upper mask is deformed during plating so as at least partially to mask the edge(s) of the exposed part.
    Type: Grant
    Filed: October 3, 1983
    Date of Patent: May 21, 1985
    Assignee: S. G. Owen Limited
    Inventor: Michael A. Richards
  • Patent number: 4492615
    Abstract: A process for the continuous, electrolytic plating of a long span of metal with a layer of metal, having a high line speed and low period of immersion in the electrolyte, and a device therefor. The span of metal is passed through a shaving drawplate, then through a metal plating solution to which an electric voltage is applied through a fluid electric connector comprising a solution of metal chloride, a fluoride and boric acid.The process is used to plate a metal with an adhesive metal layer, which provides both ductility to facilitate extrusion and low, non-evolving contact resistance.
    Type: Grant
    Filed: April 18, 1983
    Date of Patent: January 8, 1985
    Assignee: Aluminium Pechiney
    Inventor: Jacques LeFebvre