Abstract: A power supply system for a vertical continuous electroplating frame, comprising: a power supply rail arranged on the vertical continuous electroplating device; and an electrode case, arranged a case body on the top surface of the electroplating frame, inside the case body having an electrode plate corresponding to the power supply rail, at the bottom of the electrode plate having an elastic unit, the top surface of the case body having a positioning groove corresponding to the electrode plate, when the electrode plate is electrical contacted with the power supply rail, the electroplating current is provided to the object to be plated through the electroplating frame.

Abstract: Apparatus and methods for electroplating are described. Apparatus described herein include anode supports including positioning mechanisms that maintain a consistent distance between the surface of the wafer and the surface of a consumable anode during plating. Greater uniformity control is achieved.

Abstract: Provided are an elastic cushion member and an ion exchange membrane electrolyzer using the same, which elastic cushion member can be installed even in an ion exchange membrane electrolyzer having such a small gap between an electrode and an electrode current collecting plate that a conventional elastic cushion member cannot be arranged therein. An elastic cushion member (10) has a pair of corrosion-resistant metal thin plates (11) arranged at a distance in parallel fashion and a fixing member (12) which fixes the pair of corrosion-resistant metal thin plates (11) and comprises a metal elastic body (13) wound between the pair of corrosion-resistant metal thin plates (11). The fixing member (12) is attached to the pair of corrosion-resistant metal thin plates (11) in a manner that enables detachment of the fixing member therefrom. The metal elastic body (13) is preferred to be a metal coil body.

Abstract: One embodiment provides an electroplating apparatus, which includes a tank filled with an electrolyte solution, a number of anodes situated around edges of the tank, a cathode situated above the tank, and a plurality of wafer-holding jigs attached to the cathode. A respective wafer-holding jig includes a common connector electrically coupled to the cathode and a pair of wafer-mounting frames electrically coupled to the common connector. Each wafer-mounting frame includes a plurality of openings, and a respective opening provides a mounting space for a to-be-plated solar cell, thereby facilitating simultaneous plating of front and back surfaces of the plurality of the solar cells.

Abstract: The invention relates to a coating mask (1) for electrolytically coating the piston ring groove (39) of a piston (38), which is made of an elastically deformable material and has openings (3 to 10) that are arranged axially and are distributed in a uniform manner over the periphery, into which rods (11 to 18) of an expansion device (19) can be introduced, the rods being arranged in a displaceable manner such that the expansion device (19) can increase the radial diameter of the coating mask (1) and also the inner opening (2) so that the piston (38) can be introduced into the inner opening (2). The radial diameter of the coating mask (1) is selected in such a manner that after the reduction of radial diameter of the coating mask (1) and the inner opening, the elastically tensed coating mask (1) presses sealing lips (44, 45) of the coating groove (37) against the piston (38), on both sides of the piston ring groove (39).

Abstract: A device, apparatus, and method for abrasive electrochemical finishing of an arc flange leaf pack are presented. The device includes: a concave support block having holes to receive securing members; removable first and second end blocks configured to seat at opposite ends of the concave support block; removable first and second face plates attached to opposite sides of the concave support block via the securing members; and a region of space between the removable first and second face plates, the removable first and second end blocks, and the concave support block.

Abstract: There is provided a substrate holder which can absorb a change in the thickness between substrates and can hold a substrate while preventing deflection of the substrate and keeping the amount of compression of a substrate sealing member within a certain narrow range. The substrate holder includes a first holding member and a second holding member, both for detachably holding a substrate by holding a peripheral portion of the substrate therebetween; and a substrate sealing member, mounted to the second holding member, for sealing the peripheral portion of the substrate along a substrate sealing line. The first holding member has a thickness absorbing mechanism which biases the substrate toward the second holding member at positions along the substrate sealing line.

Abstract: An apparatus for supporting a semiconductor workpiece includes a heating system configured to cause thermally-induced motion of the semiconductor workpiece by heating a surface of the workpiece relative to a bulk of the workpiece. The thermally-induced motion includes vertical motion of an outer edge region of the workpiece and a center of the workpiece relative to each other. The apparatus further includes a support system configured to allow the thermally-induced motion including the vertical motion of the outer edge region of the workpiece and the center of the workpiece relative to each other while supporting the workpiece.

Abstract: The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.

Abstract: Embodiments of a closed-contact electroplating cup assembly that may be rapidly cleaned while an electroplating system is on-line are disclosed. One disclosed embodiment comprises a cup assembly and a cone assembly, wherein the cup assembly comprises a cup bottom comprising an opening, a seal surrounding the opening, an electrical contact structure comprising a plurality of electrical contacts disposed around the opening, and an interior cup side that is tapered inwardly in along an axial direction of the cup from a cup top toward the cup bottom.

Abstract: The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.

Abstract: An electrolytic ozone cell anode spring fastening board structure includes a solid polymer electrolyte membrane (1), an anode electrocatalyst layer (2), a diffusion layer (3), frame body and support parts (5). A diffusion layer counterpiece (4) has one side attached to the diffusion layer (3), the other side of the diffusion layer counterpiece (4) equipped with a centered elevated step, which contacts the center of the convex side of a spherical spring board (6). In addition, the solid polymer electrolyte membrane (1), frame body and support parts (5), diffusion layer (3), diffusion layer counterpiece (4) and spring board (6) are held together by mechanical fastening means. It prevents a decrease in ozone generation rate in electrolytic ozone cell that can occur from the metal board deformation and thinning of the anode electrocatalyst layer.

Abstract: A conductive contact ring for an electroplating or electrodeposition process on a cylindrical surface includes a frame defining an opening through which the object can be passed and an array of electrically conductive fibers spanning the opening. The frame is electrically conductive and is connected to a DC power source in the process. Two or more contact rings can be used in a process to provide consistent electrical contact with the surface sliding therethrough. A single contact ring can have first and second groups of filaments spaced from each other along the axial length of the surface.

Abstract: The torch with integrated electrolytic action for the surface treatment of metals, comprises a peak-paddle (2) connected with the unipolar electric current supply (7, 16) from an external apparatus, the other pole being connected with the metal surface being treated, and has the electrolytic solution used, for the specific treatment, arranged in a tank (6, 21) connected to said torch to supply said peak-paddle through channels inside said torch; the electrolytic solution being put under pressure in the delivery direction through a dosaging device of said solution controlled by the user. Different embodiments are described with manually actuated pumps and/or rigid or flexible tanks for spraying by the user. The tank (6, 21) is advantageously made removable, to allow the replacement of the electrolytic solution and to change the type of work to be carried out on the metallic surface in a quick and clean manner.

Abstract: A workpiece holder for fluid processing a workpiece including a transportable frame, a flexible member connected to the frame and defining at least one retaining feature, and a ring comprising at least one engagement feature engageable with the at least one retaining feature of the flexible member, wherein the flexible member is flexed to provide a force to the at least one engagement feature to cause the ring to form a barrier to fluid entry with the workpiece.

Abstract: A method for coating workpieces which consist of two different metallic materials includes providing the workpiece in a nickel strike electrolyte with a nickel layer as substrate before the application of a corrosion-resistant layer.

Abstract: One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The carrier includes a non-conductive carrier body on which the substrates are placed and conductive lines embedded within the carrier body. A plurality of conductive clip attachment parts are attached in a permanent manner to the conductive lines embedded within the carrier body. A plurality of contact clips are attached in a removable manner to the clip attachment parts. The contact clips hold the substrates in place and conductively connecting the substrates with the conductive lines. Other embodiments, aspects and features are also disclosed.

Abstract: Methods, apparatuses, and various apparatus components, such as base plates, lipseals, and contact ring assemblies are provided for reducing contamination of the contact area in the apparatuses. Contamination may happen during removal of semiconductor wafers from apparatuses after the electroplating process. In certain embodiments, a base plate with a hydrophobic coating, such as polyamide-imide (PAI) and sometimes polytetrafluoroethylene (PTFE), are used. Further, contact tips of the contact ring assembly may be positioned further away from the sealing lip of the lipseal. In certain embodiments, a portion of the contact ring assembly and/or the lipseal also include hydrophobic coatings.

Abstract: A method of fluid sealing a workpiece is provided. The method includes providing a force to cause a ring to form a barrier to fluid entry with the workpiece and preventing fluid from crossing the barrier to fluid entry by forming a pressure differential across the barrier.

Abstract: A plating apparatus allows a substrate holder to be serviced easily while ensuring easy access to the substrate holder and while a substrate is being processed in the plating apparatus. The plating apparatus includes a plating section for plating a substrate, a substrate holder for holding the substrate, a substrate holder transporter for holding and transporting the substrate holder, a stocker for storing the substrate holder, and a stocker setting section for storing the stocker therein. The stocker includes a moving mechanism for moving the stocker into and out of the stocker setting section.

Abstract: Apparatus and methods for electroplating are described. Apparatus described herein include anode supports including positioning mechanisms that maintain a consistent distance between the surface of the wafer and the surface of a consumable anode during plating. Greater uniformity control is achieved.

Abstract: A tending module for a series of electrolysis cells designed for the manufacture of aluminum by igneous electrolysis, each cell including a series of anodes provided with a metal rod designed to fix and electrically connect the anodes to a metal anode frame. The tending module includes a frame to be fixed to a mobile component, and at least one anode handling unit connected to the frame. The module also includes, integral with the anode handling unit, an activator that can exert at least one force or impulse on the anode rod, with a force such that, although the stem is firmly maintained in contact against the anode frame, the contact surfaces are moved in relation to each other by an amount sufficient for electrical contact to be improved. Advantageously, the activator is a jack or an impulse generator integral with the anode clamp.

Abstract: A system for plating a conductive substrate is provided. The system comprises a conductive substrate, comprising a first and a second conductive side, wherein said first side of the conductive substrate is to be plated. Furthermore, the system comprises a substrate holder with an attachment means, for attaching the conductive substrate to the substrate holder, such that a first surface of the substrate holder faces the second side of the conductive substrate. The substrate holder also comprises a resilient contact means, attached to the first surface of the substrate holder, said resilient contact means being connectable to a first external potential. The second side of the conductive substrate is provided with an insulating material exposing the second side of the conductive substrate, such that at least one contact area is provided, wherein the resilient contact means is in contact with the exposed second side in said at least one contact area. A substrate holder therefore is also provided.

Abstract: An electrode mounting structure of a surface treatment apparatus in which a metal electrode is disposed so as to oppose to an inner-peripheral surface of a cylinder, the electrode and the cylinder are energized in a state where treatment liquid is interposed between the electrode and the cylinder inner-peripheral surface so as to perform pre-plating or plating to the cylinder inner-peripheral surface, and the metal electrode is detachably attached to a metal electrode holder member. The structure includes a resin coupler having a threaded portion engaged with a threaded portion formed on the electrode holder member.

Abstract: A method of fluid sealing a workpiece is provided. The method includes placing a workpiece on a ring, engaging at least one engagement feature of the ring with at least one retaining feature defined by the member and flexing the member to provide a force to the at least one engagement feature to cause the ring to form a barrier to fluid entry with the workpiece.

Abstract: A contacting device for a galvanization apparatus comprises contacting rollers with a continuous rigid external face, which is joined to a jacket section. The jacket section is provided with an inner opening that is wider than a rotating shaft on which the contacting roller sits. This allows the contacting roller to be moved in a radial direction, wherein electric contacting and securing of a basic position is obtained via springs in every one of the radially moved positions. The moveability of the contacting roller ensures good contact as the contacting roller rests against substrates also when the substrates are uneven. The contact pressure can be relatively small.

Abstract: Embodiments of a closed-contact electroplating cup are disclosed. One embodiment comprises a cup bottom comprising an opening, and a seal disposed on the cup bottom around the opening. The seal comprises a wafer-contacting peak located substantially at an inner edge of the seal. The embodiment also comprises an electrical contact structure disposed over a portion of the seal, wherein the electrical contact structure comprises an outer ring and a plurality of contacts extending inwardly from the outer ring, and wherein each contact has a generally flat wafer-contacting surface. The embodiment further comprises a wafer-centering mechanism configured to center a wafer in the cup.

Abstract: Embodiments of a closed-contact electroplating cup assembly that may be rapidly cleaned while an electroplating system is on-line are disclosed. One disclosed embodiment comprises a cup assembly and a cone assembly, wherein the cup assembly comprises a cup bottom comprising an opening, a seal surrounding the opening, an electrical contact structure comprising a plurality of electrical contacts disposed around the opening, and an interior cup side that is tapered inwardly in along an axial direction of the cup from a cup top toward the cup bottom.

Abstract: In one embodiment, a substrate holder comprises a base supporting a substrate that includes a surface having a peripheral region. A cover may be assembled with the base and includes at least one opening exposing only a portion of the surface therethrough. A seal assembly substantially seals a region between the cover and base and further adjacent to the peripheral region of the substrate. An electrode includes at least one contact portion positioned within the region and extending over at least a portion of the peripheral region of the substrate. A compliant member comprises a polymeric material and may be positioned within the region between the at least one contact portion and either the peripheral region of the substrate or the cover. In other embodiments, an electroplating system is disclosed that may employ such a substrate holder.

Abstract: A plating apparatus can form a plated film having a uniform thickness over the entire surface of a substrate without a change of members. The plating apparatus includes a substrate holder, a cathode contact for contacting a conductive film formed on the substrate so that the conductive film serves as a cathode, a ring-shaped seal member for covering the cathode contact and bringing its inner circumferential portion into contact with the peripheral portion of the substrate to seal the peripheral portion of the substrate, an anode disposed so as to face the conductive film formed on the substrate, and an auxiliary cathode disposed with respect to the seal member such that at least part of the auxiliary cathode is exposed on a surface of the seal member. Plating is carried out by bringing the conductive film, the anode and the auxiliary cathode into contact with a plating solution.

Abstract: In order for electrical feeds (2, 3) of an electrical supply unit for material (1) to be treated, in a device for the electrochemical treatment thereof, to be protected against metal deposition, it is proposed that at least one electrically insulating shell (7, 8) should be provided, which encloses the at least one electrical feed (2, 3), over a particular length starting from contact means (12) for making contact with the material to be treated, so that no metal deposit of more than 0.04 mm is formed on the blank parts of the electrical feed when the electrical feed (2, 3) is immersed up to this particular length in a liquid during the electrochemical treatment of the material (1) to be treated.

Abstract: A substrate holding and transporting assembly is disclosed. The substrate holding and transporting assembly includes a base plate and a pair of clamps connected to the base plate in a spaced apart orientation, the spaced apart orientation of the pair of clamps enable support of a substrate with at least two independent points. The substrate holding and transporting assembly also includes an electrode assembly connected to the base plate at a location that is substantially between the pair of clamps. The electrode assembly defined to impart an electrical contact to the substrate when present and held by the pair of clamps.

Abstract: A suction pad used for use in a substrate treatment apparatus which treats a substrate by immersing the substrate in a solution while the pad attaches to the substrate, including: a main face for attaching to the substrate; an outer face disposed along the outer periphery of the substrate; and a suction opening formed in the main face. In a cross-sectional shape including the main face and the outer face, the angle formed between a line corresponding to the main face and a line corresponding to the outer face is an acute angle.

Abstract: A method and apparatus for retaining a workpiece against a workpiece holder are described. A flexible member can be used to provide a substantially uniform force to securely retain the workpiece, which can allow the workpiece to be consistently positioned in a process module. In one detailed embodiment, a barrier to fluid entry is formed between the workpiece and a ring for retaining the workpiece against a workpiece holder. This provides a reliable seal during fluid processing to prevent fluid from reaching the underside of a workpiece. In various embodiments, the workpiece holder can be used to align a workpiece in a process module or to hold one or more workpieces in a configuration that allows for higher throughput.

Abstract: Embodiments of the invention generally provide a method and apparatus for processing a substrate in an electrochemical mechanical planarizing system. In one embodiment, a contact assembly for electrochemically processing a substrate includes a housing having a ball disposed in a passage formed through the housing. The ball is adapted to extend partially from the housing to contact the substrate during processing. The housing includes a fluid inlet that is positioned to cause fluid, entering the housing through the inlet, to sweep the entire passage. In another embodiment, a method for electrochemically processing includes flowing a processing fluid through a passage retaining a conductive element. The flow sweeps the entire passage of the housing. A first electrical bias is applied to the conductive element in contact with the substrate relative an electrode electrically coupled to the substrate by the processing fluid.

Abstract: A multi-layered wafer support apparatus is provided for performing an electroplating process on a semiconductor wafer (“wafer”). The multi-layered wafer support apparatus includes a bottom film layer and a top film layer. The bottom film layer includes a wafer placement area and a sacrificial anode surrounding the wafer placement area. The top film layer is defined to be placed over the bottom film layer. The top film layer includes an open region to be positioned over a surface of the wafer to be processed, i.e., electroplated. The top film layer provides a liquid seal between the top film layer and the wafer, about a periphery of the open region. The top film layer further includes first and second electrical circuits that are each defined to electrically contact a peripheral top surface of the wafer at diametrically opposed locations about the wafer.

Abstract: A frame for holding sheet material taut comprises a support as well as two legs which extend essentially parallel to one another transversely from the support, on which legs fixing elements are provided for fixing, in each case, one of the opposing edges of a piece of sheet material thereto. At least one of the legs can be moved along the support towards and away from the other leg. Furthermore compensation elements are provided for compensating for stretch and/or shrinkage of the piece of sheet material fixed between the legs.

Abstract: An anode holder is used to hold an anode in a plating tank. The anode holder includes a bar having a conductive portion connected to a power source, a conductive anode shaft attached to the bar, and an anode connected to the conductive anode shaft. The conductive anode shaft includes an external thread portion provided at an end of the conductive anode shaft, an O-ring, and a step portion provided between the O-ring and the external thread portion. The step portion has a diameter larger than a diameter of the external thread portion but smaller than a diameter of the O-ring. The anode includes an internal thread hole to which the external thread portion of the conductive anode shaft is screwed. The anode also includes a receiving portion for receiving the step portion of the conductive anode shaft in a state such that the O-ring of the conductive anode shaft is brought into contact with an inner surface of the receiving portion.

Abstract: Clip devices contemplated herein comprise a metal-containing base, wherein the base comprises a lower clip body and an upper clip body, and wherein the lower clip body further comprises at least two sets of electrically conducting wire springs. Contemplated electrically conducting wire springs comprise at least one non-contact body section and a plurality of contact points.

Abstract: An ion exchange membrane electrolyzer comprises electrodes at least either of which is held in contact with leaf springs formed integrally with a leaf spring holding member arranged in an electrode chamber so as to extend toward the electrode and remain electrically energized at the respective electrode touching sections thereof, each of the leaf springs having a crooked section arranged at a position separated from its connecting section connecting itself to the leaf spring holding member and adapted to be bent toward the leaf spring holding member when the electrode touching section is pressed toward the leaf spring holding member side.

Abstract: Contact assemblies for electrochemical processing of microelectronic workpieces. The contact assembly (400) can comprise a support member (410) that includes an inner wall (412) which defines an opening (414) configured to receive the workpiece and a plurality of contacts (420). The individual contacts (420) include a conductor (440) and a cover (430). The conductor (440) can comprise a proximal section (435) projecting inwardly into the opening (414) relative to the support member (410), a distal section (436) extending from the proximal section (435), and an inert exterior (444) at least at the distal section (436). The cover (430) comprises a dielectric element that covers at least the proximal section of the conductor, but does not cover at least a portion of the distal section of the core. The exposed portion of the distal section of the core, accordingly, defines a conductive contact site for contacting a conductive layer (e.g., a seed layer) on the workpiece.

Abstract: An apparatus and method for supporting a substrate is provided. In one embodiment, an apparatus for supporting a substrate includes a body having a band extending therefrom. The band is adapted to retain a fluid on the body thereby forming a shallow processing bath for processing the substrate. The band is adapted to deflect under centrifugal force to release the fluid from the substrate as the body is rotated above a predetermined rate.

Abstract: A plating apparatus (10) provided with: a plating vessel (61a to 61d) having a cylindrical side wall (361) for containing a plating liquid; a substrate holding mechanism (74a to 74d) for generally horizontally holding a generally round substrate (W) to be treated; a cathode ring (80) provided in the substrate holding mechanism and having substantially the same inner diameter as the plating vessel for sealing a peripheral edge portion of a lower surface of the substrate, the cathode ring having a cathode (83) to be brought into contact with the substrate held by the substrate holding mechanism; and a rotative driving mechanism (45) for rotating the substrate held by the substrate holding mechanism together with the cathode ring; wherein the plating vessel has an upper edge portion complementary in configuration to a portion of the cathode ring opposed to the plating vessel so that the lower surface of the substrate held by the substrate holding mechanism can approach the plating vessel so as to be substantiall

Abstract: The invention relates to an electrolytic cell, and a method for manufacturing such cell. The cell comprises an anode and a cathode compartment, a separator partitioning the compartments, gas diffusion electrode members arranged to the separator with a space between adjacent electrode members in the vertical direction, and current collector members electrically connected to the electrode members. The current collector members comprise resilient means arranged to homogenise the contact between the electrode members, the current collector and the separator. The invention also relates to the use of the electrolytic cell for production of e.g. alkali metal hydroxide.

Abstract: Embodiments of the invention may further provide a contact ring for an electrochemical plating system. The contact generally includes a substrate receiving member having a substrate support surface formed thereon, a plurality of electrical contact pins extending from the substrate support surface, a first seal positioned on the substrate support surface radially inward of the plurality of electrical contacts, and a second seal positioned radially outward of the plurality of electrical contacts. Additionally, the contact ring generally includes a fluid inlet configured to supply a fluid to a volume between the first seal and the second seal.

Abstract: A plating device and a plating method are provided that are capable of enhancing uniformity in plating on a treatment surface of an object to be treated.

Abstract: A contact assembly for supporting a substrate in an electrochemical plating system, wherein that contact assembly includes a contact ring and a thrust plate assembly. The contact ring includes an annular ring member having an upper surface and a lower surface, an annular bump member positioned on the upper surface, and a plurality of flexible and conductive substrate contact fingers extending radially inward from the lower surface. The thrust plate includes an annular plate member sized to be received within the annular ring member, and a seal member extending radially outward from the plate member, the seal member being configured to engage the annular bump member for form a fluid seal therewith.

Abstract: A jig (10) is provided for holding an elongate member (56) to be surface treated. The jig (10) comprises a beam (12) and a plurality of hangers 14 spaced apart along the beam (12). The hangers (14) have supports (90) with retaining springs (96) thereon which are arranged to support and grip the elongate member (56). The beam (12) has hook-like members (18) for engagement with a lifting bar (30) of a crane (28). The crane (28) is used to transport the jig (10) to an anodising station (60) and subsequently to transport the jig (10) still with the anodised elongate member (56) thereon to a painting station. In that way, an elongate member to be surface treated can be manually placed on the respective supports (90) and held in place by the retaining springs (96) without having to use other forms of clamps.

Abstract: Contact assemblies for electrochemical processing of microelectronic workpieces. The contact assemblies can comprise a support member that includes an inner wall which defines an opening configured to receive the workpiece and a plurality of contacts. The individual contacts include a conductor and a cover. The conductor can comprise a proximal section projecting inwardly into the opening relative to the support member, a distal section extending from the proximal section, and an inert exterior at least at the distal section. The cover comprises a dielectric element that covers at least the proximal section of the conductor, but does not cover at least a portion of the distal section of the core. The exposed portion of the distal section of the core, accordingly, defines a conductive contact site for contacting a conductive layer (e.g., a seed layer) on the workpiece.

Abstract: Contact assemblies, electroplating machines with contact assemblies, and methods for making contact assemblies that are used in the fabrication of microelectronic workpieces. The contact assemblies can be wet-contact assemblies or dry-contact assemblies. A contact assembly for use in an electroplating system can comprise a support member and a contact system coupled to the support member. The support member, for example, can be a ring or another structure that has an inner wall defining an opening configured to allow the workpiece to move through the support member along an access path. In one embodiment, the support member is a conductive ring having a plurality of posts depending from the ring that are spaced apart from one another by gaps. The contact system can be coupled to the posts of the support member. The contact system can have a plurality of contact members projecting inwardly into the opening relative to the support member and transversely with respect to the access path.