Abstract: Electroplating methods and systems are described that include adding a metal-ion-containing starting solution to a catholyte to increase a metal ion concentration in the catholyte to a first metal ion concentration. The methods and systems further include measuring the metal ion concentration in the catholyte while the metal ions electroplate onto a substrate and the catholyte reaches a second metal ion concentration that is less than the first metal ion concentration. The methods and systems additionally include adding a portion of an anolyte directly to the catholyte when the catholyte reaches the second metal ion concentration. The addition of the portion of the anolyte increases the metal ion concentration in the catholyte to a third metal ion concentration that is greater than or about the first metal ion concentration.

Abstract: A method for plating a work piece. An electroless layer of material is applied to the work piece using an electroless plating process. The method includes creating a barrier in electrical conductivity in the work piece to divide the work piece into a first segment and a second segment which are substantially electrically insulated from one another, prior to electroplating the work piece. A plurality of methods are disclosed for dividing the work piece into the first and second segments.

Abstract: Systems and methods for electroplating are described. The electroplating system may include a vessel configured to hold a first portion of a liquid electrolyte. The system may also include a substrate holder configured for holding a substrate in the vessel. The system may further include a first reservoir in fluid communication with the vessel. In addition, the system may include a second reservoir in fluid communication with the vessel. Furthermore, the system may include a first mechanism configured to expel a second portion of the liquid electrolyte from the first reservoir into the vessel. The system may also include a second mechanism configured to take in a third potion of the liquid electrolyte from the vessel into the second reservoir when the second portion of the liquid electrolyte is expelled from the first reservoir. Methods may include oscillating flow of the electrolyte within the vessel.

Abstract: Exemplary methods of electroplating may include delivering a current from a power supply through a plating bath of an electroplating chamber for a first period of time. The current delivered may be or include a pulsed current at a duty cycle of less than or about 50%. The methods may include plating a first amount of metal on a substrate within the plating bath. The substrate may define a via within the substrate. The methods may include, subsequent the first period of time, transitioning the power supply to a continuous DC current delivery for a second period of time. The methods may include plating a second amount of metal on the substrate.

Abstract: The invention is a redox flow battery (1000) comprising n electrochemical cells 300 that are electrically connected in series (300) with each cell including a cathode (310) and an anode (320) that are separated by a membrane (330) and that are respectively passed through by a catholyte and an anolyte originating from a catholyte tank (110) and an anolyte tank (120). The cells are fluidically connected in parallel. The invention is also a system for decreasing bi-pass currents including means (700) for injecting a gas into the inlet ducts (401) and outlet ducts (501) of the cathode and anode of (n?1) cells to form gas bubbles; and a device (800) for removing the gas bubbles, placed, on the inlet ducts of the cathode and anode of the (n?1) cells, downstream of the means for injecting the gas and upstream of the cathode and anode of the cells.

Abstract: Methods and electroplating systems for controlling plating electrolyte concentration on an electrochemical plating apparatus for substrates are disclosed. A method involves: (a) providing an electroplating solution to an electroplating system; (b) electroplating the metal onto the substrate while the substrate is held in a cathode chamber of an electroplating cell of electroplating system; (c) supplying the make-up solution to the electroplating system via a make-up solution inlet; and (d) supplying the secondary electroplating solution to the electroplating system via a secondary electroplating solution inlet. The secondary electroplating solution includes some or all components of the electroplating solution. At least one component of the secondary electroplating solution has a concentration that significantly deviates from its target concentration.

Abstract: In one implementation a wafer processing method includes filling a plurality of through-resist recessed features with a metal, such that a ratio of fill rate of a first feature to a fill rate of a second feature is R1; followed by electrochemically removing metal such that a ratio of metal removal rate from the first feature to the metal removal rate from the second feature is greater than R1, improving the uniformity of the fill. In some embodiments the method includes contacting an anodically biased substrate with an electrolyte such that the electrolyte has a transverse flow component in a direction that is substantially parallel to the working surface of the substrate. The method can be implemented in an apparatus that is configured for generating the transverse flow at the surface of the substrate. In some implementations the method makes use of distinct electrochemical regimes to achieve improvement in uniformity.

Abstract: An electrolytic copper foil capable of improving a capacity retention rate of a secondary battery, an electrode including the same, a secondary battery including the same, and a method of manufacturing the same. The electrolytic copper foil, which includes a first surface and a second surface opposite the first surface, includes a copper layer including a matte surface facing the first surface and a shiny surface facing the second surface, and a first protective layer on the matte surface of the copper layer, wherein the first surface has a peak density (PD) of 3 to 110, a texture coefficient [TC(220)] of a (220) plane of 1.32 or less, and a surface roughness (Rz) of 0.5 to 2.7 ?m.

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a chip structure. The semiconductor package structure includes a first conductive structure over the chip structure. The first conductive structure is electrically connected to the chip structure. The first conductive structure includes a first transition layer over the chip structure, and a first conductive layer on the first transition layer. The first conductive layer is substantially made of twinned copper.

Abstract: A carrier-attached copper foil having good circuit formability is provided. The carrier-attached copper foil has a carrier, an intermediate layer and an ultra-thin copper layer in this order, the average grain size of crystal grains that form the ultra-thin copper layer is 1.05 to 6.5 ?m, and a ten point average roughness Rz of a surface on a side of the ultra-thin copper layer is 0.1 to 2.0 ?m.

Abstract: The present invention provides a copper-nickel alloy electroplating bath which contains (a) a copper salt and a nickel salt, (b) a metal complexing agent, (c) a conductivity imparting agent, (d) a sulfur-containing organic compound and (e) a redox potential regulator.

Abstract: Electroless plating is accomplished by forming a metal salt and a polymer solution as a binder into a solid electrolyte block and depositing metal on the surface by rubbing or brushing the solid electrolyte block onto a surface with minimal or no water and without an electric potential/power source. The solid electrolyte block is also conformable/moldable and can be used to deposit metal on to both conductive and nonconductive surface through electroless deposition process.

Abstract: Pulse plating methods which include a forward pulse but no reverse pulse inhibit or reduce dimpling and voids during copper electroplating of through-holes in substrates such as printed circuit boards. The pulse plating methods may be used to fill through-holes with copper where the through-holes are coated with electroless copper or flash copper.

Abstract: A plating method can improve uniformity in a thickness of a plating layer formed on an inner surface of a recess. The plating method includes a loading process of loading the substrate in which the recess is formed into a casing; and a plating process of supplying a plating liquid to the substrate and forming a plating layer having a specific function on an inner surface of the recess. The plating process includes a first plating process of supplying a first plating liquid to the substrate and forming a first plating layer; and a second plating process of supplying a second plating liquid to the substrate and forming a second plating layer on the first plating layer after the first plating process. Further, a concentration of an additive contained in the first plating liquid is different from a concentration of an additive contained in the second plating liquid.

Abstract: An apparatus for continuous simultaneous electroplating of two metals having substantially different standard electrodeposition potentials (e.g., for deposition of Sn—Ag alloys) comprises an anode chamber for containing an anolyte comprising ions of a first, less noble metal, (e.g., tin), but not of a second, more noble, metal (e.g., silver) and an active anode; a cathode chamber for containing catholyte including ions of a first metal (e.g., tin), ions of a second, more noble, metal (e.g., silver), and the substrate; a separation structure positioned between the anode chamber and the cathode chamber, where the separation structure substantially prevents transfer of more noble metal from catholyte to the anolyte; and fluidic features and an associated controller coupled to the apparatus and configured to perform continuous electroplating, while maintaining substantially constant concentrations of plating bath components for extended periods of use.

Abstract: Methods, systems, and apparatus for plating a metal onto a work piece with a plating solution having a low oxygen concentration are described. In one aspect, a method includes reducing an oxygen concentration of a plating solution. The plating solution includes about 100 parts per million or less of an accelerator. After reducing the oxygen concentration of the plating solution, a wafer substrate is contacted with the plating solution in a plating cell. The oxygen concentration of the plating solution in the plating cell is about 1 part per million or less. A metal is electroplated with the plating solution onto the wafer substrate in the plating cell. After electroplating the metal onto the wafer substrate, an oxidizing strength of the plating solution is increased.

Abstract: Amino sulfonic acid based polymers are reaction products of amino sulfonic acids, an amine, polyepoxide compounds and epihalohydrin. The polymers may be used as levelers in copper electroplating baths, to provide good throwing power. Such reaction products may plate copper or copper alloys with good surface properties and good physical reliability.

Abstract: The present invention relates to aqueous acidic plating baths for copper and copper alloy deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises copper ions, at least one acid and an ureylene polymer comprising amino residues on both termini and which is free of organically bound halogen. The plating bath is particularly useful for filling recessed structures with copper and build-up of pillar bump structures.

Abstract: An apparatus for continuous simultaneous electroplating of two metals having substantially different standard electrodeposition potentials (e.g., for deposition of Sn—Ag alloys) comprises an anode chamber for containing an anolyte comprising ions of a first, less noble metal, (e.g., tin), but not of a second, more noble, metal (e.g., silver) and an active anode; a cathode chamber for containing catholyte including ions of a first metal (e.g., tin), ions of a second, more noble, metal (e.g., silver), and the substrate; a separation structure positioned between the anode chamber and the cathode chamber, where the separation structure substantially prevents transfer of more noble metal from catholyte to the anolyte; and fluidic features and an associated controller coupled to the apparatus and configured to perform continuous electroplating, while maintaining substantially constant concentrations of plating bath components for extended periods of use.

Abstract: The invention relates to a device for centrifuging at least one food product having at least one conveyance means (7, 7a, 7b) and at least one centrifuge element (9a, 9b) having an interior space (15a, 15b) to receive the food product and being adapted to be spun around a first rotational axis, wherein the food product is conveyable into the internal space via the conveyance means, wherein the conveyance means is at least partly insertable into and extricable out of the interior space, as well as a method for centrifuging at least one food product using said device.

Abstract: A method of processing an article having a substrate and a cobalt-phosphorous coating disposed on the substrate includes heat treating the article. At least one physical characteristic of the cobalt-phosphorous coating is altered using the heat treating to thereby change a performance characteristic of the article. For example, the article may be an actuator component having a bore or a shaft that is movably disposed at least partially within the bore.

Abstract: Anodized electroplated aluminum structures and methods for making the same are disclosed. Cosmetic structures according to embodiments of the invention are provided by electroplating a non-cosmetic structure with aluminum and then anodizing the electroplated aluminum. This produces cosmetic structures that may possess desired structural and cosmetic properties and that may be suitable for use as housing or support members of electronic devices.

Abstract: A process electrolyte replenishment module adapted to replenish ions in a process electrolyte in a substrate electrochemical deposition apparatus having a first anode and a first cathode, the replenishment module having a second anode. A process electrolyte recirculation compartment is disposed in the frame configured so that the process electrolyte is recirculating between the replenishment module and the deposition apparatus. An anode compartment is coupled to the process electrolyte recirculation compartment having the second anode, that is a soluble anode, for immersion in a secondary anolyte, and having a first ion exchange membrane being a cationic member separating the secondary anolyte from the process electrolyte.

Abstract: An electrolytic cell for adjusting pH and replenishing nickel in a nickel plating solution of a nickel plating bath and a method of using the same is disclosed. The electrolytic cell comprises an inlet for receiving nickel plating solution from the nickel plating bath; a cooled cathode connected to a first bus bar connected to a negative terminal of a power supply; a plurality of nickel anodes capable of creating hydrogen gas on the cooled cathode when current is applied, connected to at least a second bus bar, the at least the second bus bar connected to a positive terminal of the power supply; and an outlet for returning nickel plating solution in the electrolytic cell to the nickel plating bath.

Abstract: To provide a method of electroplating with Sn-alloy in which a problem of deposition of metals on an anode when electroplating with Sn-alloy such as Sn—Ag based-alloy or the like is performed is solved and a soluble anode is enabled to be used. Dividing an inside of a plating tank into a cathode cell and an anode cell by an anion-exchange membrane; supplying plating solution including Sn ions to the cathode cell; supplying acid solution to the anode cell; electroplating by energizing an object to be plated in the cathode cell and an anode made of Sn in the anode cell; and using the acid solution including Sn ions liquated out form the anode made of Sn along with progress of plating as replenishing solution of Sn ions for plating solution in the cathode cell.

Abstract: An electrochemical deposition system is described. The electrochemical deposition system includes one or more electrochemical deposition modules arranged on a common platform for depositing one or more metals on a substrate, and a chemical management system coupled to the one or more electrochemical deposition modules. The chemical management system is configured to supply at least one of the one or more electrochemical deposition modules with one or more metal constituents for depositing the one or more metals. The chemical management system can include at least one metal enrichment cell and at least one metal-concentrate generator cell.

Abstract: Methods are disclosed for replenishing tin and its alloying metals in an aqueous electrolytic plating bath using an acidic solution containing stannous oxide. During electroplating of tin or tin alloys the stannous ions and alloying metal ions are depleted. To maintain continuous and efficient electroplating processes predetermined amounts of the plating bath containing tin and its alloying metals are bailed out. The bail out is then mixed with a predetermined amount of acidic solution containing stannous oxide and any alloying metals. The mixture is then retuned to the plating bath to return the stannous ions and alloying metal ions to their steady state concentrations.

Abstract: An Sn alloy plating apparatus is disclosed. The apparatus includes a plating bath configured to store an Sn alloy plating solution therein with an insoluble anode and a substrate immersed in the Sn alloy plating solution, an Sn dissolving having an anion exchange membrane therein which isolates an anode chamber, in which an Sn anode is disposed, and a cathode chamber, in which a cathode is disposed, from each other, a pure water supply structure configured to supply pure water to the anode chamber and the cathode chamber, a methanesulfonic acid solution supply structure configured to supply a methanesulfonic acid solution, containing a methanesulfonic acid, to the anode chamber and the cathode chamber, and an Sn replenisher supply structure configured to supply an Sn replenisher, produced in the anode chamber and containing Sn ions and a methanesulfonic acid, to the plating bath.

Abstract: A method and system are disclosed for controlling plating bath compositions. Speciation analyzers including HPLC and mass spectrometry are employed to separate, detect, identify, and quantify additives and degradation products. A control unit is linked to a plating bath interface, analyzer interface, and valves to control the flow of plating bath to an analyzer sampler and back to plating bath. For each degradation product, a response output is determined for at least one performance factor in terms of an additive equivalent amount that produces the same effect. A data processing unit receives concentration data for additives and degradation products from speciation analyzers and calculates an amount of each additive needed to replenish a used bath. As a result, the bleed-and-feed ratio for maintaining plating baths can be substantially reduced with significant productivity improvement and cost savings in terms of chemicals, chemical disposal, less down time and improved product quality.

Abstract: Disclosed is a method for a repeated electroplating of a workpiece to be plated as a cathode by using an insoluble anode in a plating vessel accommodating a copper sulfate plating bath, wherein a copper dissolution vessel different from the plating vessel is provided, the plating bath is transferred to the copper dissolution vessel and is returned from the copper dissolution vessel to the plating vessel for circulating the plating bath between the plating vessel and the copper dissolution vessel, copper ion supplying salt is charged into the copper dissolution vessel and dissolved in the plating bath so that copper ions consumed by the plating can be replenished, and the workpiece to be plated is continuously electroplated, characterized in that the plating bath is permitted to transfer between the anode side and the cathode side, and the plating bath is returned to vicinity of the anode in the return of the plating bath from the copper dissolution vessel to the plating vessel.

Abstract: Disclosed is an electroplating method for filling cavities, through holes, blind holes, or micro blind holes of a work piece with metals. According to said method, the work piece containing cavities, through holes, blind holes, or micro blind holes is brought in contact with a metal deposition electrolyte, and a voltage is applied between the work piece and at least one anode such that a current flow is fed to the work piece. The invention method is characterized in that the electrolyte encompasses a redox system.

Abstract: The invention as described in the following relates to an apparatus for the electrochemical deposition of a metal on a substrate, which apparatus is capable of refreshing an electrolyte used for the deposition in a continuous way. Furthermore, the invention as described relates to a method of refreshing an electrolyte for the electrochemical deposition of a metal on a substrate.

Abstract: A plating apparatus for plating a surface of a substrate includes a plurality of plating tanks for holding a plating solution therein, a plurality of pumps combined respectively with the plating tanks, for circulating the plating solution through the plating tanks, a plurality of suction pipes connecting respective suction ports of the pumps to the plating tanks, respectively, and a plurality of discharge pipes connecting respective discharge ports of the pumps to respective different ones of the plating tanks from the plating tanks which are connected to the suction ports of the pumps. The plating tanks and the pumps are connected in series with each other.

Abstract: The invention relates to a system and a method of plating metal alloys, as well as to the structures thus obtained. The system for plating metal alloys comprises an electrolytic cell containing an electrolytic solution (3) in which an anode (4,4a,4b), a cathode (5), and a plurality of metal components to be plated onto the cathode are immersed, the anode (4,4a,4b) and the cathode (5) being electrically connected to means (6) adapted to apply a potential difference between said anode (4,4a,4b) and said cathode (5). The invention is characterized in that the means (6) adapted to apply a potential difference between said cathode (5) and said anode (4,4a,4b) impose a potential difference value that changes over time according to a predefined law.

Abstract: An electrolytic cell for replenishing chromium content of a trivalent chromium electrolyte and a method of replenishing trivalent chromium content using the electrolytic cell is provided. The method comprising the steps of immersing a chromium electrode and a second electrode in a trivalent chromium electrolyte and applying an alternating pulse current across the chromium electrode and the second electrode. In this manner, trivalent chromium is electrolytically dissolved from the chromium electrode and the trivalent chromium content of the electrolyte in which the chromium electrode is immersed is enriched.

Abstract: Methods of replenishing indium ions in indium electroplating compositions are disclosed. Indium ions are replenished during electroplating using indium salts of certain weak acids. The method may be used with soluble and insoluble anodes.

Abstract: To provide an anodic oxidation method, a titanium oxide film manufacturing method and a catalyst carrying method which is suitable, for example, for anodic oxidation of aluminum, titanium and catalyst carrying on the surface of alumite (registered trademark), capable of generating an oxide film at a low cost and rapidly by eliminating the use of a strongly acid or strongly basic electrolytic solution and using a carbonated water as an electrolytic solution, capable of controlling the sealing treatment of oxide film through a simple method, capable of effecting the oxide film dyeing and catalyst carrying rationally and easily, and capable of effecting the catalyst carrying safely and surely without eroding a base material. An object (3) to be treated is electrolyzed in an electrolytic solution received in a treatment vessel (1) serving the object (3) as an anodic electrode. It is an anodic oxidation method in which an oxide film is generated on the surface of the object (3).

Abstract: Anode applicators include consumable anodes, that can be operated in a non-stationary mode and are insensitive to orientation, are used in selective plating/brush electrodeposition of coatings or free-standing components. The flow-through dimensionally-stable, consumable anodes employed are perforated/porous to provide relatively unimpeded electrolyte flow and operate at low enough electrochemical potentials to provide for anodic metal/alloy dissolution avoiding undesired anodic reactions. The consumable anodes include consumable anode material(s) in high surface area to reduce the local anodic current density. During electroplating, sufficient electrolyte is pumped through the consumable anodes at sufficient flow rates to minimize concentration gradient and/or avoid the generation of chlorine and/or oxygen gas and/or undesired reaction such as the anodic oxidation of P-bearing ions in the electrolyte.

Abstract: Systems and methods for electrodepositing a nickel-cobalt alloy using a rotating cylinder electrode assembly with a plating surface and an electrical contact. The assembly is placed within a plating bath and rotated while running a plating cycle. Nickel-cobalt alloy deposition is selectively controlled by controlling current density distribution and/or cobalt content in the plating bath while running the plating cycle to deposit an alloy of a desired yield strength onto the plating surface in a single plating cycle. In various embodiments, the rotating cylinder may be used as an insitu monitoring method to assist in obtaining the properties desired.

Abstract: The present invention provides a system and a method for metal deposition in semiconductor processing, the system comprising a plating tool with one or more plating tanks, each containing one of a respective electrolyte solution, one or more replenishment sections each fluidly connected to a respective one of the one or more plating tanks, one or more draining sections each fluidly connected to a respective one of the one or more plating tanks, and a control system adapted to operate the one or more replenishing sections and/or the one or more draining sections so as to maintain a condition of the electrolyte solutions.

Abstract: A substrate processing apparatus can arbitrarily switch the flow direction of a processing liquid without causing a change in the overall flow rate of the processing liquid nor creating a non-uniform flow of the processing liquid. The substrate processing apparatus includes a plurality of inlet pipes and a plurality of outlet pipes, connected to a processing tank and to be switched therebetween to create a flow of a processing liquid in the processing tank in a direction different from that of the processing liquid before the switching. The inlet pipes and the outlet pipes are each provided with a flow control device which is controlled by a control section so that upon switching between the pipes, the flow rate of the processing liquid flowing therethrough changes with time.

Abstract: An apparatus for single-sided bilayer formation includes a first fluid chamber including a sidewall and a second fluid chamber extending through the sidewall. A barrier wall, having at least a portion defining a hydrophobicity or hydrophilicity surface property, separates the first and second fluid chambers and includes a nanopore therein across which a planar lipid bilayer (PLB) is formed. In use, an electrolyte is added to the first and second fluid chambers and a lipid/organic solvent mixture is added to the first fluid chamber to form a lipid/organic solvent layer. The electrolyte level within the first fluid chamber is adjusted such that the lipid layer is raised above the barrier wall and a PLB is formed through single-sided spontaneous formation from the first fluid chamber across the nanopore.

Abstract: The preceding invention concerns a galvanic bath as well as a method for depositing a zinc-bearing layer onto a substrate surface. According to the invention, it is provided that the galvanic bath be divided into at least two cell chambers, in which the division occurs by means of a cation-exchange membrane and one cell chamber includes an acidic deposition-electrolyte and the other cell chamber includes a neutral or acidic anolyte. The acidic anolyte here is at least partially removed from the cell chamber containing it and is stripped of the foreign metal ions contained in it by means of a cation-exchange arrangement.

Abstract: A copper electroplating bath that includes an aqueous solution that comprises a copper salt and at least one acid and a container that comprises a copper salt in solid form, is disclosed. The container supplies copper ions to the aqueous solution to maintain the copper ion concentration of the aqueous solution at saturation levels while retaining the copper salt in solid form within the container.

Abstract: An electrolytic cell for replenishing chromium content of a trivalent chromium. electrolyte and a method of replenishing trivalent chromium content using the electrolytic cell is provided. The method comprising the steps of immersing a chromium electrode and a second electrode in a trivalent chromium electrolyte and applying an alternating pulse current across the chromium electrode and the second electrode. In this manner, trivalent chromium is electrolytically dissolved from the chromium electrode and the trivalent chromium content of the electrolyte in which the chromium electrode is immersed is enriched.

Abstract: A method for producing a metal-ceramic composite coating with increased hardness on a substrate includes adding a sol of a ceramic phase to the plating solution or electrolyte. The sol may be added prior to and/or during the plating or coating and at a rate of sol addition controlled to be sufficiently low that nanoparticles of the ceramic phase form directly onto or at the substrate and/or that the metal-ceramic coating forms on the substrate with a predominantly crystalline structure and/or to substantially avoid formation of nanoparticles of the ceramic phase, and/or agglomeration of particles of the ceramic phase, in the plating solution or electrolyte. The ceramic phase may be a single or mixed oxide, carbide, nitride, silicate, boride of Ti, W, Si, Zr, Al, Y, Cr, Fe, Pb, Co, or a rare earth element. The coating, other than the ceramic phase may comprise Ni, Ni—P, Ni—W—P, Ni—Cu—P, Ni—B, Cu, Ag, Au, Pd.

Abstract: A semiconductive counter electrode covers a highly electronically conductive electric current buss. The semiconductive counter electrode is impervious to ion flow. A substrate holder is operable to hold a substrate and to form a thin fluid gap between the semiconductive counter electrode and a substrate surface. A thin liquid electrolyte layer is located in the thin fluid gap. A power supply connected to the electric current buss and a peripheral edge of a conductive substrate surface is able to generate a potential difference between the electric current buss and the semiconductive counter electrode, on one side of the electrolyte layer, and the substrate on the other side. The semiconductive counter electrode provides a substantial resistance in the various current flow paths between the electric current buss and the semiconductive counter electrode, on one side, and the conductive substrate surface, on the other, thereby enhancing control of current distribution.

Abstract: In a copper electroplating apparatus having separate anolyte and catholyte portions, the concentration of anolyte components (e.g., acid or copper salt) is controlled by providing a diluent to the recirculating anolyte. The dosing of the diluent can be controlled by the user and can follow a pre-determined schedule. For example, the schedule may specify the diluent dosing parameters, so as to prevent precipitation of copper salt in the anolyte. Thus, precipitation-induced anode passivation can be minimized.

Abstract: An electrolytic cell for adjusting pH and replenishing nickel in a nickel plating solution of a nickel plating bath and a method of using the same is disclosed. The electrolytic cell comprises an inlet for receiving nickel plating solution from the nickel plating bath; a cooled cathode connected to a first bus bar connected to a negative terminal of a power supply; a plurality of nickel anodes capable of creating hydrogen gas on the cooled cathode when current is applied, connected to at least a second bus bar, the at least the second bus bar connected to a positive terminal of the power supply; and an outlet for returning nickel plating solution in the electrolytic cell to the nickel plating bath.

Abstract: A simple titration method involving a single copper ion titrant detected by a copper ion specific electrode provides the concentrations of both copper ions and bath complexing agent (ethylene diamine, for example) in alkaline copper electroplating baths of the type used to deposit or thicken copper seed layers on silicon wafers. Standard addition of an excess of a strong complexing agent (EDTA, for example) and back-titration with the copper ion titrant yields the bath copper ion concentration, and continued titration to a second endpoint, preferably after addition of hydroxide to adjust the pH of the analysis solution, yields the total concentration of bath complexing agent. Based on these analyzes, the concentration of free bath complexing agent may be calculated. The method also provides direct determination of the free bath complexing agent concentration via standard addition of excess bath complexing agent to a sample of the plating bath and titration with the copper ion titrant.