Abstract: A method of forming a copper layer with increased electromigration resistance. A doped copper layer is formed by controlling the incorporation of a non-metallic dopant during copper electroplating.

Abstract: A method of nanometer-scale deposition of a metal onto a nanostructure includes the steps of: providing a substrate having thereon at least two electrically conductive nanostructures spaced no more than about 50 &mgr;m apart; and depositing metal on at least one of the nanostructures by electric field-directed, programmable, pulsed electrolytic metal deposition. Moreover, a method of nanometer-scale depletion of a metal from a nanostructure includes the steps of providing a substrate having thereon at least two electrically conductive nanostructures spaced no more than about 50 &mgr;m apart, at least one of the nanostructures having a metal disposed thereon; and depleting at least a portion of the metal from the nanostructure by electric field-directed, programmable, pulsed electrolytic metal depletion. A bypass circuit enables ultra-finely controlled deposition.

Abstract: A method is provided of forming a semiconductor seed layer starting with a non-electrochemical deposition of an initial deposition of the seed layer. This is followed by a very slow deposition rate electrochemical deposition with an organic additive at the beginning of the plating process to overcome the initial thin seed coverage at the bottom and bottom sidewall of a feature. The electrochemical deposition plates at a very low rate initially followed by a low rate deposition to build up a thicker and more uniform seed layer at the bottom and bottom sidewall. In the meantime, this slow plating rate step only adds a small thickness to the top portion of the feature where non-electrochemical deposition seed coverage was initially thicker.

Abstract: The present invention discloses a method for microelectrogravimetrically depositing an electroactive species onto an electrode or a plurality of electrodes. The method comprises dispensing a solution containing the electroactive species from a microdispenser so as to form a hanging drop of the solution. The method further comprises contacting the electrode with the hanging drop of the solution, wherein the electrode is electrically coupled with the microdispenser so as to form an electrochemical cell, and applying a potential to the electrochemical cell. The application of the potential effects deposition of the electroactive species onto the electrode. The method of the invention eliminates the need for immersion of the electrode in a bath, reduces the volume of solution required by a factor of at least 10-100, and avoids uneven depletion of various components of the solution over successive applications.

Abstract: The present invention provides a chrome-plated sliding member free from periodical decreases in wear resistance or seizure resistance without the necessity to intentionally bend a multi-layer hard chrome plating film. This is a sliding member having a multi-layer hard chrome plating film on the sliding surface of the substrate 1. Microcracks 6 opening to the outer surface side of the individual hard chrome plating layers are distributed in hard chrome plating layers 2, 3, 4 and 5. The microcracks of the individual hard chrome plating layers comprise relatively shallow portions 6a where bottoms stop within a single layer, and relatively deep portions 6b and 6c where cracks run through two or more layers. The quantities of the microcracks expressed by the area ratios of microcracks on a cross-section of the hard chrome plating film include a quantity of the portions where cracks stop within a single layer within a range of from 1.5 to 35.

Abstract: A method for separating metal ions absorbed on a resin includes: suspending or percolating a cationic exchange resin charged with a polar solvent containing an eluting agent or a mixture of eluting agents containing at least an organic or mineral ligand complexing the metal ions to be separated; circulating a direct electric current, whether constant or not, in the charged eluting solution forming an electrolyte so as to recuperate at least a metal by deposition; and finally optionally repeating the last step by setting up one or several cathode(s) made of another metal and by re-adjusting the cathode potential and the anode/cathode potential difference to new values, depending on the new type of metal to be recuperated. An installation for treating/recycling photographic bath waste includes an exchanger connected to a tank for waste bath to be treated, to a treated waste bath tank, to a regenerating solution tank and to an electrolysis vessel.

Abstract: A method is described for catalyst-induced growth of carbon nanotubes, nanofibers, and other nanostructures on the tips of nanowires, cantilevers, conductive micro/nanometer structures, wafers and the like. The method can be used for production of carbon nanotube-anchored cantilevers that can significantly improve the performance of scaning probe microscopy (AFM, EFM etc). The invention can also be used in many other processes of micro and/or nanofabrication with carbon nanotubes/fibers. Key elements of this invention include: (1) Proper selection of a metal catalyst and programmable pulsed electrolytic deposition of the desired specific catalyst precisely at the tip of a substrate, (2) Catalyst-induced growth of carbon nanotubes/fibers at the catalyst-deposited tips, (3) Control of carbon nanotube/fiber growth pattern by manipulation of tip shape and growth conditions, and (4) Automation for mass production.

Abstract: The invention concerns a method for forming a coating on conductive particles by grafting a polymer and/or a copolymer of the particles from a bath containing at least a monomer from which the polymer and/or copolymer is formed. The method consists of producing the grafting by electrochemical reduction of the monomer in an electrolytic solution, where at least a cathode and an anode are provided, and containing an aprotic solvent, a support electrolyte and the monomer(s) required for polymerizing or copolymerizing the coating, by suspending the particles and moving the solution so as to produce an intermittent contact between the particles and the cathode, and to form, by polymerization or copolymerization, the coating on the particles by applying an electric potential.

Abstract: Improved electrolytic cells are described. The cells comprise the novel electrolyte K2HPO4, or a less alkaline phosphate buffer solution, electrodes having a modified composition, or a combination of the new electrolyte and a modified composition electrode. The K2HPO4 electrolyte, or less alkaline phosphate buffer solution, and modified electrodes can be used in liquid delivery devices which deliver a liquid agent at a constant rate or a controlled variable rate over a period of time.

Abstract: Disclosed is an Ni-plated layer of biaxial texture, which is formed by electroplating. In the Ni-plated layer,peaks measured on a &thgr;-rocking curve have a FWHM of 7° or less in terms of the misorientation on the c-axis; and peaks measured on &phgr;-scan have a FWHM of 21° or less in terms of the misorientation on the plane formed by the a-axis and the b-axis. Also, a process of electroplating a Ni layer are disclosed. The process comprises forming a Ni-plated layer of biaxial texture under a magnetic field by electroplating and subjecting the Ni-plated layer to thermal treatment to develop the biaxial texture. This electroplating process is expected to give a significant contribution to the development of the electroplating technology and to replace the vacuum deposition used for the preparation of thin film magnetic materials or thin film piezoelectric materials.

Abstract: A method and apparatus for electrochemically depositing a metal into a high aspect ratio structure on a substrate are provided. In one aspect, a method is provided for processing a substrate including positioning a substrate having a first conductive material disposed thereon in a processing chamber containing an electrochemical bath, depositing a second conductive material on the first conductive material as the conductive material is contacted with the electrochemical bath by applying a plating bias to the substrate while immersing the substrate into the electrochemical bath, and depositing a third conductive material in situ on the second conductive material by an electrochemical deposition technique to fill the feature. The bias may include a charge density between about 20 mA*sec/cm2 and about 160 mA*sec/cm2. The electrochemical deposition technique may include a pulse modulation technique.

Abstract: The present invention is directed to an improved electroplating method, chemistry, and production worthy apparatus for depositing noble metals (e.g., platinum) and their alloys onto the surface of the workpiece, such as a semiconductor wafer, pursuant to manufacturing a microelectronic device, circuit, and/or component. The reliability of the noble metal material deposited using the disclosed method, chemistry, and/or apparatus is significantly better than the reliability of noble metal structures deposited using the teachings of the prior art. This is largely attributable to the low stress of films that are deposited using the teachings disclosed herein. The metals, which can be deposited, include gold, silver, platinum, palladium, ruthenium, iridium, rhodium, osmium and alloys containing these metals.

Abstract: Using a chrome plating bath containing organic sulfonic acid, plating is conducted by application of a pulse current to thereby form a crack-free lower chrome layer on a steel substrate. The lower chrome layer has a compressive residual stress of 100 MPa or more and a crystal grain size of from 9 nm to less than 16 nm. Subsequently, by application of a direct current, a cracked upper chrome layer is formed on the lower chrome layer, to thereby obtain a chrome plated part. The lower chrome layer imparts the chrome plated part with heat resistance and corrosion resistance, and the upper chrome layer imparts the chrome plated part with wear resistance and good sliding properties.

Abstract: A structured surface coating is electrochemically deposited on an (electrically conductive) surface of a component. The component to be coated forms the cathode in a galvanic bath. The process current is raised in discrete steps in a nucleation phase during which island formations are deposited on the surface, with brief pauses between each increase of between 0.1 and 30 sec. The process current is then maintained at a constant level, during which the islands grow. The process sequence may be repeated several times.

Abstract: A multilayer engine bearing (10) includes a steel backing (12) having a liner (14) of bearing metal of either copper-lead or aluminum alloys formed on the backing (12). A multilayer overplate (24, 124) is formed on the base lining member (16) and includes at least a first layer (28, 128) electrodeposited from a bath at a first current density to a desired thickness, and at least one additional layer (26, 126) electrodeposited from the same bath but at a different current density and to a desired thickness to yield a composite lamellar overplate structure having layers with differing deposit characteristics, such as hard and soft layers, generated from the same bath at different current densities.

Abstract: Electroplating methods using an electroplating bath containing metal ions and a suppressor additive, an accelerator additive, and a leveler additive, together with controlling the current density applied to a substrate, avoid defects in plated films on substrates having features with a range of aspect ratios, while providing good filling and thickness distribution. The methods include, in succession, applying DC cathodic current densities optimized to form a conformal thin film on a seed layer, to provide bottom-up filling, preferentially on features having the largest aspect ratios, and to provide conformal plating of all features and adjacent field regions. Including a leveling agent in the electroplating bath produces films with better quality after subsequent processing.

Abstract: A method of plating for filling via holes, in which each via hole formed in an insulation layer covering a substrate so as to expose, at its bottom, part of a conductor layer located on the substrate, is plated with copper, to be filled with the plated metal, the method comprising the steps of forming a copper film on the top surface of the insulation layer covering the substrate, and the side walls and bottoms of the respective via holes, immersing the substrate having the copper film formed in an aqueous solution containing a plating promoter to thereby deposit the plating promoter on the surface of the copper film, removing the plating promoter from the surface of the copper film located on the insulation layer and leaving the plating promoter on the side walls and bottoms of the respective via holes, and subsequently electroplating the substrate having the copper film formed with copper to thereby fill the via holes with the plated copper and simultaneously form a continuous copper film which eventually c

Abstract: A process for electroplating metal on a resistive substrate and the article of manufacture produced therefrom are disclosed. The metal layer is electroplated onto the resistive substrate in an electroplating bath having a polarization parameter &xgr; less than approximately 10 such that the metal layer is of substantially uniform thickness. The polarization parameter &xgr; of less than approximately 10 for the electroplating bath can be achieved by numerous means, such as by providing a low metal ion concentration in the electroplating bath or by adding one or more additives to the electroplating bath. The present invention may be used with a variety of metals and resistive substrates.

Abstract: In a process for manufacturing an electrode for a PEM fuel cell or an electrochemical energy converter, an ion-exchange polymer is applied to one face of an electrode substrate. An electrocatalyst is then applied to the substrate by electrochemical deposition, preferably from a solution containing one or more complexes or salts of the electrocatalyst. The electrochemical deposition occurs by application of a voltage between a pair of electrodes, one of which is the electrode under preparation. The voltage between the two electrodes is controlled by controlling the potential of the working electrode. A pulsed voltage profile is applied across the two electrodes during the electrodeposition process.

Abstract: The flexibility of a wiring design is improved by preventing any erosion from happening upon forming a buried wiring. An interlayer insulating film is formed on a silicon substrate, and then trenches are formed in the interlayer insulating film. Thereafter, the barrier layer is deposited on side surfaces and a bottom surface in the trenches and on an entire area on the interlayer insulating film, and a copper seed layer is formed over an entire area on the barrier layer. Fountain plating is performed using the copper seed layer as an electrode to deposit the copper plated layer on the trenches and on a peripheral area of the same the copper plated layer buries the trenches and has a protruded configuration. Thereafter, the surface of the copper plated layer is polished with a CMP method until the interlayer insulating film is exposed to form a buried wiring.

Abstract: A method is described for electrodepositing an alloy of Ni-Fe-W-P. The alloy has good corrosion and wear resistance and hence is a possible replacement for hard chromium. The electrodeposition solution contains nickel ions, iron ions, tungsten ions and phosphorous ions, and a reducing agent. The solution yields high iron content, bright level alloy deposits containing up to 40 percent iron. In another aspect of the invention, electrodeposition is carried out on a surface containing a geometric error. A sensor determines the surface topography of the surface. This is compared in a microprocessor to the desired topography. A corrective signal is sent to an electric current source to cause electrodeposition of a quantity of leveling agent sufficient to at least partially correct the geometric error.

Abstract: The circuit arrangement and method for supplying pulsed current to electrolytic cells according to the invention are used in electroplating systems. To supply current to each electrolytic cell, there are provided two galvanic rectifiers 5, 32 and one change-over switch 12 with respectively two individual switches 23, 24, one output of the rectifiers being connected via a first electric line 33 with the one terminal of the electrolytic cell, the respective other outputs of the rectifiers being connected each via a second electric line 34, 35 with the inputs of the change-over switches, and the output 18 of the change-over switch being connected with the other terminal of the electrolytic cell, a capacitor 20, 21 being respectively connected, in addition, between the first electric line and the second electric lines. Periodic pulse sequences are generated by alternate opening and closing said separate switches.

Abstract: The invention relates to a method of generating short, cyclically repeating, unipolar or bipolar pulse currents I.sub.G, I.sub.E for electroplating, and to a circuit arrangement for electroplating with which pulse currents I.sub.G, I.sub.E can be generated. Electroplating methods of this type are referred to as pulse-plating methods. According to the invention, the secondary winding 6 of a current transformer 1 is connected in series into the electroplating direct current circuit 5, consisting of a bath direct current source 2 and a bath which is contained in an electroplating cell and which is represented by resistor R.sub.B. The primary winding 7 of the transformer has a larger number of turns than the secondary winding. The primary winding is controlled with pulses of high voltage and with relatively low current. The high pulse current on the secondary side temporarily compensates in pulses the electroplating direct current.

Abstract: A process with the following process steps is used to electrolytically deposit copper layers, especially on printed circuit boards. An electrically-conductive substrate and anodes that decompose upon electrolytic deposition are brought into contact with a deposition bath. The deposition bath contains copper ions, compounds that increase the electrical conductivity of the deposition bath, additives to influence the material properties of the copper layers, additional compounds of an electrochemically reversible redox system, and solvents or solvent mixtures. The substrate and the electrodes are connected to a power supply. The copper layers are deposited on the substrate using a pulsed current or a pulsed voltage process. When this process is used, metal layers with favorable visual and mechanical material properties are deposited after a brief bath preparation time.

Abstract: Erosion of high density metallization areas associated with conventional damascene-CMP processing is avoided and greater planarity achieved by selectively increasing the metal overburden layer thickness at high density metallization regions. Embodiments include initially filling recesses formed in the substrate surface with a metal forming a blanket or overburden layer of the metal thereon. Regions of the blanket or overburden layer overlying regions of high density metallization are selectively electroplated to a greater thickness. The surface is then planarized by CMP, with the selectively increased thickness areas of the overburden layer compensating for greater erosion rates thereat during CMP, thereby resulting in greater planarity of the polished surface.

Abstract: The invention relates to a method for the electrolytic deposition of metal coatings, in particular of copper coatings with certain physical-mechanical and optical properties and uniform coating thickness. According to known methods using soluble anodes and applying direct current, only uneven metal distribution can be attained on complex shaped workpieces. By using a pulse current or pulse voltage method, the problem of the coatings being of varying thickness at various places on the workpiece surfaces can indeed be reduced. However, the further problem of the geometric ratios being changed continuously during the depositing process by dissolving of the anodes is not resolved thus. This can be avoided by using insoluble anodes.

Abstract: A gas diffusion electrode for a proton exchange membrane fuel cell is prepared by electrodeposition of a catalytic metal in nanocrystalline form on a substrate by contacting an electrically conductive substrate and a counterelectrode with a plating bath containing ions of a metal to be deposited on the substrate and passing a pulsed electric current between the substrate and counterelectrode having pulses that are cathodic with respect to the substrate and have a short on-time and/or a short duty cycle with a frequency from about 10 hertz to about 5000 hertz. In a preferred embodiment the electric current is a modulated reversing electric current having pulses that are cathodic with respect to the substrate and pulses that are anodic with respect to the substrate, the cathodic pulses having a short on-time and/or short duty cycle, the charge transfer ratio of the cathodic pulses to the anodic pulses being greater than one, and the frequency of the pulses ranging from about 10 hertz to about 5 kilohertz.

Abstract: High aspect ratio openings in excess of 3, such as trenches, via holes or contact holes, in a dielectric layer are voidlessly filled employing a pulse or forward-reverse pulse electroplating technique to deposit copper or a copper-base alloy. A leveling agent is incorporated in the electroplating composition to ensure that the opening is filled substantially sequentially from the bottom upwardly.

Abstract: A structured surface coating is electrochemically deposited on an electrically conductive surface of a component. The component to be coated forms the cathode in a galvanic bath. The process current is raised in discrete steps in a nucleation phase during which island formations are deposited on the surface, with brief pauses between each increase of between 0.1 and 30 sec. The process current is then maintained at a constant level, during which the islands grow. The process sequence may be repeated several times.

Abstract: In a method of manufacturing foils of plastic material which are electrically conductive in a transverse direction, but not in the plane of the foil wherein micropassages are formed in the foil by etching nucleus traces which are generated by exposure to a heavy ion beam, conductive layers are deposited on one side of the foil and the micropassages are filled by electrolytic metal ion depositions from the other side until caps are formed on the passages. After dissolving the two conductive layers, the steps are repeated to form caps also on the passages at the other side of the foil so as to provide for good contacting capabilities at both sides of the foil.

Abstract: A method for rendering a surface of a contact rough includes submerging the surface of the contact in an electroplating bath having a dissolved metal salt, and pulsing an electric current through the contact and the bath to form a rough metallic structure on the surface of the contact.

Abstract: There it is disclosed a chemical treatment for copper foil which imparts a dark brown to black color to the foil and improves the bond strength of the foil to a dielectric substrate without detrimentally changing the etching characteristics of the foil. The treatment includes depositing a nodular copper/nickel alloy layer on a surface of the foil. These nodules are 55% to 95% by weight copper and are electrolytically deposited using a pulse power controller.

Abstract: A process for plating tin or tin alloy onto metal substrates is described. In the process, a metal substrate is placed in an electroplating bath that contains a stannous sulfate and an organic compound additive in which the organic compound has a heterocyclic moiety in an aqueous solution of sulfonic acid. The bath is then subjected to pulse plating conditions that plate a layer of tin or tin alloy onto the metal substrate wherein the tin in the tin layer has a grain size of about 2 .mu.m to about 8 .mu.m. During pulse plating, a current density of about 65 ASF to about 250 ASF is applied to the electroplating bath in a pulsed manner, i.e. the current is cycled on and off during plating. The duty cycle of the pulse is about twenty-five percent to about thirty percent. The duration of the on pulse during the cycle is about 50 .mu.s to about 500 .mu.s.

Abstract: High quality thin films of copper-indium-gallium-diselenide useful in the production of solar cells are prepared by electrodepositing at least one of the constituent metals onto a glass/Mo substrate, followed by physical vapor deposition of copper and selenium or indium and selenium to adjust the final stoichiometry of the thin film to approximately Cu(In,Ga)Se.sub.2. Using an AC voltage of 1-100 KHz in combination with a DC voltage for electrodeposition improves the morphology and growth rate of the deposited thin film. An electrodeposition solution comprising at least in part an organic solvent may be used in conjunction with an increased cathodic potential to increase the gallium content of the electrodeposited thin film.

Abstract: The improved method comprises contacting a substrate 5 at least once by a liquid containing the elements that compose a pure metal or an alloy with which the small holes or recesses 3a in the substrate 5 are to be filled or covered, whereby the liquid wets the inner surfaces of said small holes or recesses 3a while, at the same time, said pure metal or said alloy is deposited on the surface of said substrate 5. The method is capable of filling small holes or covering small recesses in the surface of the substrate 5 with improved efficiency while, at the same time, it improves the heat resistance and materials stability of the part that contains the formed filling or covering layer.

Abstract: A slide surface construction which is an inorganic skin film formed of an aggregate of Fe crystals having a body-centered cubic structure. The aggregate includes a large number of {222} oriented Fe crystals with their {222} planes (by Miller indices) oriented toward a slide surface. At least some of these {222} oriented Fe crystals are hexangular pyramid-shaped Fe crystals having six ridge lines. These Fe crystals having six ridge lines ensure that the oil retention of the slide surface construction can be improved, and a slide load acting on the slide surface can be finely divided. The inorganic skin film may be formed by a plating process such as electrolytic plating, chemical vapor deposition, or sputtering. During plating the output of a plating energy source is controlled to produce a pulsed waveform.

Abstract: A zinc or zinc alloy electroplated metal sheet comprises a metal sheet having, on at least one surface thereof, a composite zinc or zinc alloy plated coating formed by electroplating with zinc or a zinc alloy in a plating solution which contains at least one organic compound selected from the group consisting of alkynes, alkynols, amines and salts thereof, thio compounds, heterocyclic compounds, and aromatic carboxylic acids and salts thereof. The composite plated coating has a coating weight of 0.5-200 g/m.sup.2 and contains 0.001-10 wt % of co-deposited carbon. The electroplated metal sheet has improved post-painting corrosion resistance, press formability, and spot weldability.

Abstract: A method and apparatus for plating metals which delivers a voltage pulse with the possibility of a widely varying current magnitude characteristic to a plating electrode and an object having a large electrical reactance in terms of a parallel resistance and capacitance in order to raise the voltage potential between the electrode and an object to a programmed plating voltage overpotential and underpotential. The programmed plating voltage overpotential determines how fast the electrochemical reaction is allowed to proceed in the diffusion layer, and the programmed voltage underpotential determines how quickly the electrochemical reaction of the diffusion layer will slow down.

Abstract: A method for the production of metal foam with high specific surface area is disclosed. A foam material which may be either conductive or nonconductive is provided. If the material is nonconductive, an electrically conductive covering layer is formed. The electrically conductive foam material is then electrolytically coated with nickel from a nickel plating bath. The bath includes at least one unsaturated organic second class brightener in an amount effective to promote preferential growth of nickel onto the foam material such that the value of the growth ratio R, defined by the total of the growth of metal onto the foam material in the direction of the preferential growth divided by the total of the growth of metal in a direction perpendicular to the direction of the preferential growth, is greater than one. The nickel plating may be carried out using pulse current. The bath liquid may be flowed through the openings of the foam substrate in one or more directions during the deposition.

Abstract: A method for making superconducting ceramic precursor films by electrodeposition. In the electrodeposition step, superconducting precursor metal ions are electrodeposited onto a working electrode by applying a combined direct current voltage upon which is superimposed an alternating current having a frequency of between about 5 to 100 KHz. The resulting electrodeposited film is particularly well suited for further oxidation/annealing to form a superconducting ceramic.

Abstract: A process for repairing degraded sections of metal tubes, such as heat exchanger tubes, by in situ electroforming utilizes a probe containing an electrode. The probe is movable through the tube to the site of degradation and is sealed in place, thereby creating an electrochemical cell. Electrolyte flows from a reservoir through the cell and a structural layer of metal is deposited on the tube using a pulsed direct current and a duty cycle of 10-60%. The metal layer so formed possesses an ultrafine grain size preferably with a highly twinned microcrystalline structure giving the layer excellent mechanical properties.

Abstract: A process and apparatus for the application of a control variable having a fractal structure to a body or process. The process of the present invention comprises the steps of generating a control variable having a fractal structure and applying the control variable to a body or process reacting in accordance with the control variable. The process is applicable to electroforming where first, second and successive pulsed-currents are applied to cause the deposition of material onto a substrate, such that the first pulsed-current, the second pulsed-current, and successive pulsed currents form a fractal pulsed-current waveform.

Abstract: A wiring pattern forming method in which side etch of a wiring pattern at the time of etching the substrate copper foil of a copper plating pattern is reduced to hold down an increase in line resistance, the wiring pattern forming method including the steps of: providing a plating resist pattern of which open area comprises a wiring pattern on the surface of a copper-clad laminate which is obtained by providing a copper foil on an insulating substrate; plating such open area with copper to form a copper plating pattern; then plating a crevice between the copper plating pattern and the plating resist pattern with a solder film by alternately repeating application of a current for a predetermined time period and suspension of the current application for a predetermined time period; and etching away the copper foil by using the solder film as an etching resist to form the wiring pattern.

Abstract: A process for producing nanocrystalline materials, and in particular nanocrystalline nickel having an average grain size of less than about 11 nanometers and ternary and quaternary nickel-iron alloys, such as NiFeCr and NiFeCrMn alloys, having a grain size less than about 100 nm is described. The nanocrystalline nickel is electrodeposited onto the cathode in an aqueous acidic electrolytic cell by application of a pulsed D.C. current. The ternary and quaternary Nickel-Iron alloys and other binary, ternary and quaternary alloys may be produced by D.C. electroplating or by pulsed D.C. electroplating. The cell electrolyte also contains a stress reliever, such as saccharin, which helps to control the grain size. The novel products of the invention find utility as wear resistant coatings, hydrogen storage materials, magnetic materials and as catalysts for hydrogen evolution.

Abstract: A process for electrochemically depositing a structured surface layer on a component, such as a machine component, particularly a steel water cylinder of a printing press, is disclosed. The process comprises the steps of defining an electrical parameter, such as a potential and/or an electrical current, effecting an electro-chemical layer deposition; and depositing a surface layer on the component with a structured outer surface topography. The depositing step is performed by providing an initial pulse of the electrical parameter and forming a plurality of island formations of deposition material on a surface of the component to be electro-chemically coated, and subsequently providing a follow-up pulse of the electrical parameter and causing a growth of the deposition material on the plurality of islands for causing the structured outer surface topography.

Abstract: A process for producing nanocrystalline materials, and in particular nanocrystalline nickel having an average grain size of less than about 11 nanometers is described. The nanocrystalline material is electrodeposited onto the cathode in an aqueous acidic electrolytic cell by application of a pulsed D.C. current. The cell electrolyte also contains a stress reliever, such as saccharin, which helps to control the grain size. The novel product of the invention find utility as wear resistant coatings, hydrogen storage materials, magnetic materials and as catalysts for hydrogen evolution.

Abstract: A process for the production of a composition modulated alloy having a predetermined concentration is disclosed, in which alternating layers of at least two metals are successively deposited upon a substrate by electrodeposition, vacuum deposition, vapor deposition, or sputtering. The individual thicknesses of at least one metal's layers are varied in a predetermined manner. Pulsed galvanostatic electrodeposition using a tailored waveform is preferred. A copper-nickel concentration graded alloy is disclosed. Concentration graded alloys of predetermined concentration having at least one region of local homogeneity are also disclosed. The region of local homogeneity has a thickness corresponding to the thickness of two adjacent layers of different metals which have been diffusion annealed together. A pulsed electrodeposition/diffusion anneal process for production of such alloys is also disclosed.

Abstract: A dense, smooth, ductile, hard, highly reflective, corrosion-resistant, temperature resistant, and wear-resistant crystalline alloy of nickel, cobalt and boron. The alloy is epitaxially electrodeposited on an activated substrate using a pulsed square wave current. The epitaxial deposition occurs in an electrolytic bath containing nickel ions, cobalt ions, complexing agents, and an amino borane compound at a moderately low pH level and moderate temperature. An insoluble, solid catalyst, preferably palladium, causes the alloy to diffuse into the surface of the substrate and become bonded by a polar-covalent bond to it. Implements coated with the alloy, as well as plating solutions and methods for making the alloy are also disclosed.

Abstract: A process for preparing an indium-thallium alloy which exhibits shape memory transformation at a temperature greater than that temperature at which shape memory transformation would occur for a thermally prepared alloy of the same composition. The process includes providing an article for use as a cathode, providing an electrolyte which comprises indium and thallium ions, and electrodepositing an indium-thallium alloy having between about 21 and about 35 atomic percent thallium onto the article. A process for preparing an article constructed of an electrodeposited indium-thallium alloy which exhibits shape memory effect. An electrodeposited indium-based shape memory alloy.

Abstract: A separable and reconnectable connection for electrical equipment is provided that is suitable for miniaturization in which vertical interdigitating members integrally attached and protruding from a planar portion are accommodated in control of damage in lateral displacement that occurs on mating with an opposite similar contact. Displacement damage is averted through accommodating lateral stresses by providing one or more of a conformal opposing contact, by strengthening through coating and base reinforcement and a deformable coating. The contacts are fabricated by physical and chemical processes including sputtering, normal and pulse electroplating and chemical vapor deposition. Pulse electroplating of palladium provides a dendritic deposit of uniform height, uniform rounded points and less branching. The contacts on completion are provided with a surrounding immobilizing material that enhances rigidity.