Abstract: A can body that has been subjected to outer surface painting (OV), inner surface painting (INS), and a neck process (SDN) but that has not been subjected to image formation is manufactured in a canning factory. The can body that has not been subjected to image formation is shipped to a beverage can manufacturing factory. At the beverage can manufacturing factory, an image formation process using a printer (PR) is performed. Specifically, ink is ejected from an inkjet head toward the can body, to thereby form an image on the outer circumferential surface of the can body. Thereafter, the can body is filled with beverage in a filler (FL), and then a can lid is attached to the can body in a seamer (SM).

Abstract: Provided herein are systems and methods for applying materials to articles or projectiles in order to coat at least a portion of the projectile. An embodiment of disclosure provides launching the a projectile into a stream of fluid. The fluid may be a molten metal, powder suspension or slip to be later sintered, molten polymer, monomers to be later polymerized or gaseous species that can locally react with the projectile to produce coatings such as oxides, nitrides, carbides, etc. The passage of the projectile through the fluid results in a coating on the projectile.

Abstract: A wiring substrate includes a stack having a plurality of insulation layers and a plurality of wiring layers. Each of the plurality of insulation layer is formed by an insulative resin of which main component is a photosensitive resin. The plurality of insulation layers and the plurality of wiring layers are alternately stacked one upon another. The wiring substrate further includes a first insulation layer covering a lower surface of the stack and entirely covering a side surface of the stack. The first insulation layer has a higher rigidity than the plurality of insulation layers. An upper surface of the uppermost one of the plurality of wiring layers and an upper surface of the uppermost one of the plurality of insulation layers are exposed from the first insulation layer.

Abstract: A wiring board includes a substrate, an electrode on a surface of the substrate, a wall surface in a ring shape surrounding an outer circumference of the electrode, an upper end of the wall surface is located at a position higher than a surface of the electrode, and a protrusion at the upper end of the wall surface, the protrusion protruding with respect to the wall surface inward of a ring shape defined by the wall surface.

Abstract: A method for fabrication of a piece including, superposing an electrically insulating layer including a first orifice, an additional layer including a first aperture, an intermediate layer including a first hole, and a base layer surmounted by a base motif, depositing a metal layer, so that at the end of this step, the metal layer forms a shell covering electrically conductive walls of the base motif, of the first orifice, of the first aperture and of the first hole, and includes a lateral area resting on the insulating layer, dissolving the insulating layer, coating the metal or alloy layer with a volume formed by a base material of the piece, so that the volume conforms to the shapes of the metal layer.

Abstract: Techniques or processes for providing markings on products are disclosed. In one embodiment, the products have housings and the markings are to be provided on the housings. For example, a housing for a particular product can include an outer housing surface and the markings can be provided in the outer housing surface so as to be visible from the outside of the housing.

Abstract: What is described is a dishwasher (1) comprising a body (2), at least one rack (3) placed into the body (2), having a base and side walls (4) surrounding the base and wherein the objects to be washed are placed, at least one shelf (7), mounted to the side walls (4) of the rack (3), having a carrying surface (5) whereon kitchenware like cups, glasses etc can be placed. At least one slot (8) with both ends closed is located on the shelf (7) and an auxiliary element (10) having at least one pin (9) that can both rotate and slide inside the slot (8) is folded over the carrying surface (5) by being rotated around the pin (9) when the pin (9) is rested against any end of the slot (8).

Abstract: An enclosure for a portable computing device is disclosed. The enclosure includes an indicium (e.g., logo) positioned in an opening extending partially through the enclosure. The enclosure includes multiple material removal processes. First, a tool (e.g., laser ablation tool) can be used to ablate the opening defining an ablation having a shape or profile similar to that of the indicium. A second material removal process can remove a region within the ablation to define an indicium support. The second material removal process may be performed by a CNC cutting tool capable of forming the indicium support to a desired precision. As a result, when the indicium is secured with the indicium support, the indicium includes a desired flatness that prevents an undesired reflectivity. In order to ensure the indicium properly fits in the opening, a third material removal process may be performed to define an indention region around the opening.

Abstract: The present disclosure provides a conductive film of a touch panel. The conductive film has a film and a plurality of a plurality of hydrophobic units. The film is used for sensing touch signals, and the hydrophobic units are disposed in the film with intervals. Conductive material of the conductive film of the touch panel is distributed outside the region of the hydrophobic units, and as the hydrophobic units have good light transmittance, the touch panel of the present disclosure has a characteristic of high light transmittance.

Abstract: A metal part is surface treated using anodization and plating processes to produce different finishes on selective regions of the metal part. The different finishes can contrast in decorative appearance (such as color, shininess and texture) and structural properties (such as wear resistance).

Abstract: A support for an optoelectronic semiconductor chip includes a support body with a first main face and a second main face opposite the first main face, at least one electrical plated-through hole extending from the first main face to the second main face and formed in the support body, and an insulating layer arranged on the first main face, the insulation layer covering the electrical plated-through hole only in regions.

Abstract: An image forming apparatus includes a chassis, an image forming section, a fan, a circuit board, and a first cooling air channel. The chassis includes a first surface and a second surface that is opposite to the first surface. The image forming section is arranged in an internal space formed between the first surface and the second surface of the chassis and performs an image forming process on a sheet. The fan is arranged between the first surface and the image forming section and is rotationally driven to cause an airflow to flow into the internal space. The circuit board is vertically arranged between the second surface and the image forming section. The first cooling air channel is arranged in the internal space and sends the airflow toward the circuit board.

Abstract: A housing having a coating is disclosed. The housing comprises a base substrate made of metallic material; a micro-arc oxide layer formed on the base substrate; and a protection outer film formed on the micro-arc oxide layer and comprising a coating layer and a metallic layer, wherein the metallic layer is formed on the micro-arc oxide layer and covers a portion of the micro-arc oxide layer; and the coating layer is formed on a remaining portion of the micro-arc oxide layer so that the micro-arc oxide layer is covered by the metallic layer and the coating layer.

Abstract: Methods and structures for forming anodization layers that protect and cosmetically enhance metal surfaces are described. In some embodiments, methods involve forming an anodization layer on an underlying metal that permits an underlying metal surface to be viewable. In some embodiments, methods involve forming a first anodization layer and an adjacent second anodization layer on an angled surface, the interface between the two anodization layers being regular and uniform. Described are photomasking techniques and tools for providing sharply defined corners on anodized and texturized patterns on metal surfaces. Also described are techniques and tools for providing anodizing resistant components in the manufacture of electronic devices.

Abstract: Disclosed is a method for marking a socket. The method includes the steps of providing a socket, making at least one indented mark in the surface of the socket, executing a heat treatment on the surface of the socket, providing at least one colored layer in the indented mark, providing an electroplated layer on the surface of the socket except the colored layer, removing a portion of the electroplated layer from the surface of the socket to form an exposed portion of the surface of the socket, and providing a black-dyed layer on the exposed portion of the surface of the socket. The heat treatment can be executed after the colored layer is provided.

Abstract: A method for anodizing and dyeing a metallic article including a first dipped end, a second dipped end opposite to the first dipped end, and a decorated surface located between the first dipped end and the second dipped end, includes steps as follows: anodizing the metallic article to form an anodization layer on the decorated surface by an anodizing treatment, in which the anodization layer is porous with a number of holes, an immersion time of the decorated surface immersed in the electrolyte solution changes gradually from the first dipped end toward the second dipped end, and a depth of the plurality of holes of the anodization layer after the anodizing step thereby changes gradually from the first dipped end toward the second dipped end; and coloring the metallic article sealed in a dyeing treatment.

Abstract: The method of fabricating metal microstructures includes the following steps: a) taking a substrate that has a conductive strike surface; b) to d) forming a first resin mould by UV photolithography, the apertures in the first resin mould revealing the conductive strike surface of the substrate; e) electroforming the first element by galvanic deposition of a first metal material in the apertures of the first resin mould, f) removing the first mould around the first element to expose the conductive strike surface of the substrate; g) to i) forming a new resin mould by UV photolithography, the apertures in the new resin mould revealing the first element, and the conductive strike surface of the substrate; j) electroforming the second element by galvanic deposition of a second metal material in the apertures of the new resin mould to form said metal microstructure; k) separating said metal microstructure from the substrate and from said new mould.

Abstract: Disclosed is a method for marking a socket. The method includes the steps of providing a socket, making at least one indented mark in the surface of the socket, executing a heat treatment on the surface of the socket, providing at least one colored layer in the indented mark, providing an electroplated layer on the surface of the socket except the colored layer, removing a portion of the electroplated layer from the surface of the socket to form an exposed portion of the surface of the socket, and providing a black-dyed layer on the exposed portion of the surface of the socket. The heat treatment can be executed after the colored layer is provided.

Abstract: Molded metallized polymeric components are formed by methods of multi-shot injection molding of a first resin and a second resin, where the first resin forms a first polymer that is metal-platable and the second resin forms a second polymer that is colored and resistant to metallization. Select regions corresponding to the metal-platable polymer surface are metallized. Further, one or more interface regions between the first metal-platable polymer and the second colored polymer can be concealed from a visible direction. Molded decorative polymeric components formed from such methods are also provided.

Abstract: A metal identification platelet equipped with an identification code, while the identification code comprises a hologram. A method of producing the identification platelet with the identification code, including the following steps: A shield from an electro-insulation material is formed on a shim with a holographic motif. Then, the shim is galvanized in the places not covered by the shield from the electro-insulation material. And the completed metal identification platelets are removed from the shim.

Abstract: A method of surface printing and electric plating, it is to perform pre-plating to form a pre-plated layer firstly on a surface of a metallic or non-metallic article to be plated, thereby the metallic or non-metallic surface will not be oxidized, and to perform printing and then electric plating to make the plated layer higher than the electric printed layer, thus an effect of 3 dimensions can be resulted; and the printing oil ink is protected in the plated layer, thereby it is not subjected to being stripped off by abrasion.

Abstract: A process for selecting a surrogate part for metallic plating, the metallic plating of the surrogate part predicting results for the metallic plating of a new or predetermined part is disclosed. The process can include providing a reinforcement learning system having a memory circuitry and a processing circuitry. The memory circuitry can have a database with data associated with a plurality of surrogate parts and data associated with the predetermined part can be entered into the data input module. The processing circuitry can compare the data associated with each of the plurality of surrogate parts and the data associated with the predetermined part and select a surrogate part that affords predicting a plating result of the predetermined part.

Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

Abstract: A method includes forming an aluminum alloy structure, performing a first anodizing process to form a first color layer on the aluminum alloy structure, performing a first cutting process to form at least one first working groove in the first color layer and the aluminum alloy structure, performing a second anodizing process to form a second color layer in the first working groove, performing a second cutting process to form at least one second working groove in the first color layer and the aluminum alloy structure, and performing a third anodizing process to form a third color layer in the second working groove. Thus, the aluminum alloy structure is worked by cutting processes and anodizing processes to form an aluminum alloy product so that the aluminum alloy product has multiple color layers.

Abstract: The invention is directed to a method of providing a plastic substrate with a metallic pattern and to a plastic substrate with a metallic pattern obtainable by said method. The method of the invention comprises i) replicating a pattern of recesses and protrusions on a plastic substrate by pressing a stamp having recesses and protrusions against the substrate, thereby providing said plastic substrate with recesses and protrusions; ii) removing said stamp from said substrate; iii)—applying a layer of seed material capable of initiating an electroless or electrochemical metal deposition process onto said plastic substrate in a selective pattern at least in the recesses of said plastic substrate to yield a substrate wherein said seed material remains selectively in the recesses of said substrate; and thereafter iv) using said seed material to initiate a metal deposition process.

Abstract: Disclosed are embodiments of a circuit and method for electroplating a feature (e.g., a BEOL anti-fuse device) onto a wafer. The embodiments eliminate the use of a seed layer and, thereby, minimize subsequent processing steps (e.g., etching or chemical mechanical polishing (CMP)). Specifically, the embodiments allow for selective electroplating metal or alloy materials onto an exposed portion of a metal layer in a trench on the front side of a substrate. This is accomplished by providing a unique wafer structure that allows a current path to be established from a power supply through a back side contact and in-substrate electrical connector to the metal layer. During electrodeposition, current flow through the current path can be selectively controlled. Additionally, if the electroplated feature is an anti-fuse device, current flow through this current path can also be selectively controlled in order to program the anti-fuse device.

Abstract: In the case of a method for producing decorative surface structures, patterns or the like on articles, in particular sanitary articles, basic bodies made of a first metal, basic bodies made of metal that are coated with a first metal or basic bodies made of plastic that are coated with a first metal are used as a basis. Then, a layer of material temporarily applied to the article is partially removed by electromagnetic radiation or by particle radiation, thereby forming a first surface structure with regions that are free from material. Subsequently, the first metal is at least partially removed in the material-free regions or the first metal or some other metal is built up in the material-free regions. This method step is followed by removal of the still present material, a second (final) surface structure being formed. Finally, further top layers can preferably be applied to the article, the second surface structure being substantially retained.

Abstract: A personal ornament having an ornament base article made of a metal or the like; an underlayer, preferably nickel-free, formed on the base article; and a coloring layer constituted of an abrasion-resistant layer of 0.2-1.5 ?m thick formed by dry-plating on the surface of the underlayer and an outermost layer of 0.002-0.1 ?m thick formed by dry-plating on the surface of the abrasion-resistant layer. The coloring layer is a white hard coating film of a stainless-steel color which provides superior quality, high resistance to deterioration of appearance by scratching, and a high-quality image like a stainless steel film.

Abstract: Method of forming a multilayer structure by electroetching or electroplating on a substrate. A seed layer is arranged on the substrate and a master electrode is applied thereto. The master electrode has a pattern layer forming multiple electrochemical cells with the substrate. A voltage is applied for etching the seed layer or applying a plating material to the seed layer. A dielectric material (9) is arranged between the structures (8) thus formed. The dielectric layer is planarized for uncovering the structure below and another structure layer is formed on top of the first. Alternatively, the dielectric layer is applied with a thickness two layers and the structure below is accessed by selective etching of the dielectric layer for selectively uncovering the top surface of the structure below. Multiple structure layer may also be formed in one step.

Abstract: According to a method of producing a key top for a pushbutton switch of the present invention, a base layer made of an insulating resin that can be plated with metal, an electroless plating layer to be formed on the surface of the base layer, and a polymer coating layer, if required, are stacked on the surface of a key top body. Alternatively, an electroplating layer formed by electroplating is further formed on the electroless plating layer. Therefore, a plating layer can be directly and easily formed on the insulating resin, whereby a key top for a pushbutton switch having a sensation of metal and being rich in design is obtained.

Abstract: A method for depositing a multi-layered protective and decorative coating on an article comprising first depositing at least one coating layer on the article by electroplating, removing the electroplated article from the electroplating bath and subjecting it to pulse blow drying to produce a spot-free surface on the electroplated article, and then depositing, by physical vapor deposition, at least one vapor deposited coating layer on the electroplated article. The electroplated layers are selected from copper, nickel and chrome. The physical vapor deposited layers are selected from non-precious refractory metals, non-precious refractory metal alloys, non-precious refractory metal compounds, and non-precious refractory metal alloy compounds.

Abstract: The present invention relates to a web handling apparatus and process ideally suited for applications involving wet chemistry. The invention involves the horizontal processing of webs in processing containers. The web is redirected into the processing container by inserting a cassette across the web and into the processing container. The cassette includes at least one functional fluid element that facilitates processing of the web. The web handling practices of the invention improve the quality of the processed web. The invention is preferably used in electrodeposition processes.

Abstract: According to the present invention, there is provided a method for forming a mark having superior conspicuity, wherein plural plating layers each having a different hue are formed on a base, a portion of the upper plating layer is removed by laser marking so as to reveal the color of the lower plating layer, and thereby the color difference between a mark and the upper plating layer is made clear. Further, after the upper plating layer is removed by laser marking, another plating layer may be applied to a mark portion to make the mark conspicuous. Furthermore, a concave portion or concavo-convex portions may be provided on the surface of the plating layers, and the concave portion or concavo-convex portions may be colored with ink or paint. With these methods, it is possible to easily form a colored mark having superior conspicuity, corrosion resistance, adhesion, abrasion resistance and to produce a product bearing such a mark.

Abstract: A method of manufacturing a decorative plate (1) includes the steps of: preparing a metal substrate and covering selected areas (11, 16) of the substrate with a protective film; anodizing the substrate; and removing the protective film to expose metallic surfaces in the selected areas of the substrate.

Abstract: Pulse reverse electrolysis of acid copper solutions is used for applying copper to decorative articles, such as aluminium alloy automotive wheels and plastic parts for automotive use. The benefits include an improved thickness distribution of the copper electrodeposited on the plated article, reduced metal waste, reduced plating times and increased production capacity.

Abstract: A method of providing a decorative metal pattern on an electrically non-conductive substrate, such as a glass or plastic substrate, which includes applying a mixture of heat fusible material, such as glass or plastic, with a metal having a particle size less than about 500 mesh constituting at least 50% of the mixture, to the substrate in the desired pattern, heating the so-applied mixture until the heat fusible material fuses and bonds to the substrate, cleaning the substrate with the pattern thereon, and a electroplating the pattern with the desired finish metal. In one method in which the mixture includes glass, a negative resist is adhesively secured to the substrate and the mixture is applied. The resist disintegrates upon heating. In another method, used when the substrate is plastic, a mixture of plastic and metal in past form is applied to the substrate by silk screening or pad printing to form the pattern.

Abstract: A method of forming a copper layer with increased electromigration resistance. A doped copper layer is formed by controlling the incorporation of a non-metallic dopant during copper electroplating.

Abstract: A method of forming microstructures. An article including a metal atom precursor is disproportionally exposed to electromagnetic radiation in an amount and intensity sufficient to convert some of the precursor to elemental metal. Additional conductive material may then be deposited onto the elemental metal to produce a microstructure.

Abstract: Liquid transfer rolls such as printing rolls are made by imposing a hard ceramic coating on an incipient liquid transfer roll in an electrolytic bath subjected to a modified shaped wave alternating current, which causes dielectric breakdown and the formation of a hard ceramic coating on the roll. The roll is laser engraved to form liquid carrying reservoirs or cells on the surface of the roll, either before or after the ceramic coating is built on the roll.

Abstract: The present invention relates to a process for the multilayer coating of substrates with electrodeposition and powder coating materials, in which electrodeposition is used to apply at least one coat (2) of electrodeposition coating material to the substrate (1), after deposition the substrate (1) is, if desired, wholly or partially air-dried, a coat of powder coating material (3) is then applied, and finally electrodeposition coating material and powder coating material are jointly baked.

Abstract: A method for depositing a multi-layered protective and decorative coating on an article comprising first depositing at least one coating layer on the article by electroplating, removing the electroplated article from the electroplating bath and subjecting it to pulse blow drying to produce a spot-free surface on the electroplated article, and then depositing, by physical vapor deposition, at least one vapor deposited coating layer on the electroplated article.

Abstract: A method for depositing a multi-layered protective and decorative coating on an article comprising first depositing at least one coating layer on the article by electroplating, removing the electroplated article from the electroplating bath and subjecting it to pulse blow drying to produce a spot-free surface on the electroplated article, and then depositing, by chemical vapor deposition, at least one chemically vapor deposited coating layer on the electroplated article. The electroplated layers are selected from copper, nickel and chrome. The chemical vapor deposited layers are selected from non-precious refractory metals, non-precious refractory metal alloys, non-precious refractory metal compounds, and non-precious refractory metal alloy compounds.

Abstract: A method for manufacturing a fine pattern includes steps of forming a master substrate having an electrode layer patterned to a predetermined shape, forming peel layers made of a conductive water-repellent thin film on the master substrate, forming the fine pattern made of the electrodeposit resin on the peel layers, impregnating the electrodeposit resin with water, and stripping the fine pattern off the master substrate and transferring the fine pattern on a bonding layer of the media substrate. A color filter and a shading pattern filter are manufactured by the method for manufacturing the fine pattern. The color LCD element includes plastic film substrates, a transparent pixel electrode, a liquid crystal material, and color filters. The color filters are pasted on the plastic film with a bonding film laid therebetween.

Abstract: Methods of treating wafers for analyzing defects present therein comprise providing wafers having front side surfaces comprising defective portions and a back side surfaces opposite thereto; and decorating the defective portion of the front side of the wafer with copper.

Abstract: A method of providing a decorative metal pattern on an electrically non-conductive substrate, such as a glass or plastic substrate, which includes applying a mixture of a heat fusible material, such as glass or plastic, with a metal having a particle size less than about 500 mesh constituting at least 50% of the mixture, to the substrate in the desired pattern, heating the so-applied mixture until the heat fusible material fuses and bonds to the substrate, cleaning the substrate with the pattern thereon, and electroplating the pattern with the desired finish metal. In one method in which the mixture includes glass, a negative resist is adhesively secured to the substrate and the mixture is applied. The resist disintegrates upon heating. In another method, used when the substrate is plastic, a mixture of plastic and metal in paste form is applied to the substrate by silk screening or pad printing to form the pattern.

Abstract: A method for manufacturing a fine pattern is provided which method makes it possible to well reproducibly and completely strip and transfer the fine pattern, repetitively use a master substrate, and simply form a high-definition and high-density fine pattern with good massproductivity. Further, a color filter and a shading pattern filter are implemented by the fine pattern. A color LCD element with the color filter is provided which enables to output a well color-reproducibly high-quality image with no color or brightness evenness. Moreover, a color LCD element is provided which enables to continuously output a coloring function for a certain length of time after light from a light source or ambient light disappears and form a brighter and more vivid image.

Abstract: A method for depositing a multi-layered protective and decorative coating on the article comprising first depositing at least one coating layer on the article by electroplating, removing the electroplated article from the electroplating bath and subjecting it to pulse blow drying to produce a spot-free surface on the electroplated article, and then depositing, by physical vapor deposition, at least one vapor deposited coating layer on the electroplated article. The electroplated layers are selected from copper, nickel and chrome. The physical vapor deposited layers are selected from non-precious refractory metals, non-precious refractory metal alloys, non-precious refractory metal compounds, and non-precious refractory metal alloy compounds.

Abstract: A method for producing a color filter involves the steps of: (A) forming a photosensitive coating film on an electrically conductive layer formed on a surface of a substrate, and exposing the photosensitive coating film through a mask having patterns of at least three different degrees of light transmittances; (B) developing and removing a photosensitive coating film portion registering with one of the patterns of smallest and largest degrees of light transmittances for exposing the electrically conductive layer, and electrodepositing a colored coating on the exposed electrically conductive layer for forming a colored layer thereon; (C) repeating the step (B) for the respective patterns of different degrees of light transmittances in sequence of difference in transmittances for producing different colored layers, respectively; and (D) transcribing the colored layers onto another substrate.

Abstract: A method of inlaying metal in non-conductive materials utilizes conventional electroforming or electroplating techniques to build up metal in grooves or channels formed in the surface of the material. An adhesive is deposited in the grooves, and a cathode is positioned in the adhesive. A metallic base is applied onto or into the adhesive in electrical communication with the cathode, and then the material is immersed in an electrolytic solution wherein metal is built up in the grooves by electrolysis using the metallic base as a cathode.

Abstract: A method for preparing decorative lacquered Ti-based articles is disclosed, which method comprises the steps of: (a) heating to 900.degree. to 1300.degree. in vacuum a base of titanium or its alloy whose surface serves as a base material, to grow the crystal grains on the surface of the base while simultaneously thermally etching the surface, so as to make the base surface uneven; (b) cooling the base; (c) etching the surface of the base with an etchant to enlarge the unevenness of the surface; (d) anodizing the base; (e) applying an undercoat onto the surface of the base; (f) optionally heating the undercoat to cure the same; and (g) further applying a coating onto the undercoat and then drying it. The method makes it possible to prepare decorative lacquered Ti-based articles having a Raden-, Hyomon- or Heidatsu, Kyushitsu- or Makie-like appearance utilizing titanium or its alloy as a base material.